CN114430614A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN114430614A CN114430614A CN202210109125.2A CN202210109125A CN114430614A CN 114430614 A CN114430614 A CN 114430614A CN 202210109125 A CN202210109125 A CN 202210109125A CN 114430614 A CN114430614 A CN 114430614A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 claims abstract description 71
- 239000002184 metal Substances 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 35
- 239000012212 insulator Substances 0.000 claims description 28
- 230000000903 blocking effect Effects 0.000 claims description 26
- 239000003292 glue Substances 0.000 claims description 23
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000012546 transfer Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 2
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- 238000010586 diagram Methods 0.000 description 18
- 239000000758 substrate Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
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- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The embodiment of the application provides a circuit board and a manufacturing method thereof, relates to the technical field of circuit boards, and is used for solving the technical problem that the circuit board in the related technology is poor in heat dissipation performance. According to the embodiment of the application, the first heat conduction assembly, the second heat conduction assembly and the heat dissipation groove are arranged on the circuit board, the first heat conduction assembly and the second heat conduction assembly can quickly transfer heat formed in the circuit board to the surface of the circuit board, the heat dissipation of the circuit board is facilitated, in addition, the high heat area of the circuit board can be exposed by the heat dissipation groove, and the heat dissipation groove exposes the first heat conduction assembly, so that the heat generated by the high heat area can be quickly transferred to the heat dissipation groove by the first heat conduction assembly, the heat is further quickly transferred to the outside of the circuit board, the heat is prevented from being accumulated in the circuit board, the service life of the circuit board is prolonged, and the safety performance of the circuit board is improved.
Description
Technical Field
The embodiment of the application relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof.
Background
In recent years, along with the development of science and technology, higher and higher requirements are put forward on the heat conducting performance of the circuit board, particularly, the heat production quantity of communication element assemblies such as 5G and the like is large, the temperature of the assemblies and the whole circuit board is easily increased during application, and the situation of large local temperature difference occurs, so that the signal mutation instability of the assemblies is easily caused, and therefore, the heat conducting and radiating performance of the circuit board is improved, and the heat conducting and radiating performance of the circuit board is of great significance to popularization and application of the circuit board.
In the related art, the circuit board usually includes a plurality of copper-clad substrates, and a high thermal conductive material is filled between adjacent copper-clad substrates to realize connection of the adjacent copper-clad substrates and heat dissipation of heat formed by the copper-clad substrates, but the flow of the high thermal conductive material is poor, which causes the problem of insufficient filling between the adjacent copper-clad substrates, and further causes the defect of poor heat dissipation performance of the circuit board.
Disclosure of Invention
In view of the above problems, embodiments of the present application provide a circuit board and a manufacturing method thereof, which can improve heat dissipation performance of the circuit board.
In order to achieve the above object, the embodiments of the present application provide the following technical solutions:
a first aspect of embodiments of the present application provides a circuit board, which includes: the circuit board comprises at least three circuit sub-boards, a first heat conducting assembly, a second heat conducting assembly and a heat dissipation groove;
the circuit board is provided with a plurality of circuit sub-boards, wherein the circuit sub-boards are sequentially stacked along a first direction, adjacent circuit sub-boards are connected through a first prepreg, and the circuit board is provided with a first surface and a second surface along the first direction;
the first heat conduction assembly is arranged in the circuit board, one end of the first heat conduction assembly is aligned with the first surface, and the other end of the first heat conduction assembly is located between the first surface and the second surface;
the second heat conduction assembly is arranged in the circuit board, one end of the second heat conduction assembly is aligned with the first surface, and the other end of the second heat conduction assembly is aligned with the second surface;
the heat dissipation groove is arranged on the second surface, and the bottom of the heat dissipation groove is exposed out of the other end of the first heat conduction assembly.
In a possible implementation manner, each of the line sub-boards includes a first metal layer, a second prepreg, and a second metal layer that are sequentially stacked along a first direction, and the first metal layer and/or the second metal layer has a line pattern thereon.
In a possible implementation manner, the number of the first heat conduction assemblies is at least two, and the plurality of first heat conduction assemblies are arranged in the circuit board at intervals.
In one possible implementation manner, the circuit board comprises a first area and a second area which are connected with each other, and the heat quantity of the first area is higher than that of the second area;
the first heat conducting assembly and the heat dissipation groove are arranged in the first area, and the second heat conducting assembly is arranged in the second area.
In a possible implementation manner, each first heat conduction assembly includes a plurality of first heat conduction members, the plurality of first heat conduction members are arranged on the circuit board in an array, and the number of the first heat conduction members in adjacent rows is the same or different.
In one possible implementation manner, the second heat conduction assembly includes a plurality of second heat conduction members, and the plurality of second heat conduction members are arranged on the circuit board at intervals.
In a possible implementation manner, the first heat conduction member and the second heat conduction member each include a heat conduction insulator and a conductive layer coated outside the heat conduction insulator.
A second aspect of the embodiments of the present application provides a method for manufacturing a circuit board, which includes the following steps:
providing at least three line sub-boards and at least two first semi-curing sheets;
connecting two of the circuit sub-boards together through one of the first semi-curing sheets to form a first press-fit body, wherein the two circuit sub-boards are respectively positioned at two opposite sides of the first semi-curing sheet;
forming a first heat conduction assembly in the first pressing body, wherein the first heat conduction assembly penetrates through the first pressing body;
forming a glue blocking gasket in the other first semi-cured sheet, wherein the glue blocking gasket at least covers the first heat conduction assembly on the projection of the first laminating body;
arranging a third circuit sub-board on the first press-fit body by using the first semi-curing sheet with the glue blocking gasket to form a second press-fit body;
forming a second heat-conducting assembly in the second press fit body, wherein the second heat-conducting assembly penetrates through the second press fit body;
and removing the adhesive blocking gasket to form a heat dissipation groove, wherein the heat dissipation groove exposes out of the first heat conduction assembly.
In one possible implementation, after the step of providing at least three line sub-boards and at least two first semi-cured sheets, before the step of connecting two of the line sub-boards together by one of the first semi-cured sheets to form a first press-fit body, the method further includes:
and respectively patterning the two circuit sub-boards to form a circuit pattern on each circuit sub-board.
In one possible implementation manner, the step of forming a first heat conducting assembly in the first press-fitting body, where the first heat conducting assembly penetrates through the first press-fitting body, includes:
forming a plurality of first through hole groups on the first press-fit body, wherein each first through hole group comprises a plurality of first through holes which are arranged in an array mode, and the number of the first through holes in adjacent rows is the same or different;
forming a conductive layer on the inner wall of each first through hole, wherein the conductive layer forms a first filling hole in the first through hole;
and forming a heat conduction insulator in the first filling hole, wherein the heat conduction insulator fills the first filling hole, the conductive layer and the heat conduction insulator in the same first through hole form one first heat conduction member, and a plurality of first heat conduction members form a first heat conduction assembly.
In one possible implementation manner, the step of forming a glue blocking pad in another of the first semi-cured sheets, wherein the glue blocking pad at least covers the first heat conducting assembly on the projection of the first laminating body, includes:
forming a third through hole in the other first prepreg;
forming a glue blocking gasket in the third through hole;
after another step of forming a resist pad in the first prepreg, the method comprises:
and patterning the surface of the third line sub-board facing the first press-fit body to form a line pattern.
In one possible implementation manner, the step of forming a second heat conducting assembly in the second press-fitting body, where the second heat conducting assembly penetrates through the second press-fitting body, includes:
forming a plurality of second through hole groups on the second press-fit body, wherein each second through hole group comprises a plurality of second through holes which are arranged in an array;
forming a conductive layer on the inner wall of each second through hole, wherein the conductive layer surrounds a second filling hole in the second through hole;
and forming a heat conduction insulator in the second filling hole, wherein the heat conduction insulator fills the second filling hole, the conductive layer and the heat conduction insulator in the same second through hole form one second heat conduction member, and a plurality of second heat conduction members form a second heat conduction assembly.
In a possible implementation manner, the removing the adhesive blocking pad to form a heat dissipation groove, where the heat dissipation groove exposes the first heat conducting assembly includes:
the circuit board is provided with a first surface and a second surface which are oppositely arranged, a first groove is formed on the second surface, and the first groove exposes the glue blocking gasket;
and taking out the glue blocking gasket to form a second groove communicated with the first groove, wherein the groove and the second groove form a heat dissipation groove.
In the circuit board and the manufacturing method thereof provided by the embodiment of the application, the first heat conduction assembly, the second heat conduction assembly and the heat dissipation groove are arranged on the circuit board, the first heat conduction assembly and the second heat conduction assembly can quickly transfer heat formed in the circuit board to the surface of the circuit board, and heat dissipation of the circuit board is facilitated.
In addition to the technical problems solved by the embodiments of the present application, the technical features constituting the technical solutions, and the advantages brought by the technical features of the technical solutions described above, other technical problems that can be solved by the circuit board and the manufacturing method thereof provided by the embodiments of the present application, other technical features included in the technical solutions, and advantages brought by the technical features will be further described in detail in the detailed description.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following descriptions are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board provided in an embodiment of the present application;
fig. 2 is a distribution diagram of a first heat-conducting component in a circuit board according to an embodiment of the present disclosure;
fig. 3 is a process flow diagram of a method for manufacturing a circuit board according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a circuit daughter board provided in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 5 is a schematic structural diagram of two of the patterned circuit sub-boards in the manufacturing method of the circuit board provided in the embodiment of the present application;
fig. 6 is a schematic structural diagram of a first press-fit body formed in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 7 is a schematic structural diagram of forming a first through hole group in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 8 is a top view of a first through hole group formed in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 9 is a schematic structural diagram of a conductive layer formed in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 10 is a schematic structural diagram illustrating a formation of a thermal conductive insulator in a method for manufacturing a circuit board according to an embodiment of the present application;
fig. 11 is a schematic structural diagram of forming a third through hole in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 12 is a schematic structural diagram of a glue blocking pad formed in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 13 is a schematic structural diagram of a third patterned circuit sub-board in the manufacturing method of the circuit board according to the embodiment of the present application;
fig. 14 is a schematic structural diagram of a second press-fit body formed in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 15 is a schematic structural diagram of forming a second through hole group in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 16 is a schematic structural diagram of a conductive layer forming a second heat conduction member in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 17 is a schematic structural diagram of a thermal conductive insulator forming a second thermal conductive member in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 18 is a schematic structural diagram of a circuit pattern formed in the method for manufacturing a circuit board according to the embodiment of the present application;
fig. 19 is a schematic structural diagram of forming a first groove in the method for manufacturing a circuit board according to the embodiment of the present application.
Description of reference numerals:
10: a line daughter board; 11: a first metal layer; 12: a second prepreg; 13: a second metal layer; 20: a first semi-cured sheet; 21: a third through hole; 30: a first heat conducting component; 31: a first heat-conducting member; 311: a conductive layer; 312: a thermally conductive insulator; 40: a second heat conducting assembly; 41: a second heat-conducting member; 50: a heat dissipation groove; 51: a first groove; 52: a second groove; 60: a first press-fit body; 61: a first group of through holes; 611: a first through hole; 612: a first filling hole; 70: a glue blocking gasket; 80: a second press fit body; 81: a second group of through holes; 811: a second through hole; 812: a second filling hole; 90: a first surface; 100: a second surface.
Detailed Description
As described in the background art, the circuit board in the related art has a technical problem of poor heat conduction and heat dissipation performance, and the inventor researches and discovers that the problem occurs because the heat dissipation mode of the circuit board in the related art only uses the high heat conduction material arranged between the adjacent copper-clad substrates to dissipate heat, but the fluidity of the high heat conduction material is poor, so that the underfill is insufficient between the adjacent copper-clad substrates, and the heat dissipation performance of the circuit board is reduced.
In view of the above technical problems, an embodiment of the present application provides a circuit board and a manufacturing method thereof, in which a first heat conducting assembly, a second heat conducting assembly and a heat dissipation groove are disposed on the circuit board, the first heat conducting assembly and the second heat conducting assembly can quickly transfer heat formed in the circuit board to the surface of the circuit board, thereby facilitating heat dissipation of the circuit board, in addition, the heat dissipation groove can expose a high heat area of the circuit board, and the heat dissipation groove exposes the first heat conducting assembly, so that the first heat conducting assembly can quickly transfer heat generated in the high heat area to the heat dissipation groove, thereby quickly transferring the heat to the outside of the circuit board, preventing the heat from being accumulated in the circuit board, and improving the service life and safety performance of the circuit board.
In order to make the aforementioned objects, features and advantages of the embodiments of the present application more comprehensible, embodiments of the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The present embodiment provides a circuit board, which can be applied to an electronic device, and referring to fig. 1, the circuit board includes at least three circuit daughter boards 10, a first heat conductive member 30, a second heat conductive member 40, and a heat dissipation groove 50.
The circuit sub-board 10 serves as a main constituent part of the circuit board for forming a desired circuit pattern to fulfill the function of the circuit board.
In this embodiment, the circuit board may have a multi-layer structure, for example, the number of the circuit daughter boards 10 is at least three, that is, the number of the circuit daughter boards 10 is three, four, or even more, and as for the number of the circuit daughter boards 10, the number may be freely set according to the requirement of the customer.
For convenience of limiting the structure of the circuit board, the structure of the circuit board will be described in detail without taking the number of the circuit sub-boards 10 as three as an example.
As shown in fig. 1, the plurality of line sub-boards 10 are sequentially stacked in a first direction, that is, the plurality of line sub-boards 10 are sequentially stacked from bottom to top in a vertical direction, wherein the first direction may be understood as a Z direction in fig. 1.
The adjacent line sub-boards 10 are connected through the first semi-curing sheet 20, so that a plurality of line sub-boards 10 are laminated to form a whole, wherein each line sub-board 10 is provided with a line pattern, and the adjacent line sub-boards 10 can be connected through via holes to realize the transmission of electric signals.
The first semi-cured sheet 20 comprises resin with a heat conductivity coefficient of 0.8-2.5W/(m.K), and the first semi-cured sheet 20 has good fluidity, so that the resin can flow conveniently when the circuit sub-board 10 is pressed, the problem of insufficient glue filling when the circuit sub-board 10 is pressed in the related art is solved, and the heat dissipation performance of the circuit board is improved.
In addition, the thickness of the first semi-cured sheet 20 is less than 3mil, so that the thickness of the first semi-cured sheet 20 can be reduced, the thickness of the circuit board is reduced, and the development of the circuit board towards light weight and small size is facilitated.
In this embodiment, each of the circuit sub-boards 10 may have a stacked structure, for example, each of the circuit sub-boards 10 includes a first metal layer 11, a second prepreg 12, and a second metal layer 13, and the first metal layer 11, the second prepreg 12, and the second metal layer 13 are sequentially stacked from bottom to top along a first direction, that is, the second prepreg 12 is disposed on the first metal layer 11, and the second metal layer 13 is disposed on the second prepreg 12.
The first metal layer 11 and/or the second metal layer 13 have a circuit pattern, that is, the circuit pattern may be formed on the first metal layer 11 alone, the circuit pattern may be formed on the second metal layer 13, and the circuit patterns may be formed on the first metal layer 11 and the second metal layer 13 at the same time.
In the present example, the first metal layer 11 and the second metal layer 13 may be copper foil layers, and the thickness of the copper foil layers is 1 to 6OZ, where 1OZ is 35 μm.
The first metal layer 11 and the second metal layer 13 can be connected through the second prepreg 12, and compared with the technical scheme that the first metal layer 11 and the second metal layer 13 are connected through a common resin substrate in the related art, on one hand, the heat dissipation performance of the circuit sub-board 10 can be increased, on the other hand, the thickness of the circuit sub-board 10 can be reduced, and the circuit board can be conveniently developed towards the direction of light weight and small size.
The material and thickness of the second prepreg 12 may be the same as or different from those of the first prepreg 20.
Taking the orientation shown in fig. 1 as an example, the circuit board has a first surface 90 and a second surface 100 which are oppositely arranged along a first direction, wherein the first surface 90 can be understood as a lower surface of the circuit board, and the second surface 100 can be understood as an upper surface of the circuit board.
The first heat conducting assembly 30 is disposed in the circuit board, one end of the first heat conducting assembly 30 is aligned with the first surface 90, and the other end of the first heat conducting assembly 30 is located between the first surface 90 and the second surface 100, that is, the lower end surface of the first heat conducting assembly 30 is flush with the first surface 90, and the upper end surface of the first heat conducting assembly 30 is located in the circuit board
Moreover, the heat dissipation groove 50 is disposed on the second surface 100, and the bottom of the heat dissipation groove 50 exposes the other end of the first heat conducting assembly 30, and a part of heat generated by the circuit board can be respectively conducted to the first surface 90 and the heat dissipation groove 50 through the two ends of the first heat conducting assembly 30, which is beneficial for conducting heat in the circuit board.
The proportion of the heat dissipation groove 50 to the circuit board can be set according to actual requirements, for example, the depth of the heat dissipation groove 50 is 1/3-1/2 of the thickness of the circuit board.
The second heat conduction assembly 40 is disposed in the circuit board, and one end of the second heat conduction assembly 40 is aligned with the first surface 90, and the other end of the second heat conduction assembly 40 is aligned with the second surface 100, that is, the second heat conduction assembly 40 penetrates through the circuit board, so that the area of the second heat conduction assembly 40 can be increased, and further, the heat dissipation area of the circuit board can be increased, and the heat conduction and heat dissipation performance of the circuit board can be improved.
In some embodiments, the wiring board includes a first region and a second region connected to each other, the first region having a higher heat amount than the second region; the first area may be understood as a high heat dissipation area, the heat dissipated by the area is relatively large, and may be understood as an H area shown in fig. 1, and the number of the first areas may be one or multiple, which is not specifically limited herein.
The region other than the first region in the wiring board may be understood as the second region.
In view of the fact that the heat quantity of the first area is higher than that of the second area, in the present embodiment, the first heat conducting assembly 30 and the heat dissipation groove 50 are disposed in the first area, and the second heat conducting assembly 40 is disposed in the second area, so that the high heat dissipation area of the circuit board can be exposed through the heat dissipation groove 50, thereby increasing the heat dissipation capacity of the first area and improving the performance of the circuit board.
In some embodiments, the number of the first heat conducting assemblies 30 is at least two, and a plurality of the first heat conducting assemblies 30 are arranged in the circuit board at intervals, wherein when the number of the first areas is multiple, the first heat conducting assembly 30 can be arranged in each first area, and thus, the arrangement can ensure that the first heat conducting assembly 30 is arranged in each first area, so as to ensure the heat conduction and the heat dissipation performance of the circuit board.
In some embodiments, as shown in fig. 2, each of the first heat-conducting assemblies 30 includes a plurality of first heat-conducting members 31, and the plurality of first heat-conducting members 31 are arranged in an array on the circuit board.
The plurality of first heat conduction members 31 are arranged on the circuit board in multiple rows and multiple columns, wherein the number of the first heat conduction members 31 in adjacent rows may be the same or different, for example, taking the orientation shown in fig. 2 as an example, the number of the first heat conduction assemblies 30 is three, and from left to right, the three first heat conduction assemblies 30 are not marked as: the first heat conduction assembly 30, the second first heat conduction assembly 30 and the third first heat conduction assembly 30, wherein the number of the first heat conduction members 31 in adjacent rows of the first heat conduction assembly 30 and the third first heat conduction assembly 30 is different by one, and the number of the first heat conduction members 31 in adjacent rows of the second first heat conduction assembly 30 is the same.
Therefore, the layout mode of each first heat conduction assembly 30 can be reasonably set according to the sizes of different first areas so as to ensure the heat conduction and heat dissipation performance of the circuit board
In some embodiments, the second heat conducting assembly 40 includes a plurality of second heat conducting members 41, and the plurality of second heat conducting members 41 are arranged on the circuit board in an array manner, which may be the same as the arrangement manner of the first heat conducting assembly 30, and the description of this embodiment is not repeated herein.
This embodiment can increase the way of circuit board heat conduction through the setting of first heat conduction subassembly 30 and second heat conduction subassembly 40, and in the correlation technique, relies on the radiating mode of multilayer thick copper in the circuit board to compare, can increase the thermal heat dissipation way and the heat radiating area of each circuit copper circuit layer, and then has improved the heat conduction and the heat dispersion of circuit board.
In some embodiments, as shown in fig. 1 and fig. 2, each of the first heat conduction member 31 and the second heat conduction member 41 includes a heat conduction insulator 312 and a conductive layer 311 covering the heat conduction insulator 312.
The heat conducting insulator 312 is made of heat conducting resin, and the conductive layer 311 is made of copper, so that the first heat conducting member 31 and the second heat conducting member 41 both have a conductive material and an insulating material, thereby increasing the heat conducting performance between the circuit daughter boards 10, and further improving the heat conducting performance and the heat dissipating performance of the circuit board.
As shown in fig. 3, an embodiment of the present application further provides a method for manufacturing a circuit board, including the following steps:
step S100: at least three line daughter boards 10 and at least two first semi-cured sheets 20 are provided.
When the number of the line sub-boards 10 is three, the number of the first semi-cured sheets 20 is two, and the two first semi-cured sheets 20 are respectively disposed between the adjacent line sub-boards 10. When the number of the line sub-boards 10 is four, the number of the first semi-cured sheets 20 is three, and the three first semi-cured sheets 20 are respectively arranged between the adjacent line sub-boards 10.
The plurality of circuit sub-boards 10 have the same structure, as shown in fig. 4, for example, one of the circuit sub-boards 10 is taken as an example to define the circuit sub-board 10, for example, the circuit sub-board 10 may include a first metal layer 11, a second prepreg 12 and a second metal layer 13, where the first metal layer 11, the second prepreg 12 and the second metal layer 13 are sequentially stacked from bottom to top along a first direction, that is, the second prepreg 12 is disposed on the first metal layer 11, and the second metal layer 13 is disposed on the second prepreg 12.
The following description will be made of a method for manufacturing a circuit board, taking three sub-boards 10 and two first semi-cured sheets 20 as examples.
As shown in fig. 5, two line sub-boards 10 are patterned to form a line pattern on each of the line sub-boards 10, wherein the line pattern may be formed on one surface of each of the line sub-boards 10, or simultaneously formed on both surfaces of each of the line sub-boards 10.
Illustratively, the circuit patterns may be formed on the surfaces of the two circuit sub-boards 10 by conventional etching to meet the performance requirements of the respective circuit sub-boards 10.
Step S200: the two circuit sub-boards 10 are connected together by one of the first semi-curing sheets 20 to form a first press-fit body 60, wherein the two circuit sub-boards 10 are respectively located at two opposite sides of the first semi-curing sheet 20, and the structure is shown in fig. 6.
Illustratively, the second prepreg 12 may be disposed between the first metal layer 11 and the second metal layer 13, and the three layers are fixedly connected together by means of pressing, wherein the second prepreg 12 has good fluidity, and during the pressing process, a part of resin in the second prepreg 12 may be filled into the first metal layer 11 and the second metal layer 13 except for the circuit pattern, so as to enhance the connection strength between the first metal layer 11 and the second prepreg 12, and between the second metal layer 13 and the second prepreg 12.
In addition, the second prepreg 12 has strong heat dissipation performance, which can enhance the heat dissipation performance of the circuit daughter board 10 itself, thereby improving the heat conduction and heat dissipation performance of the circuit board.
Step S300: the first heat transfer member 30 is formed inside the first laminate 60, and the first heat transfer member 30 penetrates the first laminate 60.
Illustratively, as shown in fig. 7, a plurality of first through hole groups 61 are formed on the first press-fit body 60, each first through hole group 61 includes a plurality of first through holes 611, the plurality of first through holes 611 are arranged in a matrix, and each first through hole group 61 is located in a first region, wherein the first region is a high heat dissipation region.
The plurality of first through holes 611 may be arranged in a plurality of rows and columns, where the number of the first through holes 611 in adjacent rows may be the same or different, for example, taking the orientation shown in fig. 7 as an example, the number of the first through hole groups 61 is three, and from left to right, the three first through hole groups 61 are not respectively recorded as: the first through hole group 61, the second first through hole group 61 and the third first through hole group 61, wherein the number difference of the first through holes 611 in adjacent rows in the first through hole group 61 and the third first through hole group 61 is one, and the first through holes 611 in adjacent rows are arranged in a staggered manner; in the second first through-hole group 61, the number of first through-holes 611 in adjacent rows is the same.
Therefore, the layout mode of each first through hole group 61 can be reasonably set according to the sizes of different first areas, so that the heat conduction and the heat dissipation performance of the circuit board are ensured.
In fig. 8, the first through holes 611 located within the dashed line frame are collectively referred to as a first through hole group 61.
As shown in fig. 9, after the first through holes 611 are to be formed, a conductive layer 311 may be formed on an inner wall of each of the first through holes 611 using a deposition process, the conductive layer 311 surrounding the first filling hole 612 within the first through hole 611.
Then, as shown in fig. 10, a thermal conductive insulator 312 is formed in the first filling hole 612 by a deposition process, the first filling hole 612 is filled with the thermal conductive insulator 312, the conductive layer 311 and the thermal conductive insulator 312 in the same first through hole 611 form a first thermal conductive member 31, and the first thermal conductive members 31 form the first thermal conductive assembly 30.
Step S400: a glue-blocking pad 70 is formed in the other first semi-cured sheet 20, and the glue-blocking pad 70 covers at least the first heat transfer assembly 30 on the projection of the first laminating body 60.
Exemplarily, as shown in fig. 11, a third through-hole 21 is formed in the other first prepreg 20; for example, the third through holes 21 may be formed in the first semi-cured sheet 20 by a conventional patterning process, wherein the thickness of the first semi-cured sheet 20 may be increased or the number of the first semi-cured sheets 20 may be increased in consideration of the thickness of the adhesive blocking pad 70 and the area for forming the heat dissipation grooves 50.
Then, as shown in fig. 12, a glue blocking pad 70 is formed in the third through hole 21, wherein the glue blocking pad 70 is made of teflon.
After the step of forming the glue barrier 70 in the other of the first prepreg sheets 20, the method comprises:
as shown in fig. 13, the third line sub-board 10 is patterned toward the surface of the first laminate body 60 to form a line pattern.
For a specific forming process, reference may be made to the process of forming the line patterns on the first line sub-board 10 and the second line sub-board 10 in the foregoing embodiment, and details of this embodiment are not repeated herein.
Step S500: the third circuit sub-board 10 is disposed on the first laminate body 60 by using the first semi-cured sheet 20 having the resist pad 70 to form a second laminate body 80, the structure of which is shown in fig. 14.
Step S600: the second heat transfer member 40 is formed inside the second lamination body 80, and the second heat transfer member 40 penetrates the second lamination body 80.
Illustratively, as shown in fig. 15, a plurality of second through-hole groups 81 are formed on the second press-fitting body 80, each second through-hole group 81 includes a plurality of second through-holes 811, and the plurality of second through-holes 811 are arranged at intervals.
Thereafter, as shown in fig. 16, a conductive layer 311 is formed on an inner wall of each second through hole 811, the conductive layer 311 enclosing a second filling hole 812 within the second through hole 811.
Then, as shown in fig. 17, the heat conductive insulator 312 is formed in the second filling hole 812, the heat conductive insulator 312 fills the second filling hole 812, the conductive layer 311 and the heat conductive insulator 312 in the same second through hole 811 form one second heat conductive member 41, and the plurality of second heat conductive members 41 form the second heat conductive assembly 40.
After the second heat transfer member 40 is formed, as shown in fig. 18, a line pattern is formed on the outer surface of the second laminate 80, wherein the outer surface of the second laminate 80 may be the upper and lower surfaces of the second laminate 80.
Step S700: the adhesive blocking pad 70 is removed to form the heat dissipation groove 50, and the heat dissipation groove 50 exposes the first heat conduction assembly 30.
Exemplarily, as shown in fig. 19, the circuit board has a first surface 90 and a second surface 100 which are oppositely disposed, a first groove 51 is formed on the second surface 100 by using an etching process, the first groove 51 exposes the glue blocking pad 70, and the first groove 51 exposes all the glue blocking pads 70.
And then, taking out the glue-resistant gasket to form a second groove 52 communicated with the first groove 51, wherein the first groove 51 and the second groove 52 form a heat dissipation groove 50, and the structure of the heat dissipation groove can be continuously referred to fig. 1.
It should be noted that the first recess 51 may be understood as an area above the dotted line in fig. 1, and the second recess 52 may be understood as an area below the dotted line in fig. 1.
In this embodiment, the first region, that is, the high heat dissipation region, can be exposed by the arrangement of the heat dissipation groove 50, so that high heat generated in the first region of the circuit board can be quickly transferred to the second surface 100 of the circuit board, and further transferred to the outside of the circuit board, thereby improving the heat dissipation performance of the circuit board.
After the heat dissipation groove 50 is formed, the residual medium on the bottom surface and the sidewall of the heat dissipation groove 50 can be removed by processing, and the whole circuit board precursor is subjected to surface cleaning and the like, so that the circuit board is manufactured.
In the present specification, each embodiment or implementation mode is described in a progressive manner, and the emphasis of each embodiment is on the difference from other embodiments, and the same and similar parts between the embodiments may be referred to each other.
It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
In general, terms should be understood at least in part by their use in context. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in the singular or may be used to describe a combination of features, structures, or characteristics in the plural, depending, at least in part, on the context. Similarly, terms such as "a" or "the" may also be understood to convey a singular use or to convey a plural use, depending at least in part on the context.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (13)
1. A circuit board, comprising: the circuit board comprises at least three circuit sub-boards, a first heat conducting assembly, a second heat conducting assembly and a heat dissipation groove;
the circuit board is provided with a plurality of circuit sub-boards, wherein the circuit sub-boards are sequentially stacked along a first direction, adjacent circuit sub-boards are connected through a first prepreg, and the circuit board is provided with a first surface and a second surface along the first direction;
the first heat conduction assembly is arranged in the circuit board, one end of the first heat conduction assembly is aligned with the first surface, and the other end of the first heat conduction assembly is located between the first surface and the second surface;
the second heat conduction assembly is arranged in the circuit board, one end of the second heat conduction assembly is aligned with the first surface, and the other end of the second heat conduction assembly is aligned with the second surface;
the heat dissipation groove is arranged on the second surface, and the bottom of the heat dissipation groove is exposed out of the other end of the first heat conduction assembly.
2. The wiring board according to claim 1, wherein each of the circuit sub-boards comprises a first metal layer, a second prepreg and a second metal layer which are sequentially stacked along a first direction, and the first metal layer and/or the second metal layer has a circuit pattern thereon.
3. The wiring board of claim 2, wherein the number of the first heat-conducting components is at least two, and a plurality of the first heat-conducting components are arranged in the wiring board at intervals.
4. The wiring board of claim 3, wherein the wiring board comprises a first region and a second region connected to each other, the first region having a higher heat than the second region;
the first heat conducting assembly and the heat dissipation groove are arranged in the first area, and the second heat conducting assembly is arranged in the second area.
5. A wiring board according to any one of claims 1 to 4, wherein each of the first heat-conducting assemblies comprises a plurality of first heat-conducting members, and the plurality of first heat-conducting members are arranged in an array on the wiring board, and the number of first heat-conducting members in adjacent rows is the same or different.
6. The wiring board of claim 5, wherein the second thermally conductive assembly comprises a plurality of second thermally conductive members, the plurality of second thermally conductive members being spaced apart on the wiring board.
7. The wiring board of claim 6, wherein the first and second thermal conductive members each comprise a thermal conductive insulator and a conductive layer coated over the thermal conductive insulator.
8. The manufacturing method of the circuit board is characterized by comprising the following steps:
providing at least three line sub-boards and at least two first semi-curing sheets;
connecting two of the circuit sub-boards together through one of the first semi-curing sheets to form a first press-fit body, wherein the two circuit sub-boards are respectively positioned at two opposite sides of the first semi-curing sheet;
forming a first heat-conducting assembly in the first press fit body, wherein the first heat-conducting assembly penetrates through the first press fit body;
forming a glue blocking gasket in the other first semi-cured sheet, wherein the glue blocking gasket at least covers the first heat conduction assembly on the projection of the first laminating body;
arranging a third circuit sub-board on the first press-fit body by using the first semi-curing sheet with the glue blocking gasket to form a second press-fit body;
forming a second heat conduction assembly in the second pressing body, wherein the second heat conduction assembly penetrates through the second pressing body;
and removing the adhesive blocking gasket to form a heat dissipation groove, wherein the heat dissipation groove exposes out of the first heat conduction assembly.
9. The method of claim 8, wherein after the step of providing at least three circuit sub-boards and at least two first semi-cured sheets, and before the step of connecting two of the circuit sub-boards together by one of the first semi-cured sheets to form a first press-fit body, the method further comprises:
and respectively patterning the two circuit sub-boards to form a circuit pattern on each circuit sub-board.
10. The method for manufacturing a circuit board according to claim 9, wherein the step of forming a first heat conducting member in the first press body, the first heat conducting member penetrating through the first press body, comprises:
forming a plurality of first through hole groups on the first press-fit body, wherein each first through hole group comprises a plurality of first through holes which are arranged in an array mode, and the number of the first through holes in adjacent rows is the same or different;
forming a conductive layer on the inner wall of each first through hole, wherein the conductive layer forms a first filling hole in the first through hole;
and forming a heat conduction insulator in the first filling hole, wherein the heat conduction insulator fills the first filling hole, the conductive layer and the heat conduction insulator in the same first through hole form one first heat conduction member, and a plurality of first heat conduction members form a first heat conduction assembly.
11. A method for fabricating a circuit board according to claim 10, wherein the step of forming a resist pad in another of the first prepreg sheets, the resist pad at least covering the first heat conducting assembly in a projection of the first lamination body comprises:
forming a third through hole in the other first prepreg;
forming a glue blocking gasket in the third through hole;
after another step of forming a resist pad in the first prepreg, the method comprises:
and patterning the surface of the third line sub-board facing the first press-fit body to form a line pattern.
12. The method for manufacturing a circuit board according to claim 11, wherein the step of forming a second heat conducting member in the second bonding body, the second heat conducting member penetrating through the second bonding body, comprises:
forming a plurality of second through hole groups on the second press-fit body, wherein each second through hole group comprises a plurality of second through holes which are arranged in an array;
forming a conductive layer on the inner wall of each second through hole, wherein the conductive layer surrounds a second filling hole in the second through hole;
and forming a heat conduction insulator in the second filling hole, wherein the heat conduction insulator fills the second filling hole, the conductive layer and the heat conduction insulator in the same second through hole form one second heat conduction member, and a plurality of second heat conduction members form a second heat conduction assembly.
13. The method for manufacturing a circuit board according to claim 12, wherein the step of removing the adhesive blocking pad to form a heat dissipation groove, the heat dissipation groove exposing the first heat conducting assembly comprises:
the circuit board is provided with a first surface and a second surface which are oppositely arranged, a first groove is formed on the second surface, and the first groove exposes the glue blocking gasket;
and taking out the glue blocking gasket to form a second groove communicated with the first groove, wherein the groove and the second groove form a heat dissipation groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210109125.2A CN114430614A (en) | 2022-01-28 | 2022-01-28 | Circuit board and manufacturing method thereof |
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| CN202210109125.2A CN114430614A (en) | 2022-01-28 | 2022-01-28 | Circuit board and manufacturing method thereof |
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| CN114430614A true CN114430614A (en) | 2022-05-03 |
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Effective date of registration: 20230703 Address after: 519002 No. 107, Baishi Road, Qianshan, Xiangzhou District, Zhuhai City, Guangdong Province Applicant after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Applicant after: New founder holdings development Co.,Ltd. Address before: 519002 No. 107, Baishi Road, Qianshan, Xiangzhou District, Zhuhai City, Guangdong Province Applicant before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Applicant before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. |
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Application publication date: 20220503 |