JP3083035B2 - Soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for performing soldering while transferring a wiring board into a chamber for sealing an atmosphere so that the wiring board after the soldering process can be cooled in a timely manner. The present invention relates to a soldering device that has been used.

[0002]

2. Description of the Related Art In this type of soldering apparatus, it is necessary that the atmosphere sealing property of a chamber is not impaired.

[0003] When an electronic component or the like is mounted on a wiring board and soldered, it is generally performed in the following series of steps regardless of the flow type or the reflow type.

[0004] That is, a step of applying a flux to the soldering surface of the wiring board, a step of preheating the wiring board, a step of soldering the wiring board, and a step of cooling the wiring board. It should be noted that there is a soldering apparatus that enables all of these steps to be performed as a series of steps, and a soldering apparatus that performs only the flux application step by another apparatus and enables the above-described steps to be performed as a series of steps. .

In the soldering process, flux fume is generated. However, in a soldering apparatus that performs soldering in a chamber for sealing the atmosphere, the flux fume stays in the chamber. Therefore, a soldering apparatus having a device for collecting and removing impurities such as flux fume staying in the atmosphere has become popular.

Incidentally, it is preferable that the wiring board after the soldering step is cooled quickly. That is,
This is because it is desirable to prevent the heat shock to the components and to cool and solidify the solder in the molten state to quickly increase the bonding strength of soldering.

The reason is that no matter how excellent the transporting device (device for transporting the wiring board) is, there are slight shaking and vibration, etc., which are transitioning from a molten state to a solidified state. This is because fine cracks may be generated in the solder, which may lower the solder wettability and lower the bonding strength of soldering. In particular, the effect is remarkable in so-called micro-soldering in which the soldering area and the interval between the soldering wiring portions are minute.

[0008] There are a soldering device for performing the cooling process of the wiring board outside the chamber and a device for performing the process in the chamber.

The technique relating to the "reflow furnace" disclosed in Japanese Utility Model Publication No. 3-15253 is a technique for extracting the atmosphere in the reflow furnace with a pipe and removing flux fume with a filter. In addition, a heater is provided in the pipe, and the temperature of the atmosphere lowered in the pipe is raised to a predetermined temperature, and then the pipe is refluxed into the furnace.

Japanese Patent Application Laid-Open No. 4-134474 discloses a technique relating to an "atmosphere furnace" for removing flux fume by cooling the atmosphere in the atmosphere furnace. The atmosphere after cooling is heated in the heating blower and then returned to the furnace.

[0011] Technical relating to "reflow apparatus" in Japanese Patent Laid-Open 4-262862 discloses the Chissogasu supplied to the reflow device (N ₂₎ is jetted toward the wiring board, also to the cooling of the wiring substrate at the possible It is a technique to be performed.

The technique relating to the "inert gas reflow device" disclosed in Japanese Utility Model Laid-Open No. 5-262 is a technique for cooling a circuit board by providing a heat exchanger in a cooling chamber to cool the atmosphere.

Japanese Patent Application Laid-Open No. 5-305430 discloses a technique relating to a "heating furnace for soldering", which is characterized by the good heat radiation of a black body and the good heat conductivity of copper and aluminum (the resistance to the heat conduction of the material of the member itself). Low, that is, low thermal resistance), lowering the thermal resistance to the surrounding atmosphere by the radiation fins, and increasing the natural cooling power of the outlet passage,
This is a technique for cooling a wiring board through an atmosphere.

In the description, "it was considered to arrange a water-cooling pipe on the outer periphery of the outlet passage to enhance the cooling effect in the outlet passage. , And operation and inspection are troublesome, which poses a practical problem. "

In addition to these techniques, there is a technique in which a cooling air is brought into contact with a wiring board conveyed and unloaded from a chamber by a blowing means such as a fan to cool the wiring board.

[0016]

Problems to be Solved by the Invention
The technique disclosed in Japanese Patent No. 15253 and the technique disclosed in Japanese Patent Application Laid-Open No. 4-134474 have the disadvantage that the cooling atmosphere needs to be reheated, so that the running cost due to heating power and the like increases. That is, the cooling atmosphere is not effectively used.

Further, the technique disclosed in Japanese Patent Application Laid-Open No. 4-262852 has a disadvantage that it can be applied only to an apparatus having a means for supplying liquid nitrogen.

Further, the cooling amount is "Chisso gas" (N ₂ ).
Is basically defined by the supply flow rate, and on the other hand, "also serves as a gas shutter means". Therefore, it is necessary to constantly supply the required flow rate of "nitrogen gas", which is disadvantageous in that the running cost tends to increase.

Next, in the technique disclosed in Japanese Utility Model Laid-Open No. 5-262, the atmosphere cooled by the heat exchanger is heated by the chamber body of the cooling chamber adjacent to the reflow chamber. However, there is a disadvantage that the cooling efficiency tends to be low. That is, a cooling running cost is required only for cooling the wiring board.

The technique disclosed in Japanese Patent Application Laid-Open No. 5-305430 is
There is a disadvantage in that the cooling power is limited due to natural cooling, and the cooling power cannot be adjusted or controlled.

Further, it is described in the technique of the publication that the problem of using the water cooling means cannot be solved. In other words, no technology has been developed to take advantage of water cooling.

Further, when the wiring board after the soldering step is completed in a timely manner, that is, in a case where a series of soldering steps are automatically performed continuously using the wiring board transport means, the cooling amount of the wiring board at an optimum position is determined. The technology for adjusting and controlling the pressure has not been realized. Therefore, the temperature profile in the cooling step cannot be adjusted and controlled.

Further, in the technique in which cooling air is brought into contact with the wiring board conveyed and unloaded from the chamber by a blowing means such as a fan or the like, the cooling air generated by the blowing means can easily enter the chamber from the chamber outlet, and the chamber can be cooled. Has the disadvantage that the atmosphere sealing property is reduced. In addition, there is a problem that a long time is required from the completion of the soldering process to the transfer and unloading from the chamber, and timely cooling cannot be performed.

The present invention solves the above-mentioned problems in the prior art, optimizes the energy consumption of the entire soldering apparatus, enables timely cooling, prevents heat shock to parts and prevents soldering. The attachment strength is increased and the cooling power is excellently adjustable.
An object of the present invention is to realize a soldering apparatus which can adjust and control the cooling of a wiring board and does not impair the atmosphere sealing property of a chamber.

[0025]

SUMMARY OF THE INVENTION The present invention is directed to a configuration in which energy consumption is optimized with a device for collecting and removing flux fume, and cooling power can be easily adjusted. There are features.

According to the present invention , soldering is performed in a chamber.
A soldering device that is used to
Equipped with a collection device that removes by removing the fumes by cooling
Flux fume in the soldering machine
Soldering the suction case to lead it to the collection device
Provided in the process, the flux fume by the collecting device
Cooling step but provided a discharge port housing for returning the atmosphere has been removed within the chamber downstream of the soldering process
In this example, the wiring board is disposed toward the soldering surface of the wiring board.

[0027]

[0028]

Further, in a chamber for sealing the atmosphere,
Soldering equipment that performs soldering while transporting the wiring board
Cooling equipment installed after the soldering process.
The Chang a cooler for cooling the chamber extent of the chamber
It is provided so as to be in contact with the outside of the bar, and its mounting position can be freely changed and detached.

[0030]

[0031]

In a chamber for sealing the atmosphere,
Soldering equipment that performs soldering while transporting the wiring board
The lower chamber and the upper chamber
A tunnel-shaped chamber and the upper chamber.
Multiple lids can be attached and detached in the direction of transport of the wiring board
A passage for passing cooling water through the lid
Is provided.

[0033]

[0034]

According to the present invention, it occurs in the soldering process.
Flux fume is taken from the suction port housing provided in the process.
Since the atmosphere from which the flux fume is removed after being sucked and cooled is used as it is for cooling the wiring board in the cooling step, there is no need to perform unnecessary heat exchange, and the efficiency of the entire soldering apparatus is increased. Also, since the position of the discharge port housing can be arranged at a position optimal for cooling the wiring board,
Timely cooling of the wiring board can be performed. The air outside the chamber does not flow into the chamber with the cooling.

[0035]

[0036]

Further, since the atmosphere in the chamber is cooled by cooling the chamber itself, thereby indirectly cooling the wiring board, the atmosphere outside the chamber does not flow into the chamber, and the atmosphere is sealed. Does not impair the performance.

Further, since the cooling position of the chamber can be arbitrarily selected, cooling can be performed at a position most suitable for cooling the wiring board, and the cooling temperature can be easily adjusted and controlled. It can be taken out for maintenance, and inspection and cleaning are easy.

[0039]

[0040]

In addition, a simple chamber structure enables chamber cooling. Further, by selecting the position of the lid, the position of cooling the wiring board can be arbitrarily selected. Furthermore, a soldering machine with excellent cooling properties is obtained,
The atmosphere sealing property is good, and the cooling capacity and cooling characteristics can be adjusted and selected freely at low cost.

[0042]

Next, an embodiment of the soldering apparatus according to the present invention will be described. In this embodiment, the case of the flow type soldering apparatus is mainly described, but the case of the reflow type soldering apparatus can be similarly implemented.

FIG. 1 is a schematic side sectional view of a flow type showing a first embodiment of the present invention. In this figure, reference numeral 1 denotes a wiring board, which is transported by a transport conveyor 2 in the direction of arrow A.
Reference numeral 3 denotes a chamber, which includes an upper chamber 3A and a lower chamber 3B.
It consists of. 4 is a preheater, 5 is a solder tank, 6 is a solder melt, 7 is a jet tank, 8 is a jet liquid, and 9 and 1
Reference numeral 0 denotes an entrance and an exit for loading and unloading the wiring board 1 formed in the chamber 3.

Further, in the tunnel-shaped chamber 3, above the position where the wiring substrate 1 and the solder melt 6 come into contact with each other.
That is, above the soldering process, a suction port housing 11 in which an opening for sucking the atmosphere is widened radially is provided, and the sucked atmosphere is connected to a collection device 13 for collecting foreign substances such as flux fume. Leading through 12 ,
After cooling in the cooling unit 14 of the collection device 13, the filter unit 1
5 and the cooling step after the soldering step is completed, that is, the flow is returned into the chamber 3 from the discharge port case 18 provided in front of the wiring board 1 in the transport direction (the direction of arrow A). It is configured to be.

Further, the fan 17 provided at the next stage of the filter unit 15 is a pump mechanism for circulating the atmosphere. Further, the opening of the discharge port housing 18 has a shape that spreads radially, and the opening is arranged to face the soldering surface of the wiring board 1. Then, the cooling unit 14 of the collection device 13
Is water-cooled, and is provided with a flow control valve 16 for controlling the supply flow rate of cooling water. Reference numeral 19 denotes an inert gas supply port for supplying an inert gas such as N ₂ into the chamber 3.

Meanwhile, distributing a discharge port housing 18 in the cooling step
The chamber 3 is located further forward in the direction of arrow A than the
A cooler 21 for cooling the cooling water is provided in contact with the cooler 21, and the cooler 21 is also configured to have a water cooling structure and a flow control valve 22 for adjusting a supply flow rate of cooling water.

The cooling device 21 can be freely attached to and detached from the chamber 3 by the locking member 23.

FIG. 2 shows a second embodiment of the present invention and is a schematic side sectional view showing an embodiment in the case of a reflow soldering apparatus. 2, the same reference numerals as those in FIG. 1 denote the same parts, 31 denotes a labyrinth part on the inlet 9 side, 32
Is a first preheating section, 33 is a second preheating section, 34 is a reflow section, 35 is a cooling section, 36 is a labyrinth section on the exit 10 side, 37 is a heater, and 38 is each labyrinth section 3
This is a deterrent plate provided on the first and second members.

[0049] That is, the inlet housing 11 is provided above the reflow section 34 is a soldering process, flux fumes or the like condensing capturing cooled in collecting device 13, the discharge port housing provided in the cooling unit 35 is a cooling step It is configured to recirculate from 18 into the chamber 3. Note that the discharge port housing 18 is disposed toward the upper surface and the lower surface of the wiring board 1.

On the other hand, the cooler 21 for cooling the chamber 3 and the suppression plate 38 is brought into contact with the next stage of the cooling unit 35, that is, the labyrinth unit 36 for the purpose of sealing the atmosphere in front of the arrow A direction. Provided, and the chamber section 36 is also cooled.
It is configured so that it can also be used as a process. Further, the cooler 21 is also provided with a flow control valve 22 for adjusting the supply flow rate of cooling water as a water-cooled configuration.

Also, in the case of FIG.
3 allows the attachment position to be changed and the attachment / detachment to and from the chamber 3 to be freely performed.

FIGS. 3, 4 (a) and 4 (b) show the collecting device 1.
3 is a diagram illustrating an example of a water-cooled cooler provided in the cooling unit 14 of FIG. 3, FIG. 3 is a perspective view, FIG. 4A is a cross-sectional view taken along a line II in FIG. 3, and FIG. 3 is a plan view of FIG.

That is, the cooling unit 41 is arranged side by side with the housing 42 to form the cooling section 14. Each cooling unit 41 is provided with a cooling pipe 44 for passing cooling water to the cooling plate 43 in close contact therewith. A joint 45 is provided as a connecting means for passing water through the cooling pipe 44 of each cooling unit 41. Is provided. In addition, each cooling unit 41 is air-tightly attached and fixed to the housing 42 by the mounting screw 46. Reference numeral 47 denotes an atmosphere suction port, and reference numeral 48 denotes an opening.

In FIG. 3, two types of cooling units 41 are alternately arranged and combined to form a zigzag atmosphere passage. That is, in FIGS. 3 and 4A, the cooling unit 41 on the suction port 47 side is
3 is a length that does not abut the bottom surface of the housing 42, and the cooling unit 41 of the next stage has a length in which the cooling plate 43 abuts the bottom surface of the housing, but has an opening 48 formed in the upper part. .

By configuring the cooling unit 41 in this manner, a zigzag atmosphere passage as shown in FIG. 4A can be formed as a whole.

In FIG. 4B, the joints 45 of the cooling units 41 shown in FIG.
A configuration in which cooling water is sequentially passed in a column is described.

As described above, it is possible to easily increase or decrease the cooling unit 41 by attaching and detaching the cooling unit 41 and connecting and detaching the connecting pipe 49. It should be noted that an air-cooling type, a gas-cooling type, cooling by a heat pump, a heat exchanger, and the like can be used as other coolers other than liquid cooling.

[0058] FIG. 5 (a), (b) is a diagram for explaining an example of a cooler chamber 3, FIG. 5 (a) post-process portion from the solder bath 5, that corresponds to the forward portion of the arrow A cooling
Perspective view of a chamber 3 part of the process, FIG. 5 (b) is a perspective view of the lid of the upper chamber 3A.

The chamber 3 shown in FIG.
This is an example in which an upper chamber 3A, that is, a plurality of lids 51 are juxtaposed on B to form a tunnel-shaped chamber 3.

The cover 51 is provided with a glass window 52 so that a wiring board (not shown) in the chamber 3 can be monitored while being carried through each process. Also,
A locking piece 53 is provided on the lid 51, and the locking piece 53 is fixed by applying tension to the fixing piece 54 provided in the lower chamber 3B. In this configuration, the lid 51 is Airtightly fixed to 3B. In this example, a configuration example in which the lids 51 are arranged side by side is shown.

Further, a passage 55 for passing cooling water is provided in the peripheral portion of the lid 51, and the cooling water is supplied and passed through a joint 56.

Therefore, the cover 51 through which the cooling water can pass is provided.
Are arranged side by side, it is possible to cool the chamber 3 and the atmosphere in the chamber 3 according to the juxtaposed positions and sections. In this case, a configuration may be adopted in which the joints 56 of the lids 51 are connected in cascade as in the example of FIG. Further, it is not necessary to pass cooling water through the lid 51 which does not require cooling. In this case, the lid 51 having no cooling passage may be used.

FIGS. 6A and 6B show another example of a chamber cooler in a cooling step and the like . FIG.
Side sectional view showing an example in which a cooler 61 is provided in the chamber 3 of FIG.
FIG. 6B is a perspective view seen from below explaining an example of a lid provided with a labyrinth depressing plate 38 in the chamber structure in which the lid 51 of FIG. 5 is juxtaposed.

1 and 5 indicate the same parts.

That is, the labyrinth portion 36 is
Although it is common practice to provide a deterrent plate 38 for forming, for equipment in contact cooler 61 formed by passed through the cooling water to the portion of the chamber 3. Thus, to forming an action of suppressing plate 38 to form a labyrinth portion 36 corresponds to a large heat absorption plate surface area, cooling engineering the labyrinth portion 36
Can also be used as a process.

In FIG. 6A, reference numeral 62 denotes a locking piece which locks the tension spring 63 and stretches the tension spring 63 so that the cooler 6
1 is brought into contact with the chamber 3 and detachably attached.

As shown in FIG. 6B, when the chamber 3 of the labyrinth part 36 is composed of the lower chamber 3B shown in FIG. 5A and the upper chamber 3A forming the lid 51. 5, the depressing plate 38 is provided as in FIG. 5, and the lid 51 and the depressing plate 38 can be cooled together by passing cooling water from the joint 56 to the periphery of the lid 51.

Next, the operation of the first and second embodiments will be described.

In FIGS. 1 and 2, the wiring board 1 after the soldering process is conveyed in the direction of arrow A by the conveyor 2, and is sent out from the discharge port case 18 when it reaches the position of the discharge port case 18 in the cooling step. The soldered surface of the wiring board 1 is cooled by the cooled atmosphere. Next, the wiring board 1
Is transported to the position of the cooler 21 in the chamber 3, the wiring board 1 is cooled by the cooled chamber 3 and the cooled atmosphere in the vicinity thereof.

When the labyrinth portion 36 is formed in the chamber 3 for cooling, the labyrinth portion 36 is formed.
Is also effective as a heat-absorbing plate having a large surface area, and the atmosphere cooling performance in this region is significantly improved. That is, the cooling property of the wiring board 1 is excellent.

[0071] Incidentally, the ambient temperature fed from the discharge port housing 18, through water to the cooling part 14 of the trap 13 can be varied, adjusted by adjusting a flow rate control valve 16, the optimum cooling temperature Ru can be selected. It goes without saying that the temperature of the cooling water is also defined. Also, the temperature of the chamber 3 cooled by the cooler 21 can be varied and adjusted by adjusting the flow rate of the water with the flow control valve 22 in the same manner.

On the other hand, the cooling unit 14 of the collection device 13
Since the cooling units 41 are arranged side by side as shown in (1), the maximum heat exchange amount can be arbitrarily selected by adjusting the number of cooling units 41. Therefore, it required
It is possible at the optimum design of heat exchange amount are determined namely to match the design value of the amount of heat exchange to select the number of cooling units 41, reducing the size of the structure and design cost and manufacturing cost
Becomes possible.

The cooler 21 of the chamber 3 can be fixed by a locking piece 53 and a fixture 54 as shown in FIG. 5, and in another example, the upper chamber 3A constituting the chamber 3 , that is, in the configuration which allows cooling water to pass therethrough lid 51, it is possible to arbitrarily select the cooling position, put in the conveying direction of the wiring substrate 1 by juxtaposed
The cooling length can be arbitrarily selected stepwise . At the same time, the maximum heat exchange amount can be arbitrarily selected, and maintenance by attachment and detachment is easy, so that the usability such as inspection and cleaning is excellent.

FIG. 7 shows a high-temperature solder (with a soldering temperature of about 3).
5 is a time chart of measuring a temperature change on a soldering surface of the wiring board 1 when the present embodiment is applied to a soldering apparatus using (50 degrees).

The preheating temperature of the wiring board 1 is about 170 to
It reaches 180 degrees and reaches about 350 degrees during soldering. Thereafter, the temperature rapidly decreased in the cooling step.

Here, part A shows a temperature decrease due to the atmosphere sent out from the discharge port housing 18, and part (B) shows a temperature decrease due to the cooling of the chamber 3. That is, it is possible to cool the wiring board 1 at a short time after the completion of the soldering process, and the cooling rapidly increases the bonding strength of the solder.

The cooling water used for this measurement is about 10 l / min in total with the cooling unit 35 of the collection device 13 and the cooler of the chamber body, and the water temperature is normal temperature.

[0078]

As described above, according to the present invention, soldering
Sucks flux fume generated in the evacuation process with the suction case
A cooling unit provided at a later stage of the soldering process is provided with a discharge port housing for returning the atmosphere from which the flux fume has been removed to the chamber by cooling and removing the flux fumes.
Is arranged toward the soldering surface of the wiring board, so the atmosphere from which the flux fume has been removed by cooling can be used for cooling the wiring board as it is
And flux fume generated in the soldering process
Is efficiently removed by cooling, and
The cooled atmosphere is distributed in the cooling process.
Since it is used for cooling the wire substrate, there is no need to perform unnecessary heat exchange, and the efficiency of the entire soldering apparatus is increased.

Further, since the position of the discharge port housing is arranged at an optimum position for cooling the wiring board, the wiring board can be cooled in a timely manner. The air outside the chamber does not flow into the chamber with the cooling.

[0080]

[0081]

Further, it is provided after the soldering process.
A cooler for cooling the chamber is provided in the cooling process chamber.
Since it is provided in contact with the outside of the chamber and its mounting position can be freely changed and detached, the atmosphere in the chamber is cooled by cooling the chamber itself, thereby indirectly cooling the wiring board. Therefore, the atmosphere outside the chamber does not flow into the chamber, and the atmosphere sealing property is not impaired. The cooler is installed by contact
Because only by may be detachable and changing the mounting position is arbitrarily selected freely in the chamber cooling position, it is possible to perform the cooling at the optimum position on the wiring substrate cooling, easy regulation and control of the cooling temperature , and the addition, remove the condenser can also perform maintenance, it is easy inspection and cleaning.

[0083]

[0084]

Since the upper part of the chamber is formed by a lid composed of a cooler through which cooling water flows, the chamber can be cooled with a simple chamber structure. Further, by selecting the position of the lid, the position of cooling the wiring board can be arbitrarily selected.

[0086]

As described above, according to the present invention, the energy consumption of the entire soldering apparatus can be optimized, timely cooling and optimal adjustment can be performed, and the cooling power and its adjustability are excellent. In addition, the cooling temperature of the wiring board can be easily adjusted and controlled, and a soldering environment that does not impair the sealing property of the chamber atmosphere can be realized. Further, there are various advantages such as easy and simple maintenance, reliability of solderability can be enhanced, and an excellent operating environment with low running cost can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic side sectional view showing a first embodiment of the present invention.

FIG. 2 is a schematic side sectional view showing a second embodiment of the present invention.

FIG. 3 is a perspective view showing an example of a water-cooled cooler.

FIG. 4 is a cross-sectional view and a plan view taken along line II of FIG. 3;

FIG. 5 is a perspective view showing a cooler of the chamber.

FIG. 6 is a side sectional view and a perspective view showing another example of the cooler of the chamber.

FIG. 7 is a time chart for measuring a temperature change on a soldering surface of a wiring board by the soldering apparatus of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 2 Conveyor 3 Chamber 3A Upper chamber 3B Lower chamber 11 Suction port case 13 Collection device 14 Cooling unit 16 Flow rate control valve 18 Discharge port case 21 Cooler 22 Flow rate control valve 31 Labyrinth part 36 Labyrinth part 38 Suppression plate 41 Cooling unit 51 Lid 52 Glass window 53 Locking piece 54 Fixture 61 Cooler 62 Locking piece

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-305430 (JP, A) JP-A 5-70757 (JP, U) JP-A 5-93079 (JP, U) JP-A 5-93079 172456 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/34 B23K 1/008 B23K 1/08 B23K 31/02

Claims (3)

(57) [Claims] 1. Soldering for soldering in a chamber
In soldering apparatus provided with a collecting device for removing flux fumes generated within the chamber to a rack arrangement by cooling, it was guided to the collecting device sucking flux fumes
The inlet housing of order provided in the soldering process, the said discharge opening housing for recirculating <br/> atmosphere flux fumes are removed in the chamber by the collecting device with I <br/> step A soldering device, wherein the soldering device is disposed toward a soldering surface of the wiring board in a cooling process provided in a subsequent stage . 2. Wiring in a chamber for sealing an atmosphere
For soldering equipment that performs soldering while transporting substrates
In the cooling process chamber that is provided after the soldering process.
A cooler for cooling the chamber is connected to the outside of the chamber.
It is provided by touching, and its mounting position can be changed and detached.
Soldering equipment characterized by being freely provided 3. A wiring in a chamber for sealing an atmosphere.
For soldering equipment that performs soldering while transporting substrates
The lower chamber and the upper chamber
And a wiring board as the upper chamber.
Multiple lids are removably juxtaposed along the transport direction
In addition, the lid is provided with a passage for passing cooling water.
And a soldering apparatus characterized by the following: