CN114430614A - Circuit board and method of making the same - Google Patents

Abstract

The embodiment of the application provides a circuit board and a manufacturing method thereof, relates to the technical field of circuit boards, and is used for solving the technical problem that the circuit board in the related technology is poor in heat dissipation performance. According to the embodiment of the application, the first heat conduction assembly, the second heat conduction assembly and the heat dissipation groove are arranged on the circuit board, the first heat conduction assembly and the second heat conduction assembly can quickly transfer heat formed in the circuit board to the surface of the circuit board, the heat dissipation of the circuit board is facilitated, in addition, the high heat area of the circuit board can be exposed by the heat dissipation groove, and the heat dissipation groove exposes the first heat conduction assembly, so that the heat generated by the high heat area can be quickly transferred to the heat dissipation groove by the first heat conduction assembly, the heat is further quickly transferred to the outside of the circuit board, the heat is prevented from being accumulated in the circuit board, the service life of the circuit board is prolonged, and the safety performance of the circuit board is improved.

Description

Circuit board and method of making the same

technical field

The embodiments of the present application relate to the technical field of circuit boards, and in particular, to a circuit board and a manufacturing method thereof.

Background technique

In recent years, with the development of science and technology, higher and higher requirements have been placed on the thermal conductivity of circuit boards. In particular, communication components such as 5G generate large amounts of heat, which can easily cause the temperature of the components and the overall circuit board to rise during application. And there is a large local temperature difference, which easily leads to the sudden change of the component signal and instability. Therefore, improving the thermal conductivity and heat dissipation performance of the circuit board is of great significance for its promotion and application.

In the related art, a circuit board usually includes several copper clad substrates, and high thermal conductivity materials are filled between adjacent copper clad substrates to realize the connection of adjacent copper clad substrates and dissipate heat formed by the copper clad substrates. However, The flow of the high thermal conductivity material is poor, which leads to the problem of insufficient glue filling between adjacent copper clad substrates, which in turn leads to the defect of poor heat dissipation performance of the circuit board.

SUMMARY OF THE INVENTION

In view of the above problems, embodiments of the present application provide a circuit board and a manufacturing method thereof, which can improve the heat dissipation performance of the circuit board.

In order to achieve the above purpose, the embodiments of the present application provide the following technical solutions:

A first aspect of the embodiments of the present application provides a circuit board, which includes: at least three circuit sub-boards, a first heat-conducting component, a second heat-conducting component, and a heat dissipation groove;

A plurality of the circuit sub-boards are sequentially stacked along the first direction, and adjacent circuit sub-boards are connected by a first prepreg, and along the first direction, the circuit boards have a first surface and a second surface;

The first heat-conducting component is arranged in the circuit board, one end of the first heat-conducting component is aligned with the first surface, and the other end of the first heat-conducting component is located on the first surface and the first surface. between the two surfaces;

The second heat-conducting component is disposed in the circuit board, one end of the second heat-conducting component is aligned with the first surface, and the other end of the second heat-conducting component is aligned with the second surface;

The heat dissipation groove is disposed on the second surface, and the bottom of the heat dissipation groove exposes the other end of the first heat conducting component.

In a possible implementation manner, each of the circuit sub-boards includes a first metal layer, a second prepreg and a second metal layer that are sequentially stacked along the first direction, the first metal layer and/or the The second metal layer has circuit patterns.

In a possible implementation manner, the number of the first heat-conducting components is at least two, and a plurality of the first heat-conducting components are arranged in the circuit board at intervals.

In a possible implementation manner, the circuit board includes a first area and a second area that are connected to each other, and the heat of the first area is higher than the heat of the second area;

The first heat-conducting component and the heat-dissipating groove are arranged in the first area, and the second heat-conducting component is arranged in the second area.

In a possible implementation manner, each of the first heat-conducting components includes a plurality of first heat-conducting components, the plurality of first heat-conducting components are arranged in an array on the circuit board, and the first heat-conducting components in adjacent rows are arranged in an array. The number of a heat-conducting member is the same or different.

In a possible implementation manner, the second heat-conducting component includes a plurality of second heat-conducting components, and the plurality of second heat-conducting components are arranged on the circuit board at intervals.

In a possible implementation manner, both the first thermally conductive member and the second thermally conductive member include a thermally conductive insulator and a conductive layer wrapped around the thermally conductive insulator.

A second aspect of the embodiments of the present application provides a method for manufacturing a circuit board, which includes the following steps:

providing at least three circuit daughter boards and at least two first prepregs;

Two of the circuit sub-boards are connected together by one of the first prepregs to form a first pressing body, wherein the two circuit sub-boards are respectively located on opposite sides of the first prepreg;

A first heat-conducting component is formed in the first pressing body, and the first heat-conducting component penetrates the first pressing body;

A glue-resisting gasket is formed in another first prepreg, and the glue-resisting gasket covers at least the first heat conducting component on the projection of the first pressing body;

Disposing the third circuit daughter board on the first pressing body by using the first prepreg with the glue-resisting gasket to form a second pressing body;

A second heat-conducting component is formed in the second pressing body, and the second heat-conducting component penetrates the second pressing body;

The glue-resisting gasket is removed to form a heat dissipation groove, and the heat dissipation groove exposes the first heat conducting component.

In a possible implementation manner, after the step of providing at least three circuit sub-boards and at least two first prepregs, two of the circuit sub-boards are connected together through one of the first prepregs, Before the step of forming the first pressed body, the method further includes:

Two of the circuit sub-boards are separately patterned to form a circuit pattern on each of the circuit sub-boards.

In a possible implementation manner, the step of forming a first heat-conducting component in the first pressing body, the first heat-conducting component penetrating the first pressing body, includes:

A plurality of first through hole groups are formed on the first pressing body, each of the first through hole groups includes a plurality of first through holes, and the plurality of first through holes are arranged in an array, adjacent rows The number of the first through holes is the same or different;

forming a conductive layer on the inner wall of each of the first through holes, the conductive layer enclosing a first filling hole in the first through hole;

A thermally conductive insulator is formed in the first filling hole, the thermally conductive insulator fills the first filling hole, and the conductive layer and the thermally conductive insulator located in the same first through hole constitute one of the first thermally conductive insulators A plurality of the first heat-conducting parts constitute a first heat-conducting component.

In a possible implementation manner, a glue-resisting gasket is formed in another first prepreg, and the glue-resisting gasket covers at least the first thermally conductive component on the projection of the first pressing body steps, including:

forming a third through hole in another of the first prepregs;

forming a glue-resisting gasket in the third through hole;

After another step of forming an adhesive resist gasket in the first prepreg, the manufacturing method includes:

The surface of the third circuit sub-board facing the first pressing body is patterned to form circuit patterns.

In a possible implementation manner, the step of forming a second heat-conducting component in the second pressing body, and the second heat-conducting component penetrating the second pressing body, includes:

A plurality of second through hole groups are formed on the second pressing body, each of the second through hole groups includes a plurality of second through holes, and the plurality of the second through holes are arranged in an array;

forming a conductive layer on the inner wall of each of the second through holes, the conductive layer enclosing a second filling hole in the second through hole;

A thermally conductive insulator is formed in the second filling hole, the thermally conductive insulator fills the second filling hole, and the conductive layer and the thermally conductive insulator located in the same second through hole constitute a second thermally conductive insulator A plurality of the second heat-conducting parts constitute a second heat-conducting component.

In a possible implementation manner, the step of removing the glue-resisting gasket to form a heat dissipation groove, the heat dissipation groove exposing the first heat conducting component, includes:

The circuit board has a first surface and a second surface disposed opposite to each other, a first groove is formed on the second surface, and the first groove exposes the glue-resisting gasket;

The glue resisting gasket is taken out to form a second groove communicating with the first groove, and the groove and the second groove constitute a heat dissipation groove.

In the circuit board and the manufacturing method thereof provided by the embodiments of the present application, by arranging the first heat-conducting component, the second heat-conducting component and the heat-dissipating groove on the circuit board, the first heat-conducting component and the second heat-conducting component can form heat in the circuit board. It is quickly transferred to the surface of the circuit board, which is beneficial to the heat dissipation of the circuit board. In addition, the heat dissipation groove can expose the high heat area of the circuit board, and the heat dissipation groove exposes the first heat conduction component. In this way, the first heat conduction component The heat generated in the high heat area can be quickly transferred to the heat dissipation groove, and then the heat can be quickly transferred to the outside of the circuit board, preventing heat from accumulating in the circuit board, and improving the service life and safety performance of the circuit board.

