CN104411114A - Production process of multi-layer rigid-flex printed circuit board - Google Patents
Production process of multi-layer rigid-flex printed circuit board Download PDFInfo
- Publication number
- CN104411114A CN104411114A CN201410640589.1A CN201410640589A CN104411114A CN 104411114 A CN104411114 A CN 104411114A CN 201410640589 A CN201410640589 A CN 201410640589A CN 104411114 A CN104411114 A CN 104411114A
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- Prior art keywords
- inspection
- rigid
- circuit board
- printed circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A production process of a multi-layer rigid-flex printed circuit board relates to the technical field of electronic processing and comprises the steps of blanking, stacking, laminating and first inspection; drilling holes, catching edges, baking, ionizing and first inspection; imaging, copper plating, chemical washing, sticking dry films on two sides, developing, etching and first inspection; removing films, automatic optical inspection, chemical washing, blanking, printing with green oil and first inspection; pre-baking, exposing and first inspection; repairing, solidifying, automatic positioning and punching and first inspection; surface treatment, horizontal cutting with a cutter, first inspection, forming and packaging. The production process of the multi-layer rigid-flex printed circuit board has the advantages of simple process, rational design and capability of effectively solving problems such as stability and off set in the production process of the multi-layer rigid-flex printed circuit board; and the manufacturing of the rigid-flex printed circuit board is lifted to a higher level.
Description
Technical field:
The present invention relates to electronics processing technique field, be specifically related to a kind of production technology of multilayer Rigid Flex.
Background technology:
The birth of FPC and PCB and development, expedited the emergence of this new product of Rigid Flex.Therefore, Rigid Flex is exactly flexible circuit board and rigid wiring board, through operations such as pressings, combines by related process requirement, the wiring board with FPC characteristic and PCB characteristic of formation.Because Rigid Flex is the combination of FPC and PCB, the production of Rigid Flex should possess FPC production equipment and PCB production equipment simultaneously.First, circuit and the profile of Soft Bonding plate is drawn according to demand by Electronics Engineer, then, be issued to the factory that can produce Rigid Flex, through CAM engineer, associated documents processed, plan, then arrange FPC to produce line production required FPC, PCB product line and produce PCB, this two soft board and hardboard out after, according to the planning requirement of Electronics Engineer, by FPC and PCB through the seamless pressing of pressing machine, again through a series of details link, the finally Rigid Flex with regard to processing procedure.A very important link, should be Rigid Flex difficulty large, detailed problem is many, before shipment, generally all will entirely examine, because its value ratio is higher, in order to avoid allow both sides of supply and demand cause relevant benefit to lose.
Rigid Flex possesses the characteristic of FPC and the characteristic of PCB simultaneously, and therefore, it may be used for the products that some have particular/special requirement, existing certain flexure region, also has certain rigid region, to saving interiors of products space, reduce finished-product volume, enhance product performance and be very helpful.Rigid Flex production process is various, and production difficulty is large, and yields is lower, throw material, manpower is more, therefore, its price comparison is expensive, and the production cycle is long.
Rigid Flex production process is various, and production difficulty is large, and yields is lower, throw material, manpower is more, therefore, its price comparison is expensive, and the production cycle is long.Area for improvement is also had in whole production process.
Summary of the invention:
The object of this invention is to provide the production technology of multilayer Rigid Flex, its technique is simple, reasonable in design, effectively can solve some problems run in Rigid Flex production process, as stability, side-play amount etc., the manufacture of Rigid Flex is improved a higher level.
In order to solve the problem existing for background technology, the present invention is by the following technical solutions: its technological process of production is as follows: blanking-lamination-lamination-head examines-holes-drag for limit-baking-electricity slurry-first inspection-imaging-copper facing-chemical cleaning-two sides paste dry film-development-etching-head inspection-striping-automatic visual inspection-chemical cleaning-blanking-green oil printing-head inspection-preliminary drying-exposure-development-head and examine-repair-solidify-automatically recognize position and punch-head inspection-surface treatment-cutter horizontal segmentation-head examines-shaping-pack.
Namely described boring need to select sharp drill bit, if the printed board quantity processed hole number that is large or that process in plate is many, then also will after having bored certain hole count timely more bit change, the rotating speed of drill bit and feeding are most important technological parameters, need to select drilling machine and drilling parameter thereof according to thickness of slab and minimum aperture aperture.
Described copper facing its require it is that the elongation of copper electroplating layer is greater than the coefficient of thermal expansion of rigid flexible system and flexible multi-layered printed board and effectively higher tensile strength, when through heat-shock, the overall expansion rate larger than copper plate in hole 1.65% of the multilayered printed plate substrate of rigid flexible system, and this index is only 0.03% in rigid multi-layer plate, therefore, the tension stress specific rigidity multi-layer sheet that in rigid flexible system printed board, plated-through hole bears is much bigger.
