CN108124384A - Small size wiring board method for processing forming without interior positioning - Google Patents
Small size wiring board method for processing forming without interior positioning Download PDFInfo
- Publication number
- CN108124384A CN108124384A CN201711129408.9A CN201711129408A CN108124384A CN 108124384 A CN108124384 A CN 108124384A CN 201711129408 A CN201711129408 A CN 201711129408A CN 108124384 A CN108124384 A CN 108124384A
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- China
- Prior art keywords
- plate
- small size
- cell board
- board
- strip plank
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of small size wiring board method for processing forming without interior positioning, comprise the following steps：The strip plank being made of row's cell board and the frame positioned at strip plank periphery are cut by plate is produced by gong plate, and the both ends of strip plank link together with frame；The production plate is the plate for having been subjected to surface treatment, and the production plate includes at least row's cell board；On the two sides of strip plank and between adjacent two cell board, progress V cuts to form V-groove；Fracture the connection position that strip plank both ends are connected with frame；V slot connection positions between adjacent two cell board on strip plank are interrupted, obtain cell board.The method of the present invention has subtracted the supplies consumption of adhesive tape and has manually taped, the flow of tear tape, improves production efficiency and reduces production cost；Also solve the problems, such as that small size cell board can not cross finished product cleaning.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of small size wiring board without interior positioning into
Type processing method.
Background technology
In industry traditional wiring board gong plate positioning PIN nail diameters it is basic >=0.8mm, aperture≤0.8mm or board size compared with
It is small without enough position set in location hole, the external form processing of wiring board at this time can not be produced by the way of interior positioning.Often
The method that rule are taped using assist side surface fixes the cell board of small size, again tears adhesive tape after gong plate；Another kind is
(punch forming) punching by the way of beer plate.In addition, shaping after due to unit board size it is small, can not normally over cleaning equipment into
Row cleaning easily leads to wipe in cleaning process and spend, it is impossible to ensure product appearance requirement using cleaning auxiliary fixture cleaning.
There are following defects for above-mentioned forming method：The side of auxiliary gong plate is carried out using fixed small size cell board of taping
Method needs to tear adhesive tape off, adds flow and cost of labor, and efficiency is low, it is necessary to using artificial rubberizing after being molded gong plate；It adopts
With the mode of beer plate, it is necessary to dedicated mold, the cost of one set of die is 3000-5000 members, can be with for large quantities of templates
It is made by the way of beer plate, but for small quantities of template, by the way of beer plate, cost is too high；And it is adopted after unit sheet metal forming
It is easily led to cleaning auxiliary fixture cleaning and flower is wiped in cleaning process, it is impossible to ensure product appearance requirement.
The content of the invention
There are long flow path, efficiency are low, of high cost and clear for existing small size cell board method for processing forming by the present invention
The problem of card face is easily wiped when washing, provides a kind of small size wiring board method for processing forming without interior positioning, and this method subtracts
It the supplies consumption of adhesive tape and manually tapes, the flow of tear tape, improve production efficiency and reduces production cost；Also solve
It's the problem of finished product cleaning can not past small size of having determined cell board (wiring board).
In order to solve the above technical problem, the present invention provides a kind of small size wiring board processing and forming sides without interior positioning
Method comprises the following steps：
S1, gong plate：The strip plank that is made of row's cell board is cut into and positioned at strip by plate is produced by gong plate
The frame of shape plank periphery, and the both ends of strip plank link together with frame；The production plate is to have been subjected to surface
The plate of processing, the production plate include at least row's cell board.
Preferably, in step S1, the production plate also includes drilling, heavy copper, electric plating of whole board, system successively before surface treatment
Make outer-layer circuit and the process for making solder mask；In drilling operating, between adjacent two cell board at every row's cell board both ends
One location hole is set respectively.
S2, V are cut：On the two sides of strip plank and between adjacent two cell board, progress V cuts to form V-groove, up and down
It is V slot connection positions between the opposite V-groove in two sides.
Preferably, in step S2, between location hole and cell board adjacent thereto carrying out V cuts to form V-groove.
Preferably, in step S2, the thickness of V slot connection positions is 0.2mm ± 0.05mm.
Preferably, in step S2, the angle of V-groove slot bottom is 30 °.
Preferably, in step S2, the Aligning degree of the opposite V-groove of upper and lower surface is controlled in ± 0.05mm.
S3, fracture：Fracture the connection position that strip plank both ends are connected with frame.
Preferably, step S31 board-washings are further included between step S3 and S4：Strip plank is carried out using cleaning machine clear
It washes, removes the dust on strip plank.
S4, scoreboard：V slot connection positions between adjacent two cell board on strip plank are interrupted, obtain cell board.
Preferably, in step S4, the V slots between adjacent two cell board on strip plank are connected using automatic board separator
It interrupts position.
Compared with prior art, the present invention has the advantages that：
The present invention is replaced shaping gong plate by the way of V-CUT (V is cut), solved by changing molding technological process
In cell board without location hole in processing and forming there are long flow path, efficiency is low, of high cost the problem of；V cut after by multiple units
The strip plank of plate composition can carry out finished product cleaning, solve the problems, such as that small size cell board is unable to over cleaning machine；Using certainly
Production plate after dynamic board separator cuts V is divided into small size cell board, reduces manually, can effectively improve production efficiency and reduce and give birth to
Produce cost.
Description of the drawings
Fig. 1 is the schematic diagram for boring location hole in embodiment on whole plate wiring board；
Fig. 2 is the schematic diagram of gong plate growth strip plank in embodiment；
Fig. 3 be embodiment in whole plate wiring board V cut after schematic diagram；
Fig. 4 is the schematic diagram of strip plank after fractureing in embodiment；
Fig. 5 is the front view of strip plank in embodiment.
Specific embodiment
In order to more fully understand the technology contents of the present invention, below in conjunction with the accompanying drawings and the specific embodiments to the present invention's
Technical solution is described further and illustrates.
Embodiment 1
As shown in Figures 1 to 5, the production method of a kind of wiring board shown in the present embodiment, a kind of nothing especially therein
The small size wiring board method for processing forming of interior positioning, the production method of wiring board include following treatment process successively：Sawing sheet →
Internal layer circuit making → pressing → drilling → heavy copper → electric plating of whole board → outer-layer circuit making → welding resistance → silk-screen character → surface
Processing → shaping → electric performance test → final inspection, is as follows：
(1), sawing sheet：Core plate is outputed by jigsaw size 520mm × 620mm, and the thickness of core plate is 0.5mm, the outer layer of core plate
The thickness of copper foil is 0.5OZ.
(2), internal layer circuit makes (negative film technique)：Inner figure shifts, and light-sensitive surface, light-sensitive surface are coated with vertical application machine
8 μm of film thickness monitoring, using Full-automatic exposure machine, internal layer circuit exposure is completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule), through aobvious
Shadow forms inner line figure on core plate；Internal layer etches, and the core plate after exposure imaging is etched internal layer circuit, interior layer line
Width is measured as 3mil；Then internal layer AOI checks the defects of opening short circuit, circuit notch, circuit pin hole of internal layer circuit, defective
Processing is scrapped, flawless product goes out to downstream.
(3), press：Brown speed is according to bottom copper copper thickness brown, by core plate, prepreg, outer copper foil on request successively
Overlapping forms superimposed sheet, then according to plate Tg appropriate lamination is selected to press superimposed sheet, forms production plate 1；
Include the cell board 2 of at least row's small size on production plate 1.
(4), drill：According to existing drilling technique, Drilling operation is carried out on production plate according to design requirement；Drilling
When, a location hole 3 is drilled out respectively between outermost adjacent two cell board 2 in every 2 both ends of row's cell board.
(5), heavy copper：Make the hole metallization on production plate, backlight tests 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), electric plating of whole board：According to the prior art and by design requirement electric plating of whole board is carried out on production plate.
(7), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer-layer circuit figure is formed on production plate
Shape；Outer graphics are electroplated, then the copper facing and tin plating respectively on production plate, and copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is to electroplate 10min, 3-5 μm of tin thickness with the current density of 1.2ASD；Outer layer etches, and then moves back film, erosion successively again
Tin is carved and moves back, the layers of copper in etching outer-layer circuit on production plate and removing location hole 3.
(8), welding resistance, silk-screen character：According to the prior art and by design requirement solder mask and silk-screen are made on production plate
Character.
(9), it is surface-treated：It is surface-treated according to the prior art and by design requirement on production plate.
(10), it is molded：Comprise the following steps：
A, gong plate：It is positioned with location hole 3, plate 1 will be produced by gong plate cut into and multiple be made of row's cell board 2
Strip plank 4 and the frame 5 positioned at the periphery of strip plank 4, and the both ends of strip plank 4 are both connected to frame 5
Together；
B, V is cut：V is carried out using automatic V-Cut machines to production plate 1 to cut, according to the size of small size cell board, in strip
V is carried out among the two sides between adjacent two cell board 2 on plank 4 using V-Cut knives to cut to form V-groove 6, upper and lower surface phase
To V-groove 6 between remaining thickness be V slots connection position 7；It, need to be in location hole 3 and between two adjacent cell boards 2 of location hole 3
Both sides (i.e. between location hole and cell board) carry out V and cut, and the later stage is used to remove location hole 3；
Wherein, remaining thick (i.e. the thickness of V slots connection position) between the V-groove 6 of upper and lower surface control 0.2mm ±
The angle that 0.05mm, V are cut is 30 °, and when upper and lower surface is cut using V-Cut knives progress V, cutter is in the cutting path pair of upper and lower surface
Accuracy control makes the Aligning degree control of the V-groove that upper and lower surface is opposite after cutting facilitate the later stage in ± 0.05mm in ± 0.05mm
It interrupts V slots connection position and prevents that V-groove dislocation brings quality problem up and down.
C, fracture：Fracture the connection position that 4 both ends of strip plank are connected with frame 5, makes strip plank 4 disconnected with frame 5
It opens, obtains strip plank 4；
D, board-washing：Strip plank 4 is cleaned using finished product cleaning machine, removes the dust on strip plank；
E, scoreboard：The V slots connection position 7 between adjacent two cell board 2 on strip plank 4 is beaten using automatic board separator
It is disconnected, obtain small size cell board 2.
(11), electric performance test：The electric property of small size cell board is detected, detects qualified cell board into next
A processing link；
(12), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of finished product etc. is taken a sample test respectively,
Qualified product can shipment.
The technical solution provided above the embodiment of the present invention is described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are set forth, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion this specification content should not be construed as limiting the invention.
Claims (8)
1. a kind of small size wiring board method for processing forming without interior positioning, which is characterized in that comprise the following steps：
S1, gong plate：The strip plank that is made of row's cell board is cut into and positioned at strip plate by plate is produced by gong plate
The frame of sub- periphery, and the both ends of strip plank link together with frame；The production plate is to have been subjected to surface treatment
Plate, it is described production plate include at least row's cell board；
S2, V are cut：On the two sides of strip plank and between adjacent two cell board, progress V cuts to form V-groove, upper and lower surface
It is V slot connection positions between opposite V-groove；
S3, fracture：Fracture the connection position that strip plank both ends are connected with frame；
S4, scoreboard：V slot connection positions between adjacent two cell board on strip plank are interrupted, obtain cell board.
2. the small size wiring board method for processing forming according to claim 1 without interior positioning, which is characterized in that step S1
In, the production plate before surface treatment also includes drilling, heavy copper, electric plating of whole board, making outer-layer circuit and makes welding resistance successively
The process of layer；In drilling operating, a location hole is set respectively between adjacent two cell board at every row's cell board both ends.
3. the small size wiring board method for processing forming according to claim 2 without interior positioning, which is characterized in that step S2
In, between location hole and cell board adjacent thereto carrying out V cuts to form V-groove.
4. the small size wiring board method for processing forming according to claim 1 without interior positioning, which is characterized in that step S2
In, the thickness of V slot connection positions is 0.2mm ± 0.05mm.
5. the small size wiring board method for processing forming according to claim 1 without interior positioning, which is characterized in that step S2
In, the angle of V-groove slot bottom is 30 °.
6. the small size wiring board method for processing forming according to claim 1 without interior positioning, which is characterized in that step S2
In, the Aligning degree of the opposite V-groove of upper and lower surface is controlled in ± 0.05mm.
7. the small size wiring board method for processing forming according to claim 1 without interior positioning, which is characterized in that step S3
Step S31 board-washings are further included between S4：Strip plank is cleaned using cleaning machine, removes the powder on strip plank
Dirt.
8. the small size wiring board method for processing forming according to claim 1 without interior positioning, which is characterized in that step S4
In, the V slot connection positions between adjacent two cell board on strip plank are interrupted using automatic board separator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711129408.9A CN108124384B (en) | 2017-11-15 | 2017-11-15 | Small-size circuit board forming processing method without inner positioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711129408.9A CN108124384B (en) | 2017-11-15 | 2017-11-15 | Small-size circuit board forming processing method without inner positioning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108124384A true CN108124384A (en) | 2018-06-05 |
| CN108124384B CN108124384B (en) | 2019-12-24 |
Family
ID=62228445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711129408.9A Active CN108124384B (en) | 2017-11-15 | 2017-11-15 | Small-size circuit board forming processing method without inner positioning |
Country Status (1)
| Country | Link |
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| CN (1) | CN108124384B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561587A (en) * | 2018-11-28 | 2019-04-02 | 江门市利诺达电路科技有限公司 | A kind of production method of printed circuit board |
| CN110087396A (en) * | 2019-05-27 | 2019-08-02 | 江西景旺精密电路有限公司 | A kind of method of the processing and forming and on off test of small size PCB |
| CN111432563A (en) * | 2020-05-28 | 2020-07-17 | 遂宁市广天电子有限公司 | Method for reducing dimension tolerance of PCB V-cut board |
| CN112533382A (en) * | 2020-12-09 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Processing method for routing belt of circuit board and circuit board without positioning hole |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01178408A (en) * | 1988-01-07 | 1989-07-14 | Fujitsu Ltd | Dividing method for printed wiring board |
| JPH10217227A (en) * | 1997-02-02 | 1998-08-18 | Tdk Corp | Method of division forming of piezoelectric ceramic substrate |
| CN103298252A (en) * | 2012-03-02 | 2013-09-11 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing the same |
| CN203691752U (en) * | 2014-01-24 | 2014-07-02 | 东莞市合通电子有限公司 | Circuit board with improved connecting plate structure |
| CN203788551U (en) * | 2014-02-10 | 2014-08-20 | 柏承电子（惠阳）有限公司 | Multilayer board anti-miss cutting structure |
-
2017
- 2017-11-15 CN CN201711129408.9A patent/CN108124384B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01178408A (en) * | 1988-01-07 | 1989-07-14 | Fujitsu Ltd | Dividing method for printed wiring board |
| JPH10217227A (en) * | 1997-02-02 | 1998-08-18 | Tdk Corp | Method of division forming of piezoelectric ceramic substrate |
| CN103298252A (en) * | 2012-03-02 | 2013-09-11 | Lg伊诺特有限公司 | Printed circuit board and method for manufacturing the same |
| CN203691752U (en) * | 2014-01-24 | 2014-07-02 | 东莞市合通电子有限公司 | Circuit board with improved connecting plate structure |
| CN203788551U (en) * | 2014-02-10 | 2014-08-20 | 柏承电子（惠阳）有限公司 | Multilayer board anti-miss cutting structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561587A (en) * | 2018-11-28 | 2019-04-02 | 江门市利诺达电路科技有限公司 | A kind of production method of printed circuit board |
| CN110087396A (en) * | 2019-05-27 | 2019-08-02 | 江西景旺精密电路有限公司 | A kind of method of the processing and forming and on off test of small size PCB |
| CN111432563A (en) * | 2020-05-28 | 2020-07-17 | 遂宁市广天电子有限公司 | Method for reducing dimension tolerance of PCB V-cut board |
| CN112533382A (en) * | 2020-12-09 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Processing method for routing belt of circuit board and circuit board without positioning hole |
| CN112533382B (en) * | 2020-12-09 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Processing method for routing belt of circuit board and circuit board without positioning hole |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108124384B (en) | 2019-12-24 |
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