CN111148351B - Processing method of 5G small-sized base station power amplifier module PCB with step groove - Google Patents
Processing method of 5G small-sized base station power amplifier module PCB with step groove Download PDFInfo
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- CN111148351B CN111148351B CN201911310602.6A CN201911310602A CN111148351B CN 111148351 B CN111148351 B CN 111148351B CN 201911310602 A CN201911310602 A CN 201911310602A CN 111148351 B CN111148351 B CN 111148351B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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Abstract
The invention belongs to the technical field of PCB processing, and provides a processing method of a 5G small-sized base station power amplifier module PCB with a step groove, which comprises the following steps: s1, designing a flow; s2, designing processing data of the formed V-CUT; s3.V-CUT processing; s4, cleaning the V-CUT burr; s5, designing a routing groove; and S6, detecting the size and the appearance. Starting from the technological capability of equipment and the characteristics of materials, the invention ensures that the aluminum-based power amplifier module PCB with the step groove can be processed in batch, has no burrs on the appearance, is easy for a client to separate boards, and meets the design requirements on size and quality by designing the V-CUT special for mixed lamination and aluminum base and the processing flow for removing burrs and improving the quality.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a processing method of a PCB of a power amplifier module of a 5G small-sized base station power supply with a step groove.
Background
Compared with 4G signals, 5G network signal transmission has the characteristics of high frequency, high speed and short distance, and the miniaturization due to the large number of base stations is a necessary choice. Because the power supply and the power amplifier module can only be made smaller, an aluminum-based printed board with excellent performance and low cost is adopted as a heat radiating device of the power amplifier in a heat radiating mode, and therefore the heat radiating device becomes a necessary choice.
For the PCB with smaller size, the conventional production method adopts a stamp hole + bridging or V-CUT mode to ensure the demand of the paster, and the conventional method comprises two modes of manual board separation and machine board separation after the paster is finished. Because the metal material all is than adopting stamp hole + bridging's mode manual branch board can cause the size to be bigger than the hard shaping processing back, and automatic board separator can't cut the branch board to the metal again, therefore the size of metal material PCB all is great and adopt the mode production of veneer delivery. The single aluminum base of the miniaturized 5G base station power amplifier module is small in size, some single boards are only 20 mm-30mm or even smaller and delivered to customers, and accordingly the chip mounting cannot be completed, and multiple PCBs are required to be spliced to be subjected to component mounting and then to be divided. The method is difficult to realize for the metal aluminum-based PCB with small size according to the conventional routing method at present. The 5G power amplifier module or the antenna array usually adopts an antenna matrix of a 2.35mmx2.35mm patch antenna, a step groove is required to be formed on a metal surface for placing an element, and the manufacturing of a PCB product without an inner positioning hole and with a step groove is more difficult to realize.
Disclosure of Invention
In view of the above, the invention provides a method for processing a 5G small-sized base station power amplifier module PCB with a step groove, which starts from the process capability of equipment and the characteristics of materials, ensures that the aluminum-based power amplifier module PCB with the step groove can be processed in batch by designing a hybrid laminated, aluminum-based special V-CUT and a processing flow for removing burrs and improving the quality, has no burrs on the appearance, is easy for customers to separate boards, and meets the design requirements on size and quality.
The technical scheme of the invention is as follows:
a processing method of a 5G small-sized base station power amplifier module PCB with a step groove is characterized by comprising the following steps: s1, flow design: designing a main flow of PCB processing of the aluminum-based power amplifier module with the step groove, and designing a sub-flow of a forming and burr control method; the processing efficiency and the quality of the product are ensured.
S2, designing forming V-CUT processing data;
setting hanging holes according to the equipment parameters of the V-CUT machine and the hole center distance of 100mm, calculating the center line through which the V-CUT passes according to the outer frame data and the degree data provided by customers, and making data;
s3.V-CUT processing;
s4, cleaning the V-CUT burr;
s5, designing a routing groove: because of poor rigidity of aluminum-based materials, the products need to be processed by V-CUT and then grooved so as to ensure that the products cannot be broken; because burrs are generated on the V-CUT line and the routing groove on the same straight line, a counterclockwise coarse routing program and a clockwise fine routing program are required to be designed to remove the burrs in the groove;
and S6, detecting the size and the appearance.
Further, the step S3 includes: performing V-CUT on all aluminum bases, and reserving a part of FR4 in the mixed laminated structure as excess thickness; the client is convenient to divide the board; for the processing of the single-sided aluminum base, a multiple single-sided V-CUT scheme needs to be designed, and the final depth of the double-sided V-CUT is determined according to the residual thickness. The special cutter such as diamond is adopted for production, when the thickness of an aluminum base exceeds 1mm, the larger the resistance of the V-CUT cutter is, 1 reverse V-CUT burr removing groove needs to be additionally arranged in the same path every time the plate thickness is increased by 0.5mm, and the processing speed of the V-CUT cutter is reduced to about 30 percent of that of a conventional product.
Further, in the step S3, the processing mode is to firstly perform coarse gong counterclockwise for 1 time, the tolerance is controlled to be about +0.05-0.1mm, and then call the data of the fine gong to perform fine gong clockwise for 1 time to remove burrs in the groove, and the tolerance is controlled to be about ± 0.5mm.
Further, the step S3 further includes: the conventional V-CUT processing speed is between 30 and 60m/min, when the ultra-thick metal material product is produced, the more times of processing the same position, the greater the resistance on the V-CUT knife, the processing speed of the V-CUT knife needs to be reduced in sequence, and the speed is set according to 40 to 70 percent of the conventional product.
Further, the step S4 includes designing a V-CUT burr cleaning process for a product having a step and subjected to surface treatment, filling the step with blue glue for a product having a smaller step depth, and then treating the burr by using a plate grinding scheme, wherein the burr can be directly treated by using a belt grinding plate for a product having a deeper step, and the V-CUT direction and the plate grinding direction are the same when the plate is ground. Specifically, a 600-800# abrasive belt plate grinding machine is adopted to grind the aluminum base surface on one side, then the aluminum base surface is polished on one side of the 800-1000# grinding plate, the V-CUT direction and the grinding plate direction are required to be consistent when the plate is ground, so that the aluminum base surface is scratched by aluminum-based filaments, and no acid exists in all washing processes.
Further, the step S6 comprises the steps of measuring the residual thickness of the V-shaped groove by using a V-CUT residual thickness measuring instrument, ensuring that the dimension meets the design requirement, and checking whether the appearance has quality problems of burrs, scratches and the like.
Further, step S1 includes a laminated structure design, where the laminated structure includes an FR4 layer, a PP layer, and an aluminum base layer, which are sequentially disposed.
Further, step S1 includes designing a processing flow according to FR4, PP, and an aluminum base, where a conventional FR4 plate processing part needs to complete production and short circuit opening functionality test according to a normal flow, PP selects a no-flow adhesive PP, and after aluminum base cutting, it needs to perform groove milling on PP and a metal aluminum base surface as required by a connection plug-in position of an abrasive belt grinding plate and FR4 and perform production to a V-CUT process according to a flow after total pressure.
The main innovation points of the invention are as follows:
1. a manufacturing method for solving the problem of processing a small-sized 5G base station power amplifier module PCB with a step groove by adopting a hybrid lamination process and a V-CUT forming process technology. The new technology designs a mixed lamination flow and method and adopts a multiple depth control V-CUT processing technology with FR4 material as the excess thickness and different depths to meet the requirements of product size and quality.
2. The V-CUT on aluminum-based materials produces a large number of burrs on and around the walls of the cell that can scratch the substrate and the entire product. The invention develops control measures and processes for cutting aluminum base and removing burrs in a grading way, and is an effective method for ensuring the processing quality of products.
3. A mixed laminated product containing metal materials adopts a processing technology of dividing an aluminum base by adopting a V-CUT cutting technology and completely designing excess thickness on a conventional FR4 material. The technical problems that the products cannot be separated and the size of the products is larger by adopting a stamp hole and bridging technology are solved. The V-CUT can improve the production efficiency and reduce the processing cost. The requirement of enterprise batch production is met. Belongs to 5G and subsequent market high value-added processing projects, and can obtain more orders and high processing profits for companies.
The invention has the beneficial effects that:
1. the PCB adopts a mixed lamination process, the aluminum base surface is designed with a step groove, the finished product has small size, the veneer delivery cannot be used for pasting, and the scheme of stamp hole and bridging cannot be used for the connection delivery.
2. To ensure acceptable dimensions, the V-CUT wire and the milling groove are positioned in the same straight line and have burrs, and cutting on the aluminum-based material also generates a large amount of burrs around the V-CUT groove to scratch the substrate and the whole product. The invention needs to develop a control method of burrs during cutting aluminum base, and ensures the product quality.
3. The development of a special V-CUT tool processing technical scheme can be more efficient than a conventional stamp hole + bridging production mode, and can also obtain a better product size. The processing capacity of the product is improved, the processing cost is reduced, the method belongs to a 5G and subsequent market high-added-value processing project, and more orders and high-amount processing profits can be obtained for a company.
4. The novel process is a technical innovation of the existing process, has strong operability, can meet the requirements of batch production and safe production of printed board manufacturers, and can become a new profit increasing point of enterprises.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
A processing method of a 5G small-sized base station power amplifier module PCB with a step groove is characterized by comprising the following steps: s1, flow design: designing a main flow of PCB processing of the aluminum-based power amplifier module with the step groove, and designing a sub-flow of a forming and burr control method; the processing efficiency and the quality of the product are ensured.
S2, designing processing data of the formed V-CUT;
setting hanging holes according to the equipment parameters of the V-CUT machine and the hole center distance of 100mm, calculating the center line through which the V-CUT knife passes according to the outer frame data and the degree data provided by customers and manufacturing data;
s3.V-CUT processing;
s4, cleaning the V-CUT burr;
s5, designing a routing groove: because the rigidity of the aluminum-based material is poor, the product is required to be subjected to V-CUT processing and then groove routing so as to ensure that the product cannot be broken; because burrs can be generated on the same straight line of the V-CUT line and the routing groove, a program for removing the burrs in the groove needs to be designed for anticlockwise rough routing and clockwise fine routing;
and S6, detecting the size and the appearance.
Further, the step S3 includes: performing V-CUT on all aluminum bases, and reserving a part of FR4 in the mixed laminated structure as a residual thickness; the client board separation is convenient; for the processing of the single-sided aluminum base, a multiple single-sided V-CUT scheme needs to be designed, and the final depth of the double-sided V-CUT is determined according to the residual thickness.
Further, in the step S3, the processing mode is to firstly perform coarse gong counterclockwise for 1 time, the tolerance is controlled to be about +0.05-0.1mm, and then call the data of the fine gong to perform fine gong clockwise for 1 time to remove burrs in the groove, and the tolerance is controlled to be about ± 0.5mm.
Further, the step S3 further includes: the V-CUT conventional processing speed is between 30 and 60m/min, when the ultra-thick metal material product is produced, the more times of processing at the same position, the greater the resistance on the V-CUT cutter, the processing speed of the V-CUT cutter needs to be reduced in sequence, and the speed is set according to 40 to 70 percent of the conventional product.
Further, the step S4 includes designing a V-CUT burr cleaning process for a product having a step and subjected to surface treatment, filling the step with blue glue for a product having a smaller step depth, and then treating burrs by using a plate grinding scheme, wherein the burrs of the product having a deeper step depth can be directly treated by using an abrasive belt plate, and the V-CUT direction and the plate grinding direction are the same as each other when the plate is ground.
Further, the step S6 comprises the steps of measuring the residual thickness of the V-shaped groove by using a V-CUT residual thickness measuring instrument, ensuring that the dimension meets the design requirement, and checking whether the appearance has quality problems of burrs, scratches and the like.
Further, step S1 includes a laminated structure design, where the laminated structure includes an FR4, PP, and an aluminum base layer that are sequentially disposed.
Further, step S1 includes designing a processing flow according to FR4, PP, and an aluminum base, where a conventional FR4 plate processing part needs to complete production and short circuit opening functionality test according to a normal flow, PP selects a no-flow adhesive PP, and after aluminum base cutting, it needs to perform groove milling on PP and a metal aluminum base surface as required by a connection plug-in position of an abrasive belt grinding plate and FR4 and perform production to a V-CUT process according to a flow after total pressure.
The invention also provides a specific embodiment of the following table processing parameter setting.
In the embodiment, the PCB adopts a mixed lamination process, the aluminum base surface is designed with a step groove, the finished product has small size, the veneer delivery cannot be used for pasting, and the scheme of stamp hole and bridging cannot be used for the continuous delivery.
To ensure acceptable dimensions, the V-CUT wire and the milling groove are positioned in the same straight line and have burrs, and cutting on the aluminum-based material also generates a large amount of burrs around the V-CUT groove to scratch the substrate and the whole product. The invention needs to develop a control method of burrs during cutting aluminum base, and ensures the product quality.
The special V-CUT tool processing technical scheme developed by the invention can be more efficient than the conventional stamp hole + bridging production mode, and can also obtain more excellent product size. The processing capacity of the product is improved, the processing cost is reduced, the method belongs to a 5G and subsequent market high-added-value processing project, and more orders and high-amount processing profits can be obtained for a company.
The novel process is a technical innovation of the existing process, has strong operability, can meet the requirements of batch production and safe production of printed board manufacturers, and can become a new profit increasing point of enterprises.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (8)
1. A processing method of a 5G small-sized base station power amplifier module PCB with a step groove is characterized by comprising the following steps: s1, flow design: designing a main flow of PCB processing of the aluminum-based power amplifier module with the step groove, and designing a sub-flow of a forming and burr control method; the processing efficiency and the quality of the product are ensured;
s2, designing processing data of the formed V CUT;
setting hanging holes according to the equipment parameters of the V-CUT machine and the hole center distance of 100mm, calculating the center line through which the V-CUT passes according to the outer frame data and the degree data provided by customers, and making data;
s3.V-CUT processing;
s4.V-CUT burr cleaning;
s5, designing a routing groove: because of poor rigidity of aluminum-based materials, the products need to be processed by V-CUT and then grooved so as to ensure that the products cannot be broken; because burrs are generated on the V-CUT line and the routing groove on the same straight line, a counterclockwise coarse routing program and a clockwise fine routing program are required to be designed to remove the burrs in the groove;
and S6, detecting the size and the appearance.
2. The method for processing the 5G small-sized base station power amplifier module PCB with the step groove as claimed in claim 1, wherein the step S3 comprises: performing V-CUT on all aluminum bases, and reserving a part of FR4 in the mixed laminated structure as excess thickness; the client board separation is convenient; for the processing of the single-sided aluminum base, a multiple single-sided V-CUT scheme needs to be designed, and the final depth of the double-sided V-CUT is determined according to the residual thickness.
3. The processing method of a 5G small-sized base station power amplifier module PCB with a step groove according to claim 2, wherein in the step S5, the processing mode is that firstly, the process is carried out 1 time counterclockwise thick gong, the tolerance is controlled to be 0.05-0.1mm, then, the process is carried out 1 time clockwise fine gong by calling the data of the fine gong to remove burrs in the groove, and the tolerance is controlled to be +/-0.5 mm.
4. The processing method of the 5G small-sized base station power amplifier module PCB with the step groove according to the claim 2 or 3, wherein the step S3 further comprises the following steps: the conventional V-CUT processing speed is between 30 and 60m/min, when the ultra-thick metal material product is produced, the more times of processing the same position, the greater the resistance on the V-CUT knife, the processing speed of the V-CUT knife needs to be reduced in sequence, and the speed is set according to 40 to 70 percent of the conventional product.
5. The method for processing the PCB of the 5G small-sized base station power amplifier module with the step groove as claimed in claim 1, wherein the step S4 comprises designing a V-CUT burr cleaning process for a product with a step position and subjected to surface treatment, wherein the burr is processed by a grinding plate scheme after the step position is filled with blue glue for a product with a smaller step depth, the burr is processed by a belt grinding plate directly for a product with a deeper step position, and the V-CUT direction is consistent with the grinding plate direction during plate grinding.
6. The method for processing the PCB of the 5G small-sized base station power amplifier module with the stepped groove as claimed in claim 1, wherein the step S6 comprises measuring the residual thickness of the V groove by using a V-CUT residual thickness measuring instrument, ensuring that the dimension meets the design requirements, and checking whether burrs or scratches exist on the appearance.
7. The method for processing the power amplifier module PCB of the 5G small-sized base station with the stepped groove as claimed in claim 1, wherein the step S1 comprises a laminated structure design, and the laminated structure comprises an FR4 layer, a PP layer and an aluminum base layer which are sequentially arranged.
8. The method for processing a 5G small-sized base station power amplifier module PCB with the step groove according to claim 7, wherein the step S1 further comprises designing and processing procedures according to FR4, PP and aluminum base, wherein a conventional FR4 plate processing part needs to complete production and short circuit opening functional test according to a normal procedure, the PP selects no-flow glue PP, after the aluminum base is CUT, a position of a plug-in unit for connecting the abrasive belt grinding plate and the FR4 is needed, the surface mounted device is needed to process the grooves of PP and a metal aluminum base surface, and after total pressure, the PCB is produced to a V-CUT procedure according to the procedure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911310602.6A CN111148351B (en) | 2019-12-18 | 2019-12-18 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
| PCT/CN2020/106997 WO2021120639A1 (en) | 2019-12-18 | 2020-08-05 | Machining method for 5g small-cell base station power amplifier module pcb having stepped grooves |
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| CN201911310602.6A CN111148351B (en) | 2019-12-18 | 2019-12-18 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
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| CN111148351A CN111148351A (en) | 2020-05-12 |
| CN111148351B true CN111148351B (en) | 2023-03-17 |
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| CN111148351B (en) * | 2019-12-18 | 2023-03-17 | 惠州市金百泽电路科技有限公司 | Processing method of 5G small-sized base station power amplifier module PCB with step groove |
| CN111432563A (en) * | 2020-05-28 | 2020-07-17 | 遂宁市广天电子有限公司 | Method for reducing dimension tolerance of PCB V-cut board |
| CN112752405B (en) * | 2020-11-12 | 2023-07-25 | 惠州市金百泽电路科技有限公司 | Processing method of PCB connecting sheet of 5G base station calibration network board |
| CN112616258B (en) * | 2021-01-12 | 2022-06-17 | 广东世运电路科技股份有限公司 | Circuit board negative film and processing method thereof |
| CN113411975A (en) * | 2021-06-26 | 2021-09-17 | 奥士康精密电路（惠州）有限公司 | Routing method for PTH groove tangent to forming edge |
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- 2020-08-05 WO PCT/CN2020/106997 patent/WO2021120639A1/en active Application Filing
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| CN103124469A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Step printed circuit board and manufacture method of the step printed circuit board |
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| WO2021120639A1 (en) | 2021-06-24 |
| CN111148351A (en) | 2020-05-12 |
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