CN216607549U - Circuit board reflow soldering device - Google Patents
Circuit board reflow soldering device Download PDFInfo
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- CN216607549U CN216607549U CN202122973566.0U CN202122973566U CN216607549U CN 216607549 U CN216607549 U CN 216607549U CN 202122973566 U CN202122973566 U CN 202122973566U CN 216607549 U CN216607549 U CN 216607549U
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- circuit board
- reflow soldering
- furnace body
- plate
- cooling
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Abstract
The utility model discloses a circuit board reflow soldering device which comprises a conveying mechanism, a soldering chamber furnace body, a heating module, a fan, a material plate and a cooling assembly, wherein the conveying mechanism penetrates through the soldering chamber furnace body, the material plate is arranged on a conveying surface of the conveying mechanism and used for bearing a circuit board to be reflowed, the cooling assembly is arranged at the bottom of the material plate, a plurality of fans are arranged above the conveying mechanism at intervals, an air inlet is formed in the top end of the soldering chamber furnace body corresponding to the fans, and the heating module is arranged between the fans and the air inlet. The soldering paste can be efficiently heated and melted on the welding disc of the circuit board, and the circuit board can be prevented from being too high in temperature.
Description
Technical Field
The utility model belongs to the field of SMT (surface mount technology) mounting of circuit boards, and particularly relates to a circuit board reflow soldering device.
Background
The reflow soldering device is internally provided with a heating circuit which heats air or nitrogen to a high enough temperature and blows the heated air or nitrogen to a circuit board on which the element is stuck, so that solder on two sides of the element is melted and then is bonded with the mainboard. The process has the advantages of easy temperature control, no oxidation during welding and easy control of the manufacturing cost.
Disclosure of Invention
The purpose of the utility model is as follows: in order to overcome the defects in the prior art, the utility model provides the circuit board reflow soldering device which can efficiently heat and melt soldering paste on a bonding pad of a circuit board and can prevent the circuit board from being over-high in temperature.
The technical scheme is as follows: in order to achieve the purpose, the technical scheme of the utility model is as follows:
the utility model provides a circuit board reflow soldering device, includes transport mechanism, welds room furnace body, heating module, supplies fan, material board and cooling subassembly, transport mechanism wears to establish through welding the room furnace body, be provided with the material board on transport mechanism's the conveying face, the material board is used for bearing the circuit board of treating reflow soldering, just the bottom of material board is provided with the cooling subassembly, transport mechanism's top interval is provided with a plurality of confession fans, the air intake has been seted up corresponding to the confession fan on the top of welding the room furnace body, the heating module sets up between confession fan and the air intake.
Furthermore, a mixed flow partition plate is arranged in the inner cavity of the welding chamber furnace body and above the conveying mechanism at an interval, a plurality of backflow holes are formed in the mixed flow partition plate in a penetrating mode, the fan is arranged on the mixed flow partition plate, and the air inlet end and the air outlet end of the fan are respectively located on two sides of the mixed flow partition plate.
Furthermore, the air inlet is provided with an air filter element.
Further, transport mechanism contains two sets of slewing belt who sets up at conveying width direction upper parallel interval, the material grillage is established two sets of on the slewing belt, the cooling subassembly sets up between two sets of slewing belt, just the cooling subassembly is adjusted with material board interval in vertical direction and is set up.
Furthermore, the cooling assembly comprises a lifting adjusting mechanism and a cooling plate arranged on the lifting adjusting mechanism, and the cooling plate is in contact with or spaced from the bottom surface of the material plate.
Furthermore, the cooling plate is a water cooling plate.
Furthermore, a fastening mechanism is arranged on the inner wall of the rotary conveyor belt or the welding chamber furnace body corresponding to the material plate, and the material plate is relatively fixed on the rotary conveyor belt through the fastening mechanism.
Furthermore, the rotary conveying belt is of a chain plate type conveying structure, the fastening mechanism comprises a locking screw and a pressing plate movably sleeved on the locking screw, and the locking screw is detachably arranged on a chain plate of the rotary conveying belt.
Has the advantages that: according to the utility model, the air in the welding chamber furnace body is heated by the heating module and the air supply fan, and the hot air acts on the welding plate of the circuit board, so that the soldering paste is melted, when the temperature in the welding chamber furnace body is overhigh, the circuit board area can be cooled by the cooling assembly, the overhigh temperature of the circuit board is prevented, and the damage to other electronic elements is prevented.
Drawings
FIG. 1 is a schematic half-section view of the overall structure of the present invention;
FIG. 2 is a semi-sectional view of the present invention in FIG. 1.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, a circuit board reflow soldering device, including transport mechanism 1, welding chamber furnace body 2, heating module 3, air feed fan 4, material board 5 and cooling assembly 6, transport mechanism 1 wears to establish through welding chamber furnace body 2, be provided with material board 5 on transport mechanism 1's the conveying face, material board 5 is used for bearing and fixes the circuit board of treating reflow soldering, just the bottom of material board 5 is provided with cooling assembly 6, transport mechanism 1's top interval is provided with a plurality of air feed fans 4, welding chamber furnace body 2's top has seted up air intake 7 corresponding to air feed fan 4, heating module 3 sets up supply between fan 4 and the air intake 7. Heat the inside air of welding chamber furnace body 2 through heating module 3 and air feed fan 4, and make hot-blast pad that acts on the circuit board to melt the soldering paste, when the high temperature in welding chamber furnace body 2, can also cool down the circuit board region through cooling assembly 6, prevent the circuit board high temperature, prevent the damage to other electronic component.
The utility model discloses a welding chamber furnace body 2, including welding chamber furnace body 2, conveying mechanism 1, mixed flow baffle 20, it has seted up a plurality of backward flow holes 21 to link up on the mixed flow baffle 20, supply fan 4 to set up on mixed flow baffle 20, the air inlet end and the air-out end that supply fan 4 are located mixed flow baffle 20's both sides respectively, when heating welding chamber furnace body 2 inside, except the gas that the air intake got into, the air that is located mixed flow baffle 20 below can flow to mixed flow baffle's top through backward flow hole 21, heats back rethread supply fan 4 backward flow to mixed flow baffle's 20 below through the heating module, forms the hot air current of circulation backward flow, can guarantee the inside heat homogeneity of welding chamber furnace body.
The air inlet 7 is provided with an air filter element 22 which is used for filtering air to ensure that no impurities exist in the air entering the welding chamber furnace body on one hand, and on the other hand, as the welding chamber furnace body is of a non-closed structure, partial heat-containing air flow overflows, the air inlet amount of the air inlet can be reduced in the air flow circulation process in the welding chamber furnace body, and the air flow circulation in the welding chamber furnace body is ensured to be mainly used.
The two ends of the welding chamber furnace body 2 corresponding to the conveying mechanism 1 are respectively provided with a heat insulation baffle plate 23 for sealing the opening and reducing the opening area.
Transport mechanism 1 contains two sets of slewing belt 8 that the parallel interval set up in conveying width direction, material board 5 erects two sets of slewing belt 8 is last, cooling subassembly 6 sets up between two sets of slewing belt 8, just cooling subassembly 6 is adjusted with 5 intervals of material board in the vertical direction and is set up. The cooling assembly 6 comprises a lifting adjusting mechanism 9 and a cooling plate 11 arranged on the lifting adjusting mechanism 9, and the cooling plate 11 is in contact with or spaced from the bottom surface of the material plate 5. The lift adjustment mechanism 9 is screw mechanism or cylinder, the cooling board 11 is the water-cooling board, contains cold water inlet and cold water export, through the cooling of water-cooling board, avoids welding 2 inside high temperatures of room furnace body, and when the circuit board high temperature, the lower bottom surface of material board 5 is laminated to cooling board 11, and material board 5 is heat-conducting medium, through the indirect contact of cooling board 11 with the circuit board, can take away the heat on the circuit board by the efficient, cools down the circuit board.
The inner wall of the rotary conveyor belt 8 or the welding chamber furnace body 2 is provided with a fastening mechanism 12 corresponding to the material plate 5, and the material plate 5 is relatively fixed on the rotary conveyor belt 8 through the fastening mechanism 12. Through fastening device 12 for it is fixed with material board 5, can stably laminate when making the cooling plate shift up and contact in material board.
In this embodiment, fastening device 12 sets up at the carousel fan, carousel 8 is the link plate formula conveying structure, fastening device 12 includes that locking screw 13 and movable sleeve establish the clamp plate 14 on locking screw 13, locking screw 13 dismantles to set up on carousel's link plate, through the threaded connection of screw rod, and the operation is very simple and convenient.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the utility model and these are intended to be within the scope of the utility model.
Claims (8)
1. A circuit board reflow soldering device is characterized in that: including transport mechanism (1), weld room furnace body (2), heating module (3), supply fan (4), material board (5) and cooling assembly (6), transport mechanism (1) wears to establish through welding room furnace body (2), be provided with material board (5) on the conveying face of transport mechanism (1), material board (5) are used for bearing the circuit board of treating reflow soldering, just the bottom of material board (5) is provided with cooling assembly (6), the top interval of transport mechanism (1) is provided with a plurality of confession fans (4), air intake (7) have been seted up corresponding to confession fan (4) on the top of welding room furnace body (2), heating module (3) set up supply between fan (4) and air intake (7).
2. A circuit board reflow soldering apparatus in accordance with claim 1, wherein: the welding chamber furnace body (2) is characterized in that mixed flow partition plates (20) are arranged in the inner cavity of the welding chamber furnace body (2) at intervals above the conveying mechanism (1), a plurality of backflow holes (21) are formed in the mixed flow partition plates (20) in a penetrating mode, the fan (4) is arranged on the mixed flow partition plates (20), and the air inlet end and the air outlet end of the fan (4) are respectively located on two sides of the mixed flow partition plates (20).
3. A circuit board reflow soldering apparatus in accordance with claim 2, wherein: the air inlet (7) is provided with an air filter element (22).
4. A circuit board reflow soldering apparatus in accordance with claim 1, wherein: transport mechanism (1) contains two sets of slewing belt (8) that the parallel interval set up in conveying width direction, material board (5) erect two sets of slewing belt (8) are gone up, cooling subassembly (6) set up between two sets of slewing belt (8), just cooling subassembly (6) are adjusted with material board (5) interval in vertical direction and are set up.
5. A circuit board reflow soldering apparatus in accordance with claim 4, wherein: the cooling assembly (6) comprises a lifting adjusting mechanism (9) and a cooling plate (11) arranged on the lifting adjusting mechanism (9), and the cooling plate (11) is in contact with or spaced from the bottom surface of the material plate (5).
6. A circuit board reflow soldering apparatus in accordance with claim 5, wherein: the cooling plate (11) is a water cooling plate.
7. A circuit board reflow soldering apparatus in accordance with claim 4, wherein: and a fastening mechanism (12) is arranged on the inner wall of the rotary conveyor belt (8) or the welding chamber furnace body (2) corresponding to the material plate (5), and the material plate (5) is relatively fixed on the rotary conveyor belt (8) through the fastening mechanism (12).
8. A circuit board reflow soldering apparatus in accordance with claim 7, wherein: the rotary conveying belt (8) is of a chain plate type conveying structure, the fastening mechanism (12) comprises a locking screw (13) and a pressing plate (14) which is movably sleeved on the locking screw (13), and the locking screw (13) is detachably arranged on a chain plate of the rotary conveying belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122973566.0U CN216607549U (en) | 2021-11-30 | 2021-11-30 | Circuit board reflow soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122973566.0U CN216607549U (en) | 2021-11-30 | 2021-11-30 | Circuit board reflow soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216607549U true CN216607549U (en) | 2022-05-27 |
Family
ID=81698751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122973566.0U Active CN216607549U (en) | 2021-11-30 | 2021-11-30 | Circuit board reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216607549U (en) |
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2021
- 2021-11-30 CN CN202122973566.0U patent/CN216607549U/en active Active
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