CN111770638A - Manufacturing process of printed circuit board with steps and printed circuit board - Google Patents
Manufacturing process of printed circuit board with steps and printed circuit board Download PDFInfo
- Publication number
- CN111770638A CN111770638A CN202010546041.6A CN202010546041A CN111770638A CN 111770638 A CN111770638 A CN 111770638A CN 202010546041 A CN202010546041 A CN 202010546041A CN 111770638 A CN111770638 A CN 111770638A
- Authority
- CN
- China
- Prior art keywords
- copper
- tin
- clad plate
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses a manufacturing process of a printed circuit board with steps, which comprises the following steps of: a circuit pattern is manufactured on the copper-clad plate by a dry film pasting mode, the step position is designed to have a dry film removing effect, and copper on the side wall and the bottom of the step is exposed; electroplating copper and tin: sequentially electroplating a copper layer and a tin layer on a circuit pattern area on the copper-clad plate; step bottom laser tin burning: utilizing a mode of removing the tin layer by laser ablation to expose the electroplated copper layer at the bottom of the step; etching: after removing the dry film on the copper-clad plate, etching the exposed copper layer on the copper-clad plate to obtain the copper-clad plate with the circuit pattern covered by the tin layer; tin stripping: and (4) removing the tin layer on the copper-clad plate to obtain the printed circuit board with the outer layer circuit. The process method shortens the process flow and improves the manufacturing speed. Also discloses a printed circuit board manufactured by the manufacturing process, and the printed circuit board is provided with a step mechanism.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing process of a printed circuit board with steps and the printed circuit board.
Background
With the large-scale design of the high-end PCB market changing to high-frequency high-speed acceleration, the printed circuit board with the step (cavity) can greatly improve the heat dissipation problem of components, the printed circuit board achieves a better shielding effect, and the size of the printed circuit board can be smaller. Accordingly, higher requirements are provided for production and manufacturing, the conventional pattern transfer of the printed circuit board is realized on a flat surface through a special dry film, but for the printed circuit board with steps (cavities), the dry film cannot be tightly attached to the positions of bulges or depressions, the pattern transfer cannot be completed on the outer surface layer of the copper-clad plate at one time, the inner layer of the pattern at the bottom of the step is etched firstly and then laminated, or the bottom of the step only supports the only selection of all-metal retention (or no retention), when the steps with various depths are designed, the metal of the side wall of the step is coated, and different electrical patterns are arranged at the bottom, the pattern transfer at the bottom of the step cannot be completed by the traditional process, so that the technology of completing the pattern transfer of the surface layer and the bottom of the step at one time needs to be researched.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a manufacturing process of a printed circuit board with steps, which can simultaneously realize pattern transfer at the bottom of the steps of the printed circuit board, and has the advantages of short flow and high efficiency.
The invention also provides a printed circuit board manufactured by the manufacturing process.
According to the manufacturing process of the printed circuit board with the steps, the manufacturing process of the printed circuit board with the steps comprises the following steps of imaging by external light: a circuit pattern is manufactured on the copper-clad plate by a dry film pasting mode, the step position is designed to have a dry film removing effect, and copper on the side wall and the bottom of the step is exposed; electroplating copper and tin: sequentially electroplating a copper layer and a tin layer on the circuit pattern area on the copper-clad plate; step bottom laser tin burning: utilizing a mode of removing the tin layer by laser ablation to expose the electroplated copper layer at the bottom of the step; etching: after removing the dry film on the copper-clad plate, etching the exposed copper layer on the copper-clad plate to obtain the copper-clad plate with the circuit pattern covered by the tin layer; tin stripping: and removing the tin layer on the copper-clad plate to obtain the printed circuit board with the outer layer circuit.
The manufacturing process of the printed circuit board with the steps, provided by the embodiment of the invention, at least has the following beneficial effects: the external light imaging step and the copper and tin electroplating step can manufacture a circuit prototype formed by the copper electroplating layer on the surface of the copper-clad plate, and the tin layer can protect the copper electroplating layer; in the step of burning tin on the bottom of the step by laser, a part of tin layer at the bottom of the step can be stripped, so that a corresponding circuit pattern is formed at the bottom of the step and the electroplated copper layer is exposed, and the area of the bottom of the step still covered and protected by the tin layer is the circuit prototype at the bottom of the step; then, etching the copper layer on the surface of the copper-clad plate, which is covered by the dry film, and the copper layer exposed at the bottom of the step, wherein the remaining copper layer is the circuit; and removing the tin layer on the copper-clad plate through a tin removing step to obtain the printed circuit board with the outer layer provided with the circuit. The circuit pattern on the surface layer of the copper-clad plate and the circuit pattern on the bottom of the step can be sequentially completed, then the surface layer of the copper-clad plate and the bottom of the step are synchronously etched, and finally a required circuit is obtained.
According to some embodiments of the invention, the dry film on the copper-clad plate is removed between the step of electroplating copper tin and the step bottom laser tin burning step, or the dry film on the copper-clad plate is removed between the step bottom laser tin burning step and the etching step.
According to some embodiments of the present invention, in the step of burning tin by laser at the bottom of the step, the laser energy of the laser device is set according to the thickness of the tin layer of 10um corresponding to 150-300KW energy.
According to some embodiments of the invention, the etching step etches away the exposed copper layer by an alkaline etchant.
According to some embodiments of the invention, before the external light imaging step, a drilling step and a copper deposition step are sequentially arranged, a through hole is drilled on the copper-clad plate, and then a copper layer is formed on the side wall of the through hole.
According to some embodiments of the invention, after the step of solder stripping, a step of solder mask is further provided, the circuit and all the copper layers are covered, ink is printed on the copper-clad plate, and the ink is exposed and cured so that the ink in the solder mask area is retained and cured.
According to some embodiments of the present invention, the step of forming the external light image includes a dry film attaching step, an exposing step and a developing step, the dry film is flatly attached to the surface of the copper clad laminate, the pattern on the film is partially sensitized by ultraviolet rays of an exposing machine to transfer the pattern on the base sheet to the copper clad laminate, and then the unexposed film is removed to leave the sensitized film.
According to the printed circuit board of the embodiment of the second aspect of the invention, the printed circuit board is manufactured by adopting the manufacturing process.
The printed circuit board has all the advantages brought by the manufacturing process of the printed circuit board with the steps in the embodiment, and repeated description is not repeated herein.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic flow chart of a manufacturing process according to an embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that if there is a description relating to an orientation such as the orientations or positional relationships indicated by upper, lower, front, rear, left, right, etc., the description of the orientation may be based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and for the simplicity of description, but not for indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, a manufacturing process of a printed circuit board having steps includes the following steps: a circuit pattern is manufactured on the copper-clad plate by a dry film pasting mode, the step position is designed to have a dry film removing effect, and copper on the side wall and the bottom of the step is exposed; electroplating copper and tin: sequentially electroplating a copper layer and a tin layer on a circuit pattern area on the copper-clad plate; step bottom laser tin burning: utilizing a mode of removing the tin layer by laser ablation to expose the electroplated copper layer at the bottom of the step; etching: after removing the dry film on the copper-clad plate, etching the exposed copper layer on the copper-clad plate to obtain the copper-clad plate with the circuit pattern covered by the tin layer; tin stripping: and (4) removing the tin layer on the copper-clad plate to obtain the printed circuit board with the outer layer circuit.
The external light imaging step and the copper and tin electroplating step can manufacture a circuit prototype formed by the copper electroplating layer on the surface of the copper-clad plate, and the tin layer can protect the copper electroplating layer; in the step of burning tin on the bottom of the step by laser, a part of tin layer at the bottom of the step can be stripped, so that a corresponding circuit pattern is formed at the bottom of the step and the electroplated copper layer is exposed, and the area of the bottom of the step still covered and protected by the tin layer is the circuit prototype at the bottom of the step; then, etching the copper layer on the surface of the copper-clad plate, which is covered by the dry film, and the copper layer exposed at the bottom of the step, wherein the remaining copper layer is the circuit; and removing the tin layer on the copper-clad plate through a tin removing step to obtain the printed circuit board with the outer layer provided with the circuit. The circuit pattern on the surface layer of the copper-clad plate and the circuit pattern on the bottom of the step can be sequentially completed, then the surface layer of the copper-clad plate and the bottom of the step are synchronously etched, and finally a required circuit is obtained.
It is understood that the printed circuit board may be a single layer board, a double layer board, or a multi-layer board. The pretreatment is carried out before the manufacture of the printed circuit board, the pretreatment comprises the cutting of a copper-clad plate, the grinding of the plate and the sawing of the plate, the cutting of a large-size substrate obtains the copper-clad plate of which the shape and the size meet the design requirements, the grinding of the plate removes the sharp corner of the copper-clad plate, and the sawing of the plate conditions are as follows: 145+5 ℃/4H, the internal stress of the copper-clad plate can be eliminated by sawing the plate, and the reliability and the dimensional stability of the material are improved.
In some embodiments of the invention, the dry film on the copper-clad plate is removed between the step of electroplating copper and tin and the step of burning tin by laser at the bottom of the step, and the etching step can be executed after the dry film is removed, while in other embodiments, the dry film on the copper-clad plate is removed between the step of burning tin by laser at the bottom of the step and the etching step. The dry film can be removed by using 3% -5% sodium hydroxide solution.
In some embodiments of the invention, in the step of burning tin by laser at the bottom of the step, the laser energy of the laser equipment is set according to the thickness of the tin layer of 10um corresponding to the energy of 150-300KW, so that the tin layer can be completely removed, and the effect of removing the tin layer is good.
In some embodiments of the present invention, in the etching step, the exposed copper layer is etched away by an alkaline etchant, the exposed copper layer includes a copper layer generated by electroplating and a copper layer on the surface of the copper-clad plate, and the required copper layer circuit can be obtained by removing the excessive copper layers. And the copper layer circuit obtained after the etching step is also provided with an AOI (automated optical inspection) step for inspecting the manufacturing condition of the copper layer circuit.
In some embodiments of the invention, before the external light imaging step, a drilling step and a copper deposition step are sequentially arranged, a through hole is drilled on the copper-clad plate, and then a copper layer is formed on the side wall of the through hole. The through holes can be used as positioning holes to provide positioning reference for subsequent process steps and realize the conduction between layers. The copper deposition step, also called plate electroplating, deposits a layer of conductive metal on the sidewall of the through hole to conduct the circuits of different layers. A layer of conductive metal can be chemically deposited on the sidewalls of the via.
In some embodiments of the invention, after the step of detinning, a step of solder mask is further provided, the circuit and all copper layers are covered, the ink is printed on the copper-clad plate, and the ink is exposed and cured to cure and retain the ink in the solder mask area. The printing ink is green oil, the printing ink is coated on the surface of the circuit board, the exposure negative film is pasted on the surface of the circuit board, exposure is carried out under ultraviolet rays, the printing ink irradiated by the ultraviolet rays is solidified and attached on the surface of the circuit board, uncured printing ink is washed away, the copper layer surface required to be exposed is exposed finally, and the unexposed copper layer surface is protected by the solidified printing ink. And after the step of solder resist, specific characters can be manufactured on the surface of the printed circuit board.
In some embodiments of the invention, the step of external light imaging comprises a step of attaching a dry film, an exposure step and a development step, wherein the dry film is flatly attached on the surface of the copper-clad plate, the part of the pattern on the film is sensitized by ultraviolet rays of an exposure machine so that the pattern on the negative plate is transferred to the copper-clad plate, and then the unexposed film is removed to leave the sensitized film. The dry film is pasted on the copper-clad plate, the dry film is attached to the copper layer through a pressing roller by a film pasting machine, meanwhile, the protective film of the dry film is torn off, the bottom plate is provided with a pattern, and ultraviolet rays of an exposure machine penetrate through the bottom plate to enable the upper portion of the film to be photosensitive and enable the shape of the photosensitive portion of the film to be matched with the pattern on the bottom plate.
A printed circuit board is manufactured by adopting the manufacturing process.
The printed circuit board has all the advantages brought by the manufacturing process of the printed circuit board with the steps in the embodiment, and repeated description is not repeated herein.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (8)
1. A manufacturing process of a printed circuit board with steps is characterized by comprising the following steps,
external light imaging: a circuit pattern is manufactured on the copper-clad plate by a dry film pasting mode, the step position is designed to have a dry film removing effect, and copper on the side wall and the bottom of the step is exposed;
electroplating copper and tin: sequentially electroplating a copper layer and a tin layer on the circuit pattern area on the copper-clad plate;
step bottom laser tin burning: utilizing a mode of removing the tin layer by laser ablation to expose the electroplated copper layer at the bottom of the step;
etching: after removing the dry film on the copper-clad plate, etching the exposed copper layer on the copper-clad plate to obtain the copper-clad plate with the circuit pattern covered by the tin layer;
tin stripping: and removing the tin layer on the copper-clad plate to obtain the printed circuit board with the outer layer circuit.
2. The process for manufacturing a printed circuit board with steps as claimed in claim 1, wherein: and removing the dry film on the copper-clad plate between the step of electroplating copper tin and the step of laser tin burning at the bottom of the step, or removing the dry film on the copper-clad plate between the step of laser tin burning at the bottom of the step and the step of etching.
3. The process for manufacturing a printed circuit board with steps as claimed in claim 1, wherein: in the step of burning tin by laser at the bottom of the step, the laser energy of the laser equipment is set according to the corresponding energy of 150-300KW of the thickness of a tin layer of 10 um.
4. The process for manufacturing a printed circuit board with steps as claimed in claim 1, wherein: and in the etching step, the exposed copper layer is corroded by alkaline etching solution.
5. The process for manufacturing a printed circuit board with steps as claimed in claim 1, wherein: before the step of external light imaging, a drilling step and a copper deposition step are sequentially arranged, a through hole is drilled on the copper-clad plate, and then a copper layer is formed on the side wall of the through hole.
6. The process for manufacturing a printed circuit board with steps as claimed in claim 1, wherein: and after the step of tin removal, a step of solder mask is also provided, the circuit and all the copper layers are covered, ink is printed on the copper-clad plate, and the ink is exposed and cured so that the ink in a solder mask area is reserved and cured.
7. The process for manufacturing a printed circuit board with steps as claimed in claim 1, wherein: the step of external light imaging comprises a step of pasting a dry film, a step of exposure and a step of development, wherein the dry film is flatly pasted on the surface of the copper-clad plate, the upper part of the film is sensitized by ultraviolet rays of an exposure machine so that the pattern on the negative plate is transferred to the copper-clad plate, and then the unexposed film is removed so as to leave the sensitized film.
8. A printed circuit board, characterized by: the printed circuit board is manufactured by the manufacturing process of any one of the claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010546041.6A CN111770638A (en) | 2020-06-16 | 2020-06-16 | Manufacturing process of printed circuit board with steps and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010546041.6A CN111770638A (en) | 2020-06-16 | 2020-06-16 | Manufacturing process of printed circuit board with steps and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111770638A true CN111770638A (en) | 2020-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010546041.6A Pending CN111770638A (en) | 2020-06-16 | 2020-06-16 | Manufacturing process of printed circuit board with steps and printed circuit board |
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| Country | Link |
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| CN (1) | CN111770638A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533365A (en) * | 2020-12-14 | 2021-03-19 | 深圳市艾诺信射频电路有限公司 | Substrate processing method and substrate |
| CN113133215A (en) * | 2021-04-14 | 2021-07-16 | 深圳市深联电路有限公司 | PCB circuit forming method |
| CN113438816A (en) * | 2021-06-25 | 2021-09-24 | 竞华电子(深圳)有限公司 | PCB processing method |
| CN113727537A (en) * | 2021-08-30 | 2021-11-30 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by respectively processing electroplating hole and circuit mask and etching by laser |
| CN114269076A (en) * | 2021-12-22 | 2022-04-01 | 无锡天杨电子有限公司 | Etching method for two-step pattern of thick-coated copper ceramic substrate |
| CN114340186A (en) * | 2022-01-06 | 2022-04-12 | 安捷利电子科技（苏州）有限公司 | FPC and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0056472A2 (en) * | 1981-01-15 | 1982-07-28 | Robert Bosch Gmbh | Thin-film electronic circuit |
| CN102548225A (en) * | 2012-02-13 | 2012-07-04 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method for printed circuit board (PCB) |
| CN111031692A (en) * | 2019-12-24 | 2020-04-17 | 奥士康科技股份有限公司 | Production method of metallized blind slot local thick copper PCB |
-
2020
- 2020-06-16 CN CN202010546041.6A patent/CN111770638A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0056472A2 (en) * | 1981-01-15 | 1982-07-28 | Robert Bosch Gmbh | Thin-film electronic circuit |
| CN102548225A (en) * | 2012-02-13 | 2012-07-04 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method for printed circuit board (PCB) |
| CN111031692A (en) * | 2019-12-24 | 2020-04-17 | 奥士康科技股份有限公司 | Production method of metallized blind slot local thick copper PCB |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533365A (en) * | 2020-12-14 | 2021-03-19 | 深圳市艾诺信射频电路有限公司 | Substrate processing method and substrate |
| CN113133215A (en) * | 2021-04-14 | 2021-07-16 | 深圳市深联电路有限公司 | PCB circuit forming method |
| CN113438816A (en) * | 2021-06-25 | 2021-09-24 | 竞华电子(深圳)有限公司 | PCB processing method |
| CN113727537A (en) * | 2021-08-30 | 2021-11-30 | 德中（天津）技术发展股份有限公司 | Method for manufacturing circuit board by respectively processing electroplating hole and circuit mask and etching by laser |
| CN114269076A (en) * | 2021-12-22 | 2022-04-01 | 无锡天杨电子有限公司 | Etching method for two-step pattern of thick-coated copper ceramic substrate |
| CN114269076B (en) * | 2021-12-22 | 2024-04-09 | 无锡天杨电子有限公司 | Etching method of second step pattern of thick copper-clad ceramic substrate |
| CN114340186A (en) * | 2022-01-06 | 2022-04-12 | 安捷利电子科技（苏州）有限公司 | FPC and preparation method thereof |
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Application publication date: 20201013 |
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