CN105957930A - Manufacturing method of RGB metal substrate - Google Patents

Manufacturing method of RGB metal substrate Download PDF

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Publication number
CN105957930A
CN105957930A CN201610396240.7A CN201610396240A CN105957930A CN 105957930 A CN105957930 A CN 105957930A CN 201610396240 A CN201610396240 A CN 201610396240A CN 105957930 A CN105957930 A CN 105957930A
Authority
CN
China
Prior art keywords
rgb
film
basal board
metal basal
insulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610396240.7A
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Chinese (zh)
Inventor
黄琦
鲍量
黄强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanshan Xingda Ductile Iron Plant
Original Assignee
Hanshan Xingda Ductile Iron Plant
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanshan Xingda Ductile Iron Plant filed Critical Hanshan Xingda Ductile Iron Plant
Priority to CN201610396240.7A priority Critical patent/CN105957930A/en
Publication of CN105957930A publication Critical patent/CN105957930A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention discloses a manufacturing method of an RGB metal substrate. The method comprises the following steps of (1) front treatment, (2) film pressing, (3) film alignment, (4) exposure, (5) development, (6) etching, (7) film stripping, (8) surface acetylation, (9) silver plating, (10) insulation material manufacture, and (11) cutting. The method is used for manufacturing an RGB LED substrate, the processing cost is reduced, and the reliability is greatly improved at the same time.

Description

A kind of manufacture method of RGB metal basal board
Technical field
The present invention relates to the manufacture method of a kind of RGB metal basal board, belong to RGB matrix technique field.
Background technology
Small size RGB LED obtains Rapid Popularization, if RGB 1010 is a size of because of its size is little, luminous efficiency is high 1.0mm*1.0mm, is the baseplate material being applied to Small Distance display screen electronic component, and currently mainly RGB substrate has filling holes with resin Plate, copper base for post plate, the former reliability is relatively poor, the latter's good reliability, and processing cost is of a relatively high.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of RGB metal basal board, be used for manufacturing RGB LED-baseplate, add Work cost drastically declines, and is also greatly improved in reliability simultaneously.
For achieving the above object, present invention employs following technical proposals.
The manufacture method of a kind of RGB metal basal board, it is characterised in that comprise the following steps:
(1) pre-treatment: with copper alloy plate thick for 0.1-0.2mm as raw material, carry out oil removal treatment, then cleans dry with pure water Only, surface contaminant is removed;
(2) press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer;
(3) film aligning: carry out two-sided film aligning according to design configuration;
(4) exposure: use parallel exposing machine to be exposed;
(5) development: the photosensitive dry film after chemical development exposure, exposes figure to be etched;
(6) etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove;Metal basal board The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter;And etch multiple die bond region for placing LED chip;
(7) film is moved back: photosensitive dry film is all returned;
(8) surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment;
(9) silver-plated: to select electroplated metal layer according to reality application, can be first electronickelling, re-plating silver, it is also possible to be direct plating Silver, direct silver plating thicknesses relatively nickel plating silver is thick.
(10) insulant processing: fill insulant at total eclipse cutting, insulant herein is to play connection RGB The effect of two pieces of metallic plates of metal basal board unit and insulating effect;
(11) cutting: cut along half-etching groove, obtain RGB metal basal board unit.
Further preferably, carry out surface after moving back film and acetify, the most silver-plated, carry out insulant processing the most again.
Further preferably, insulant adds man-hour, makes reflector cover on half-etching groove.Insulant completion of processing After, RGB metal basal board unit attaches RGB wafer, and makes fluorescent material layer, cut into single RGB metal the most again Base board unit.
Further preferably, also can be in pretreatment stage, after cleaning up, make anti-oxidant layer on copper alloy plate surface and protect Protect copper alloy plate not oxidized;Chemical scavenging anti-oxidant layer after moving back film.
Preferably, arrange exposure parameter to be 30000mJ, 9-11 lattice can be arranged on by gage.
Preferably, speed control be 3.5m/min, breakpoint be that 40-70% develops.
Beneficial effects of the present invention: compared to tradition RGB base plate processing method, processing cost of the present invention drastically declines, with Time reliability on be also greatly improved.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection Enclose.
The manufacture method of a kind of RGB metal basal board, it is characterised in that comprise the following steps:
(1) pre-treatment: with copper alloy plate thick for 0.1-0.2mm as raw material, carry out oil removal treatment, then cleans dry with pure water Only, surface contaminant is removed;
(2) press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer;
(3) film aligning: carry out two-sided film aligning according to design configuration;
(4) exposure: use parallel exposing machine to be exposed;
(5) development: the photosensitive dry film after chemical development exposure, exposes figure to be etched;
(6) etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove;Metal basal board The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter;And etch multiple die bond region for placing LED chip;
(7) film is moved back: photosensitive dry film is all returned;
(8) surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment
(9) silver-plated: to select electroplated metal layer according to reality application, can be first electronickelling, re-plating silver, it is also possible to be direct plating Silver, direct silver plating thicknesses relatively nickel plating silver is thick.
(10) insulant processing: making reflector cover on half-etching groove, fill insulant at total eclipse cutting, this The insulant at place is effect and the insulating effect playing the two pieces of metallic plates connecting RGB metal basal board unit;Insulant adds After work, RGB metal basal board unit attaches RGB wafer, and makes fluorescent material layer;
(11) cutting: cut along half-etching groove, obtain RGB metal basal board unit.
Further preferably, also can be in pretreatment stage, after cleaning up, make anti-oxidant layer on copper alloy plate surface and protect Protect copper alloy plate not oxidized;Chemical scavenging anti-oxidant layer after moving back film.
It is the baseplate material being applied to Small Distance display screen electronic component to make RGB 1010, as long as substrate has at present Resin plug orifice plate, copper base for post plate, the former reliability is relatively poor, the latter's good reliability, and processing cost is of a relatively high.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck Territory, is the most in like manner included in the scope of patent protection of the present invention.

Claims (2)

1. the manufacture method of a RGB metal basal board, it is characterised in that comprise the following steps:
Pre-treatment: with copper alloy plate as raw material, carries out oil removal treatment, then cleans up with pure water, removes surface contaminant;
Press mold: use vacuum film pressing machine to shape photosensitive dry film at the metal sheet surface scribbling anti-oxidant layer;
Film aligning: carry out two-sided film aligning according to design configuration;
Exposure: use parallel exposing machine to be exposed;
Development: the photosensitive dry film after chemical development exposure, exposes figure to be etched;
Etching: the half that etch depth is thickness of slab of the etching groove of reflector cover shaping area obtains half-etching groove;Metal basal board list The partition grooves of unit uses total eclipse to obtain total eclipse cutting quarter, and etches multiple die bond region for placing LED chip;
Move back film: photosensitive dry film is all returned;
Surface coarsening: utilize chemically and physically method to show substrate to carry out roughening treatment;
Silver-plated: first electronickelling, re-plating silver;Or it is the most silver-plated;
Insulant makes: fill insulant at total eclipse cutting, and insulant herein is to play connection RGB metal basal board The effect of two pieces of metallic plates of unit and insulating effect;
Cutting: cut along half-etching groove, obtain RGB metal basal board unit.
The manufacture method of RGB metal basal board the most according to claim 1, it is characterised in that pretreatment stage, cleans up After, make anti-oxidant layer protection copper alloy plate on copper alloy plate surface not oxidized;Chemical scavenging antioxidant after moving back film Layer.
CN201610396240.7A 2016-06-07 2016-06-07 Manufacturing method of RGB metal substrate Pending CN105957930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610396240.7A CN105957930A (en) 2016-06-07 2016-06-07 Manufacturing method of RGB metal substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610396240.7A CN105957930A (en) 2016-06-07 2016-06-07 Manufacturing method of RGB metal substrate

Publications (1)

Publication Number Publication Date
CN105957930A true CN105957930A (en) 2016-09-21

Family

ID=56907758

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610396240.7A Pending CN105957930A (en) 2016-06-07 2016-06-07 Manufacturing method of RGB metal substrate

Country Status (1)

Country Link
CN (1) CN105957930A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107634134A (en) * 2017-10-30 2018-01-26 深圳市立洋光电子股份有限公司 A kind of unsupported encapsulated LED light source and preparation method thereof
CN116632123A (en) * 2023-04-28 2023-08-22 崇辉半导体(江门)有限公司 Manufacturing method of EMC bracket

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026207A (en) * 2006-02-23 2007-08-29 宏齐科技股份有限公司 Light-emitting diode package structure and its package method
CN101855735A (en) * 2007-11-19 2010-10-06 松下电器产业株式会社 Semiconductor light emitting device and method for manufacturing semiconductor light emitting device
JP2015099874A (en) * 2013-11-20 2015-05-28 凸版印刷株式会社 Electronic element package and method for manufacturing the same
CN204424309U (en) * 2015-01-30 2015-06-24 博罗承创精密工业有限公司 A kind of two cup LED support

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026207A (en) * 2006-02-23 2007-08-29 宏齐科技股份有限公司 Light-emitting diode package structure and its package method
CN101855735A (en) * 2007-11-19 2010-10-06 松下电器产业株式会社 Semiconductor light emitting device and method for manufacturing semiconductor light emitting device
JP2015099874A (en) * 2013-11-20 2015-05-28 凸版印刷株式会社 Electronic element package and method for manufacturing the same
CN204424309U (en) * 2015-01-30 2015-06-24 博罗承创精密工业有限公司 A kind of two cup LED support

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107634134A (en) * 2017-10-30 2018-01-26 深圳市立洋光电子股份有限公司 A kind of unsupported encapsulated LED light source and preparation method thereof
WO2019085479A1 (en) * 2017-10-30 2019-05-09 深圳市立洋光电子股份有限公司 Support-free packaged led light source and manufacturing method therefor
CN116632123A (en) * 2023-04-28 2023-08-22 崇辉半导体(江门)有限公司 Manufacturing method of EMC bracket
CN116632123B (en) * 2023-04-28 2024-04-16 崇辉半导体(江门)有限公司 Manufacturing method of EMC bracket

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Application publication date: 20160921

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