Described chemical cleaning be cleaning be cleaning Rigid Flex hole in contamination be main, its these stain main with polyimide resin, epoxy glass, epoxy resin is main, at this, select plasma chemical treatment system-Plasma Desmearing system, by vacuum cavity, vacuum pump, RF generator, microcomputerized controller, original gas forms, first after the vacuum degree that equipment cavity reaches certain, high-purity nitrogen and oxygen is injected in proportion wherein, its effect is clean hole wall, macromolecular material is made to have certain activity, be conducive to subsequent treatment, be generally 90 DEG C, 8 minutes, again with CF
4: oxygen and nitrogen, as original gas and resin reaction, reach the object of decontamination, are generally 95 DEG C, 30 minutes, last using oxygen as original gas, remove the residue formed in two-step pretreatment process above, clean hole wall.
The present invention has following beneficial effect: its technique is simple, reasonable in design, effectively can solve some problems run in Rigid Flex production process, as stability, side-play amount etc., the manufacture of Rigid Flex is improved a higher level.
Embodiment:
This embodiment is by the following technical solutions: its technological process of production is as follows: blanking-lamination-lamination-head examines-holes-drag for limit-baking-electricity slurry-first inspection-imaging-copper facing-chemical cleaning-two sides paste dry film-development-etching-head inspection-striping-automatic visual inspection-chemical cleaning-blanking-green oil printing-head inspection-preliminary drying-exposure-development-head and examine-repair-solidify-automatically recognize position and punch-head inspection-surface treatment-cutter horizontal segmentation-head examines-shaping-pack.
Namely described boring need to select sharp drill bit, if the printed board quantity processed hole number that is large or that process in plate is many, then also will after having bored certain hole count timely more bit change, the rotating speed of drill bit and feeding are most important technological parameters, need to select drilling machine and drilling parameter thereof according to thickness of slab and minimum aperture aperture.
Described copper facing its require it is that the elongation of copper electroplating layer is greater than the coefficient of thermal expansion of rigid flexible system and flexible multi-layered printed board and effectively higher tensile strength, when through heat-shock, the overall expansion rate larger than copper plate in hole 1.65% of the multilayered printed plate substrate of rigid flexible system, and this index is only 0.03% in rigid multi-layer plate, as can be seen here, the tension stress specific rigidity multi-layer sheet that in rigid flexible system printed board, plated-through hole bears is much bigger.
Described chemical cleaning be cleaning be cleaning Rigid Flex hole in contamination be main, its these stain main with polyimide resin, epoxy glass, epoxy resin is main, at this, select plasma chemical treatment system-Plasma Desmearing system, by vacuum cavity, vacuum pump, RF generator, microcomputerized controller, original gas forms, first after the vacuum degree that equipment cavity reaches certain, high-purity nitrogen and oxygen is injected in proportion wherein, its effect is clean hole wall, macromolecular material is made to have certain activity, be conducive to subsequent treatment, be generally 90 DEG C, 8 minutes, again with CF
4, oxygen and nitrogen, as original gas and resin reaction, reach the object of decontamination, are generally 95 DEG C, 30 minutes, last using oxygen as original gas, remove the residue formed in two-step pretreatment process above, clean hole wall.
This embodiment has following beneficial effect: its technique is simple, reasonable in design, effectively can solve some problems run in Rigid Flex production process, as stability, side-play amount etc., the manufacture of Rigid Flex be improved a higher level.
The above is only in order to illustrate technical scheme of the present invention and unrestricted, other amendment that those of ordinary skill in the art make technical scheme of the present invention or equivalently to replace, only otherwise depart from the spirit and scope of technical solution of the present invention, all should be encompassed in the middle of right of the present invention.
Claims (4)
1. the production technology of multilayer Rigid Flex, is characterized in that its technological process of production is as follows: blanking-lamination-lamination-head examines-holes-drag for limit-baking-electricity slurry-first inspection-imaging-copper facing-chemical cleaning-two sides paste dry film-development-etching-head inspection-striping-automatic visual inspection-chemical cleaning-blanking-green oil printing-head inspection-preliminary drying-exposure-development-head and examine-repair-solidify-automatically recognize position and punch-head inspection-surface treatment-cutter horizontal segmentation-head examines-shaping-pack.