In addition to the technical problems solved by the embodiments of the present application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of the technical solutions described above, the circuit boards and the manufacturing methods thereof provided by the embodiments of the present application can Other technical problems to be solved, other technical features included in the technical solution, and the beneficial effects brought about by these technical features will be described in further detail in the specific embodiments.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the accompanying drawings used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

1 is a schematic structural diagram of a circuit board provided by an embodiment of the present application;

FIG. 2 is a distribution diagram of a first heat conducting component in a circuit board provided by an embodiment of the present application;

3 is a process flow diagram of a method for manufacturing a circuit board provided by an embodiment of the present application;

4 is a schematic structural diagram of a circuit sub-board provided in the method for manufacturing a circuit board provided in an embodiment of the present application;

5 is a schematic structural diagram of patterning two circuit sub-boards in the method for manufacturing a circuit board provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of forming a first pressing body in a method for manufacturing a circuit board provided by an embodiment of the present application;

7 is a schematic structural diagram of forming a first through hole group in a method for manufacturing a circuit board provided by an embodiment of the present application;

8 is a top view of forming a first through hole group in a method for manufacturing a circuit board provided by an embodiment of the present application;

9 is a schematic structural diagram of forming a conductive layer in a method for fabricating a circuit board provided by an embodiment of the present application;

10 is a schematic structural diagram of forming a thermally conductive insulator in a method for manufacturing a circuit board provided by an embodiment of the present application;

11 is a schematic structural diagram of forming a third through hole in the method for fabricating a circuit board provided by an embodiment of the present application;

12 is a schematic structural diagram of forming a resist gasket in a method for manufacturing a circuit board provided by an embodiment of the present application;

13 is a schematic structural diagram of a patterned third circuit daughter board in the method for manufacturing a circuit board provided by an embodiment of the present application;

14 is a schematic structural diagram of forming a second pressing body in the method for manufacturing a circuit board provided by an embodiment of the present application;

15 is a schematic structural diagram of forming a second through hole group in the method for fabricating a circuit board provided by an embodiment of the present application;

FIG. 16 is a schematic structural diagram of forming a conductive layer of a second thermally conductive member in a method for manufacturing a circuit board provided by an embodiment of the present application;

17 is a schematic structural diagram of a thermally conductive insulator forming a second thermally conductive member in the method for manufacturing a circuit board provided by an embodiment of the present application;

18 is a schematic structural diagram of forming a circuit pattern in a method for manufacturing a circuit board provided by an embodiment of the present application;

FIG. 19 is a schematic structural diagram of forming a first groove in a method for fabricating a circuit board provided by an embodiment of the present application.

Description of reference numbers:

10: circuit sub-board; 11: first metal layer; 12: second prepreg; 13: second metal layer; 20: first prepreg; 21: third through hole; 30: first thermal component; 31: first 311: Conductive layer; 312: Thermal insulator; 40: Second thermal component; 41: Second thermal component; 50: Heat dissipation groove; 51: First groove; 52: Second groove; 60: No. 61: The first through hole group; 611: The first through hole; 612: The first filling hole; 70: The glue resisting gasket; 80: The second pressing body; 81: The second through hole group; 811: The second through hole; 812: the second filling hole; 90: the first surface; 100: the second surface.

Detailed ways

As mentioned in the background art, the circuit boards in the related art have technical problems of poor thermal conductivity and heat dissipation performance. The inventors have found that the reason for this problem is that the heat dissipation methods of the circuit boards in the related art are only arranged in adjacent The high thermal conductivity material between the copper clad substrates dissipates heat, but the fluidity of the high thermal conductivity material is poor, resulting in insufficient glue filling between adjacent copper clad substrates, thereby reducing the heat dissipation performance of the circuit board.

In view of the above technical problems, the embodiments of the present application provide a circuit board and a manufacturing method thereof. The heat formed in the circuit board is quickly transferred to the surface of the circuit board, which is beneficial to the heat dissipation of the circuit board. In addition, the heat dissipation groove can expose the high heat area of the circuit board, and the heat dissipation groove exposes the first heat conduction component. In this way, the first heat-conducting component can quickly transfer the heat generated in the high-heat area to the heat dissipation groove, thereby quickly transferring the heat to the outside of the circuit board, preventing the heat from accumulating in the circuit board, and improving the service life of the circuit board. safety performance.

In order to make the above objects, features and advantages of the embodiments of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

The embodiment of the present application provides a circuit board, which can be applied to electronic devices. Referring to FIG. 1 , the circuit board includes at least three circuit sub-boards 10 , a first heat-conducting component 30 , a second heat-conducting component 40 , and a heat dissipation groove. 50.

The circuit daughter board 10 is used as a main component of the circuit board to form required circuit patterns to realize the function of the circuit board.

In this embodiment, the circuit board may be a multi-layer structure. For example, the number of circuit sub-boards 10 is at least three, that is, the number of circuit sub-boards 10 is three, four, or even more. As for the number of circuit sub-boards 10, it can be freely set according to the needs of customers.

In order to facilitate the limitation of the structure of the circuit board, the structure of the circuit board may be described in detail by taking the number of the circuit sub-boards 10 as three as an example.

As shown in FIG. 1 , a plurality of circuit sub-boards 10 are stacked in sequence along a first direction, that is, a plurality of circuit sub-boards 10 are stacked in sequence from bottom to top along a vertical direction, wherein the first direction can be understood as the figure 1 in the Z direction.

