CN101841972B - Method for manufacturing high-AR and fine-line PCB - Google Patents
Method for manufacturing high-AR and fine-line PCB Download PDFInfo
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- CN101841972B CN101841972B CN 201010159324 CN201010159324A CN101841972B CN 101841972 B CN101841972 B CN 101841972B CN 201010159324 CN201010159324 CN 201010159324 CN 201010159324 A CN201010159324 A CN 201010159324A CN 101841972 B CN101841972 B CN 101841972B
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Abstract
The invention provides a method for manufacturing a high-AR (aspect ratio) and fine-line PCB (printed circuit board), which comprises the following steps: (1) preparing a PCB substrate; (2) carrying out PTH (plating through hole) process; (3) carrying out primary electroplating process; (4) carrying out primary pattern transfer; (5) carrying out pattern electroplating process; (6) removing dry film; (7) abrading the PCB substrate by an abrasive belt; (8) carrying out secondary electroplating process; (9) carrying out secondary pattern transfer; and (10) carrying out the acid etching process. By adopting the primary electroplating process and the secondary electroplating process and adopting the step for plating holes instead of surfaces with copper, the method of the invention can meet the requirements for the thickness of the hole copper, reduce the thickness of the surface copper and make the etching process easier at the same time, thus favoring for the production of fine-line and small-gap PCBs, being helpful for the fine-line manufacture and meeting the requirements of quality for the reliability of the PCBs.
Description
Technical field
The present invention relates to a kind of manufacture method of pcb board, more particularly, relate to the manufacture method of a kind of high thickness to diameter ratio, fine-line PCB.
Background technology
Along with the high speed development of electronic product, pcb board (being printed circuit board) has got into high thickness to diameter ratio (AR), fine-line epoch, and above-mentioned high thickness to diameter ratio is meant that generally radius-thickness ratio is greater than or equal to 8: 1.
In high thickness to diameter ratio, fine-line PCB manufacturing process, the making of fine rule road, little spacing pcb board, requirement will be shown copper thickness and be limited in certain thickness, exceed this thickness, and the making of circuit will encounter difficulties; And the hole copper thickness of circuit board has a minimum thickness requirement, thereby causes showing the requirement of copper thickness and contradiction has appearred in the requirement of hole copper thickness.
And in the pcb board manufacturing process of routine, general adopt once dull and stereotyped the plating and a figure transfer, and promptly according to customer requirement, once the table copper thickness of property plating customer requirement and hole copper thickness on the PCB substrate, once property is carried out figure transfer on the PCB substrate.Because there are contradiction in the requirement of table copper thickness and the requirement of hole copper thickness, so for the making of high thickness to diameter ratio, fine-line PCB, bottleneck has appearred in conventional pcb board manufacture method, is difficult to even can't produces the pcb board of high thickness to diameter ratio, fine-line.
Summary of the invention
The technical problem that the present invention will solve provides the manufacture method of a kind of high thickness to diameter ratio, fine-line PCB.
In order to solve the problems of the technologies described above, the technical scheme that the present invention adopts is following:
The manufacture method of a kind of high thickness to diameter ratio, fine-line PCB, form by following steps:
(1) prepare the PCB substrate: above-mentioned PCB substrate is provided with plated-through hole;
(2) heavy copper: the PCB substrate sink the copper processing according to the heavy process for copper of routine;
(3) dull and stereotyped for the first time the plating: will in the PCB substrate immersion plating liquid after heavy copper is handled, electroplate, the above-mentioned first time, dull and stereotyped table copper thickness of electroplating and hole copper thickness were all between 5 μ m-8 μ m;
Table copper thickness and the hole copper thickness of above-mentioned 5 μ m-8 μ m can stand the various processing in the flow manufacturing process;
(4) figure transfer for the first time: on the PCB substrate surface after dull and stereotyped plating the for the first time, paste dry film, all plated-through holes on the substrate are windowed;
The size that plated-through hole is windowed is carried out according to figure transfer equipment precision and customer requirement weld-ring size, requires to be less than or equal to customer requirement weld-ring width greater than equipment precision;
(5) graphic plating is to the plated-through hole copper facing of windowing;
(6) move back film: the PCB substrate is taken out, wash dry film from electroplate liquid;
(7) abrasive band nog plate: the limit, hole of plated-through hole after the copper facing is polished;
The graphic plating layer on limit, plated-through hole hole needn't grind off fully after the copper facing, and after can reaching the plate circuit and forming, outward appearance does not see that the aperture projection gets final product.
(8) flat board is electroplated for the second time: on the basis that the first time, flat board was electroplated, the PCB substrate is electroplated, the table copper of the dull and stereotyped plating first time, the dull and stereotyped plating second time and hole copper gross thickness satisfy the table copper thickness and the hole copper thickness of the plating that requires;
(9) figure transfer for the second time: use the acid etching film that the PCB substrate after dull and stereotyped plating is the for the second time carried out figure transfer,,, circuit is compensated according to the table copper thickness through the above-mentioned acid etching film;
(10) acid etching: on the PCB substrate after the second time figure transfer, carry out acid etching, form circuit, thereby produce high thickness to diameter ratio, fine-line PCB.
The present invention's beneficial effect against existing technologies is because this manufacture method adopts dull and stereotyped the plating twice, between twice dull and stereotyped plating, to adopt and once only plate the flow process that hole copper does not plate table copper; So this manufacture method can reduce the table copper thickness when satisfying hole copper thickness requirement; Reduced the etching difficulty; Help fine rule road, the production of little spacing pcb board, thereby be convenient to the making of fine-line, and make the pcb board reliability satisfy quality requirements.
Below in conjunction with accompanying drawing and embodiment the present invention is done further explanation.
Description of drawings
Accompanying drawing is the flow diagram of the preferred embodiment of the present invention.
Embodiment
Shown in accompanying drawing, the manufacture method of high thickness to diameter ratio, fine-line PCB in this preferred embodiment, form by following steps:
(1) prepare the PCB substrate: above-mentioned PCB substrate is provided with plated-through hole;
(2) heavy copper: the PCB substrate sink the copper processing according to the heavy process for copper of routine;
(3) dull and stereotyped for the first time the plating: will in the PCB substrate immersion plating liquid after heavy copper is handled, electroplate, dull and stereotyped for the first time table copper thickness of electroplating and hole copper thickness are all between 5 μ m-8 μ m; The dull and stereotyped for the first time current density 1.2ASD that electroplates, electroplating time 21MIN;
Table copper thickness and the hole copper thickness of above-mentioned 5 μ m-8 μ m can stand the various processing in the flow manufacturing process;
(4) figure transfer for the first time: on the PCB substrate surface after dull and stereotyped plating the for the first time, paste dry film, all plated-through holes on the substrate are windowed;
The size that plated-through hole is windowed is carried out according to figure transfer equipment precision and customer requirement weld-ring size, requires to be less than or equal to customer requirement weld-ring width greater than equipment precision;
(5) graphic plating is to the plated-through hole copper facing of windowing; The current density 1.1ASD of graphic plating, electroplating time 90MIN;
(6) move back film: the PCB substrate is taken out, wash dry film from electroplate liquid;
(7) abrasive band nog plate: the limit, hole of plated-through hole after the copper facing is polished;
The graphic plating layer on limit, plated-through hole hole needn't grind off fully after the copper facing, and after can reaching the plate circuit and forming, outward appearance does not see that the aperture projection gets final product.
(8) flat board is electroplated for the second time: on the basis that the first time, flat board was electroplated, the PCB substrate is electroplated, the table copper of the dull and stereotyped plating first time, the dull and stereotyped plating second time and hole copper gross thickness satisfy the table copper thickness and the hole copper thickness of the plating that requires;
Above-mentioned current density 1.2ASD, electroplating time 90MIN electroplates about the table copper thickness 30um of back;
(9) figure transfer for the second time: use the acid etching film that the PCB substrate after dull and stereotyped plating is the for the second time carried out figure transfer,,, circuit is compensated according to the table copper thickness through the above-mentioned acid etching film;
Above-mentioned copper facing current density 1.2ASD, electroplating time 90MIN, zinc-plated current density 1.5ASD, electroplating time 15MIN.
(10) acid etching: on the PCB substrate after the second time figure transfer, carry out acid etching, form circuit, thereby produce high thickness to diameter ratio, fine-line PCB.
Make the result:
Pcb board characteristics: pcb board size 24 * 18 ", thickness of slab 1.65mm, minimum boring aperture 0.2mm; radius-thickness ratio 8.25: 1, minimum outer live width 3mil, minimum spacing 4mil; minimum weld-ring 5mil, more than the thinnest 25um of hole copper thickness, the actual completion about circuit 2.8mil; and very evenly, accomplish hole copper thickness 30um;
The physical property test :-40/125 ℃, 500 circulation back measuring resistance changing values, resistance variations explains that the pcb board physical property is good in 10%.
The above is merely preferred embodiment of the present invention, is not to be used for limiting practical range of the present invention; Be all equivalents of being done according to claim scope of the present invention, be claim scope of the present invention and cover.
Claims (1)
1. the manufacture method of a high thickness to diameter ratio, fine-line PCB, form by following steps:
(1) prepare the PCB substrate: above-mentioned PCB substrate is provided with plated-through hole;
(2) heavy copper: the PCB substrate sink the copper processing according to the heavy process for copper of routine;
(3) dull and stereotyped for the first time the plating: will in the PCB substrate immersion plating liquid after heavy copper is handled, electroplate, the above-mentioned first time, dull and stereotyped table copper thickness of electroplating and hole copper thickness were all between 5 μ m-8 μ m;
(4) figure transfer for the first time: on the PCB substrate surface after dull and stereotyped plating the for the first time, paste dry film, all plated-through holes on the substrate are windowed;
(5) graphic plating is to the plated-through hole copper facing of windowing;
(6) move back film: the PCB substrate is taken out, wash dry film from electroplate liquid;
(7) abrasive band nog plate: the limit, hole of plated-through hole after the copper facing is polished;
(8) flat board is electroplated for the second time: on the basis that the first time, flat board was electroplated, the PCB substrate is electroplated, the table copper of the dull and stereotyped plating first time, the dull and stereotyped plating second time and hole copper gross thickness satisfy the table copper thickness and the hole copper thickness of the plating that requires;
(9) figure transfer for the second time: use the acid etching film that the PCB substrate after dull and stereotyped plating is the for the second time carried out figure transfer,,, circuit is compensated according to the table copper thickness through the above-mentioned acid etching film;
(10) acid etching: on the PCB substrate after the second time figure transfer, carry out acid etching, form circuit, thereby produce high thickness to diameter ratio, fine-line PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010159324 CN101841972B (en) | 2010-04-23 | 2010-04-23 | Method for manufacturing high-AR and fine-line PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010159324 CN101841972B (en) | 2010-04-23 | 2010-04-23 | Method for manufacturing high-AR and fine-line PCB |
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| Publication Number | Publication Date |
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| CN101841972A CN101841972A (en) | 2010-09-22 |
| CN101841972B true CN101841972B (en) | 2012-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010159324 Expired - Fee Related CN101841972B (en) | 2010-04-23 | 2010-04-23 | Method for manufacturing high-AR and fine-line PCB |
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| CN102984892B (en) * | 2012-11-15 | 2017-06-13 | 华为机器有限公司 | A kind of hole metallization method of high thickness to diameter ratio circuit board, circuit board and electronic product |
| CN103014799B (en) * | 2012-12-05 | 2015-12-02 | 深圳市兴达线路板有限公司 | A kind of circuit board plating process of burn-out-proof plate |
| CN103068169B (en) * | 2012-12-24 | 2015-04-29 | 广州杰赛科技股份有限公司 | Method of preparing blind groove printed plate |
| CN104053305B (en) * | 2013-03-13 | 2017-06-16 | 北大方正集团有限公司 | A kind of printed wiring board and preparation method thereof |
| CN103228112B (en) * | 2013-04-03 | 2016-03-23 | 深圳崇达多层线路板有限公司 | A kind of electroless copper plating method of high aspect ratio pcb board |
| CN103533756A (en) * | 2013-09-29 | 2014-01-22 | 胜宏科技（惠州）股份有限公司 | Method for etching printed circuit board |
| CN103796449B (en) * | 2014-01-24 | 2016-09-21 | 广州兴森快捷电路科技有限公司 | The manufacture method of high thickness to diameter ratio wiring board plated hole consent |
| CN105323973B (en) * | 2015-11-03 | 2018-11-06 | 大连崇达电路有限公司 | The bad reworking method of backlight caused by printed wiring board hole wall is coarse |
| CN106211560B (en) * | 2016-08-16 | 2019-01-25 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN106304692A (en) * | 2016-08-31 | 2017-01-04 | 开平依利安达电子第三有限公司 | A kind of Wiring board processing method plating thick through hole |
| CN106413273B (en) * | 2016-11-01 | 2019-11-22 | 江门崇达电路技术有限公司 | The technique for improving plate face copper particle |
| CN106961803A (en) * | 2017-04-07 | 2017-07-18 | 安捷利电子科技（苏州）有限公司 | A kind of preparation method of lifting PCB circuit depth-width ratios |
| CN106993381A (en) * | 2017-05-10 | 2017-07-28 | 深圳市深联电路有限公司 | A kind of preparation method of the intensive the electroplates in hole filling perforations of high-frequency ultrathin PCB |
| CN108124386A (en) * | 2017-12-13 | 2018-06-05 | 广州兴森快捷电路科技有限公司 | Wiring board and its production method, graph transfer method |
| CN110167274A (en) * | 2019-04-29 | 2019-08-23 | 恩达电路(深圳)有限公司 | The production method of millimetre-wave radar plate |
| CN110418504B (en) * | 2019-07-10 | 2022-05-13 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing backlight plate and backlight plate manufactured by same |
| CN111212527A (en) * | 2020-01-15 | 2020-05-29 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high-density interconnection HDI board |
| CN111629531A (en) * | 2020-06-19 | 2020-09-04 | 西安微电子技术研究所 | Method for processing HDI plate with high thickness-diameter ratio |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001230507A (en) * | 2000-02-14 | 2001-08-24 | Sumitomo Metal Electronics Devices Inc | Plastic package and its manufacturing method |
| CN100546439C (en) * | 2008-04-30 | 2009-09-30 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN101697667A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Method for making embedded hole in pad on circuit board |
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