2. the production technology of multilayer Rigid Flex according to claim 1, it is characterized in that namely described boring need to select sharp drill bit, if the printed board quantity processed hole number that is large or that process in plate is many, then also will after having bored certain hole count timely more bit change, the rotating speed of drill bit and feeding are most important technological parameters, need to select drilling machine and drilling parameter thereof according to thickness of slab and minimum aperture aperture.
3. the production technology of multilayer Rigid Flex according to claim 1, it requires it is that the elongation of copper electroplating layer is greater than the coefficient of thermal expansion of rigid flexible system and flexible multi-layered printed board and effectively higher tensile strength to it is characterized in that described copper facing, when through heat-shock, the overall expansion rate larger than copper plate in hole 1.65% of the multilayered printed plate substrate of rigid flexible system, and this index is only 0.03% in rigid multi-layer plate, therefore, the tension stress specific rigidity multi-layer sheet that in rigid flexible system printed board, plated-through hole bears is much bigger.
4. the production technology of multilayer Rigid Flex according to claim 1, it is characterized in that described chemical cleaning be cleaning be cleaning Rigid Flex hole in contamination be main, its these stain main with polyimide resin, epoxy glass, epoxy resin is main, at this, select plasma chemical treatment system-Plasma Desmearing system, by vacuum cavity, vacuum pump, RF generator, microcomputerized controller, original gas forms, first after the vacuum degree that equipment cavity reaches certain, high-purity nitrogen and oxygen is injected in proportion wherein, its effect is clean hole wall, macromolecular material is made to have certain activity, be conducive to subsequent treatment, be generally 90 DEG C, 8 minutes, again with CF
4,oxygen and nitrogen, as original gas and resin reaction, reach the object of decontamination, are generally 95 DEG C, 30 minutes, last using oxygen as original gas, remove the residue formed in two-step pretreatment process above, clean hole wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410640589.1A CN104411114A (en) | 2014-11-14 | 2014-11-14 | Production process of multi-layer rigid-flex printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410640589.1A CN104411114A (en) | 2014-11-14 | 2014-11-14 | Production process of multi-layer rigid-flex printed circuit board |
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| CN104411114A true CN104411114A (en) | 2015-03-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410640589.1A Pending CN104411114A (en) | 2014-11-14 | 2014-11-14 | Production process of multi-layer rigid-flex printed circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105592632A (en) * | 2015-12-18 | 2016-05-18 | 景旺电子科技(龙川)有限公司 | Method for improving ionic migration of PCB |
| CN106113892A (en) * | 2016-07-07 | 2016-11-16 | 深圳市景旺电子股份有限公司 | A kind of multilamellar soft board plasma processing method and multilamellar soft board |
| CN108337816A (en) * | 2018-02-05 | 2018-07-27 | 江西景旺精密电路有限公司 | A kind of development of PCB welding resistances and hot setting line production line and connecting line technics |
| CN112702844A (en) * | 2020-12-17 | 2021-04-23 | 江西弘信柔性电子科技有限公司 | Flushing method for soft and hard combined plate after drilling |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100789522B1 (en) * | 2006-09-29 | 2007-12-28 | 삼성전기주식회사 | Fabricating method of multi layer printed circuit board |
| CN101505576A (en) * | 2009-03-09 | 2009-08-12 | 深圳市中兴新宇软电路有限公司 | Manufacturing method for multilayered rigidity and flexibility combined printed circuit board |
-
2014
- 2014-11-14 CN CN201410640589.1A patent/CN104411114A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100789522B1 (en) * | 2006-09-29 | 2007-12-28 | 삼성전기주식회사 | Fabricating method of multi layer printed circuit board |
| CN101505576A (en) * | 2009-03-09 | 2009-08-12 | 深圳市中兴新宇软电路有限公司 | Manufacturing method for multilayered rigidity and flexibility combined printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 赵丽: "六层刚挠结合板的研发及应用", 《中国优秀硕士学位论文全文数据库信息科技辑》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105592632A (en) * | 2015-12-18 | 2016-05-18 | 景旺电子科技(龙川)有限公司 | Method for improving ionic migration of PCB |
| CN105592632B (en) * | 2015-12-18 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | A method of improving pcb board Ion transfer |
| CN106113892A (en) * | 2016-07-07 | 2016-11-16 | 深圳市景旺电子股份有限公司 | A kind of multilamellar soft board plasma processing method and multilamellar soft board |
| CN108337816A (en) * | 2018-02-05 | 2018-07-27 | 江西景旺精密电路有限公司 | A kind of development of PCB welding resistances and hot setting line production line and connecting line technics |
| CN112702844A (en) * | 2020-12-17 | 2021-04-23 | 江西弘信柔性电子科技有限公司 | Flushing method for soft and hard combined plate after drilling |
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Application publication date: 20150311 |
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