Adjacent circuit sub-boards 10 are connected by the first prepreg 20, so that a plurality of circuit sub-boards 10 are laminated to form a whole, wherein each circuit sub-board 10 has a circuit pattern, and adjacent circuit sub-boards 10 can be connected through vias to realize the transmission of electrical signals.

The first prepreg 20 includes a resin with a thermal conductivity of 0.8-2.5W/(m.K), and the first prepreg 20 has good fluidity, which can facilitate the flow of the resin when the circuit sub-board 10 is pressed, which solves the problem of the related art. When the circuit sub-board 10 is pressed together, there is a problem of insufficient glue filling, which increases the heat dissipation performance of the circuit board.

In addition, the thickness of the first prepreg 20 is less than 3 mil, so that the thickness of the first prepreg 20 can be reduced, thereby reducing the thickness of the circuit board and facilitating the development of the circuit board in a direction of lightness and small size.

In this embodiment, each circuit sub-board 10 may be a laminated structure. For example, each circuit sub-board 10 includes a first metal layer 11 , a second prepreg 12 and a second metal layer 13 . The first metal layer 11 , the first metal layer 11 and the second metal layer 13 The two prepregs 12 and the second metal layers 13 are sequentially stacked from bottom to top along the first direction, that is, the second prepregs 12 are arranged on the first metal layer 11 and the second metal layers 13 are arranged on the second prepregs 12 .

Wherein, the first metal layer 11 and/or the second metal layer 13 have circuit patterns, that is to say, the circuit patterns can be formed on the first metal layer 11 alone, or the circuit patterns can be formed on the second metal layer 13, and It is possible to form circuit patterns on the first metal layer 11 and the second metal layer 13 at the same time, and specifically, it can be set according to the actual product.

In this example, the first metal layer 11 and the second metal layer 13 may be copper foil layers, and the thickness of the copper foil layers is 1˜6 OZ, where 1 OZ=35 μm.

The first metal layer 11 and the second metal layer 13 can be connected through the second prepreg 12, which is in contrast to the technical solution in which the first metal layer 11 and the second metal layer 13 are connected through a common resin substrate in the related art. On the one hand, the heat dissipation performance of the circuit sub-board 10 can be increased, and on the other hand, the thickness of the circuit sub-board 10 can be reduced, which facilitates the development of the circuit board in the direction of lightness and small size.

It should be noted that the material and thickness of the second prepreg 12 may be the same as or different from those of the first prepreg 20 .

Taking the orientation shown in FIG. 1 as an example, along the first direction, the circuit board has a first surface 90 and a second surface 100 arranged oppositely, wherein the first surface 90 can be understood as the lower surface of the circuit board, and the second surface 100 It can be understood as the upper surface of the circuit board.

The first heat-conducting component 30 is disposed in the circuit board, one end of the first heat-conducting component 30 is aligned with the first surface 90, and the other end of the first heat-conducting component 30 is located between the first surface 90 and the second surface 100, that is, , the lower end surface of the first heat conducting component 30 is flush with the first surface 90, and the upper end surface of the first heat conducting component 30 is located in the circuit board

In addition, the heat dissipation groove 50 is disposed on the second surface 100 , and the bottom of the heat dissipation groove 50 exposes the other end of the first heat conducting component 30 , and part of the heat generated by the circuit board will pass through the two ends of the first heat conducting component 30 , respectively. Conduction to the first surface 90 and the heat dissipation groove 50 is conducive to the conduction of the heat in the circuit board. In addition, the disposition of the heat dissipation groove 50 in this embodiment can increase the heat dissipation area of the circuit board, thereby improving the heat conduction and heat dissipation of the circuit board. performance.

The proportion of the heat dissipation groove 50 to the circuit board can be set according to actual requirements. For example, the depth of the heat dissipation groove 50 accounts for between 1/3-1/2 of the thickness of the circuit board.

The second heat-conducting component 40 is disposed in the circuit board, one end of the second heat-conducting component 40 is aligned with the first surface 90 , and the other end of the second heat-conducting component 40 is aligned with the second surface 100 , that is, the second heat-conducting component 40 Through the circuit board, in this way, the area of the second heat conducting component 40 can be increased, and further, the heat dissipation area of the circuit board can be increased, and the heat conduction and heat dissipation performance of the circuit board can be improved.

In some embodiments, the circuit board includes a first area and a second area that are connected to each other, and the heat of the first area is higher than that of the second area; wherein, the first area can be understood as a high heat dissipation area, and the heat dissipation of this area is higher than that of the second area. The heat is relatively large, which can be understood as the H region shown in FIG. 1 , and the number of the first regions may be one or more, which is not specifically limited in this embodiment.

The area other than the first area in the circuit board can be understood as the second area.

Since the heat in the first area is higher than the heat in the second area, in this embodiment, the first heat-conducting component 30 and the heat-dissipating groove 50 are arranged in the first area, and the second heat-conducting component 40 is arranged in the second area, In this way, the high heat dissipation area of the circuit board can be exposed through the heat dissipation groove 50, so as to increase the heat dissipation capability of the first area and improve the performance of the circuit board.

In some embodiments, the number of the first heat-conducting components 30 is at least two, and the plurality of first heat-conducting components 30 are arranged in the circuit board at intervals. The first heat-conducting components 30 may be arranged in one area, and in this way, it can be ensured that the first heat-conducting components 30 are arranged in each first area, so as to ensure the heat conduction and heat dissipation performance of the circuit board.

In some embodiments, as shown in FIG. 2 , each of the first heat-conducting components 30 includes a plurality of first heat-conducting members 31 , and the plurality of first heat-conducting members 31 are arranged in an array on the circuit board.

The plurality of first heat-conducting members 31 are arranged on the circuit board in multiple rows and columns, wherein the number of the first heat-conducting members 31 in adjacent rows may be the same or different, for example, in the orientation shown in FIG. 2 For example, the number of the first heat-conducting components 30 is three. From left to right, the three first heat-conducting components 30 may be respectively recorded as: the first first heat-conducting component 30 and the second first heat-conducting component 30 and the third first heat-conducting assembly 30, wherein the number of the first heat-conducting members 31 in adjacent rows in the first first heat-conducting assembly 30 and the third first heat-conducting assembly 30 differ by one, and the second In each of the first heat-conducting components 30, the number of the first heat-conducting members 31 in adjacent rows is the same.

In this way, the layout of each first heat-conducting component 30 can be reasonably set according to the size of different first regions, so as to ensure the heat-conducting and heat-dissipating performance of the circuit board

In some embodiments, the second heat-conducting component 40 includes a plurality of second heat-conducting components 41 , and the plurality of second heat-conducting components 41 are arranged in an array on the circuit board, and the arrangement can be the same as that of the first heat-conducting component 30 . The same, this embodiment will not be repeated here.

In this embodiment, through the arrangement of the first heat-conducting component 30 and the second heat-conducting component 40, the way of heat conduction of the circuit board can be increased. The heat dissipation path and heat dissipation area of the circuit layer heat, thereby improving the thermal conductivity and heat dissipation performance of the circuit board.

In some embodiments, please continue to refer to FIG. 1 and FIG. 2 , both the first thermally conductive member 31 and the second thermally conductive member 41 include a thermally conductive insulator 312 and a conductive layer 311 that coats the thermally conductive insulator 312 .

The material of the thermally conductive insulator 312 is thermally conductive resin, and the material of the conductive layer 311 is copper, so that the first thermally conductive member 31 and the second thermally conductive member 41 have both conductive and insulating materials. The thermal conductivity of the circuit board is improved, and the thermal conductivity and heat dissipation performance of the circuit board are improved.

As shown in FIG. 3 , an embodiment of the present application also provides a method for manufacturing a circuit board, including the following steps:

Step S100 : providing at least three circuit sub-boards 10 and at least two first prepregs 20 .

It should be noted that when the number of circuit sub-boards 10 is three, the number of first prepregs 20 is two, and the two first prepregs 20 are respectively disposed between adjacent circuit sub-boards 10 . When the number of circuit sub-boards 10 is four, correspondingly, the number of first prepregs 20 is three, and the three first prepregs 20 are respectively disposed between adjacent circuit sub-boards 10 .

The structures of the plurality of circuit sub-boards 10 are the same. As shown in FIG. 4 , taking one of the circuit sub-boards 10 as an example, the circuit sub-board 10 is limited. For example, the circuit sub-board 10 may include the first metal layer 11 , The second prepreg 12 and the second metal layer 13, the first metal layer 11, the second prepreg 12 and the second metal layer 13 are sequentially stacked from bottom to top along the first direction, that is, the second prepreg 12 is arranged on the first On a metal layer 11 , a second metal layer 13 is disposed on the second prepreg 12 .

Hereinafter, the manufacturing method of the circuit board will be described by taking the number of the circuit sub-boards 10 as three and the number of the first prepregs 20 as two as an example.

As shown in FIG. 5 , two circuit sub-boards 10 are first patterned respectively to form circuit patterns on each circuit sub-board 10 , wherein the circuit patterns can be formed on one of the surfaces of each circuit sub-board 10 , or , are simultaneously formed on both surfaces of each circuit sub-board 10 .

Exemplarily, circuit patterns may be formed on the surfaces of the two circuit sub-boards 10 by conventional etching to meet the performance requirements of the respective circuit sub-boards 10 .

Step S200 : connecting the two circuit sub-boards 10 through one of the first prepregs 20 to form a first pressing body 60 , wherein the two circuit sub-boards 10 are respectively located on opposite sides of the first prepreg 20 , and The structure is shown in Figure 6.

Exemplarily, the second prepreg 12 can be arranged between the first metal layer 11 and the second metal layer 13, and the above three are fixedly connected together by means of pressing, wherein the second prepreg 12 has good During the lamination process, part of the resin in the second prepreg 12 can be filled into the regions of the first metal layer 11 and the second metal layer 13 except for the circuit pattern, which strengthens the first metal layer 11 and the second metal layer 13. The two prepregs 12 and the connection strength between the second metal layer 13 and the second prepreg 12 .

In addition, the second prepreg 12 has strong heat dissipation performance, which can enhance the heat dissipation performance of the circuit sub-board 10 itself, thereby improving the heat conduction and heat dissipation performance of the circuit board.

Step S300 : forming a first heat-conducting component 30 in the first pressing body 60 , and the first heat-conducting component 30 penetrates the first pressing body 60 .

Exemplarily, as shown in FIG. 7 , a plurality of first through hole groups 61 are formed on the first pressing body 60 , each first through hole group 61 includes a plurality of first through holes 611 , a plurality of first through holes The 611 are arranged in a matrix, and each first through hole group 61 is located in a first area, wherein the first area is a high heat dissipation area.

The plurality of first through holes 611 may be arranged in multiple rows and multiple columns, wherein the number of the first through holes 611 in adjacent rows may be the same or different, for example, in the orientation shown in FIG. 7 . For example, the number of the first through-hole groups 61 is three. From left to right, the three first through-hole groups 61 may be recorded as: the first first through-hole group 61 , the second first through-hole group 61 , the second A through hole group 61 and a third first through hole group 61 , wherein each of the first through hole groups 61 and the first through hole groups 61 in adjacent rows in the first first through hole group 61 and the third first through hole group 61 The number difference is one, and the first through holes 611 in the adjacent rows are arranged in a staggered position; in the second first through hole group 61 , the number of the first through holes 611 in the adjacent rows is the same.

In this way, the layout of each first through hole group 61 can be reasonably set according to the sizes of different first regions, so as to ensure the thermal conductivity and heat dissipation performance of the circuit board.

It should be noted that, in FIG. 8 , the first through holes 611 located in the dotted frame are collectively referred to as the first through hole group 61 .

As shown in FIG. 9 , after the first through holes 611 are to be formed, a conductive layer 311 can be formed on the inner wall of each first through hole 611 by a deposition process, and the conductive layer 311 surrounds the first through hole 611 to form a first filling hole 612.

Afterwards, as shown in FIG. 10 , the thermally conductive insulator 312 is formed in the first filling hole 612 by the deposition process, the thermally conductive insulator 312 fills the first filling hole 612 , and the conductive layer 311 and the thermally conductive layer located in the same first through hole 611 The insulator 312 constitutes a first heat-conducting member 31 , and a plurality of first heat-conducting members 31 constitute a first heat-conducting component 30 .

Step S400 : forming a glue-resisting gasket 70 in another first prepreg 20 , and the glue-resisting gasket 70 covers at least the first heat conducting component 30 on the projection of the first pressing body 60 .

Exemplarily, as shown in FIG. 11, a third through hole 21 is formed in another first prepreg 20; The thickness of the first prepreg 20 may be increased or the number of the first prepreg 20 may be increased in consideration of the thickness of the glue resisting gasket 70 and the area of the heat dissipation groove 50 .

Afterwards, as shown in FIG. 12 , a glue-resisting gasket 70 is formed in the third through hole 21 , wherein the material of the glue-resisting gasket 70 is polytetrafluoroethylene.

After another step of forming the glue resist gasket 70 in the first prepreg 20, the manufacturing method includes:

As shown in FIG. 13 , the surface of the third circuit sub-board 10 facing the first pressing body 60 is patterned to form circuit patterns.

For a specific forming process, reference may be made to the process of forming a circuit pattern on the first circuit sub-board 10 and the second circuit sub-board 10 in the above-mentioned embodiment, which will not be repeated in this embodiment.

Step S500 : disposing the third circuit sub-board 10 on the first lamination body 60 by using the first prepreg 20 with the glue-resisting gasket 70 to form the second lamination body 80 , the structure of which is shown in FIG. 14 .

Step S600 : forming a second heat-conducting component 40 in the second pressing body 80 , and the second heat-conducting component 40 penetrates the second pressing body 80 .

Exemplarily, as shown in FIG. 15 , a plurality of second through hole groups 81 are formed on the second pressing body 80 , and each second through hole group 81 includes a plurality of second through holes 811 . 811 interval setting.

After that, as shown in FIG. 16 , a conductive layer 311 is formed on the inner wall of each second through hole 811 , and the conductive layer 311 forms a second filling hole 812 in the second through hole 811 .

After that, as shown in FIG. 17 , the thermally conductive insulator 312 is formed in the second filling hole 812 , the thermally conductive insulator 312 fills the second filling hole 812 , and the conductive layer 311 and the thermally conductive insulator 312 located in the same second through hole 811 form one The second heat-conducting member 41 , a plurality of second heat-conducting members 41 constitute the second heat-conducting component 40 .

After the second heat conducting assembly 40 is formed, as shown in FIG. 18 , a circuit pattern is formed on the outer surface of the second pressing body 80 , wherein the outer surface of the second pressing body 80 may be the upper surface of the second pressing body 80 and the outer surface of the second pressing body 80 . lower surface.

Step S700 : removing the glue-resisting gasket 70 to form a heat dissipation groove 50 , and the heat dissipation groove 50 exposes the first heat conducting component 30 .

Exemplarily, as shown in FIG. 19 , the circuit board has a first surface 90 and a second surface 100 disposed opposite to each other, and a first groove 51 is formed on the second surface 100 by an etching process, and the first groove 51 is exposed. The glue-resisting gasket 70 , wherein the first groove 51 exposes all the glue-resisting gaskets 70 .

After that, the glue resisting gasket is taken out to form a second groove 52 communicating with the first groove 51 . The first groove 51 and the second groove 52 form a heat dissipation groove 50 , the structure of which can continue to refer to FIG. 1 .

It should be noted that the first groove 51 can be understood as the area above the dotted line in FIG. 1 , and the second groove 52 can be understood as the area below the dotted line in FIG. 1 .

In this embodiment, the disposition of the heat dissipation groove 50 can expose the first area, that is, the high heat dissipation area can be exposed, so that the high heat generated in the first area in the circuit board can be quickly transferred to the second surface 100 of the circuit , and then transferred to the outside of the circuit board, improving the heat dissipation performance of the circuit board.

After the heat dissipation groove 50 is formed, the residual medium on the bottom surface and the side wall of the heat dissipation groove 50 can be removed by treatment, and the circuit board can be obtained after surface cleaning and other treatments of the entire circuit board precursor.

The embodiments or implementations in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments may be referred to each other.

It should be noted that references in the specification to "one embodiment," "an embodiment," "exemplary embodiment," "some embodiments," etc. mean that the described embodiment may include a particular feature, structure, or characteristic, but not necessarily Each embodiment includes the particular feature, structure or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure or characteristic is described in conjunction with one embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments, expressly or not expressly described.

In general, terms should be understood, at least in part, by their contextual usage. For example, the term "one or more" as used herein may be used to describe any feature, structure or characteristic in the singular or a combination of features, structures or characteristics in the plural, depending at least in part on context. . Similarly, terms such as "a" or "the" can also be understood to convey a singular usage or to convey a plural usage, depending at least in part on context.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present application. scope.

Claims (13)

1. A circuit board, characterized in that, comprising: at least three circuit sub-boards, a first heat-conducting component, a second heat-conducting component, and a heat dissipation groove; A plurality of the circuit sub-boards are sequentially stacked along the first direction, and adjacent circuit sub-boards are connected by a first prepreg, and along the first direction, the circuit boards have a first surface and a second surface; The first heat-conducting component is arranged in the circuit board, one end of the first heat-conducting component is aligned with the first surface, and the other end of the first heat-conducting component is located on the first surface and the first surface. between the two surfaces; The second heat-conducting component is disposed in the circuit board, one end of the second heat-conducting component is aligned with the first surface, and the other end of the second heat-conducting component is aligned with the second surface; The heat dissipation groove is disposed on the second surface, and the bottom of the heat dissipation groove exposes the other end of the first heat conducting component. 2 . The circuit board according to claim 1 , wherein each of the circuit sub-boards comprises a first metal layer, a second prepreg and a second metal layer that are sequentially stacked along the first direction, and the first metal layer A metal layer and/or the second metal layer has circuit patterns. 3 . The circuit board according to claim 2 , wherein the number of the first heat-conducting components is at least two, and a plurality of the first heat-conducting components are arranged in the circuit board at intervals. 4 . 4. The circuit board of claim 3, wherein the circuit board comprises a first area and a second area that are connected to each other, and the heat of the first area is higher than the heat of the second area; The first heat-conducting component and the heat-dissipating groove are arranged in the first area, and the second heat-conducting component is arranged in the second area. 5. The circuit board according to any one of claims 1-4, wherein each of the first thermally conductive components comprises a plurality of first thermally conductive members, and the plurality of first thermally conductive members are arrayed in an array. On the circuit board, the number of the first heat conducting members in adjacent rows is the same or different. 6 . The circuit board according to claim 5 , wherein the second heat-conducting component comprises a plurality of second heat-conducting members, and the plurality of second heat-conducting members are arranged on the circuit board at intervals. 7 . 7 . The circuit board according to claim 6 , wherein the first thermally conductive member and the second thermally conductive member each comprise a thermally conductive insulator and a conductive layer wrapped around the thermally conductive insulator. 8 . 8. A method of making a circuit board, comprising the steps of: providing at least three circuit daughter boards and at least two first prepregs; Two of the circuit sub-boards are connected together by one of the first prepregs to form a first pressing body, wherein the two circuit sub-boards are respectively located on opposite sides of the first prepreg; A first heat-conducting component is formed in the first pressing body, and the first heat-conducting component penetrates the first pressing body; A glue-resisting gasket is formed in another first prepreg, and the glue-resisting gasket covers at least the first heat conducting component on the projection of the first pressing body; Disposing the third circuit daughter board on the first pressing body by using the first prepreg with the glue-resisting gasket to form a second pressing body; A second heat-conducting component is formed in the second pressing body, and the second heat-conducting component penetrates the second pressing body; The glue-resisting gasket is removed to form a heat dissipation groove, and the heat dissipation groove exposes the first heat conducting component. 9 . The method for manufacturing a circuit board according to claim 8 , wherein after the step of providing at least three circuit sub-boards and at least two first prepregs, two of the first prepregs are used for removing the Before the step of connecting the circuit sub-boards together to form the first pressing body, the method further includes: Two of the circuit sub-boards are separately patterned to form a circuit pattern on each of the circuit sub-boards. 10 . The manufacturing method of the circuit board according to claim 9 , wherein a first heat conducting component is formed in the first pressing body, and in the step of penetrating the first pressing body, include: A plurality of first through hole groups are formed on the first pressing body, each of the first through hole groups includes a plurality of first through holes, and the plurality of first through holes are arranged in an array, adjacent rows The number of the first through holes in is the same or different; forming a conductive layer on the inner wall of each of the first through holes, the conductive layer enclosing a first filling hole in the first through hole; A thermally conductive insulator is formed in the first filling hole, the thermally conductive insulator fills the first filling hole, and the conductive layer and the thermally conductive insulator located in the same first through hole constitute one of the first thermally conductive insulators A plurality of the first heat-conducting parts constitute a first heat-conducting component. 11 . The manufacturing method of the circuit board according to claim 10 , wherein a glue-resisting gasket is formed in another first prepreg, and the glue-resisting gasket is projected on the first pressing body. 12 . At least the step of covering the first thermally conductive component includes: forming a third through hole in another of the first prepregs; forming a glue-resisting gasket in the third through hole; After another step of forming an adhesive resist gasket in the first prepreg, the manufacturing method includes: The surface of the third circuit sub-board facing the first pressing body is patterned to form circuit patterns. 12 . The manufacturing method of a circuit board according to claim 11 , wherein a second heat-conducting component is formed in the second pressing body, and the second heat-conducting component penetrates through the second pressing body. 12 . include: A plurality of second through hole groups are formed on the second pressing body, each of the second through hole groups includes a plurality of second through holes, and the plurality of the second through holes are arranged in an array; forming a conductive layer on the inner wall of each of the second through holes, the conductive layer enclosing a second filling hole in the second through hole; A thermally conductive insulator is formed in the second filling hole, the thermally conductive insulator fills the second filling hole, and the conductive layer and the thermally conductive insulator located in the same second through hole constitute a second thermally conductive insulator A plurality of the second heat-conducting parts constitute a second heat-conducting component. 13 . The manufacturing method of the circuit board according to claim 12 , wherein, in the step of removing the glue-resisting gasket to form a heat dissipation groove, the heat dissipation groove exposes the first thermally conductive component, 14 . include: The circuit board has a first surface and a second surface disposed opposite to each other, a first groove is formed on the second surface, and the first groove exposes the glue-resisting gasket; The glue resisting gasket is taken out to form a second groove communicating with the first groove, and the groove and the second groove constitute a heat dissipation groove.

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