CN111432563A - Method for reducing dimension tolerance of PCB V-cut board - Google Patents
Method for reducing dimension tolerance of PCB V-cut board Download PDFInfo
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- CN111432563A CN111432563A CN202010468986.0A CN202010468986A CN111432563A CN 111432563 A CN111432563 A CN 111432563A CN 202010468986 A CN202010468986 A CN 202010468986A CN 111432563 A CN111432563 A CN 111432563A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Milling Processes (AREA)
Abstract
The invention provides a method for reducing the dimensional tolerance of a PCB (printed circuit board) after V-shaped cutting, relates to the technical field of PCB splitting, and solves the technical problems that the upper and lower V-shaped cutters cannot achieve 0 deviation due to the process defects after V-shaped cutting and splitting, and the PCB (printed circuit board) has abnormal tolerance exceeding the customer requirement due to burrs on the edges of the split board. A method for reducing size tolerance of a PCB after V-splitting is characterized in that makeup data (the distance between copper in the PCB and a board edge substrate is larger than 0.15 mm) provided by a customer is contracted inwards by 0.06mm per PCB platelet, and a 25-degree V cutter is used for splitting, so that the size of a single PCB platelet after V-splitting is within +/-0.015mm of the customer requirement.
Description
Technical Field
The invention relates to the technical field of PCB V-shaped split boards, in particular to a method for reducing the dimensional tolerance of a PCB V-shaped split board.
Background
In the V-shaped board cutting process of the PCB, the alignment precision of the upper and lower V-shaped cutters cannot realize zero deviation due to defects in the process, and due to the quality problem of the board, burrs are formed on the edges of the board after the board is cut, so that the tolerance phenomenon in the small board size of the cut PCB exceeds the requirement of a client is generated abnormally.
Disclosure of Invention
The invention aims to provide a method for reducing the tolerance of the dimension of a PCB (printed circuit board) subjected to V-shaped splitting, wherein a cutter with the angle of 25 degrees is used, and each small PCB is retracted by 0.06mm, so that the technical problem that when the tolerance dimension is less than +/-0.15mm and the distance between copper in the small PCB and a board edge substrate is more than 0.15mm after the V-shaped splitting is required by a customer, the dimension of a finished PCB product exceeds the tolerance is solved. The technical effects that can be produced by the preferred technical scheme in the technical schemes provided by the invention are described in detail in the following.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a method for reducing the dimensional tolerance of a PCB after V-shaped division, which comprises the steps of dividing the PCB by using a 25-degree V cutter and retracting each small PCB by 0.06 mm. (ii) a Wherein:
alternatively or preferably, the method for reducing the dimensional tolerance of the PCB board V after being cut into the boards can be divided into the following steps:
s1: analyzing the size of the space between the small PCB plates and the size of the empty area from the copper to the plate edge substrate in the PCB to design the size of the PCB;
s2: designing a DOE (design of experiments) experiment, and finding out the alignment precision of an upper V-shaped cutter and a lower V-shaped cutter in the V-shaped cutting process and the sizes of burrs on the edges of the V-shaped cut board of the base material V of different suppliers;
s3: copying an optimization mode with the minimum dimensional tolerance after V is divided into plates in the DOE experiment, and verifying the repeatability in small-batch production;
s4: according to analysis of DOE experimental data, when the V-shaped board splitting forming mode requires that the size tolerance after board splitting is less than +/-0.15mm, and the distance between copper in a small PCB board and a board edge base material is greater than 0.15mm, the size of a finished PCB product has an out-of-tolerance phenomenon;
s5: according to the DOE experiment result, the optimal optimization mode is to select a 25-degree V cutter in a V-cut plate mode for cutting, and each small PCB is retracted by 0.06 mm.
Alternatively or preferably, the DOE experiment is performed as follows:
s10, when the PCB small plates are not shrunk inwards, V cutting is carried out on the plate with the plate thickness of 0.9mm by using a 30-degree V cutting knife, the sizes of 100 PCB small plates are measured, and the tolerance range is +/-0.25 mm;
s11: when the size of the small PCB is not shrunk inwards, a 25-degree V cutting knife is used for carrying out V cutting on the board with the thickness of 0.9mm, the size of 100 small PCB boards is measured, and the tolerance range is +/-0.20 mm;
s12: when the PCB small plates are retracted by 0.06mm, after a plate with the thickness of 0.9mm is subjected to V cutting by using a 25-degree V cutting knife, 100 PCB small plate plates are measured, and the tolerance range is +/-0.15 mm.
Based on the technical scheme, the following technical effects can be generated:
the method for reducing the dimensional tolerance of the PCB after V-shaped board division is suitable for the PCB to carry out V-shaped board division. According to the method for reducing the dimensional tolerance of the PCB after V-cutting, disclosed by the invention, the 25-degree V cutting knife is used, and each small PCB is retracted by 0.06mm, so that the technical problem that when the tolerance size is less than +/-0.15mm after the V-cutting forming mode is adopted by a client, and the distance between copper in the small PCB and a board edge substrate is greater than 0.15mm, the finished product size of the PCB exceeds the tolerance is solved, the V-cutting data is optimized by using the technology, the appearance qualification rate of the V-cutting formed product can be improved by 80%, the rejection rate is reduced by 80% (0.2 flat meter scrapped before each flat meter is improved, the rejection rate is 20%, the scrapping cost is 80 yuan), the client complaint and the return rate are reduced, and the cost of the designed board per flat meter is saved by 64 yuan.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
The invention provides a method for reducing the dimensional tolerance of a PCB after V-shaped division, which comprises the steps of dividing the PCB by using a 25-degree V cutter and retracting each small PCB by 0.06 mm.
As an optional implementation manner, the method for reducing the dimensional tolerance of the PCB board V after being divided into the boards may be divided into the following steps:
s1: analyzing the size of the space between the small PCB plates and the size of the empty area from the copper to the plate edge substrate in the PCB to design the size of the PCB;
s2: designing a DOE (design of experiments) experiment, and finding out the alignment precision of an upper V-shaped cutter and a lower V-shaped cutter in the V-shaped cutting process and the sizes of burrs on the edges of the V-shaped cut board of the base material V of different suppliers;
s3: copying an optimization mode with the minimum dimensional tolerance after V is divided into plates in the DOE experiment, and verifying the repeatability in small-batch production;
s4: according to analysis of DOE experimental data, when the V-shaped board splitting forming mode requires that the size tolerance after board splitting is less than +/-0.15mm, and the distance between copper in a small PCB board and a board edge base material is greater than 0.15mm, the size of a finished PCB product has an out-of-tolerance phenomenon;
s5: according to the DOE experiment result, the optimal optimization mode is to select a 25-degree V cutter in a V-cut plate mode for cutting, and each small PCB is retracted by 0.06 mm.
As an alternative embodiment, the DOE experiment is performed as follows:
s10, when the PCB small plates are not retracted, after V cutting is carried out on the plate with the plate thickness of 0.9mm by using a 30-degree V cutting knife, the sizes of 100 PCB small plate plates are measured, and the tolerance range is +/-0.25 mm;
s11: when the PCB small plates are not retracted inwards, a 25-degree V cutting knife is used for carrying out V cutting on the plate with the thickness of 0.9mm, the sizes of 100 PCB small plate plates are measured, and the tolerance range is +/-0.20 mm;
s12: when the PCB small plates are retracted by 0.06mm, after a plate with the thickness of 0.9mm is subjected to V cutting by using a 25-degree V cutting knife, 100 PCB small plate plates are measured, and the tolerance range is +/-0.15 mm.
Before and after the invention is adopted, the statistics of the product production qualification rate are as follows:
the above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (3)
1. A method for reducing the dimensional tolerance of a PCB V after being divided into boards is characterized in that: including using a 25 degree V cutter to cut the PCB panel and retracting 0.06mm per small PCB panel.
2. The method of claim 1, wherein the dimensional tolerance of the PCB after V-splitting is reduced by: the method for reducing the dimensional tolerance of the PCB V after being divided into the boards can be divided into the following steps:
s1: analyzing the size of the space between the small PCB plates and the size of the empty area from the copper to the plate edge substrate in the PCB to design the size of the PCB;
s2: designing a DOE (design of experiments) experiment to find out the alignment precision of an upper V-shaped cutting knife and a lower V-shaped cutting knife in the V-shaped cutting process and the sizes of burrs on the edges of the V-shaped cut board of the base material V of different suppliers;
s3: copying an optimization mode with the minimum dimensional tolerance after V is divided into plates in the DOE experiment, and verifying the repeatability in small-batch production;
s4: according to analysis of DOE experimental data, when the V-shaped board splitting forming mode requires that the size tolerance after board splitting is less than +/-0.15mm, and the distance between copper in a small PCB board and a board edge base material is greater than 0.15mm, the size of a finished PCB product has an out-of-tolerance phenomenon;
s5: according to the DOE experiment result, the optimal optimization mode is to select a 25-degree V cutter in a V-cut plate mode for cutting, and each small PCB is retracted by 0.06 mm.
3. The method of claim 2, wherein the dimensional tolerance of the PCB after V-splitting is reduced by: the procedure of the DOE experiment was as follows:
s10, when the PCB small plates are not retracted, after V cutting is carried out on the plate with the plate thickness of 0.9mm by using a 30-degree V cutting knife, the sizes of 100 PCB small plate plates are measured, and the tolerance range is +/-0.25 mm;
s11: when the PCB small plates are not retracted inwards, a 25-degree V cutting knife is used for carrying out V cutting on the plate with the thickness of 0.9mm, the sizes of 100 PCB small plate plates are measured, and the tolerance range is +/-0.20 mm;
s12: when the PCB small plates are retracted by 0.06mm, after a plate with the thickness of 0.9mm is subjected to V cutting by using a 25-degree V cutting knife, 100 PCB small plate plates are measured, and the tolerance range is +/-0.15 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010468986.0A CN111432563A (en) | 2020-05-28 | 2020-05-28 | Method for reducing dimension tolerance of PCB V-cut board |
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| CN202010468986.0A CN111432563A (en) | 2020-05-28 | 2020-05-28 | Method for reducing dimension tolerance of PCB V-cut board |
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| CN111148351A (en) * | 2019-12-18 | 2020-05-12 | 惠州市金百泽电路科技有限公司 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
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| CN102438399A (en) * | 2011-09-30 | 2012-05-02 | 景旺电子科技(龙川)有限公司 | Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof |
| CN106304637A (en) * | 2016-08-09 | 2017-01-04 | 安徽广德威正光电科技有限公司 | A kind of method that pcb board shapes |
| CN106793460A (en) * | 2016-12-20 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of new ladder wiring board and preparation method thereof |
| CN106851998A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of fine and closely woven PCB circuits and preparation method |
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Application publication date: 20200717 |