CN113597113A - Manufacturing method of high-reflectivity white oil circuit board - Google Patents
Manufacturing method of high-reflectivity white oil circuit board Download PDFInfo
- Publication number
- CN113597113A CN113597113A CN202110883942.9A CN202110883942A CN113597113A CN 113597113 A CN113597113 A CN 113597113A CN 202110883942 A CN202110883942 A CN 202110883942A CN 113597113 A CN113597113 A CN 113597113A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board
- copper
- reflectivity
- baking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002310 reflectometry Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims abstract description 9
- 238000003384 imaging method Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 31
- 238000005553 drilling Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 9
- 230000002378 acidificating effect Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims 1
- 230000008602 contraction Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Abstract
The application provides a manufacturing method of a high-reflectivity white oil circuit board, and relates to the technical field of printed circuit boards. A manufacturing method of a high-reflectivity white oil circuit board comprises the following steps of carrying out board baking operation on a copper-clad core board obtained by cutting, sending the copper-clad core board to an IR furnace after board baking is finished, and carrying out reflow soldering treatment by the IR furnace. Compared with the prior art, the method has the advantages that the board baking process is added after cutting, the expansion and contraction coefficient of the circuit board is effectively controlled, the reflow soldering process is carried out in the IR furnace after the board baking, the telescopic state of the circuit board is ensured, the reflectivity of the circuit board is controlled within the wavelength band of 450-700nm, the reflectivity is not less than 80%, and the dimensional tolerance of the board is controlled within a proper range. And the laser of the LDI exposure machine is used for direct imaging on the outer layer circuit, and a film does not need to be exposed, so that the alignment precision is improved.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of printed circuit boards, in particular to a manufacturing method of a high-reflectivity white oil circuit board.
[ background of the invention ]
In recent years, with the rapid development of the panel industry, manufacturers have come to pay more attention to the improvement of the quality of products. The display panel industry will develop towards the trend of high-resolution pictures, curved surfaces, ultrathin planes, lightness, thinness, bendability, high dynamic HDR, high contrast and wide color gamut, and Mini LEDs are produced accordingly. The Mini LED is an LED chip with the size of 50-200 mu m, and can be used as a backlight source to be applied to products such as large-size display screens, smart phones, automobile panels, computer-readable notebooks and the like. In order to adapt to the market development of the Mini LED, the printed circuit board applied to the Mini LED backlight product also needs to be developed correspondingly.
Taking a traditional printed circuit board as an example, the most extensive production process flow is as follows: cutting → drilling → copper deposition → electroplating → outer dry film → etching → solder resist → exterior processing → test → appearance inspection → packaging. However, in the manufacturing process of the process flow, the circuit board may be subject to the influence of chemicals and heat to expand and contract, which may cause the reflectivity thereof to be uncontrollable, and the dimensional tolerance of the board is difficult to control, thus being difficult to apply to the Mini LED backlight product.
[ summary of the invention ]
In order to solve the problems that the reflectivity of a produced circuit board is uncontrollable and the dimensional tolerance of the circuit board is difficult to control in the existing process flow, the application provides a manufacturing method of a high-reflectivity white oil circuit board, which can stably control the reflectivity of the circuit board and the dimensional tolerance of the circuit board.
The application is realized by the following technical scheme:
a manufacturing method of a high-reflectivity white oil circuit board comprises the following steps of carrying out board baking operation on a copper-clad core board obtained by cutting, sending the copper-clad core board to an IR furnace after board baking is finished, and carrying out reflow soldering treatment by the IR furnace.
Further, in the step of baking the plate, the copper-clad core plate is baked in an environment of 120-200 ℃, and the baking time is 2-6 hours.
Preferably, the baking temperature is set to 160 ℃ and the baking time is 4 hours.
Further, after reflow soldering treatment is carried out in an IR furnace, drilling, copper deposition, VCP electroplating, outer-layer dry film and acid outer-layer etching are carried out on the copper-clad core board in sequence.
Further, in the outer layer film drying step, outer layer photosensitive materials are pasted on the surfaces of copper foils on two sides of the circuit board after VCP electroplating, then laser direct imaging is carried out by an LDI exposure machine, and then development is carried out, so that a negative photosensitive material pattern film layer matched with the size and the shape of a preset outer layer pattern circuit pattern is obtained.
Furthermore, after the acid outer layer is etched, the steps of detection, welding prevention, shape processing, electrical testing, final inspection and packaging are sequentially carried out.
Preferably, in the drilling step, a via hole penetrating the wiring board is drilled at one time by a drilling machine, and the via hole includes a hole for resin plugging and a hole for non-resin plugging.
Preferably, in the step of depositing copper, a copper layer between the conductive layers is deposited in the via hole of the circuit board.
Preferably, in the VCP electroplating step, the circuit board is integrally electroplated to increase the thickness of the copper layer on the surface of the circuit board and in the via hole.
Preferably, in the acidic outer layer etching step, the film exposed on the non-wiring copper layer is removed to expose the copper layer in the non-wiring region, and the acidic etching removes the non-wiring copper exposed after development to leave the copper layer in the wiring region.
Compared with the prior art, the method has the advantages that compared with the traditional manufacturing method, the board baking process is added after cutting, the expansion coefficient of the circuit board is effectively controlled, the reflow soldering treatment is carried out in an IR furnace after the board baking, the expansion state of the circuit board is ensured, the reflectivity of the circuit board is controlled within a wavelength band of 450 plus and minus 700nm, the reflectivity is more than or equal to 80 percent, the dimensional tolerance of the board is controlled within the absolute value of the long edge of the same board, the absolute value of the long edge of the same board is less than or equal to 50um, and the absolute value of the wide edge of the same board is less than or equal to 50um from L1 to L2. And the laser of the LDI exposure machine is used for directly imaging on the outer layer circuit, a film does not need to be exposed, the alignment precision is improved, and the graphic position precision is within +/-2 mil.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a flowchart of a method for manufacturing a high-reflectivity white oil circuit board according to an embodiment of the present application.
[ detailed description ] embodiments
In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
As shown in fig. 1, the method for manufacturing a high-reflectivity white oil circuit board according to an embodiment of the present application includes the following steps:
s1, cutting, namely cutting the raw material plate into a copper-clad core plate with a preset size and shape;
s2, baking the board, namely, putting the copper-clad core board obtained by cutting into a 120-200 ℃ environment for baking for 2-6 hours. The step effectively controls the expansion and shrinkage coefficient of the circuit board, preferably, the baking temperature is set to be 160 ℃, and the baking time is 4 hours;
s3, reflow soldering, performing reflow soldering treatment in an IR furnace, ensuring the expansion state of the circuit board, controlling the reflectivity of the circuit board in the wavelength band of 450-700nm, wherein the reflectivity is more than or equal to 80%, the board size precision is controlled to be +0.15/-0.15mm in the X direction, +0.09/-0.03mm in the Y direction, the point trapezoid precision L1-L2 is less than or equal to 50um (the absolute value of the long side of the same board), and W1-W2 is less than or equal to 50um (the absolute value of the wide side of the same board);
s4, drilling holes, namely drilling via holes penetrating through the circuit board at one time through a drilling machine, wherein the via holes comprise vip holes (namely holes for resin plug holes) and non-vip plated through holes (namely holes for non-resin plug holes);
and S5, depositing copper, and depositing a copper layer between the conducting layers in the conducting holes of the circuit board. When the method is implemented specifically, the circuit board is wholly immersed into a copper deposition groove, and then a copper layer between conducting layers is deposited in the copper deposition groove;
and S6, VCP electroplating, and carrying out integral electroplating on the circuit board to thicken the thickness of the copper layer on the surface of the circuit board and in the via hole. During specific implementation, the circuit board on which the copper layer is deposited is wholly immersed into an electroplating bath, and then the copper layer is electroplated on the surface of the deposited copper layer so as to thicken the thickness of the copper layer;
s7, pasting an outer layer photosensitive material on the surfaces of the copper foils on the two sides of the circuit board after the electroplating, then directly imaging by laser of an LDI exposure machine, compared with the traditional process, the film is not required to be exposed, the circuit alignment precision is improved, the precision tolerance of the pattern position is controlled within +/-2mil, and then developing is carried out to obtain a negative photosensitive material pattern film layer matched with the size and the shape of the preset outer layer pattern circuit pattern;
s8, etching the acidic outer layer, removing the film exposed on the non-circuit copper layer to expose the copper layer in the non-circuit area, and removing the exposed non-circuit copper after development by acidic etching to leave the copper layer in the circuit area;
s9, detecting an outer layer pattern circuit through optical detection equipment;
s10, solder mask, and screen printing solder mask ink on the circuit board;
s11, processing the shape, namely processing the circuit board into small circuit boards or decomposing the circuit boards into small circuit board pre-processed parts conveniently;
s12, performing electric test, and detecting whether the electrical performance of the circuit board is normal or not through a clamp;
s13, final inspection, namely, whether the circuit board is qualified or not is checked;
and S14, packaging, namely washing, drying, cleaning and finally packaging the qualified circuit board.
The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the disclosure to the particular forms disclosed. Similar or identical methods, structures, etc. as used herein, or several technical inferences or substitutions made on the concept of the present application should be considered as the scope of the present application.
Claims (10)
1. The manufacturing method of the high-reflectivity white oil circuit board is characterized by comprising the following steps of carrying out board baking operation on a copper-clad core board obtained by cutting, sending the copper-clad core board to an IR furnace after the board baking operation is finished, and carrying out reflow soldering treatment by the IR furnace.
2. The method for manufacturing the high-reflectivity white oil circuit board according to claim 1, wherein in the step of baking the circuit board, the copper-clad core board is baked in an environment of 120-200 ℃, and the baking time is 2-6 hours.
3. The method of claim 2, wherein the baking temperature is set to 160 ℃ and the baking time is 4 hours.
4. The method for manufacturing a high-reflectivity white oil circuit board according to claim 1, 2 or 3, wherein after the reflow soldering process is performed in an IR furnace, drilling, copper deposition, VCP plating, outer dry film and acid outer etching are sequentially performed on the copper-clad core board.
5. The method according to claim 4, wherein in the outer dry film step, an outer photosensitive material is applied to the copper foil surfaces on both sides of the VCP-plated circuit board, and then laser direct imaging is performed by an LDI exposure machine, followed by development, to obtain a negative photosensitive material pattern film matching the predetermined size and shape of the outer pattern circuit pattern.
6. The method as claimed in claim 4, wherein the etching of the acidic outer layer is followed by performing inspection, solder mask, shape processing, electrical testing, final inspection, and packaging.
7. The method for manufacturing a white oil circuit board with high reflectivity as claimed in claim 4, wherein in the drilling step, a via hole penetrating through the circuit board is drilled at one time by a drilling machine, and the via hole comprises a hole for resin plugging and a hole for non-resin plugging.
8. The method according to claim 4, wherein in the step of depositing copper, a copper layer between the conductive layers is deposited in the via hole of the circuit board.
9. The method as claimed in claim 4, wherein in the VCP electroplating step, the circuit board is electroplated to increase the thickness of the copper layer on the surface of the circuit board and in the via hole.
10. The method according to claim 4, wherein the etching step of the acidic outer layer removes the film exposed on the non-circuit copper layer to expose the copper layer in the non-circuit area, and the acidic etching removes the non-circuit copper exposed after the development to leave the copper layer in the circuit area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110883942.9A CN113597113A (en) | 2021-08-03 | 2021-08-03 | Manufacturing method of high-reflectivity white oil circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110883942.9A CN113597113A (en) | 2021-08-03 | 2021-08-03 | Manufacturing method of high-reflectivity white oil circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113597113A true CN113597113A (en) | 2021-11-02 |
Family
ID=78254401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110883942.9A Pending CN113597113A (en) | 2021-08-03 | 2021-08-03 | Manufacturing method of high-reflectivity white oil circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113597113A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114126244A (en) * | 2021-12-01 | 2022-03-01 | 广德东风电子有限公司 | PCB production process based on laser direct writing exposure |
| CN114521071A (en) * | 2022-01-24 | 2022-05-20 | 珠海市凯诺微电子有限公司 | Production process of multilayer impedance flexible printed circuit board |
| CN114710882A (en) * | 2022-03-29 | 2022-07-05 | 金禄电子科技股份有限公司 | Circuit board and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060346A (en) * | 2001-06-07 | 2003-02-28 | Matsushita Electric Ind Co Ltd | Manufacturing method of circuit board, the circuit board and power conversion module using the board |
| CN111642071A (en) * | 2020-05-14 | 2020-09-08 | 大连崇达电路有限公司 | Circuit board and method for improving board explosion and copper sheet foaming of circuit board |
| CN213638416U (en) * | 2020-11-23 | 2021-07-06 | 景旺电子科技(珠海)有限公司 | Wiring production equipment for circuit board |
| CN113163609A (en) * | 2021-04-28 | 2021-07-23 | 广东依顿电子科技股份有限公司 | Production method of 5G mainboard circuit board |
-
2021
- 2021-08-03 CN CN202110883942.9A patent/CN113597113A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003060346A (en) * | 2001-06-07 | 2003-02-28 | Matsushita Electric Ind Co Ltd | Manufacturing method of circuit board, the circuit board and power conversion module using the board |
| CN111642071A (en) * | 2020-05-14 | 2020-09-08 | 大连崇达电路有限公司 | Circuit board and method for improving board explosion and copper sheet foaming of circuit board |
| CN213638416U (en) * | 2020-11-23 | 2021-07-06 | 景旺电子科技(珠海)有限公司 | Wiring production equipment for circuit board |
| CN113163609A (en) * | 2021-04-28 | 2021-07-23 | 广东依顿电子科技股份有限公司 | Production method of 5G mainboard circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114126244A (en) * | 2021-12-01 | 2022-03-01 | 广德东风电子有限公司 | PCB production process based on laser direct writing exposure |
| CN114126244B (en) * | 2021-12-01 | 2023-07-14 | 广德东风电子有限公司 | PCB production method based on laser direct writing exposure |
| CN114521071A (en) * | 2022-01-24 | 2022-05-20 | 珠海市凯诺微电子有限公司 | Production process of multilayer impedance flexible printed circuit board |
| CN114710882A (en) * | 2022-03-29 | 2022-07-05 | 金禄电子科技股份有限公司 | Circuit board and preparation method thereof |
| CN114710882B (en) * | 2022-03-29 | 2023-07-21 | 金禄电子科技股份有限公司 | Circuit board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110139505B (en) | Manufacturing method of rigid-flex board with local flexible board layering | |
| CN113597113A (en) | Manufacturing method of high-reflectivity white oil circuit board | |
| CN108617104B (en) | Method for manufacturing printed circuit board with thickened copper local pattern | |
| US20060180346A1 (en) | High aspect ratio plated through holes in a printed circuit board | |
| KR100957418B1 (en) | Method for maanufacturig pcb and pcb manufactured using the same | |
| CN107041077A (en) | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity | |
| CN114222434B (en) | Manufacturing method of ladder circuit and circuit board | |
| CN113056116A (en) | Method for plating hole copper and processing method of circuit board | |
| KR20040061409A (en) | Two-sided PCB without via hole and the manufacturing method thereof | |
| CN112739069B (en) | Method for improving incomplete stripping of electroplated copper layer | |
| CN105704948A (en) | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN109890149B (en) | Manufacturing method of double-sided compression-joint PCB and PCB | |
| KR100440605B1 (en) | Method for manufacturing a flexible printed circuit board with double side | |
| CN108323040B (en) | Manufacturing method of PCB with stepped groove and PCB | |
| US6651324B1 (en) | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer | |
| KR101862243B1 (en) | Method for manuracturing printed circuit board with via and fine pitch circuit and printed circuit board by the same method | |
| KR101596098B1 (en) | The manufacturing method of printed circuit board | |
| CN108449887B (en) | Manufacturing method for plating thick copper on local hole wall and PCB | |
| CN108551731B (en) | Method for manufacturing non-metallized hole with no base material exposed in hole opening on circuit board | |
| KR100736455B1 (en) | Manufacturing method of a flexible printed circuit board | |
| TWI519221B (en) | Printed circuit board and methods for forming the same | |
| CN114885524A (en) | Manufacturing method of dense copper slurry hole circuit board and circuit board | |
| KR20130110877A (en) | Method for forming via hole and outer circuit layer of printed circuit board | |
| CN109327968B (en) | Processing method for improving layering of dense heat dissipation hole region | |
| KR20110110664A (en) | Manufacturing method of double-sided printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |