CN104902675A - Step-groove circuit board and processing method thereof - Google Patents
Step-groove circuit board and processing method thereof Download PDFInfo
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- CN104902675A CN104902675A CN201410079057.5A CN201410079057A CN104902675A CN 104902675 A CN104902675 A CN 104902675A CN 201410079057 A CN201410079057 A CN 201410079057A CN 104902675 A CN104902675 A CN 104902675A
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- blind hole
- step groove
- metal derby
- pressing plate
- circuit board
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Abstract
The invention discloses a step-groove circuit board and a processing method thereof so as to solve various problems existing when producing the step-groove circuit board, where metalized through holes are designed in a step-groove area in the prior art. The method comprises the following steps: processing a first surface of a first laminated board to form first blind holes and metalizing the blind holes, the bottom portion of each of the first blind holes reaching or penetrating into a first surface of a metal block in the first laminated board; arranging a pad in the step-groove area of the first surface of the first inner-layer board and laminating a second laminated board; processing a second surface of the first laminated board to form M second blind holes and metalizing the blind holes, the positions of the M second blind holes being in one-to-one correspondence with the positions of the M first blind holes and positions of the M metal blocks respectively, and the bottom portion of each second blind hole reaching or penetrating into a second surface of the corresponding metal block; carrying out slotting on the step-groove area of the second laminated board and taking the pad out to form a step groove; and drilling the M metal blocks between the M first blind holes and the M second blind holes to form M metalized through holes.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of step groove circuit board and processing method thereof.
Background technology
The application of current step groove circuit board gets more and more, and wherein there is so a kind of particular design, that is, step groove envisaged underneath has plated-through hole, be used for doing spliced eye or via or louvre, and this plated-through hole does not allow by consent.
This kind has the manufacture method of the step groove circuit board of plated-through hole to comprise the following steps in step groove zone design: the pressing of non-step level, hole in step groove position, heavy copper plating, paste pad, the pressing of step level, heavy copper plating, outer graphics makes, step is slotted, desmearing, and surface makes.
But there is following defect in above-mentioned manufacture method:
1, before the pressing of step level, step groove region forms plated-through hole, and in step level bonding processes, easily causes impurity booty to enter plated-through hole, causes plug-hole, and making cannot grafting components and parts;
2, in step level bonding processes, under high pressure and high temperature conditions, plated-through hole is very easy to distortion, and open circuit appears in causing hole copper cracking;
3, plated-through hole has higher radius-thickness ratio, when the heavy copper plating of second time, is easily formed plated-through hole and pollutes, form plating knurl in plated-through hole.
Summary of the invention
The embodiment of the present invention provides a kind of step groove circuit board and processing method thereof, has to solve prior art making step groove zone design the above-mentioned various problems existed during the step groove circuit board of plated-through hole.
First aspect present invention provides a kind of processing method of step groove circuit board, comprising:
There is provided ground floor pressing plate, the internal layer of described ground floor pressing plate is embedded with M metal derby, M be more than or equal to 1 positive integer;
Process M the first blind hole at the first surface of described ground floor pressing plate and described M the first blind hole is metallized, the position one_to_one corresponding of described M the first blind hole and a described M metal derby, and the bottom of described first blind hole is arrived at or the first surface of deeply corresponding metal derby;
In the step groove region of the first surface of described first inner plating, pad is set, and pressing second layer pressing plate, described M the first blind hole is positioned at described step groove region;
Process M the second blind hole and described M the second blind hole is metallized for second at described ground floor pressing plate, the position one_to_one corresponding of described M the second blind hole and described M the first blind hole and a described M metal derby, and the bottom of described second blind hole is arrived at or deeply corresponding to second of metal derby;
Slot in the step groove region of described second layer pressing plate and take out described pad, forming step groove;
Described M metal derby between described M the first blind hole and described M the second blind hole is drilled, forms M plated-through hole.
Second aspect present invention provides a kind of step groove circuit board.
The first surface of described step groove circuit board has step groove, and the bottom surface of described step groove has the plated-through hole being through to described step groove circuit board second.
Therefore, the embodiment of the present invention adopts and bury metal derby underground in laminated sheet, need the plated-through hole formed to be decomposed into two metalized blind vias connected by described metal derby in step groove region to make respectively, finally drill the technical scheme forming plated-through hole again, make:
1, before the pressing of step level, the plated-through hole in step groove region is not yet formed, only there is metallized first blind hole, and be provided with pad protection, thus, in step level bonding processes, impurity booty can be avoided to enter, can not plug-hole, prior art can be solved easily because pressing causes the technical problem of plated-through hole plug-hole;
2, in step level bonding processes, metallized first blind hole, because the degree of depth is less and metal derby and substrate support are arranged at bottom, therefore, can not be out of shape because of high pressure and high temperature, can not causing hole copper cracking open circuit;
3, when the heavy copper plating of second time, only need to metallize to the second blind hole, radius-thickness ratio is less, is not easy to be formed to pollute, and can not form plating knurl;
4, finally the first blind hole and the second blind hole are drilled the step forming plated-through hole, the impurity booty that may exist in the first blind hole and the second blind hole can be removed.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the processing method of a kind of step groove circuit board that the embodiment of the present invention provides;
Fig. 2 a and 2b is vertical view and the end view of metal derby module respectively;
Fig. 2 c and 2d is the schematic diagram after the first laminate piles and pressing respectively;
Fig. 3 a is the schematic diagram processing the first blind hole on ground floor pressing plate;
Fig. 3 b is the schematic diagram at ground floor pressing plate first surface processing line figure;
Fig. 3 c is the schematic diagram arranging pad on ground floor pressing plate;
Fig. 3 d is the schematic diagram of pressing second layer pressing plate on ground floor pressing plate;
Fig. 3 e is the schematic diagram processing the second blind hole on ground floor pressing plate;
Fig. 3 f is the schematic diagram of processing step groove on the multilayer circuit board that obtains in pressing;
Fig. 3 g is the final schematic diagram forming plated-through hole on the step groove circuit board obtained.
Embodiment
The embodiment of the present invention provides a kind of step groove circuit board and processing method thereof, has to solve prior art making step groove zone design the various problems existed during the step groove circuit board of plated-through hole.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of processing method of step groove circuit board, can comprise:
110, provide ground floor pressing plate, the internal layer of described ground floor pressing plate is embedded with M metal derby, M be more than or equal to 1 positive integer.
Suppose the last multilayer circuit board needing to make (P+Q) layer, wherein, wherein P and Q is the positive integer being more than or equal to 1; Further, need processing step groove on this multilayer circuit board, suppose that step groove is positioned at (P+1) layer to (P+Q) layer.
In this step, make ground floor pressing plate in advance, this ground floor pressing plate comprises the 1st layer to P layer.Suppose that the step groove bottom design of step groove circuit board has M plated-through hole, this M plated-through hole needs to be positioned at the step groove region of ground floor pressing plate and runs through ground floor pressing plate.
In the present embodiment, M metal derby can be buried underground in a certain internal layer of ground floor pressing plate, and the position making M metal derby lay respectively at M plated-through hole to pass through.The shape of metal derby can be disc or cylindrical or other arbitrary shape, and this metal derby needs the cross section slightly larger than plated-through hole.The thickness of metal derby can be greater than 0.1 millimeter, such as 0.3 millimeter.
In order to avoid in bonding processes, M metal derby displacement, M metal derby can be fixed on one piece of support plate and make metal derby module, then the internal layer metal derby module comprising support plate being buried underground ground floor pressing plate carries out pressing.The shape of support plate can be identical with ground floor pressing plate with size, as an internal layer of ground floor pressing plate; The shape of support plate and size also can be only suitable with step groove region; The shape of support plate and size can also design according to other needs.
In some embodiments of the invention, the said ground floor pressing plate that provides can comprise:
As shown in figures 2 a and 2b, make metal derby module 20, described metal derby module 20 comprises support plate 21 and is positioned at M metal derby 22 on described support plate 21.
As illustrated in figures 2 c and 2d, the copper-clad plate and the described metal derby module 20 that at least two have been formed with line pattern carry out stacked and pressing, and obtained ground floor pressing plate 30, makes described metal derby module 20 be embedded in the internal layer of described ground floor pressing plate 30.
In a kind of execution mode, the method making metal derby module 20 can comprise: blanking single-side coated copper plate, supposes that the thickness of the copper foil layer of this single-side coated copper plate is 6OZ(about 0.21 millimeter), thickness of dielectric layers is 0.15mm; Can adopt the mode thickening plating that Copper Foil thickness is plated to 8-9OZ(and be about 0.3mm); Then, according to large 5mm more than size design metal derby module more monolateral than step groove slot area, protect single-side coated copper plate needing the region overlay etchant resist forming described metal derby, copper foil layer etching single-side coated copper plate not covering etchant resist is removed, only retains the copper foil layer of the position corresponding to plated-through hole as metal derby 22; Finally, by profile Milling Machining, obtain the metal derby module of required size and shape, as shown in figures 2 a and 2b.
In a kind of execution mode, at least two are formed with the copper-clad plate of line pattern and described metal derby module 20 to carry out stacked and pressing and comprise: in each layer copper-clad plate, form thread circuit in advance, then as shown in Figure 2 c, stack gradually copper foil layer, insulating bond, copper-clad plate, insulating bond, metal derby module, insulating bond, copper-clad plate, insulating bond and copper foil layer, and carry out pressing, as shown in Figure 2 d, ground floor pressing plate 30 is obtained.
120, process M the first blind hole at the first surface of described ground floor pressing plate and described M the first blind hole is metallized, the position one_to_one corresponding of described M the first blind hole and a described M metal derby, and the bottom of described first blind hole is arrived at or the first surface of deeply corresponding metal derby.
In this step, as shown in Figure 3 a, need the position forming M plated-through hole to hole at the first surface of ground floor pressing plate 30, but drilling depth only arrives or the first surface of deeply corresponding metal derby 22, form M the first blind hole 31.Then, heavy copper and plating can be carried out to ground floor pressing plate 30, deposit one deck at the first blind hole 31 inwall and sink copper electrodeposited coating, the first blind hole 31 is metallized.Then, common process can be adopted on the copper foil layer of ground floor pressing plate first surface to be processed to form line pattern, as shown in Figure 3 b.
130, pad is set in the step groove region of the first surface of described first inner plating, and pressing second layer pressing plate, described M the first blind hole is positioned at described step groove region.
In this step, as shown in Figure 3 c, silica gel or plasticizing glue or the pad 33 of Teflon or other material are set in the step groove region of the first surface of the first inner plating 30, the line pattern in step groove region and the first blind hole 31 are protected.
Then, as shown in Figure 3 d, carry out pressing at the stacked second layer pressing plate 40 of the first surface of the first inner plating 30, obtain the multilayer circuit board of the required number of plies.Wherein, said second layer pressing plate 40 includes above-mentioned (P+1) layer to (P+Q) layer, and before lamination, (P+1) layer defines line pattern to each internal layer of (P+Q) layer.
140, process M the second blind hole at second of described ground floor pressing plate and described M the second blind hole is metallized, the position one_to_one corresponding of described M the second blind hole and described M the first blind hole and a described M metal derby, and the bottom of described second blind hole is arrived at or deeply corresponding to second of metal derby.
In this step, as shown in Figure 3 e, need the position forming M plated-through hole to hole second of ground floor pressing plate 30, but drilling depth only arrive or second of deeply corresponding metal derby 22, forms individual second blind hole 32 of M.Wherein, the first blind hole 31 is identical with the diameter of the second blind hole, equals the diameter needing the plated-through hole formed.
In this drill process, except getting out the second blind hole 32, each position of the multilayer circuit board that can also simultaneously obtain in pressing, gets out required various through hole or blind hole.
Then, heavy copper and plating can be carried out to the multilayer circuit board obtained, deposit one deck at the second blind hole 32 inwall and sink copper electrodeposited coating, the second blind hole 32 is metallized.Wherein, if this step has also bored other through hole or blind hole, then other through hole or blind hole have been metallized simultaneously.
Then, common process can be adopted on the copper foil layer on multilayer circuit board two sides to be processed to form line pattern.
150, slot in the step groove region of described second layer pressing plate and take out described pad, forming step groove.
In this step, as illustrated in figure 3f, the dark miller skill of control can be adopted in the step groove region of multilayer circuit board, processing runs through the fluting of second layer pressing plate 40, be arranged on the pad 33 of ground floor pressing plate 30 first surface before this fluting exposes, then pad 33 taken out, the step groove 41 required for formation.Step groove 41 bottom-exposed goes out the first blind hole 31 and exposes the line pattern (that is, surperficial pinup picture shape) that part is formed in ground floor pressing plate 30 first surface.Bore dirty grade for impurity if remained in step groove 41, the step of a desmearing after forming step groove 41, can also be comprised.
160, described M metal derby between described M the first blind hole and described M the second blind hole is drilled, form M plated-through hole.
As can be seen from Fig. 3 f, below step groove 41, defined M metallized first blind hole 31 and M metallized second blind hole 32, and the first blind hole 31 of every a pair correspondence and the second blind hole 32 are by middle metal derby 22 electric connector.
In this step, as shown in figure 3g, again needing the position forming M plated-through hole to hole, the first blind hole 31 of every a pair correspondence and the second blind hole 32 are being drilled by middle metal derby 22, forms final M the plated-through hole 34 formed.Wherein, in order to avoid the metallized inwall of damage, this holes the diameter of drill bit adopted should be smaller, such as, can adopt the drill bit of 0.3mm to 0.5mm less of the diameter of described first blind hole or the second blind hole, be drilled by M metal derby 22.M the plated-through hole 34 formed can be used for doing insert hole or via or louvre etc.
To sum up, the embodiment of the invention discloses a kind of processing method of step groove circuit board, the method adopts and bury metal derby underground in laminated sheet, need the plated-through hole formed to be decomposed into two metalized blind vias connected by described metal derby in step groove region to make respectively, the last technical scheme drilling formation plated-through hole again, achieves following beneficial effect:
1, before the pressing of step level, the plated-through hole in step groove region is not yet formed, only there is metallized first blind hole, and be provided with pad protection, thus, in step level bonding processes, impurity booty can be avoided to enter, can not plug-hole, prior art can be solved easily because pressing causes the technical problem of plated-through hole plug-hole;
2, in step level bonding processes, metallized first blind hole, because the degree of depth is less and metal derby and substrate support are arranged at bottom, therefore, can not be out of shape because of high pressure and high temperature, can not causing hole copper cracking open circuit;
3, when the heavy copper plating of second time, only need to metallize to the second blind hole, radius-thickness ratio is less, is not easy to be formed to pollute, and can not form plating knurl;
4, finally the first blind hole and the second blind hole are drilled the step forming plated-through hole, the impurity booty that may exist in the first blind hole and the second blind hole can be removed.
Please refer to Fig. 3 g, the embodiment of the present invention also provides a kind of step groove circuit board, and the first surface of described step groove circuit board has step groove 41, and the bottom surface of described step groove 41 has the plated-through hole 34 being through to described step groove circuit board second.
In some embodiments of the invention, the bottom surface of described step groove 41 has surperficial pinup picture shape, and described surperficial pinup picture shape by described plated-through hole 34, is connected with the line pattern of described step groove second or other inner line figure.
This plated-through hole 34 also can be used as spliced eye, and in step groove, the stitch of electronic component can insert this plated-through hole 34.Or this plated-through hole 34 also as louvre, can be used for as the electronic component in step groove dispels the heat.
To sum up, the embodiment of the present invention discloses a kind of step groove circuit board, and the processing method that this step groove circuit board can adopt embodiment one to record obtains, more detailed content, please refer to the content recorded in embodiment one.Have plated-through hole below the step groove of this step groove circuit board, this plated-through hole can be used as via or spliced eye or louvre, to meet multiple demand.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
It should be noted that, for aforesaid each embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other order or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.
The step groove circuit board provided the embodiment of the present invention above and processing method thereof are described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (9)
1. a processing method for step groove circuit board, is characterized in that, comprising:
There is provided ground floor pressing plate, the internal layer of described ground floor pressing plate is embedded with M metal derby, M be more than or equal to 1 positive integer;
Process M the first blind hole at the first surface of described ground floor pressing plate and described M the first blind hole is metallized, the position one_to_one corresponding of described M the first blind hole and a described M metal derby, and the bottom of described first blind hole is arrived at or the first surface of deeply corresponding metal derby;
In the step groove region of the first surface of described first inner plating, pad is set, and pressing second layer pressing plate, described M the first blind hole is positioned at described step groove region;
Process M the second blind hole and described M the second blind hole is metallized for second at described ground floor pressing plate, the position one_to_one corresponding of described M the second blind hole and described M the first blind hole and a described M metal derby, and the bottom of described second blind hole is arrived at or deeply corresponding to second of metal derby;
Slot in the step groove region of described second layer pressing plate and take out described pad, forming step groove;
Described M metal derby between described M the first blind hole and described M the second blind hole is drilled, forms M plated-through hole.
2. method according to claim 1, is characterized in that, described in provide ground floor pressing plate to comprise:
Make metal derby module, described metal derby module comprises support plate and is positioned at M metal derby on described support plate;
The copper-clad plate and the described metal derby module that at least two have been formed with line pattern carry out stacked and pressing, and obtained ground floor pressing plate, makes described metal derby module be embedded in the internal layer of described ground floor pressing plate.
3. method according to claim 1, is characterized in that, described making metal derby module comprises:
Protect single-side coated copper plate needing the region overlay etchant resist forming described metal derby;
The copper foil layer etching described single-side coated copper plate not covering etchant resist is removed, obtained metal derby module.
4. method according to claim 1, is characterized in that, the step groove region of the described first surface at described multilayer circuit board also comprises before arranging pad:
Line pattern is made at the first surface of described multilayer circuit board.
5. method according to claim 1, is characterized in that, the described step groove region at described second layer pressing plate fluting comprises:
The dark miller skill of control is adopted to slot in the step groove region of described second layer pressing plate.
6. method according to claim 1, is characterized in that, described described M metal derby between described M the first blind hole and described M the second blind hole is drilled before also comprise:
The two sides of the multilayer circuit board obtained after pressing makes outer-layer circuit figure respectively.
7. method according to claim 1, is characterized in that, described first blind hole is identical with the diameter of the second blind hole, and described being drilled by described M metal derby between described M the first blind hole and described M the second blind hole comprises:
Adopt the drill bit of 0.3mm to 0.5mm less of the diameter of described first blind hole or the second blind hole, described M metal derby between described M the first blind hole and individual second blind hole of described M is drilled.
8. a step groove circuit board, is characterized in that:
The first surface of described step groove circuit board has step groove, and the bottom surface of described step groove has the plated-through hole being through to described step groove circuit board second.
9. step groove circuit board according to claim 8, is characterized in that:
The bottom surface of described step groove has surperficial pinup picture shape, and described surperficial pinup picture shape by described plated-through hole, is connected with the line pattern of described step groove second or other inner line figure.
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| CN201410079057.5A CN104902675B (en) | 2014-03-05 | 2014-03-05 | A kind of step groove circuit board and its processing method |
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| CN201410079057.5A CN104902675B (en) | 2014-03-05 | 2014-03-05 | A kind of step groove circuit board and its processing method |
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| CN104902675B CN104902675B (en) | 2018-08-07 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235600A (en) * | 2017-12-28 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The preparation method of printed wiring board |
| CN110213910A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of production method of 5G high frequency mixed pressure stepped circuit board |
| CN111113549A (en) * | 2019-12-16 | 2020-05-08 | 广州兴森快捷电路科技有限公司 | Ultra-thick core plate punching system and ultra-thick core plate punching method |
| WO2021143102A1 (en) * | 2020-01-15 | 2021-07-22 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high density interconnect hdi board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1744794A (en) * | 2004-09-03 | 2006-03-08 | 华为技术有限公司 | Step type printed circuit board and its manufacturing method |
| CN101069459A (en) * | 2005-11-07 | 2007-11-07 | 松下电器产业株式会社 | Multilayer printed wiring board and process for producing the same |
| CN101695224A (en) * | 2009-11-06 | 2010-04-14 | 深南电路有限公司 | Method for processing multilayer printed circuit board |
| CN101820728A (en) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | Technological method for processing printed circuit board (PCB) with stepped groove |
| JP2012169598A (en) * | 2011-01-26 | 2012-09-06 | Sumitomo Bakelite Co Ltd | Printed wiring board and manufacturing method therefor |
-
2014
- 2014-03-05 CN CN201410079057.5A patent/CN104902675B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1744794A (en) * | 2004-09-03 | 2006-03-08 | 华为技术有限公司 | Step type printed circuit board and its manufacturing method |
| CN101069459A (en) * | 2005-11-07 | 2007-11-07 | 松下电器产业株式会社 | Multilayer printed wiring board and process for producing the same |
| CN101695224A (en) * | 2009-11-06 | 2010-04-14 | 深南电路有限公司 | Method for processing multilayer printed circuit board |
| CN101820728A (en) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | Technological method for processing printed circuit board (PCB) with stepped groove |
| JP2012169598A (en) * | 2011-01-26 | 2012-09-06 | Sumitomo Bakelite Co Ltd | Printed wiring board and manufacturing method therefor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235600A (en) * | 2017-12-28 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The preparation method of printed wiring board |
| CN110213910A (en) * | 2019-04-17 | 2019-09-06 | 奥士康科技股份有限公司 | A kind of production method of 5G high frequency mixed pressure stepped circuit board |
| CN111113549A (en) * | 2019-12-16 | 2020-05-08 | 广州兴森快捷电路科技有限公司 | Ultra-thick core plate punching system and ultra-thick core plate punching method |
| CN111113549B (en) * | 2019-12-16 | 2021-11-09 | 广州兴森快捷电路科技有限公司 | Ultra-thick core plate punching system and ultra-thick core plate punching method |
| WO2021143102A1 (en) * | 2020-01-15 | 2021-07-22 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high density interconnect hdi board |
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| Publication number | Publication date |
|---|---|
| CN104902675B (en) | 2018-08-07 |
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