CN213638416U - Wiring production equipment for circuit board - Google Patents
Wiring production equipment for circuit board Download PDFInfo
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- CN213638416U CN213638416U CN202022736251.XU CN202022736251U CN213638416U CN 213638416 U CN213638416 U CN 213638416U CN 202022736251 U CN202022736251 U CN 202022736251U CN 213638416 U CN213638416 U CN 213638416U
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Abstract
The application is suitable for the field of circuit board manufacturing, and provides a circuit board connection production device which comprises a film withdrawing line, a first conveying mechanism and a reflow soldering furnace, wherein the film withdrawing line, the first conveying mechanism and the reflow soldering furnace are sequentially connected and have the same conveying speed; the film removing line is used for removing a gold deposition protective film on a circuit board, and the first conveying mechanism is used for conveying the circuit board in the film removing line to the reflow soldering furnace; the reflow soldering furnace is sequentially provided with a plurality of temperature zones, each temperature zone has preset temperature and length, and the lengths of at least two temperature zones are unequal. Above-mentioned production facility accessible reflow oven carries out heat treatment to the circuit board to get rid of the stress in the circuit board, promoted the dimensional stability of circuit board, promoted the production efficiency and the yield of circuit board simultaneously.
Description
Technical Field
The application relates to the field of circuit board manufacturing, in particular to a circuit board connection production device.
Background
In a manufacturing process of a High Density Interconnect (HDI) circuit board, a selective gold immersion surface treatment is usually performed, a protective film is required to be attached before gold immersion, and the protective film is required to be removed after gold immersion.
Since the HDI circuit board is thin, problems of dimensional stability such as warpage and deformation are easily generated. The traditional method is to release the stress of the HDI circuit board in an oven baking plate mode after film stripping so as to enhance the size stability of the HDI circuit board. Baking at 120 c for 4 hours in a vertical oven, for example, reduces moisture in the board, increases the degree of cure and reduces stress. However, since the film removing line and the oven are two independent devices, this method requires to carry the HDI circuit board many times, which is prone to the problems of surface scratches and the like, and has low production efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model provides a line production facility of circuit board to solve among the above-mentioned prior art circuit board and wipe colored problem with the easy face in deformation problem, the repeated handling inefficiency that produce because of stress behind the heavy golden protection film that moves back.
The utility model provides a connecting line production device of a circuit board, which comprises a film withdrawing line, a first transmission mechanism and a reflow oven which are connected in sequence and have the same transmission speed; the film removing line is used for removing a gold deposition protective film on a circuit board, and the first conveying mechanism is used for conveying the circuit board in the film removing line to the reflow soldering furnace; the reflow soldering furnace is sequentially provided with a plurality of temperature zones, each temperature zone has preset temperature and length, and the lengths of at least two temperature zones are unequal.
In one embodiment, the plurality of temperature zones in the reflow furnace are a plurality of sequentially arranged heating zones and a plurality of sequentially arranged cooling zones, the temperature of the plurality of heating zones gradually rises, and the temperature of the plurality of cooling zones gradually falls;
the heating area is internally provided with an infrared heating tube and a variable-frequency hot air motor, and the cooling area is internally provided with a variable-frequency cold air motor and a water-cooling evaporator.
In an embodiment, the reflow oven further comprises a control mechanism, a temperature sensor is arranged in each temperature zone, the temperature sensors are used for sending the real-time temperature of the temperature zones to the control mechanism, and the control mechanism is used for controlling the hot air motor and the cold air motor.
In one embodiment, the cooling rate of the cooling zone is 3 ℃/s to 7 ℃/s.
In one embodiment, the temperature range of the temperature zone is from room temperature to 300 ℃.
In one embodiment, the number of the temperature zones is 20-35.
In an embodiment, the reflow oven further comprises an inner box and a shell sleeved on the inner box, the plurality of temperature regions are arranged in the inner box, a heat insulation structure is arranged in the inner box, and the temperature of the shell is less than or equal to 50 ℃.
In one embodiment, the reflow oven further comprises a conveying assembly for conveying the circuit boards, and the conveying speed of the conveying assembly is 2-3 m/min.
In one embodiment, the on-line production equipment further comprises an automatic plate placing machine and a second conveying mechanism; the automatic board placing machine is used for placing a circuit board on the second conveying mechanism, and the second conveying mechanism is connected with the film withdrawing line and used for conveying the circuit board to the film withdrawing line.
In an embodiment, the connection line production equipment further includes a third conveying mechanism and an automatic board receiving machine, the third conveying mechanism is connected to the reflow oven, and the automatic board receiving machine is used for blanking the circuit boards on the third conveying mechanism.
In the connecting line production equipment of the circuit board, the film removing line, the first conveying mechanism and the reflow soldering furnace are sequentially connected and have the same conveying speed, so that the connecting line production is realized; in addition, compared with the prior art, the film stripping and baking are completed by using the connecting line production equipment, the circuit board does not need to be transferred in different equipment, the damage problems such as scratching are avoided, the product quality is improved, and the production efficiency and the yield of the circuit board are improved.
Meanwhile, each temperature zone in the reflow soldering furnace has a preset temperature and a preset length, and the lengths of at least two temperature zones are unequal, so that the temperature and the length of each temperature zone can be set according to a preset reflow temperature curve, and the time of the circuit board passing through each temperature zone is determined according to the length of the temperature zone because the transmission speed of each temperature zone is the same; the lengths of the at least two temperature zones are unequal, so that the time of the circuit board passing through the at least two temperature zones is unequal to meet the requirement of a reflux temperature curve, therefore, the reflux soldering furnace replaces a traditional oven, the stress in the circuit board can be removed, the problems of deformation and the like of the circuit board caused by the stress are avoided, and the dimensional stability of the circuit board is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a connection line production apparatus for a circuit board according to an embodiment of the present invention;
fig. 2 is a side view of a reflow oven provided by an embodiment of the present invention;
fig. 3 is a top view of the reflow oven shown in fig. 2.
The designations in the figures mean:
100. connecting production equipment;
10. removing the film line;
20. a first conveying mechanism;
30. a reflow oven; 31. a temperature zone; 32. an infrared heating tube; 33. a variable frequency hot air motor; 34. a variable frequency cold air motor; 35. a control mechanism;
40. automatic plate placing machine;
50. a second transport mechanism;
60. a third transport mechanism;
70. automatic board collecting machine.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
To explain the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
Referring to fig. 1, the present application provides a wiring production apparatus 100 for circuit boards, which is suitable for use in the circuit board manufacturing process. The circuit board may be an HDI circuit board, but is not limited thereto.
The wiring production equipment 100 of the circuit board comprises a film stripping line 10, a first conveying mechanism 20 and a reflow oven 30 which are connected in sequence and have the same conveying speed. The film removing line 10 is used for removing a gold deposition protective film on a circuit board, and the first conveying mechanism 20 is used for conveying the circuit board in the film removing line 10 to the reflow soldering furnace 30; the reflow oven 30 is sequentially provided with a plurality of temperature zones 31, each temperature zone 31 has a preset temperature and a preset length, and the lengths of at least two temperature zones 31 are different.
When the circuit board is manufactured, the circuit board is conveyed to the film removing line 10, the film removing line 10 removes a gold deposition protective film on the circuit board, then the circuit board in the film removing line 10 is conveyed to the reflow soldering furnace 30 by the first conveying mechanism 20, the circuit board passes through the reflow soldering furnace 30, and therefore the reflow soldering furnace 30 carries out heat treatment on the circuit board through the plurality of temperature zones 31 to remove stress in the circuit board, the circuit board is prevented from deforming, and the size stability of the circuit board is improved.
In the above-mentioned wiring production equipment 100 for circuit boards, since the film removing line 10, the first conveying mechanism 20 and the reflow oven 30 are connected in sequence and the conveying speeds are the same, wiring production is realized; in addition, compared with the prior art, the film stripping and baking are completed by the connecting line production equipment 100, the circuit board does not need to be transferred in different equipment, the damage problems such as scratching are avoided, the product quality is improved, and the production efficiency is improved.
Meanwhile, since each temperature zone 31 in the reflow oven 30 has a preset temperature and length, and the lengths of at least two temperature zones 31 are unequal, the temperature and length of each temperature zone 31 can be set according to a preset reflow temperature curve, and since the transfer speed of each temperature zone 31 is the same, the time for the circuit board to pass through each temperature zone 31 is determined according to the length of the temperature zone 31; the lengths of the at least two temperature zones 31 are not equal, so that the time of the circuit board passing through the at least two temperature zones 31 is not equal to meet the requirement of the reflow temperature curve, therefore, the reflow oven 30 replaces the traditional oven, the stress in the circuit board can be removed, and the dimensional stability of the circuit board is improved.
In an embodiment, the temperatures and lengths of the plurality of temperature zones 31 may not be equal, and it is understood that the temperatures and lengths of the plurality of temperatures are set according to the reflow temperature curve, which is not limited herein.
Preferably, the plurality of temperature zones 31 in the reflow oven 30 are a plurality of sequentially arranged heating zones and a plurality of sequentially arranged cooling zones, the temperatures of the plurality of heating zones gradually increase, and the temperatures of the plurality of cooling zones gradually decrease. The reflux temperature curve of the circuit board is that the temperature rises to the highest point at first and then gradually falls, and a plurality of sequentially arranged heating areas and a plurality of sequentially arranged cooling areas are arranged, so that the circuit board can meet the reflux temperature curve, and the temperature of the circuit board is raised and then cooled, so that the stress in the circuit board is eliminated. The temperature of the circuit board is raised, so that the moisture in the board can be reduced, the curing degree of the circuit board is increased, and the stress of the circuit board is reduced; and then, cooling the circuit board so as to continue the subsequent processing.
In one embodiment, an infrared heating tube 32 and a variable frequency hot air motor 33 are disposed in the heating region, the infrared heating tube 32 is used for heating to raise the temperature in the heating region, and the variable frequency hot air motor 33 is used for blowing hot air to the circuit board. It is understood that other heating elements can be disposed in the heating zone, and are not limited to infrared heating tubes and variable frequency hot air motors.
The cooling zone is provided with a variable-frequency cold air motor 34 and a water-cooled evaporator (not shown), the variable-frequency cold air motor 34 is used for blowing cold air to the circuit board, and the cold air is subjected to heat exchange through the water-cooled evaporator, and the cold air is blown to the circuit board for heat exchange to achieve the purpose of cooling.
In one embodiment, the frequency of the variable frequency hot air motor 33 and the variable frequency cold air motor 34 may be adjusted between 25Hz and 50 Hz.
In one embodiment, the cooling rate of the cooling zone 31 is 3 ℃/s to 7 ℃/s. Therefore, the cooling zone 31 can cool the circuit board at a reasonable speed, and if the cooling rate is slow, the circuit board is easily damaged; if the cooling rate is too slow, the cooling efficiency and the production efficiency are reduced.
In one embodiment, the temperature range of the temperature zone 31 is from room temperature to 300 ℃; the number of the temperature zones 31 can be 20-35. For example, the temperatures of the plurality of heating zones are: 110 ℃, 120 ℃, 125 ℃, 130 ℃, 180 ℃, 180 ℃, 190 ℃, 240 ℃, 260 ℃ and 270 ℃; the temperatures of the plurality of cooling zones are 260 ℃, 240 ℃, 190 ℃, 180 ℃, 130 ℃, 125 ℃, 120 ℃ and 110 ℃.
The reflow oven 30 further includes a transfer assembly for transferring the circuit boards, the transfer assembly having a transfer speed of 2 m/min to 3 m/min. Therefore, the heat treatment can be completed in about 7-10 minutes, the stress of the circuit board can be effectively released, and the effect achieved is the same as the effect of releasing the stress of the baking plate in the oven for 2-4 hours.
The transmission assembly may be a gear structure or a chain structure, and is not limited herein. Since the reflow oven 30 includes the plurality of temperature zones 31 and each temperature zone 31 has a preset temperature and length, the elapsed time of the circuit board in each temperature zone 31 can meet the requirement of the reflow temperature curve under the condition that the transfer speed is 2 m/min to 3 m/min.
For example, on the reflux temperature curve, when the temperature of 160 ℃ is between 60 seconds and 180 seconds, the hot air motor and the infrared heating pipe are controlled to make the temperature of one temperature zone 31 be 160 ℃; the length of the temperature zone 31, i.e., the 160 c temperature, is calculated from the running speed, and the processing time required is 120 seconds. Assuming a conveying speed of 2 m/min, the temperature zone 31 corresponds to a length of 4 m. Accordingly, the length of the infrared heating tube may also be 4 meters.
In one embodiment, the reflow oven 30 further includes an inner box and an outer shell sleeved on the inner box, the plurality of temperature zones 31 are disposed in the inner box, the inner box is further provided with a heat insulation structure, and the temperature of the outer shell is less than or equal to 50 ℃.
The heat insulation structure can be glass fiber (fiberglass), and can also comprise heat insulation pieces arranged on six sides of the inner box. The inner box can adopt special coating argon welding airtight treatment to strengthen the sealing effect.
Alternatively, each two adjacent temperature zones 31 are located in the same frame.
In one embodiment, the wire production apparatus 100 further includes an automatic plate placing machine 40 and a second transfer mechanism 50; the automatic board placing machine 40 is used for placing the circuit board on the second conveying mechanism 50, and the second conveying mechanism 50 is connected with the film removing line 10 and used for conveying the circuit board to the film removing line 10. Thus, the on-line production equipment 100 can realize automatic board placement without manual board placement, thereby reducing labor intensity and avoiding damage to the circuit board caused by manual contact with the circuit board.
In an embodiment, the connection line production apparatus 100 further includes a third transfer mechanism 60 and an automatic board receiving machine 70, the third transfer mechanism 60 is connected to the reflow oven 30, and the automatic board receiving machine 70 is used for blanking the circuit boards on the third transfer mechanism 60. Thus, the on-line production equipment 100 can realize automatic board collection without manual board collection, further reduces labor intensity, and avoids damage to the circuit board caused by manual contact with the circuit board.
Wherein, the automatic trigger prevention device and the automatic trigger receiving device 70 can both comprise a mechanical arm, but are not limited thereto; the first transfer mechanism 20, the second transfer mechanism 50, and the third transfer mechanism 60 may each include a transfer belt, but are not limited thereto.
Preferably, the conveying speed of each section of the on-line production equipment 100 is consistent to realize continuous production.
In one embodiment, the manufacturing process of the circuit board includes cutting, inner layer circuit, pressing, laser drilling, copper plate deposition, outer layer circuit, pattern plating, outer layer etching, solder mask and character printing, gold deposition protective film pasting, gold deposition protective film retreating, reflow oven, molding, electrical testing, Organic solder mask (OSP), final inspection, packaging and shipment. The connecting line production equipment 100 carries out connecting line production on the gold-precipitation-removed protective film and the connecting line production through a reflow furnace.
The process of the connecting line manufacturing apparatus 100 of the above embodiment is as follows.
In the first section of the on-line production facility 100, the automatic board placing machine 40 is abutted with the entrance of the film withdrawing line 10 through the second conveying mechanism 50, and the automatic board placing machine 40 places the circuit board from the rack or the plate frame onto the second conveying mechanism 50.
In the second stage of the on-line production apparatus 100, the second transfer mechanism 50 is connected to the automatic board placing machine 40 and the film removing line 10, and transfers the circuit board to the film removing line 10.
In the third section of the on-line production apparatus 100, the film removing line 10 includes a first film removing section, a water washing section, a second film removing section, a water washing section, an acid section, a water washing section, and a drying section, which are sequentially disposed, and an outlet is in butt joint with an inlet of the reflow oven 30 through the first conveying mechanism 20. Wherein, the first stripping section and the second stripping section can remove the gold deposition protective film by using chemical liquid.
In the fourth stage of the wiring production apparatus 100, the first transfer mechanism 20 connects the film removing line 10 and the reflow oven 30, and transfers the film removed circuit board to the reflow oven 30.
In the fifth section of the connection line production equipment 100, the reflow oven 30 includes 20 to 35 temperature zones 31, the reflow oven 30 performs heat treatment on the circuit board, and an outlet of the reflow oven 30 is butted with the automatic board receiving machine 70 through the third conveying mechanism 60.
In the sixth stage of the wire production apparatus 100, the third transfer mechanism 60 transfers the heat-treated circuit board to the board picker 70.
In the seventh stage of the wire production facility 100, the board collector 70 places the processed circuit boards in a rack or a board frame.
The connection production equipment 100 for the circuit board of the embodiment realizes connection of the deplated gold protective film line and the reflow furnace 30, can solve the problems of deformation, low repeated carrying efficiency and easy plate surface scratching caused by stress after the HDI circuit board is deplated by the deplated gold protective film, improves the dimensional stability of the circuit board, and simultaneously improves the production efficiency and the product yield of the circuit board.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. The production equipment for the connecting line of the circuit board is characterized by comprising a film withdrawing line, a first conveying mechanism and a reflow oven which are sequentially connected and have the same conveying speed; the film removing line is used for removing a gold deposition protective film on a circuit board, and the first conveying mechanism is used for conveying the circuit board in the film removing line to the reflow soldering furnace; the reflow soldering furnace is sequentially provided with a plurality of temperature zones, each temperature zone has preset temperature and length, and the lengths of at least two temperature zones are unequal.
2. The apparatus for producing a wiring of a circuit board according to claim 1, wherein the plurality of temperature zones in the reflow furnace are a plurality of sequentially arranged heating zones and a plurality of sequentially arranged cooling zones, the temperature of the plurality of heating zones gradually rises, and the temperature of the plurality of cooling zones gradually falls;
the heating area is internally provided with an infrared heating tube and a variable-frequency hot air motor, and the cooling area is internally provided with a variable-frequency cold air motor and a water-cooling evaporator.
3. The on-line production apparatus for circuit boards according to claim 2, wherein the reflow oven further comprises a control mechanism, each of the temperature zones is provided with a temperature sensor for sending a real-time temperature of the temperature zone to the control mechanism, and the control mechanism is configured to control the hot air motor and the cold air motor.
4. The on-line production apparatus for circuit boards according to claim 2, wherein the cooling rate of the cooling zone is 3 ℃/sec to 7 ℃/sec.
5. The on-line production apparatus for circuit boards according to claim 1, wherein the temperature range of the temperature zone is from room temperature to 300 ℃.
6. The on-line production apparatus for circuit boards according to claim 1, wherein the number of the temperature zones is 20 to 35.
7. The on-line production apparatus for circuit boards according to claim 1, wherein the reflow oven further comprises an inner box and a housing fitted over the inner box, the plurality of temperature zones are provided in the inner box, a heat insulating structure is provided in the inner box, and the temperature of the housing is less than or equal to 50 ℃.
8. The in-line production apparatus for circuit boards according to claim 1, wherein the reflow oven further comprises a transfer assembly for transferring the circuit boards, the transfer assembly having a transfer speed of 2 m/min to 3 m/min.
9. The on-line production apparatus for circuit boards according to any one of claims 1 to 8, further comprising an automatic board placing machine and a second conveying mechanism; the automatic board placing machine is used for placing a circuit board on the second conveying mechanism, and the second conveying mechanism is connected with the film withdrawing line and used for conveying the circuit board to the film withdrawing line.
10. The on-line production apparatus for circuit boards according to any one of claims 1 to 8, further comprising a third transfer mechanism connected to the reflow oven and an automatic board receiving machine for blanking the circuit boards on the third transfer mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022736251.XU CN213638416U (en) | 2020-11-23 | 2020-11-23 | Wiring production equipment for circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022736251.XU CN213638416U (en) | 2020-11-23 | 2020-11-23 | Wiring production equipment for circuit board |
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| Publication Number | Publication Date |
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| CN213638416U true CN213638416U (en) | 2021-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022736251.XU Active CN213638416U (en) | 2020-11-23 | 2020-11-23 | Wiring production equipment for circuit board |
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| CN (1) | CN213638416U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597113A (en) * | 2021-08-03 | 2021-11-02 | 广东依顿电子科技股份有限公司 | Manufacturing method of high-reflectivity white oil circuit board |
-
2020
- 2020-11-23 CN CN202022736251.XU patent/CN213638416U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597113A (en) * | 2021-08-03 | 2021-11-02 | 广东依顿电子科技股份有限公司 | Manufacturing method of high-reflectivity white oil circuit board |
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