CN103517578A - Manufacturing method of multilayer PCB board and multilayer PCB board - Google Patents
Manufacturing method of multilayer PCB board and multilayer PCB board Download PDFInfo
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- CN103517578A CN103517578A CN201210197950.9A CN201210197950A CN103517578A CN 103517578 A CN103517578 A CN 103517578A CN 201210197950 A CN201210197950 A CN 201210197950A CN 103517578 A CN103517578 A CN 103517578A
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Abstract
The invention discloses a manufacturing method of a multilayer PCB board. The manufacturing method mainly comprises the following steps: a first through hole is drilled in a multilayer board to be drilled, and the first through hole is metalized, wherein the multilayer board to be drilled comprises a first back-drilling layer, a second back-drilling layer and an inner board which is arranged between the first back-drilling layer and the second back-drilling layer and has at least two line layers; back-drilling is carried out respectively at two apertures of the first through hole, and resin hole-plugging is carried out on the first through hole which has undergone two times of back-drilling; a second through hole penetrating a plug body is drilled, and the plug body isolates the second through hole from the first through hole; and the second through hole is metalized. The invention also provides a corresponding multilayer PCB board. By making conductive through holes in the inner conductive hole, connection between a line layer of the first back-drilling layer and a metal layer of the second back-drilling layer as well as connection between the line layers of the inner board are realized. Thus, areas of the inner conductive hole and the conductive through holes occupying the PCB board are reduced, and it is beneficial to make a high-density PCB board.
Description
Technical field
The present invention relates to field of electronic devices, particularly relate to a kind of multi-layer PCB board manufacture method and multi-layer PCB board.
Background technology
At present, multilayer printed circuit board (PCB, Printed Circuit Board) lamina rara externa is on pcb board, to make plated-through hole to realize with being connected of lamina rara externa, and inner plating is in inner plating, to make inner layer metal hole to realize with being connected of inner plating.Concrete, according to traditional drill process, the general hole that first drills through on inner plating, re-plating, form inner layer metal hole, realize being connected of inner plating and inner plating, then lamina rara externa and lower lamina rara externa in the upper and lower pressing of inner plating, and other positions outside inner layer metal Hua Kong position drill through hole after plated-through hole, the conduction that realizes upper and lower lamina rara externa circuit by this metallized through hole connects.
Along with improving constantly of electronic device integrated level, the circuit on pcb board is more and more closeer, and an urgent demand further improves the space availability ratio of pcb board.Yet the plated-through hole in above-mentioned connected mode and inner layer metal hole have taken the exhibiting high surface area of pcb board, affected the design of pcb board high-density line.Therefore the surface area that, how to reduce the shared pcb board in plated-through hole and inner layer metal hole is a problem demanding prompt solution.
Summary of the invention
The invention provides a kind of multi-layer PCB board manufacture method and multi-layer PCB board.The present invention makes metallized second through hole of conducting the first back drill laminate and the second back drill laminate, described metallized the second through hole runs through the cock body in metallized first through hole of inner plating, realize the connection of the first back drill laminate and the second back drill laminate and the connection between inner plating line layer, also reduce the surface area of the shared pcb board of metallized second through hole of inner plating the first plated-through hole and conducting the first back drill laminate and the second back drill laminate, thereby improved the wiring density of multi-layer PCB board.
A manufacture method, comprising:
In multilayer, treat to offer and run through the first through hole that described multilayer is treated perforated plate on perforated plate, and described the first through hole that metallizes, wherein said multilayer treat perforated plate comprise the first back drill layer, the second back drill layer and be arranged at the first back drill layer and the second back drill layer between and there is the inner plating of at least two-layer line layer, described the first through hole comprises and is positioned at the first aperture of the first back drill layer end and second aperture that be positioned at second back drill layer end relative with described the first aperture;
On the first back drill layer, the first through hole after metallization is carried out to back drill for the first time, to form the first back drill hole at the first place, aperture;
On the second back drill layer, the first through hole after metallization is carried out to back drill for the second time, to form the second back drill hole at the second place, aperture;
To the first through hole after twice back drill and through the first back drill hole and the second back drill hole of back drill formation, carry out filling holes with resin, to form, fill described the first through hole through back drill and the first back drill hole forming through back drill and the cock body in the second back drill hole;
Be drilled with the second through hole that runs through described cock body, and described cock body is isolated described the second through hole and described the first through hole;
Described the second through hole metallizes.
The degree of depth of described back drill is for the first time less than the thickness of described the first back drill layer.
The degree of depth of described back drill is for the second time less than the thickness of described the second back drill layer.
The central shaft of the central shaft of described the first through hole and described the second through hole overlaps.
, comprise the first back drill layer, the second back drill layer and be located at described the first back drill layer and described the second back drill layer between the inner plating with at least two-layer line layer,
Described the first back drill layer is provided with the first back drill hole, described the second back drill layer is provided with the second back drill hole relative with described the first back drill hole, described inner plating is provided with metallized the first conductive hole connecting for realizing inner plating circuit, and the first conductive hole of described inner plating is located between described the first back drill hole and described the second back drill hole, described the first back drill hole, in described the second back drill hole and described conductive hole, be all filled with resin cock body, the inside of described cock body is provided with and connects described cock body and metallized the second conductive hole, and described cock body is by described the first conductive hole and described the second conductive hole isolation.
The degree of depth in described the first back drill hole is less than the thickness of described the first back drill layer.
The degree of depth in described the second back drill hole is less than the thickness of described the second back drill layer.
The central shaft of described the first conductive hole overlaps with the central shaft of described the second conductive hole.
In the present invention, owing to making metallized the second through hole for realizing the cock body of metallized first through hole of inner plating circuit connection, the surface area that has reduced the shared pcb board of metallized the first through hole and metallized the second through hole, is conducive to make the pcb board that wiring density is higher.In addition, metallized the first through hole and metallized the second through hole in the present invention are to make on the pcb board after one step press, do not need the harmomegathus situation of considering that each laminate occurs in the course of processing, and twice processing through hole can share a set of alignment system, improved aligning accuracy.
Accompanying drawing explanation
Fig. 1 is the manufacture method schematic flow sheet of a kind of multi-layer PCB board of the present invention;
Fig. 2 is the structural representation corresponding to steps flow chart of the manufacture method of a kind of multi-layer PCB board of the present invention;
Fig. 3 is a kind of Multi-layer PCB structure schematic diagram of the present invention.
Embodiment
The embodiment of the present invention provides a kind of manufacture method and corresponding multi-layer PCB board of multi-layer PCB board.The present invention is described in detail to enumerate embodiment below.
As depicted in figs. 1 and 2, a kind of manufacture method of multi-layer PCB board, comprising:
101, in multilayer, treat to offer and run through the first through hole 209 that described multilayer is treated perforated plate on perforated plate, and described the first through hole 209 that metallizes, wherein said multilayer treat perforated plate comprise the first back drill layer 215, the second back drill layer 217 and be arranged at the first back drill layer 215 and the second back drill layer 217 between and there is the inner plating 216 of at least two-layer line layer, described the first through hole 209 comprises and is positioned at the first aperture 218 of the first back drill layer end and second aperture 219 that be positioned at second back drill layer end relative with described the first aperture.
Describedly treat that perforated plate can form by prepreg pressing for the central layer that multiple two sides have a circuit, also can produce this by Layer increasing method and treat perforated plate.As shown in Figure 2, this inner plating for the treatment of perforated plate is comprised of the first insulating barrier 204, the second line layer 205 of being located at the first line layer 203 of the first insulating barrier 204 upper surfaces and being located at the first insulating barrier lower surface.Described the first back drill layer 215 is comprised of the first line layer 203 and the second metal level 201 of being located at the second insulating barrier 202 surfaces, and described the second back drill layer 217 is comprised of the second line layer 205 and the 3rd metal level 207 of being located at the 3rd insulating barrier 206 surfaces.The second metal level 201 and the 3rd metal level 207 can be copper layer.
In the present embodiment, can electroplate by described the first through hole 209 being sunk to copper, inwall at described the first through hole forms the first conductive layer 208, to realize the metallization of described the first through hole 209, and passes through the first conductive layer 208 by the line layer conducting of described inner plating 216 upper and lower surfaces.
102, on the first back drill layer 215, the first through hole 209 after metallization is carried out to back drill for the first time, to form the first back drill hole 210 at 218 places, the first aperture.
103, on the second back drill layer 217, the first through hole 209 after metallization is carried out to back drill for the second time, to form the second back drill hole 211 at 219 places, the second aperture.
At the first through hole 209 to after electroplating, carry out after twice back drill, removed part or all of first conductive layer of the first through hole 209 that is positioned at the first back drill layer 215 and the second back drill layer 217 after electroplating, the 3rd metal level 207 of the line layer of inner plating and the second metal level 201 of the first back drill layer 215 and the second back drill layer 217 is disconnected.
104, to the first through hole 209 after twice back drill and through the first back drill hole 210 and the second back drill hole 211 of back drill formation, carry out filling holes with resin, to form, fill described the first through hole 209 through back drill and the first back drill hole 210 forming through back drill and the cock body 212 in the second back drill hole 211.
105, be drilled with the second through hole 213 that runs through described cock body 212, and described the second through hole 213 and described the first through hole 209 of described cock body 212 isolation.Described the second through hole 213 runs through described cock body 212, forms hole mesopore with described the first through hole.
106, described the second through hole 213 that metallizes.
After being drilled with the second through hole 213, by the heavy copper of full plate, electroplate, on the surface of the second through hole 213, form the second conductive layer 214, realize the metallization of the second through hole 213, and pass through the second conductive layer 214 by the 3rd metal level 207 conductings of the second metal level 201 of the first back drill layer 215 and the second back drill layer 217.
Because the second through hole 213 after electroplating is positioned at the inside of the first through hole 209 after twice back drill, the second through hole 214 and the first through hole 209 reality only take the area in pcb board Yi Ge hole, reduced and made the shared area in two holes, can further improve the wiring density of pcb board.
Preferably, the degree of depth of described back drill is for the first time less than the thickness of the first back drill layer 215, to prevent destroying the first line layer 203 of described inner plating 216 and the connection between the second line layer 205, guarantee the reliability connecting between the first line layer 203 and the second line layer 205.
Preferably, the degree of depth of described back drill is for the second time less than the thickness of described the second back drill layer 217, to prevent from destroying, connect the first line layer 203 of described inner plating 216 and the connection between the second line layer 205, guarantee the reliability connecting between the first line layer 203 and the second line layer 205.
Preferably, the central shaft of the central shaft of described the first through hole 209 and described the second through hole 213 overlaps.The second through hole 213, through the centre of described the first through hole, has increased the scope of the aperture selection of the second through hole, is conducive to the processing of through hole, avoids dislocation, causes the destruction to the plated-through hole of inner plating.
It should be noted that, general inner plating is in boring, heavy copper and electroplating process, inner plating will be subject to pullling of mechanicals efforts, the phenomenon that occurs to a certain extent harmomegathus, the size of inner plating is changed, thereby cause, by inner plating and lamina rara externa pressing process, easily occurring the problem of contraposition deviation.And the embodiment of the present invention is multilayer after one step press, treat on perforated plate to make plated-through hole, do not have the problem of above-mentioned contraposition deviation.
Introduce a kind of multi-layer PCB board below.
As shown in Figure 3, a kind of multi-layer PCB board, comprise the first back drill layer 313, the second back drill layer 315 and be located at described the first back drill layer 313 and described the second back drill layer 315 between the inner plating with at least two-layer line layer 314.
Described the first back drill layer 313 is provided with the first back drill hole 317, described the second back drill layer 315 is provided with the second back drill hole 318 relative with described the first back drill hole 317, described inner plating is provided with metallized the first conductive hole 316 connecting for realizing inner plating circuit, and described the first conductive hole 316 is located between described the first back drill hole 317 and described the second back drill hole 318, the inner wall surface of described the first conductive hole 316 is provided with the first conductive layer 309, described the first conductive layer 309 connects each sandwich circuit layer of described inner plating 314, described the first back drill hole 317, in described the second back drill hole 318 and described the first conductive hole 316, be all filled with resin cock body 311, the inside of described cock body 311 is provided with and connects described cock body and metallized the second conductive hole 310, and described cock body 311 is by described the first conductive hole 316 and described the second conductive hole 310 isolation.
Described inner plating 314 comprises the first insulating barrier 304, be located at the first line layer 303 of the first insulating barrier 304 upper surfaces and be located at the second line layer 305 of the first insulating barrier 304 lower surfaces.Described the first back drill layer 313 comprises the second insulating barrier 302 and second metal level 301 on the first line layer 303 surfaces that are laminated to described inner plating 314.Described the second back drill layer 315 comprises the 3rd insulating barrier 306 and the 3rd metal level 307 on the second line layer 305 surfaces that are laminated to described inner plating 314.
The surface of the surface of described cock body 311, described the first back drill layer 313 and the surface of described the second back drill layer 315 are provided with the second conductive layer 312, form metallized the second conductive hole 310.The second metal level 301 of described the first back drill layer 313 is connected with the 3rd metal level 307 of described the second back drill layer 315 by described the second conductive layer 312.
Described the first conductive layer 309 of being located at described the first conductive hole 316 inwalls connects the first line layer 303 and second line layer 305 of inner platings 314, realizes the connection between the line layer of inner plating.Described the second conductive layer 312 of being located at described the second conductive hole 310 inwalls connects respectively the metal level 301 of the first back drill layer 313 and the 3rd metal level 307 of the second back drill layer 315, realizes the connection between the metal level of back drill layer.Because described two conductive holes 310 are positioned at the cock body 311 of described the first conductive hole 316 inside, reduce the area that Liao Liang hole takies PCB, be conducive to improve the integrated level of pcb board.
Preferably, the degree of depth in described the first back drill hole is less than the thickness of the first back drill layer 313.
Preferably, the degree of depth in described the second back drill hole is less than the thickness of the second back drill layer 315.
Preferably, the central shaft of described the first conductive hole 316 overlaps with the central shaft of described the second conductive hole 310.
Described the second conductive hole 310 aperture is less than described the first conductive hole 316 aperture.
The first back drill layer in above-described embodiment and the second back drill layer can be the lamina rara externa of multi-layer PCB board.Obviously, multi-layer PCB board of the present invention is not limited to illustrated embodiment.
By embodiment, the manufacture method of a kind of multi-layer PCB board of the present invention and corresponding multi-layer PCB board are described in detail above, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.
Claims (8)
1. a multi-layer PCB board manufacture method, is characterized in that, comprising:
In multilayer, treat to offer and run through the first through hole that described multilayer is treated perforated plate on perforated plate, and described the first through hole that metallizes, wherein said multilayer treat perforated plate comprise the first back drill layer, the second back drill layer and be arranged at the first back drill layer and the second back drill layer between and there is the inner plating of at least two-layer line layer, described the first through hole comprises and is positioned at the first aperture of the first back drill layer end and second aperture that be positioned at second back drill layer end relative with described the first aperture;
On the first back drill layer, the first through hole after metallization is carried out to back drill for the first time, to form the first back drill hole at the first place, aperture;
On the second back drill layer, the first through hole after metallization is carried out to back drill for the second time, to form the second back drill hole at the second place, aperture;
To the first through hole after twice back drill and through the first back drill hole and the second back drill hole of back drill formation, carry out filling holes with resin, to form, fill described the first through hole through back drill and the first back drill hole forming through back drill and the cock body in the second back drill hole;
Be drilled with the second through hole that runs through described cock body, and described cock body is isolated described the second through hole and described the first through hole;
Described the second through hole metallizes.
2. multi-layer PCB board manufacture method according to claim 1, is characterized in that,
The degree of depth of described back drill is for the first time less than the thickness of described the first back drill layer.
3. multi-layer PCB board manufacture method according to claim 1, is characterized in that,
The degree of depth of described back drill is for the second time less than the thickness of described the second back drill layer.
4. according to the multi-layer PCB board manufacture method described in claims 1 to 3 any one, it is characterized in that,
The central shaft of the central shaft of described the first through hole and described the second through hole overlaps.
5. a multi-layer PCB board, is characterized in that, comprise the first back drill layer, the second back drill layer and be located at described the first back drill layer and described the second back drill layer between the inner plating with at least two-layer line layer,
Described the first back drill layer is provided with the first back drill hole, described the second back drill layer is provided with the second back drill hole relative with described the first back drill hole, described inner plating is provided with metallized the first conductive hole connecting for realizing inner plating circuit, and the first conductive hole of described inner plating is located between described the first back drill hole and described the second back drill hole, described the first back drill hole, in described the second back drill hole and described conductive hole, be all filled with resin cock body, the inside of described cock body is provided with and connects described cock body and metallized the second conductive hole, and described cock body is by described the first conductive hole and described the second conductive hole isolation.
6. multi-layer PCB board according to claim 5, is characterized in that,
The degree of depth in described the first back drill hole is less than the thickness of described the first back drill layer.
7. multi-layer PCB board according to claim 5, is characterized in that,
The degree of depth in described the second back drill hole is less than the thickness of described the second back drill layer.
8. according to the multi-layer PCB board described in claim 5 to 7 any one, it is characterized in that,
The central shaft of described the first conductive hole overlaps with the central shaft of described the second conductive hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210197950.9A CN103517578B (en) | 2012-06-15 | A kind of multi-layer PCB board manufacture method and multi-layer PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210197950.9A CN103517578B (en) | 2012-06-15 | A kind of multi-layer PCB board manufacture method and multi-layer PCB board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103517578A true CN103517578A (en) | 2014-01-15 |
| CN103517578B CN103517578B (en) | 2016-11-30 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103889147A (en) * | 2014-04-04 | 2014-06-25 | 杭州华三通信技术有限公司 | Machining method of PCB stepped plate and PCB stepped plate |
| CN104023484A (en) * | 2014-05-09 | 2014-09-03 | 东莞市五株电子科技有限公司 | Manufacturing method of printed circuit board overlaid through hole structure |
| CN104902694A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | Internal-layer thick-copper circuit board processing method and internal-layer thick-copper circuit board |
| CN105472861A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Printed circuit board radiating via hole manufacturing method and printed circuit board |
| CN105578748A (en) * | 2016-03-14 | 2016-05-11 | 江苏普诺威电子股份有限公司 | PCB backdrilling hole structure and processing method thereof |
| TWI578873B (en) * | 2016-06-13 | 2017-04-11 | 健鼎科技股份有限公司 | Manufacturing method of high-density multilayer board |
| CN110392484A (en) * | 2018-04-18 | 2019-10-29 | 北大方正集团有限公司 | Circuit board drilling method and device |
| CN114126257A (en) * | 2020-08-27 | 2022-03-01 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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| US6787710B2 (en) * | 2001-05-29 | 2004-09-07 | Mitsubishi Denki Kabushiki Kaisha | Wiring board and a method for manufacturing the wiring board |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902694A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | Internal-layer thick-copper circuit board processing method and internal-layer thick-copper circuit board |
| CN104902694B (en) * | 2014-03-05 | 2018-02-23 | 深南电路有限公司 | The processing method and inner-layer thick copper circuit board of inner-layer thick copper circuit board |
| CN103889147A (en) * | 2014-04-04 | 2014-06-25 | 杭州华三通信技术有限公司 | Machining method of PCB stepped plate and PCB stepped plate |
| CN104023484A (en) * | 2014-05-09 | 2014-09-03 | 东莞市五株电子科技有限公司 | Manufacturing method of printed circuit board overlaid through hole structure |
| CN105472861A (en) * | 2014-09-05 | 2016-04-06 | 深南电路有限公司 | Printed circuit board radiating via hole manufacturing method and printed circuit board |
| CN105472861B (en) * | 2014-09-05 | 2018-05-29 | 深南电路有限公司 | A kind of method and printed circuit board of the manufacture of printed circuit board dissipating vias |
| CN105578748A (en) * | 2016-03-14 | 2016-05-11 | 江苏普诺威电子股份有限公司 | PCB backdrilling hole structure and processing method thereof |
| TWI578873B (en) * | 2016-06-13 | 2017-04-11 | 健鼎科技股份有限公司 | Manufacturing method of high-density multilayer board |
| CN110392484A (en) * | 2018-04-18 | 2019-10-29 | 北大方正集团有限公司 | Circuit board drilling method and device |
| CN110392484B (en) * | 2018-04-18 | 2020-12-04 | 北大方正集团有限公司 | Circuit board drilling method and device |
| CN114126257A (en) * | 2020-08-27 | 2022-03-01 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN114126257B (en) * | 2020-08-27 | 2024-03-22 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |