CN204498464U - A kind of split structure of PCB substrate - Google Patents
A kind of split structure of PCB substrate Download PDFInfo
- Publication number
- CN204498464U CN204498464U CN201520190616.XU CN201520190616U CN204498464U CN 204498464 U CN204498464 U CN 204498464U CN 201520190616 U CN201520190616 U CN 201520190616U CN 204498464 U CN204498464 U CN 204498464U
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- Prior art keywords
- pcb substrate
- golden finger
- base plate
- split structure
- mould position
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Abstract
The utility model discloses a kind of split structure of PCB substrate, it is characterized in that, comprise the PCB substrate that base plate and polylith are provided with golden finger, base plate is provided with multiple mould position for keeping flat PCB substrate, mould position and PCB substrate shape suitable, the golden finger of each PCB substrate all deviates from the fringe region of base plate.The golden finger of multiple described PCB substrate can mutually towards.The thickness of multiple described PCB substrate is incomplete same.It effectively can solve the partially thin problem of thickness of slab of PCB substrate golden finger part in the processing of postorder, and can split be carried out on different types of PCB substrate and not affect availability ratio of the armor plate, be conducive to the raising of production quality, the lifting of qualification rate and reduce production cost.
Description
Technical field
The utility model relates to pcb board and manufactures field, particularly a kind of split structure of PCB substrate.
Background technology
Along with the development of electronics technology sector ground level, the application of pcb board is also more and more extensive, and kind also gets more and more, also thereupon more and more higher to the requirement of production technology.At present, when multiclass pcb board being carried out split and producing, strip thickness control requires just higher, (golden finger is the position that such pcb board contacts with other substrate to the precision prescribed of the particularly golden finger part thickness of gold finger plate (one in pcb board), tool has good wearability and low contact resistance, can meet the requirement repeatedly plugged), further strict especially, will cause once slightly partially thin functional bad, affect the serviceability of monoblock pcb board.
Summary of the invention
Based on this, the purpose of this utility model is the defect overcoming prior art, provides a kind of split structure of PCB substrate, and it effectively can solve the partially thin problem of thickness of slab of PCB substrate golden finger part in the processing of postorder.
Its technical scheme is as follows:
A kind of split structure of PCB substrate, it is characterized in that, comprise the PCB substrate that base plate and polylith are provided with golden finger, base plate is provided with multiple mould position for keeping flat PCB substrate, mould position and PCB substrate shape suitable, the golden finger of each PCB substrate all deviates from the fringe region of base plate.
Preferably, multiple described PCB substrate golden finger can mutually towards.
Preferably, the thickness of multiple described PCB substrate is incomplete same.
Preferably, multiple described mould position becomes array to arrange on described base plate.
Preferably, described base plate is square plate.
Below the advantage of preceding solution or principle are described:
1, the fringe region of base plate can be deviated from by the golden finger of mould position PCB substrate, thus golden finger can be solved when carrying out next step operation because gummosis seriously causes the partially thin problem of the thickness of slab of golden finger part.
2, split can be carried out to different types of PCB substrate, and not affect availability ratio of the armor plate.
3, can guarantee that golden finger position there will not be because the electric current in next step operation is excessive and causes the quality problem such as golden finger is burnt.
4, this structure is conducive to the raising of production quality, the lifting of qualification rate and reduces production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the split structure of the PCB substrate described in the utility model embodiment one;
Fig. 2 is the structural representation of the split structure of the PCB substrate described in the utility model embodiment two;
Description of reference numerals:
10, base plate, 20, PCB substrate, 21, golden finger.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail:
Embodiment one:
As shown in Figure 1, a kind of split structure of PCB substrate, comprise the PCB substrate 20 that the base plate 10 of square steel and six pieces are provided with golden finger 21, the thickness of PCB substrate 20 is incomplete same, base plate 10 is provided with six for keeping flat the mould position (can set quantity according to need of production) of PCB substrate 20, the shape of mould position and PCB substrate 20 is suitable, can away from the fringe region of base plate 10 by the golden finger 21 of each PCB substrate 20 in mould position.
In the present embodiment, six masterplates become the array format of 2 × 3, therefore the golden finger 21 of the golden finger 21 of first row PCB substrate 20 and second row PCB substrate 20 can mutually towards, the implementation and operation of operation after being convenient to.
The split structure of above-mentioned PCB substrate needs to coat protective rubber more after completion and enters next step manufacturing procedure again, roughly comprises: sawing sheet-drying-plate-internal layer dry film, etching-lamination-heavy copper, plate plating-outer dry film, etching-surface treatment-gold-plated finger-milling plate-golden finger chamfering-detection of electrons etc.Can following effect be obtained in follow-up manufacturing procedure:
1, golden finger 21 can be solved and cause the partially thin problem of the thickness of slab of golden finger 21 part because gummosis is serious.
2, can guarantee that golden finger 21 position there will not be because the electric current in next step operation is excessive and causes the quality problem such as golden finger 21 is burnt.
3, this structure is conducive to the raising of production quality, the lifting of qualification rate and reduces production cost.
4, split can be carried out to different types of PCB substrate 20, and not affect availability ratio of the armor plate, can boost productivity.
Embodiment two:
Be from embodiment one difference: the golden finger 21 in PCB substrate 20 towards different.But be also the fringe region that deviates from base plate 10, as shown in Figure 2.
The above embodiment only have expressed embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (5)
1. the split structure of a PCB substrate, it is characterized in that, comprise the PCB substrate that base plate and polylith are provided with golden finger, base plate is provided with multiple mould position for keeping flat PCB substrate, mould position and PCB substrate shape suitable, the golden finger of each PCB substrate all deviates from the fringe region of base plate.
2. the split structure of PCB substrate according to claim 1, is characterized in that, the golden finger of multiple described PCB substrate can mutually towards.
3. the split structure of PCB substrate according to claim 1, is characterized in that, the thickness of multiple described PCB substrate is incomplete same.
4. the split structure of PCB substrate according to claim 1, is characterized in that, multiple described mould position becomes array to arrange on described base plate.
5. the split structure of PCB substrate according to any one of claim 1 to 4, is characterized in that, described base plate is square plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520190616.XU CN204498464U (en) | 2015-03-31 | 2015-03-31 | A kind of split structure of PCB substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520190616.XU CN204498464U (en) | 2015-03-31 | 2015-03-31 | A kind of split structure of PCB substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204498464U true CN204498464U (en) | 2015-07-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520190616.XU Active CN204498464U (en) | 2015-03-31 | 2015-03-31 | A kind of split structure of PCB substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204498464U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934087A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Circuit board jointed board |
| CN110579845A (en) * | 2019-09-20 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | forming method of optical module board |
-
2015
- 2015-03-31 CN CN201520190616.XU patent/CN204498464U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934087A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Circuit board jointed board |
| CN105934087B (en) * | 2016-05-31 | 2018-09-04 | 广东欧珀移动通信有限公司 | Multiple-printed-panel for circuit board |
| CN110579845A (en) * | 2019-09-20 | 2019-12-17 | 胜宏科技（惠州）股份有限公司 | forming method of optical module board |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |