CN102438413B - Second-order ladder groove bottom graphical printed board and processing method thereof - Google Patents

Second-order ladder groove bottom graphical printed board and processing method thereof Download PDF

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Publication number
CN102438413B
CN102438413B CN201110314227.XA CN201110314227A CN102438413B CN 102438413 B CN102438413 B CN 102438413B CN 201110314227 A CN201110314227 A CN 201110314227A CN 102438413 B CN102438413 B CN 102438413B
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CN
China
Prior art keywords
daughter board
motherboard
board
printed board
bottom
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CN201110314227.XA
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Chinese (zh)
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CN102438413A (en
Inventor
杨泽华
任代学
关志峰
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广州杰赛科技股份有限公司
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Publication of CN102438413A publication Critical patent/CN102438413A/en
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Publication of CN102438413B publication Critical patent/CN102438413B/en

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Abstract

The invention relates to the printed circuit board technology field, especially relating to a processing method of a second-order ladder groove bottom graphical printed board. The method comprises the following steps: carrying out a pretreatment on a first daughter board which reserves a plug-in hole, a second daughter board provided with a circuit graph and a third daughter board provided with a circuit graph; pressing the first daughter board and the second daughter board to obtain a first motherboard; carrying out distressing, hole drilling, copper deposition, internal layer figure transfer, and etching resistance metal protective layer plating treatments on the first motherboard to obtain a second motherboard; pressing the third daughter board and the second motherboard to obtain a third motherboard; carrying out distressing, hole drilling, copper deposition, external layer figure transfer treatments on the third motherboard to obtain a finished second-order ladder groove bottom graphical printed board. According to the second-order ladder groove bottom graphical printed board prepared by the method, each ladder can be subjected to wiring and plug-in installation, and a usage scope of a plate is expanded. The invention also relates to the second-order ladder groove bottom graphical printed board.

Description

A kind of graphical printed board at bottom of dual-step ladder groove and processing method thereof

Technical field

The present invention relates to printed circuit board technology field, especially relate to a kind of graphical printed board at bottom of dual-step ladder groove and processing method thereof.

Background technology

At present, prior art is carried out ladder groove bottom graphical printed board processing, general adopt ink that bottom land through hole is filled up or make by the mode that special adhesive tape one side seals the through hole of step trough bottom, to avoid motherboard to enter bottom land graph area and attack the line pattern in this region sinking the liquid medicine that is passed through hole in copper, plating, etching process.

But; the processing method of this ladder groove bottom graphical printed board is not really lived printed board step trough bottom figure route protection; if adopted, bottom land through hole is all filled up to method, make ladder groove bottom graphical circuit that plug-in unit device cannot be installed; and can only surface-mounted device be installed at bottom land, the scope of application of plate is restricted.If the through hole mode that adopts special adhesive tape one side to seal step trough bottom is produced, because ladder bottom metalization hole and figure are not really protected, when doing for the second time ladder, can, because etching solution infilter second ladder bottom metalization hole internal corrosion figure and plated-through hole, cause and cannot produce the printed board of second order ladder; And the through hole mode that adopts special adhesive tape one side to seal step trough bottom produces adhesive tape and easily come off in heavy copper process, liquid medicine infilters figure zonal corrosion figure circuit bottom step trough and causes printed board to be scrapped; The position of taping can only be carried out figure in advance, if adopt existing method to make graphical printed board at bottom of dual-step ladder groove, prior art cannot be made the line pattern of adhesive tape protective position.

Summary of the invention

The invention provides a kind of graphical printed board at bottom of dual-step ladder groove, by protective layer being set with protection circuit figure not under fire at circuit patterned surface, each ladder can being connected up and plug-in unit is installed, thereby having expanded the scope of application of plate.

The present invention also provides a kind of processing method of graphical printed board at bottom of dual-step ladder groove, and each ladder of the graphical printed board at bottom of dual-step ladder groove of its processing can connect up and plug-in unit is installed, and has expanded the scope of application of plate.

For solving the problems of the technologies described above, the technical solution used in the present invention is:

A processing method for graphical printed board at bottom of dual-step ladder groove, is characterized in that, comprises the following steps:

(1) preliminary treatment be reserved with insert hole the first daughter board, be provided with line pattern the second daughter board, be provided with the 3rd daughter board of line pattern;

(2) described the second daughter board is pressed together on the first daughter board, obtains the first motherboard;

(3) described the first motherboard is shifted, plated anti-etching coat of metal and process through destressing, boring, heavy copper, inner figure, obtain the second motherboard;

(4) described the 3rd daughter board is pressed together on the second motherboard, obtains the 3rd motherboard;

(5) described the 3rd motherboard is shifted through destressing, boring, heavy copper, outer graphics, obtain finished product graphical printed board at bottom of dual-step ladder groove.

Electroless copper, be commonly called as heavy copper, it is a kind of autocatalysis redox reaction, can on non-conductive matrix, deposit, the effect of electroless copper is to realize hole metallization, thereby make double sided board, multi-layer sheet realize interconnection between layers, develop rapidly along with electronics industry, more tired higher to the manufacturing requirement of wiring board, the level of wiring board is more and more, the hole count of same plate is more and more, and aperture is more and more less, and the metallization quality in these holes directly has influence on electric Performance And Reliability.

The present invention shifts described the first motherboard, plate anti-etching coat of metal and processes through destressing, boring, heavy copper, inner figure, at circuit patterned surface, is provided with anti-etching coat of metal, and protection figure circuit is not subject to etching.This anti-etching coat of metal can sink on surface copper, electric plating of whole board, and through desmearing, microetch, electroplating liquid medicine, etching solution, takes off film liquid medicine, brown liquid medicine and after soaking, there will not be corrosion and discoloration problem.

Because the rotating speed of boring procedure bit is very high, can reach 16-18 ten thousand rpm, and expoxy glass base material is non-conductor, during boring, can produce at short notice high temperature, high temperature can leave many gum residues on hole wall, thereby forming the epoxy resin that one deck is thin bores dirty, because this resin diamond is dirty not firm with the adhesion of hole wall, when directly sinking copper, the adhesion of chemical copper and hole wall, particularly multi-layer sheet will be affected, the conducting of chemical copper layer and internal layer copper can be affected, and desmearing is removed these residues exactly, improve hole wall structure.

Alternatively, preliminary treatment is reserved with the first daughter board, the second daughter board, the 3rd daughter board of insert hole, comprises following operation: the first daughter board is carried out successively interior photoimaging, the detection of internal layer automated optical, plates anti-etching coat of metal, punching; The second daughter board is carried out to inner figure transfer, punching, the detection of internal layer automated optical, hole milling successively; The 3rd daughter board is carried out to inner figure transfer, punching, the detection of internal layer automated optical, hole milling successively.

Alternatively, the first motherboard is obtained to the second motherboard through processing, comprise successively following operation: destressing, boring, heavy copper, electric plating of whole board, interior photoimaging, inner figure shift, internal layer automated optical detects, plate anti-etching coat of metal, punching.

Alternatively, the 3rd motherboard obtained to finished product graphical printed board at bottom of dual-step ladder groove through processing, comprise successively following operation: destressing, boring, heavy copper, outer photoimaging, outer graphics transfer, outer automated optical detection, surface treatment, to choose wire, bore non-heavy copper hole, milling profile.Heavy copper hole is PTH, and hole wall has copper, is generally electric hole and component hole; Non-heavy copper hole is NPTH, and hole wall, without copper, is generally location hole and gong silk hole, available dry film sealing of hole or micelle plug or the rear secondary drilling of plating before plating.

As improvement, when described the first daughter board, the second daughter board pass through cured sheets pressing, form the first groove, in described the first groove, place silicagel pad, and take out after pressing, obtain the first motherboard; When described the 3rd daughter board, the second motherboard pass through cured sheets pressing, form the second groove, in described the second groove, place silicagel pad, and take out after pressing, obtain the 3rd motherboard.Silicagel pad has certain pliability, good insulating properties, compressibility, the natural viscosity in surface, can blind, complete the heat transmission of heating position and radiating part interdigit, and also play the effects such as insulation, damping, sealing simultaneously.This programme all arranges silicagel pad in described the first groove, the second groove, the further perfect pressing working procedure of substrate.

Preferably, in described the first groove, the second groove, pad is all set.Pad can be selected FR-4 pad, guarantees that pad pasting is smooth, prevents that figure from occurring while shifting ill-exposed.

Be further improved, between described line pattern and insert hole, be provided with wire, the electroplating clamp point conducting of described wire and daughter board edges of boards.By between line pattern and insert hole, wire being set, guarantee the electroplating clamp point conducting of line pattern, insert hole and daughter board edges of boards, be conducive to the work of graphical printed board.

A kind of graphical printed board at bottom of dual-step ladder groove; comprise the daughter board set that is provided with insert hole of pressing and second-order ladder groove bottom graphical moulding; described daughter board set comprises by prepreg successively bonding the first daughter board, the second daughter board and the 3rd daughter board; between the first daughter board and the second daughter board, the second daughter board and the 3rd daughter board, be provided with line pattern, it is characterized in that: described line pattern surface is provided with anti-etching coat of metal.

Described line pattern surface is provided with anti-etching coat of metal, and protection figure circuit is not subject to etching.This anti-etching coat of metal can sink on surface copper, electric plating of whole board, and through desmearing, microetch, electroplating liquid medicine, etching solution, takes off film liquid medicine, brown liquid medicine and after soaking, there will not be corrosion and discoloration problem.

Compared with prior art, the invention has the beneficial effects as follows:

Graphical printed board at bottom of dual-step ladder groove of the present invention arranges protective layer at circuit patterned surface; complete preservation line pattern and hole are not subject to desmearing, microetch, electroplating liquid medicine, etching solution; take off the attack of film liquid medicine, brown liquid medicine etc.; make each ladder of second order ladder can connect up and plug-in unit is installed, thereby expanded the scope of application of plate.

The processing method of graphical printed board at bottom of dual-step ladder groove of the present invention, each ladder of the graphical printed board at bottom of dual-step ladder groove of its processing can connect up and plug-in unit is installed, and has expanded the scope of application of plate.

Accompanying drawing explanation

Fig. 1 is first stage printed board schematic diagram in the processing method of graphical printed board at bottom of dual-step ladder groove of the present invention;

Fig. 2 is second stage printed board schematic diagram in the processing method of graphical printed board at bottom of dual-step ladder groove of the present invention;

Fig. 3 is phase III printed board schematic diagram in the processing method of graphical printed board at bottom of dual-step ladder groove of the present invention;

Fig. 4 is fourth stage printed board schematic diagram in the processing method of graphical printed board at bottom of dual-step ladder groove of the present invention;

Fig. 5 is five-stage printed board schematic diagram in the processing method of graphical printed board at bottom of dual-step ladder groove of the present invention.

Embodiment

Below in conjunction with embodiment, the present invention is further illustrated.

Embodiment as Fig. 1 to Fig. 5 processing method that is graphical printed board at bottom of dual-step ladder groove of the present invention, comprises the following steps:

(1) prepare to make the substrate of required daughter board set 10, be reserved with insert hole 16 the first daughter board 11, be provided with line pattern 14 the second daughter board 12, be provided with the 3rd daughter board 13 of line pattern 14;

(2) preliminary treatment be reserved with insert hole 16 the first daughter board 11, be provided with line pattern 14 the second daughter board 12, be provided with the 3rd daughter board 13 of line pattern 14;

Wherein, preliminary treatment is reserved with the first daughter board 11, the second daughter board 12, the 3rd daughter board 13 of insert hole 16, comprises following operation: the first daughter board 11 is carried out successively interior photoimaging, internal layer automated optical detection (AOI), plates anti-etching coat of metal 15, punching; The second daughter board 12 is carried out to inner figure transfer, punching, the detection of internal layer automated optical, hole milling successively; The 3rd daughter board 13 is carried out to inner figure transfer, punching, the detection of internal layer automated optical, hole milling successively.

(3) pressing the first daughter board 11, the second daughter board 12, be pressed together on the second daughter board 12 on the first daughter board 11, obtains the first motherboard 31;

Wherein, the first daughter board 11, the second daughter board 12 are bonding by prepreg 20.Prepreg 20 is the high frequency prepreg after hole milling, is between the first daughter board 11 and the second daughter board 12 by closing-up in daughter board set 10 simultaneously.

When the first daughter board 11, the second daughter board 12 pass through cured sheets pressing, form the first groove, in the first groove, place silicagel pad 40, and take out after pressing, obtain the first motherboard 31.Silicagel pad has certain pliability, good insulating properties, compressibility, the natural viscosity in surface, can blind, complete the heat transmission of heating position and radiating part interdigit, and also play the effects such as insulation, damping, sealing simultaneously.This programme arranges silicagel pad 40 in the first groove, the further perfect pressing working procedure of substrate.As improvement, in the first groove, also pad can be set.Pad can be selected FR-4 pad, guarantees that pad pasting is smooth, prevents that figure from occurring while shifting ill-exposed.

(4) the first motherboard 31 is obtained to the second motherboard 32 through processing, comprise successively following operation: destressing, boring, heavy copper, electric plating of whole board, interior photoimaging, inner figure shift, internal layer automated optical detects, plate anti-etching coat of metal 15, punching.The second motherboard 32 obtaining in this step comprises insert hole 16, line pattern 14 and anti-etching coat of metal 15.

(5) pressing the 3rd daughter board 13, the second motherboard 32, be pressed together on the 3rd daughter board 13 on the second motherboard 32, obtains the 3rd motherboard 33;

Wherein, the 3rd daughter board 13, the second motherboard 32 are bonding by prepreg 20.Prepreg 20 is the high frequency prepreg after hole milling, is between the 3rd daughter board 13 and the second motherboard 32 by closing-up in daughter board set 10 simultaneously.

When the 3rd daughter board 13, the second motherboard 32 pass through cured sheets pressing, form the second groove, in the second groove, place silicagel pad 40, and take out after pressing, obtain the 3rd motherboard 33.

(6) the 3rd motherboard 33 is obtained to finished product graphical printed board at bottom of dual-step ladder groove 50 through processing, comprise successively following operation: destressing, boring, heavy copper, outer photoimaging, outer graphics transfer, outer automated optical detection, surface treatment, choose wire, bore non-heavy copper hole, milling profile.

Wherein, heavy copper hole is PTH, and hole wall has copper, is generally electric hole and component hole; Non-heavy copper hole is NPTH, and hole wall, without copper, is generally location hole and gong silk hole, available dry film sealing of hole or micelle plug or the rear secondary drilling of plating before plating.

The present embodiment shifts, plates anti-etching coat of metal 15 by the first motherboard 31 through destressing, boring, heavy copper, inner figure and processes, and on line pattern 14 surfaces, is provided with anti-etching coat of metal 15, and protection figure circuit is not subject to etching.This anti-etching coat of metal 15 can sink on surface copper, electric plating of whole board, and through desmearing, microetch, electroplating liquid medicine, etching solution, takes off film liquid medicine, brown liquid medicine and after soaking, there will not be corrosion and discoloration problem.

As the improvement to the present embodiment, between line pattern 14 and insert hole 16, be provided with wire, the electroplating clamp point conducting of wire and daughter board edges of boards.By between line pattern 14 and insert hole 16, wire being set, guarantee the electroplating clamp point conducting of line pattern 14, insert hole 16 and daughter board edges of boards, be conducive to the work of graphical printed board.

The processing method of graphical printed board at bottom of dual-step ladder groove of the present invention, each ladder of the graphical printed board at bottom of dual-step ladder groove 50 of its processing can connect up and plug-in unit is installed, and has expanded the scope of application of plate.

Processing method by the present embodiment graphical printed board at bottom of dual-step ladder groove is processed the graphical printed board at bottom of dual-step ladder groove 50 obtaining; comprise the daughter board set 10 that is provided with insert hole 16 of pressing and second-order ladder groove bottom graphical moulding; daughter board set 10 comprises by prepreg 20 successively bonding the first daughter board 11, the second daughter board 12 and the 3rd daughter board 13; between the first daughter board 11 and the second daughter board 12, the second daughter board 12 and the 3rd daughter board 13, be provided with line pattern 14, line pattern 14 surfaces are provided with anti-etching coat of metal 15.Line pattern 14 surfaces are provided with anti-etching coat of metal 15, and protection figure circuit is not subject to etching.This anti-etching coat of metal 15 can sink on surface copper, electric plating of whole board, and through desmearing, microetch, electroplating liquid medicine, etching solution, takes off film liquid medicine, brown liquid medicine and after soaking, there will not be corrosion and discoloration problem.

This graphical printed board at bottom of dual-step ladder groove 50 arranges protective layer on line pattern 14 surfaces; complete preservation line pattern 14 is not subject to desmearing, microetch, electroplating liquid medicine, etching solution with hole; take off the attack of film liquid medicine, brown liquid medicine etc.; make each ladder of second order ladder can connect up and plug-in unit is installed, thereby expanded the scope of application of plate.

Claims (8)

1. a processing method for graphical printed board at bottom of dual-step ladder groove, is characterized in that, comprises the following steps:
Preliminary treatment be reserved with insert hole (16) the first daughter board (11), be provided with line pattern (14) the second daughter board (12), be provided with the 3rd daughter board (13) of line pattern (14);
Described the second daughter board is pressed together on the first daughter board, obtains the first motherboard (31);
Described the first motherboard is shifted, plated anti-etching coat of metal and process through destressing, boring, heavy copper, inner figure, obtain the second motherboard (32);
Described the 3rd daughter board is pressed together on the second motherboard, obtains the 3rd motherboard (33);
Described the 3rd motherboard is shifted through destressing, boring, heavy copper, outer graphics, obtain finished product graphical printed board at bottom of dual-step ladder groove (50).
2. the processing method of graphical printed board at bottom of dual-step ladder groove according to claim 1, is characterized in that, preliminary treatment is reserved with the first daughter board, the second daughter board, the 3rd daughter board of insert hole, comprises following operation:
The first daughter board is carried out successively interior photoimaging, the detection of internal layer automated optical, plates anti-etching coat of metal, punching;
The second daughter board is carried out to inner figure transfer, punching, the detection of internal layer automated optical, hole milling successively;
The 3rd daughter board is carried out to inner figure transfer, punching, the detection of internal layer automated optical, hole milling successively.
3. the processing method of graphical printed board at bottom of dual-step ladder groove according to claim 1, is characterized in that, the first motherboard is obtained to the second motherboard through processing, and comprises successively following operation:
Destressing, boring, heavy copper, electric plating of whole board, interior photoimaging, inner figure shift, internal layer automated optical detects, plate anti-etching coat of metal, punching.
4. the processing method of graphical printed board at bottom of dual-step ladder groove according to claim 1, is characterized in that, the 3rd motherboard is obtained to finished product graphical printed board at bottom of dual-step ladder groove through processing, and comprises successively following operation:
Destressing, boring, heavy copper, outer photoimaging, outer graphics transfer, outer automated optical detection, surface treatment, choose wire, bore non-heavy copper hole, milling profile.
5. according to the processing method of the arbitrary described graphical printed board at bottom of dual-step ladder groove of claim 1-4, it is characterized in that:
When described the first daughter board, the second daughter board pass through cured sheets pressing, form the first groove, in described the first groove, place silicagel pad (40), and take out after pressing, obtain the first motherboard.
6. the processing method of graphical printed board at bottom of dual-step ladder groove according to claim 5, is characterized in that:
When described the 3rd daughter board, the second motherboard pass through cured sheets pressing, form the second groove, in described the second groove, place silicagel pad (40), and take out after pressing, obtain the 3rd motherboard.
7. the processing method of graphical printed board at bottom of dual-step ladder groove according to claim 6, is characterized in that: in described the first groove, the second groove, pad is all set.
8. according to the arbitrary described graphical printed board at bottom of dual-step ladder groove of claim 1-4, it is characterized in that: between described line pattern and insert hole, be provided with wire, described wire respectively with the electroplating clamp point conducting of the first daughter board and the second daughter board edges of boards.
CN201110314227.XA 2011-10-17 2011-10-17 Second-order ladder groove bottom graphical printed board and processing method thereof CN102438413B (en)

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CN103517560B (en) * 2012-06-27 2017-02-15 深南电路有限公司 Processing method of PCB stepped groove
CN104519677B (en) * 2013-09-30 2018-03-16 北大方正集团有限公司 The preparation method and printed circuit board (PCB) of printed circuit board (PCB)
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CN104902683B (en) * 2014-03-06 2018-08-07 深南电路有限公司 Step groove circuit board and its processing method
CN105451468A (en) * 2014-08-29 2016-03-30 深南电路有限公司 Method of manufacturing a circuit board
CN105472909B (en) * 2014-09-09 2018-04-20 深南电路有限公司 A kind of processing method of stepped groove circuit board
CN104284532A (en) * 2014-09-30 2015-01-14 台山市精诚达电路有限公司 Processing method for multilayer flexible printed circuit board
CN104602464B (en) * 2015-01-23 2018-03-13 江门崇达电路技术有限公司 A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper
CN104735912B (en) * 2015-03-10 2018-07-06 广州杰赛科技股份有限公司 A kind of production method of stepped plate
CN105764238B (en) * 2015-06-25 2019-03-05 生益电子股份有限公司 A kind of production method and PCB of stepped groove PCB
CN105764237B (en) * 2015-06-25 2019-03-05 生益电子股份有限公司 A kind of production method and PCB of stepped groove PCB
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CN108012404A (en) * 2017-11-29 2018-05-08 生益电子股份有限公司 A kind of PCB equipped with step groove
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