CN106455345A - Method of machining burr-free hole of PCB copper-based core board - Google Patents
Method of machining burr-free hole of PCB copper-based core board Download PDFInfo
- Publication number
- CN106455345A CN106455345A CN201610740841.5A CN201610740841A CN106455345A CN 106455345 A CN106455345 A CN 106455345A CN 201610740841 A CN201610740841 A CN 201610740841A CN 106455345 A CN106455345 A CN 106455345A
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- China
- Prior art keywords
- copper
- film
- central layer
- etching
- processing method
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method of machining a burr-free hole of a PCB copper-based core board, and relates to the field of circuit board manufacturing. The method comprises the following steps: (1) making a resist layer; (2) etching a copper-based core board; and (3) removing the resist layer. Compared with the prior art, the burr problem caused by mechanical machining such as drilling, CNC drilling or punching is overcome, the production cost is reduced, and the production efficiency is improved.
Description
Technical field
The present invention relates to printed wiring board field, particularly to a kind of processing method in the copper-based central layer of PCB no burr hole.
Background technology
Existing printed wiring board is made required by the way of the machinings such as boring, CNC boring or punching press punching
Copper-based central layer, can produce burr, burr, once and burr burr enters in the hole in the mechanical processing process such as boring, CNC or punching press
Then it is very difficult to remove, simultaneously as being Metal Substrate, in process, to boring nozzle, the consumption of gong knife is larger, and production cost increases, raw
Produce efficiency also low.
Content of the invention
An object of the present invention is that the processing method providing a kind of copper-based central layer of PCB no burr hole, this processing side
Method overcomes burr, the Burr Problem that the machinings such as boring, CNC boring or punching press punching produce, and reduces simultaneously and produces into
This, and improve production efficiency.
The technical scheme is that：A kind of processing method in the copper-based central layer of PCB no burr hole, comprises the following steps：
(1) making of resist layer；
(2) copper-based central layer etching；
(3) move back resist layer.
Preferably, described step (1) comprises the following steps：
1. carry the making of the film of circular hole figure；
2. press last layer diaphragm with pressing dry film or silk-screen wet film method in copper-based plate surface overlying；
3. the film with figure that 1. step is prepared is attached to the copper base being covered with diaphragm, carries out in exposure machine
Exposure；
4. after exposing, the film is taken off, developed after the copper base being covered with diaphragm is stood 15 minutes.
Preferably, described step 4. in, the developer pressure of development is 1.5kg/cm2, and development point is 60%.
Preferably, described step 2. in, the press mold temperature of press mold：110 ± 5 DEG C, press mold pressure：4-6kg/CM2.
Preferably, described step 2. in, dry film be Du Pont's dry film.
Preferably, described step (2) is through moving back film liquid by diaphragm from copper base up by the copper base after etching
Fall, the copper base removing diaphragm carries the hole that printed wiring board needs.
Preferably, the common plate etching speed 10% that the etching speed of described etching is copper thickness H/Hoz controls, etching pressure
Power is upper pressure 2.8kg/cm2, push 2.3kg/cm2.
An object of the present invention is that a kind of wiring board of offer.
Technical scheme is：A kind of wiring board, this wiring board is made by above-mentioned method.
Compared with prior art, the beneficial effects of the present invention is：
The present invention adopts etch process to process copper-based central layer, overcomes the machinings such as boring, CNC boring or punching press punching
The burr of generation, Burr Problem, reduce production cost simultaneously, and improve production efficiency.
Content of the invention
Copper-based central layer-refer to copper base
Specific embodiment
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1
A kind of processing method in the copper-based central layer of PCB no burr hole, comprises the following steps：
(1) making of resist layer
1. carry the making of the film of figure.The film (film) is a kind of film, and Japanese fuji produces.
The film makes the film with different size circular hole, needs perforate with specific reference on the copper base producing below
Position and its size.The film has graphics field after exposure imaging, and the developed liquid of the corresponding diaphragm in graphics field washes out, and
The diaphragm in non-graphic region is retained；The film that wiring board uses has dividing of positive negative film, the graph area of the positive film
Domain (alternatively non-transparent region) makes required figure for wiring board, and after developing after exposure, its corresponding diaphragm is rinsed clean dew
Go out copper face, through electroplating work procedure, resist layer is plated on copper face.The negative film film in contrast, the non-graphic region (printing opacity of the film
Region) make required figure for wiring board, after exposure imaging, corresponding diaphragm is retained, as anti-during etching
Erosion layer.This technology, when resist layer makes, is exposed using the negative film film.
2. press last layer diaphragm (press mold temperature with pressing dry film (or silk-screen wet film) method in copper-based plate surface overlying：110
± 5 DEG C, press mold pressure：4-6kg/CM2).
3. the negative film film with figure that 1. step is prepared is attached to the copper base being covered with diaphragm, in exposure machine
It is exposed.The purpose of exposure is to transfer to the figure on the film on copper base, the figure transfer after exposure, on the film
To on diaphragm.
3. after exposing, the film is taken off, developed after the copper base being covered with diaphragm is stood 15 minutes.Developer pressure:
1.5kg/cm2, development point controls：60%.The place (circular hole) etching is needed to expose it is not necessary to the place etching is protected after development
Cuticula covers.Developer solution is 0.8-1.2% sodium carbonate liquor for mass ratio.
(2) copper-based central layer etching
Copper base after development is put into acidic etching liquid be etched, etching speed is the common plate erosion of copper thickness H/Hoz
Carve speed 10% to control, etching pressure is upper pressure 2.8kg/cm2, push 2.3kg/cm2.Acid etching liquid acidity is 0.2-0.3N,
Cu2+ concentration is 120-180g/l.
(3) move back resist layer
Diaphragm is removed through moving back film liquid from copper base by the copper base after etching, removes the copper-based strip of diaphragm
There is the hole that printed wiring board needs, this some holes, because being by etching out, does not therefore have burr and burr.Moving back film liquid is 4-
The sodium hydroxide solution of 6wt%.
The next procedure having etched the copper base behind hole as copper-based central layer entrance printed wiring board is made, such as central layer
Melanism or pressing plate etc..
Comparative example 1
Take copper base, produced according to printed wiring board need copper base to be carried out hole in the place needing hole, CNC boring
Or punching press punching.
Embodiment 1 and comparative example 1 result see table one：
Table one
Claims (8)
1. a kind of processing method in the copper-based central layer of PCB no burr hole, comprises the following steps：
(1) making of resist layer；
(2) copper-based central layer etching；
(3) move back resist layer.
2. the processing method in the copper-based central layer of PCB according to claim 1 no burr hole is it is characterised in that described step (1)
Comprise the following steps：
1. carry the making of the film of circular hole figure；
2. press last layer diaphragm with pressing dry film or silk-screen wet film method in copper-based plate surface overlying；
3. the film with figure that 1. step is prepared is attached to the copper base being covered with diaphragm, is exposed in exposure machine
Light；
4. after exposing, the film is taken off, developed after the copper base being covered with diaphragm is stood 15 minutes.
3. the copper-based central layer of PCB according to claim 2 no burr hole processing method it is characterised in that：Described step is 4.
In, the developer pressure of development is 1.5kg/cm2, and development point is 60%.
4. the copper-based central layer of PCB according to claim 2 no burr hole processing method it is characterised in that：Described step is 2.
In, the press mold temperature of press mold：110 ± 5 DEG C, press mold pressure：4-6kg/CM2.
5. the copper-based central layer of PCB according to claim 2 no burr hole processing method it is characterised in that：Described step is 2.
In, dry film is Du Pont's dry film.
6. the copper-based central layer of PCB according to claim 1 no burr hole processing method it is characterised in that：Described step (2)
It is that diaphragm is removed from copper base by the copper base after etching through moving back film liquid, the copper base removing diaphragm carries printing
The hole that wiring board needs.
7. the copper-based central layer of PCB according to claim 6 no burr hole processing method it is characterised in that：Described etching
Etching speed is that the common plate etching speed 10% of copper thickness H/Hoz controls, and etching pressure is upper pressure 2.8kg/cm2, push
2.3kg/cm2.
8. a kind of wiring board, method described in claim 1-7 any claim for this wiring board makes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610740841.5A CN106455345A (en) | 2016-08-26 | 2016-08-26 | Method of machining burr-free hole of PCB copper-based core board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610740841.5A CN106455345A (en) | 2016-08-26 | 2016-08-26 | Method of machining burr-free hole of PCB copper-based core board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455345A true CN106455345A (en) | 2017-02-22 |
Family
ID=58181706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610740841.5A Pending CN106455345A (en) | 2016-08-26 | 2016-08-26 | Method of machining burr-free hole of PCB copper-based core board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106455345A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535488A (en) * | 2016-10-12 | 2017-03-22 | 深圳市五株科技股份有限公司 | Slotting structure and method for copper-based circuit board |
| CN107484356A (en) * | 2017-08-01 | 2017-12-15 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of the sandwich aluminium base of thick copper |
| CN107548236A (en) * | 2017-08-28 | 2018-01-05 | 苏州福莱盈电子有限公司 | A kind of method for improving drilling holes on circuit board product peak problem using dry film |
| CN107623997A (en) * | 2017-10-18 | 2018-01-23 | 梅州市志浩电子科技有限公司 | A kind of no burr PCB processing method and PCB |
| CN108650800A (en) * | 2018-06-29 | 2018-10-12 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production procedures reducing dry film holes |
| CN109587953A (en) * | 2018-12-12 | 2019-04-05 | 东莞市若美电子科技有限公司 | Thick copper copper base borrosion hole technique |
| CN110856356A (en) * | 2019-11-15 | 2020-02-28 | 莆田市涵江区依吨多层电路有限公司 | Method for producing copper substrate based on resistance module |
| CN114745859A (en) * | 2022-06-10 | 2022-07-12 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board drilling device and processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034568A (en) * | 2006-07-27 | 2008-02-14 | Nippon Mektron Ltd | Printed-wiring board, and its munufacturing method |
| CN101913065A (en) * | 2010-08-26 | 2010-12-15 | 叶淦波 | Etching method of metal micro-holes |
| CN103209546A (en) * | 2013-04-03 | 2013-07-17 | 遂宁市广天电子有限公司 | Method for making line in direct negative etching way |
-
2016
- 2016-08-26 CN CN201610740841.5A patent/CN106455345A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034568A (en) * | 2006-07-27 | 2008-02-14 | Nippon Mektron Ltd | Printed-wiring board, and its munufacturing method |
| CN101913065A (en) * | 2010-08-26 | 2010-12-15 | 叶淦波 | Etching method of metal micro-holes |
| CN103209546A (en) * | 2013-04-03 | 2013-07-17 | 遂宁市广天电子有限公司 | Method for making line in direct negative etching way |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535488A (en) * | 2016-10-12 | 2017-03-22 | 深圳市五株科技股份有限公司 | Slotting structure and method for copper-based circuit board |
| CN107484356A (en) * | 2017-08-01 | 2017-12-15 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of the sandwich aluminium base of thick copper |
| CN107484356B (en) * | 2017-08-01 | 2020-06-02 | 深圳明阳电路科技股份有限公司 | Manufacturing method of thick copper sandwich aluminum substrate |
| CN107548236A (en) * | 2017-08-28 | 2018-01-05 | 苏州福莱盈电子有限公司 | A kind of method for improving drilling holes on circuit board product peak problem using dry film |
| CN107623997A (en) * | 2017-10-18 | 2018-01-23 | 梅州市志浩电子科技有限公司 | A kind of no burr PCB processing method and PCB |
| CN108650800A (en) * | 2018-06-29 | 2018-10-12 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production procedures reducing dry film holes |
| CN109587953A (en) * | 2018-12-12 | 2019-04-05 | 东莞市若美电子科技有限公司 | Thick copper copper base borrosion hole technique |
| CN110856356A (en) * | 2019-11-15 | 2020-02-28 | 莆田市涵江区依吨多层电路有限公司 | Method for producing copper substrate based on resistance module |
| CN114745859A (en) * | 2022-06-10 | 2022-07-12 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board drilling device and processing method |
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Application publication date: 20170222 |
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