CN103068176B - Electroplating method for circuit board of precise circuit - Google Patents
Electroplating method for circuit board of precise circuit Download PDFInfo
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- CN103068176B CN103068176B CN 201110324422 CN201110324422A CN103068176B CN 103068176 B CN103068176 B CN 103068176B CN 201110324422 CN201110324422 CN 201110324422 CN 201110324422 A CN201110324422 A CN 201110324422A CN 103068176 B CN103068176 B CN 103068176B
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Abstract
The invention discloses an electroplating method for a circuit board of a precise circuit. The electroplating method comprises the following steps of (1) part number selecting, (2) forward board arranging, (3) current setting, (4) forward electroplating, (5) reverse board arranging, (6) current setting and electroplating completing, wherein the current setting includes that an arranged circuit board current-conducting plate is adjusted into an electroplating cylinder, current density is set, the current density is set to be one half of the current density of the pre-set demand for completing copper thickness, and time remains unchanged, and after the electroplating time is completed, the circuit board is taken down from a current-conducting plate, and a next process is conducted continuously. The electroplating method for the circuit board of the precise circuit uses the circuit board of the high-precision level circuit which is manufactured with a traditional gantry type electroplating wire, and therefore copper thickness uniformity difference can be controlled within 6 um, and the control demands of manufacturing the high-precision circuit level copper thickness of and below 3mil/3mil are satisfied.
Description
Technical field
The present invention relates to a kind of electro-plating method of wiring board, particularly the little circuit board electroplating method with high-accuracy circuit of the thick lack of homogeneity opposite sex of a kind of copper, belong to the wiring board processing technique field.
Background technology
along with electronic product towards gently, book, short, little future development, the wiring density of wiring board promotes day by day, the grade of circuit (live width/circuit) also diminishes increasingly, accurate class of track has risen to other circuit of 2mil/2mil level at present, this makes for the plating of wiring board and has brought new challenge, because on fine-line is made, the copper of circuit is thick plays the important vital effect that plays, if it is excessive to complete the thick difference of wiring board surface copper of plating, when carrying out the etching of fine-line often the local location circuit etching is not out, the circuit of other position etching is excessive, finally cause the circuit of full wafer plate defective, the key of making fine-line so promote the thick uniformity of copper of circuit board electroplating.Traditional planer-type plating line is because the expensive low characteristics of its output become the first-selection of wiring board supplier when buying, but itself designs the reality that has power-on and power-off line of force skewness when electroplating, there is the excessive defective of uniformity difference so electroplate, often its uniform thickness is poor more than 10um after completing once plating, this also becomes wiring board toward the bottleneck of high-order development, high-accuracy wiring board often can't be produced, and is the key that overcomes the above problems thereby make corresponding adjustment adaptation high precision circuit Production requirement on present equipment.
Summary of the invention
Technical problem for above-mentioned existence the objective of the invention is: proposed the little circuit board electroplating method with high-accuracy circuit of the thick lack of homogeneity opposite sex of a kind of copper.
Technical solution of the present invention is achieved in that a kind of circuit board electroplating method with high-accuracy circuit, comprises following steps:
1., item number is selected: the circuit fine degree of sight path plate is distinguished, and the wiring board that the circuit fine degree is higher is classified separately, and the circuit of class of track below 3mil/3mil is as independent differentiation;
2., forward upper plate: will distinguish good plank and hang successively plating line and fly on bar, and with the link plate screw locking, guarantee the normal input of electric current in electroplating process;
3., current settings: first-class wiring board is flown bar call in the plating cylinder, and set current density, current density is set as the predetermined current density 1/2 of completing the thick requirement of copper, time-preserving;
4., forward electroplates: input above-mentioned design current density electric current total amount and electroplate after time arrival Preset Time wiring board is accessed the plating cylinder, simultaneously wiring board is taken off successively;
5., reverse upper plate: the wiring board that takes off according to original link plate order, again go up to and is flown to cling on screw, and all the condition with the forward plating is opposite for the above-below direction of face time and upper plate;
6., current settings: first-class wiring board is flown bar call in the plating cylinder, and set current density, current density is set as the predetermined current density 1/2 of completing the thick requirement of copper, time-preserving;
7., complete plating: the electroplated time takes off wiring board after completing from flying bar, proceed subsequent processing and make;
Due to the utilization of technique scheme, the present invention compared with prior art has following advantages:
The circuit board electroplating method of high-accuracy circuit of the present invention, use the thick uniformity difference of wiring board plate face copper of the high-accuracy grade circuit of traditional dragon gate-type plating line making can be controlled in the difference of 6um, meet and make 3mil/3mil and the following thick control requirement of high-accuracy class of track copper.
Embodiment
The circuit board electroplating method of a kind of high-accuracy circuit of the present invention comprises following steps:
1., item number is selected: the circuit fine degree of sight path plate is distinguished, and the wiring board that the circuit fine degree is higher is classified separately, and the circuit of class of track below 3mil/3mil is as independent differentiation;
2., forward upper plate: will distinguish good plank and hang successively plating line and fly on bar, and with the link plate screw locking, guarantee the normal input of electric current in electroplating process;
3., current settings: first-class wiring board is flown bar call in the plating cylinder, and set current density, current density is set as the predetermined current density 1/2 of completing the thick requirement of copper, time-preserving;
4., forward electroplates: input above-mentioned design current density electric current total amount and electroplate after time arrival Preset Time wiring board is accessed the plating cylinder, simultaneously wiring board is taken off successively;
5., reverse upper plate: the wiring board that takes off according to original link plate order, again go up to and is flown to cling on screw, and all the condition with the forward plating is opposite for the above-below direction of face time and upper plate;
6., current settings: first-class wiring board is flown bar call in the plating cylinder, and set current density, current density is set as the predetermined current density 1/2 of completing the thick requirement of copper, time-preserving;
7., complete plating: the electroplated time takes off wiring board after completing from flying bar, proceed subsequent processing and make.
Due to the utilization of technique scheme, the present invention compared with prior art has following advantages:
The circuit board electroplating method of high-accuracy circuit of the present invention, use the thick uniformity difference of wiring board plate face copper of the high-accuracy grade circuit of traditional dragon gate-type plating line making can be controlled in the difference of 6um, meet and make 3mil/3mil and the following thick control requirement of high-accuracy class of track copper.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow person skilled in the art scholar can understand content of the present invention and be implemented; can not limit protection scope of the present invention with this; all equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (1)
1. the circuit board electroplating method of a high-accuracy circuit comprises following steps:
1., item number is selected: the circuit fine degree of sight path plate is distinguished, and the wiring board that the circuit fine degree is higher is classified separately, and the circuit of class of track below 3mil/3mil is as independent differentiation;
2., forward upper plate: will distinguish good plank and hang successively plating line and fly on bar, and with the link plate screw locking, guarantee the normal input of electric current in electroplating process;
3., current settings: first-class wiring board is flown bar call in the plating cylinder, and set current density, current density is set as the predetermined current density 1/2 of completing the thick requirement of copper, time-preserving;
4., forward electroplates: input above-mentioned design current density electric current total amount and electroplate after time arrival Preset Time wiring board is accessed the plating cylinder, simultaneously wiring board is taken off successively;
5., reverse upper plate: the wiring board that takes off according to original link plate order, again go up to and is flown to cling on screw, and all the condition with the forward plating is opposite for the above-below direction of face time and upper plate;
6., current settings: first-class wiring board is flown bar call in the plating cylinder, and set current density, current density is set as the predetermined current density 1/2 of completing the thick requirement of copper, time-preserving;
7., complete plating: the electroplated time takes off wiring board after completing from flying bar, proceed subsequent processing and make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110324422 CN103068176B (en) | 2011-10-24 | 2011-10-24 | Electroplating method for circuit board of precise circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110324422 CN103068176B (en) | 2011-10-24 | 2011-10-24 | Electroplating method for circuit board of precise circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103068176A CN103068176A (en) | 2013-04-24 |
| CN103068176B true CN103068176B (en) | 2013-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110324422 Active CN103068176B (en) | 2011-10-24 | 2011-10-24 | Electroplating method for circuit board of precise circuit |
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| CN (1) | CN103068176B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108024458B (en) * | 2017-12-14 | 2020-12-15 | 悦虎晶芯电路(苏州)股份有限公司 | Electroplating manufacturing method based on 1.5mil circuit board |
| CN109183138A (en) * | 2018-10-30 | 2019-01-11 | 珠海杰赛科技有限公司 | A kind of plating automatic method and system |
| CN110923770A (en) * | 2019-12-03 | 2020-03-27 | 深南电路股份有限公司 | Electroplating method and electroplating device for circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0531571A1 (en) * | 1991-09-12 | 1993-03-17 | Ming-Hong Kuo | An automatic loading mechanism for PC board electroplating |
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN102051658A (en) * | 2009-11-04 | 2011-05-11 | 富葵精密组件(深圳)有限公司 | Electroplate jig |
-
2011
- 2011-10-24 CN CN 201110324422 patent/CN103068176B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0531571A1 (en) * | 1991-09-12 | 1993-03-17 | Ming-Hong Kuo | An automatic loading mechanism for PC board electroplating |
| CN102051658A (en) * | 2009-11-04 | 2011-05-11 | 富葵精密组件(深圳)有限公司 | Electroplate jig |
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
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| CN103068176A (en) | 2013-04-24 |
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Effective date of registration: 20200323 Address after: No. 999, Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Yuehu Crystal Core Circuit (Suzhou) Co., Ltd. Address before: Road Wuzhong Economic Development Zone Suzhou city Jiangsu province 215122 Yin No. 999 Patentee before: TIGERBUILDER CIRCUIT (SUZHOU) Co.,Ltd. |
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