CN107995798A - A kind of reflow soldering and its reflow soldering process for electronic circuit board - Google Patents
A kind of reflow soldering and its reflow soldering process for electronic circuit board Download PDFInfo
- Publication number
- CN107995798A CN107995798A CN201711164365.8A CN201711164365A CN107995798A CN 107995798 A CN107995798 A CN 107995798A CN 201711164365 A CN201711164365 A CN 201711164365A CN 107995798 A CN107995798 A CN 107995798A
- Authority
- CN
- China
- Prior art keywords
- reflow soldering
- flue gas
- electronic circuit
- circuit board
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention discloses a kind of reflow soldering and its reflow soldering process for electronic circuit board, comprises the following steps that：Step 1：Determine the insert hole on plug-in element and corresponding pcb board；Step 2：Plug-in unit hole site and coplanar SMD components pad are together printed into tin；Step 3：Coplanar SMD components patch, and the pin of corresponding plug-in components is inserted into insert hole；Step 4：The plug-in components in the face and SMD components together are crossed reflow ovens with pcb board to be welded；Step 5：Check the solder joint of plug-in components and SMD components.The present invention substitutes traditional wave-soldering to weld pcb board using Reflow Soldering, efficiently solve during wave-soldering because need to add scaling powder and generation environment pollute the problem of, while Reflow Soldering can improve the precision of welding.
Description
Technical field
The invention belongs to the technical field of the welding procedure of electronic component, relates particularly to a kind of returning for electronic circuit board
Fluid welding stove and its reflow soldering process.
Background technology
Component, is the general name of element and device.Existing plug-in components are welded usually using the mode of wave-soldering
Connect, to realize good Wave crest Welding effect, have to the protrutions of plug-in components and compare strict requirements.Wave-soldering is
Refer to the solder of fusing（Terne metal）, through electrodynamic pump or electromagnetic pump jet flow into the solder wave of design requirement, can also lead to
Cross to solder pot and inject nitrogen to be formed, the printed board for making to be pre-loaded with component realizes component welding end by solder wave
Or room machine and the solder of electrical connection of the pin with printed board pad, wave-soldering will first spray scaling powder, then by preheating, weldering
Connect, cooling zone.
Wave-soldering has as a drawback that：（1）, it is necessary to add scaling powder during welding, and exist in scaling powder easy
The material of volatilization, such as alcohol；（2）Scruff is produced during welding, the precision of product is unable to reach requirement, can be to environment
Pollution is produced, can not meet the needs of people are to High Quality Environment.
The present invention welds pcb board using Reflow Soldering, but needs to carry out at heating pcb board in reflow process
Reason, then again cools down pcb board, and traditional Reflow Soldering cooling system is typically that use is air-cooled, and air-cooled efficiency is low, noise
It is very big.
The content of the invention
The present invention is technical problem present in the above-mentioned background technology of solution, there is provided a kind of Reflow Soldering of electronic circuit board
Stove and its reflow soldering process.
To achieve the above object, the present invention uses following technical scheme：A kind of reflow soldering for electronic circuit board and
Its reflow soldering process, including furnace body, arch flue gas leading, trapezoidal waste gas collection box, exhaust fan and exhaust processor, the arch
The both ends of flue gas leading connect respectively to be arranged on the rear and front end of the furnace body, and the bottom of the trapezoidal waste gas collection box is arranged on
It is connected on the stage casing of the furnace body and with the inside of the furnace body, the top of the trapezoidal waste gas collection box is with being placed in the arch
The lower section of shape flue gas leading is simultaneously connected with the arch flue gas leading, and the side that the exhaust fan is arranged on the arch flue gas leading leads to
Cross arch flue gas leading described in Guan Zuyu to be connected, the exhaust processor is arranged on the outlet air end of the exhaust fan；Its feature
It is, the reflow soldering further includes cooling-cycle apparatus, and the cooling-cycle apparatus includes refrigerator pipes, air exhauster, the system
Clarifier is additionally provided with inside cold pipe, one end of the refrigerator pipes is connected with the port of export of the furnace body by the first snorkel；Institute
The other end for stating refrigerator pipes is connected by double-skin duct with the air exhauster；The air exhauster is also connected with cooler；It is described double
Layer pipeline is connected with radiator, and the radiator is connected with air blower；The air blower is also connected with the arrival end of furnace body；It is described
Double layer pipeline is connected by inner tube and the outer tube for being enclosed in inner tube periphery, said inner tube with air exhauster, the outer tube and cooler
Communicate；
The reflow soldering process comprises the following steps, and comprises the following steps that：
Step 1：Determine the insert hole on plug-in element and corresponding pcb board；
Step 2：Plug-in unit hole site and coplanar SMD components pad are together printed into tin；
Step 3：Coplanar SMD components patch, and the pin of corresponding plug-in components is inserted into insert hole；
Step 4：The plug-in components in the face and SMD components together are crossed reflow ovens with pcb board to be welded, welding temperature
For 240 DEG C -280 DEG C, weld interval 20s-30s；
Step 5：Check the solder joint of plug-in components and SMD components.
Further, the pcb board is PPA materials.
Further, the gap between step 3 insert hole is 2-2.5 millimeters.
Further, the welding temperature in step 4 is 250 DEG C, weld interval 24s；
Further, the pin in the step 3 exposes 0.5-2 centimetres of pcb board face.
Further, the trapezoidal waste gas collection box is placed in the lower section in the stage casing of the arch flue gas leading, and the arch is given up
The height of tracheae is more than the height of the trapezoidal waste gas collection box, and the length of the arch flue gas leading is more than the trapezoidal exhaust gas and receives
The length of header.
Further, the factory bottom surface of the trapezoidal waste gas collection box is connected with the upper wall of the furnace body, described trapezoidal useless
The top surface of gas collecting box is connected with the stage casing of the arch flue gas leading.
Further, the length of the arch flue gas leading is less than the length of the furnace body.
Further, the pin in the step 3 exposes 1.5 centimetres of pcb board face.
Beneficial effects of the present invention：The present invention substitutes traditional wave-soldering to weld pcb board using Reflow Soldering, effectively
Ground is solved the problems, such as because that need to add scaling powder and generation environment pollutes during wave-soldering, while Reflow Soldering can improve welding
Precision；Pcb board is made of PPA materials, can high temperature resistant and intensity it is big.
Brief description of the drawings
Fig. 1 is the structure chart of electronic circuit board made of Reflow Soldering in the embodiment of the present invention；
Fig. 2 is the left view of electronic circuit board made of Reflow Soldering in the embodiment of the present invention.
Fig. 1's to Fig. 2 is respectively labeled as：1 bearing, 2 inserted sheets, 3 pins, 4 electronic circuit boards, 5 stents.
Embodiment
Explanation and specific embodiment are further described the present invention below in conjunction with the accompanying drawings.
Embodiment 1
A kind of reflow soldering and its reflow soldering process for electronic circuit board, including furnace body, arch flue gas leading, trapezoidal exhaust gas are received
Header, exhaust fan and exhaust processor, the both ends of the arch flue gas leading connect respectively is arranged on front and rear the two of the furnace body
On end, the bottom of the trapezoidal waste gas collection box is arranged on the stage casing of the furnace body and is connected with the inside of the furnace body,
The top of the trapezoidal waste gas collection box is with being placed in the lower section of the arch flue gas leading and being connected with the arch flue gas leading, institute
State exhaust fan and be arranged on the side of the arch flue gas leading and be connected by arch flue gas leading described in Guan Zuyu, the exhaust-gas treatment
Device is arranged on the outlet air end of the exhaust fan；It is characterized in that, the reflow soldering further includes cooling-cycle apparatus, it is described cold
But recycle unit includes refrigerator pipes, air exhauster, is additionally provided with clarifier inside the refrigerator pipes, one end of the refrigerator pipes with it is described
The port of export of furnace body is connected by the first snorkel；The other end of the refrigerator pipes is connected by double-skin duct and the air exhauster
Connect；The air exhauster is also connected with cooler；The double-skin duct is connected with radiator, and the radiator is connected with air blower；
The air blower is also connected with the arrival end of furnace body；The Double layer pipeline is described by inner tube and the outer tube for being enclosed in inner tube periphery
Inner tube is connected with air exhauster, and the outer tube is communicated with cooler；
The reflow soldering process comprises the following steps, and comprises the following steps that：
Step 1：Determine the insert hole on plug-in element and corresponding pcb board；
Step 2：Plug-in unit hole site and coplanar SMD components pad are together printed into tin
Step 3：Coplanar SMD components patch, and the pin of corresponding plug-in components is inserted into insert hole；
Step 4：The plug-in components in the face and SMD components together are crossed reflow ovens with pcb board to be welded；Welding temperature
For 250 DEG C, weld interval 24s；
Step 5：Check the solder joint of plug-in components and SMD components.
The pcb board is PPA materials, instead of original nylon made of pcb board, reach high temperature resistant and the big skill of intensity
Art effect.
The trapezoidal waste gas collection box is placed in the lower section in the stage casing of the arch flue gas leading, the height of the arch flue gas leading
More than the height of the trapezoidal waste gas collection box, the length of the arch flue gas leading is more than the length of the trapezoidal waste gas collection box
Degree.
The factory bottom surface of the trapezoidal waste gas collection box is connected with the upper wall of the furnace body, the trapezoidal waste gas collection box
Top surface is connected with the stage casing of the arch flue gas leading.
The length of the arch flue gas leading is less than the length of the furnace body.
Electronic circuit board as depicted in figs. 1 and 2 is produced according to above-mentioned steps, the electronic circuit board includes bearing 1,
The electronic circuit board 4 is installed on bearing 1, and inserted sheet 2, pin 3 are respectively equipped with the electronic circuit board 4；The inserted sheet 2 is pacified
It is inserted in insert hole, the gap between the insert hole is 2 millimeters；The pin 3, which exposes electronic circuit board 4,0.5 centimetre, institute
The bottom for stating inserted sheet passes through stent 5, as shown in Figure 2.
Embodiment 2
A kind of reflow soldering and its reflow soldering process for electronic circuit board, including furnace body, arch flue gas leading, trapezoidal exhaust gas are received
Header, exhaust fan and exhaust processor, the both ends of the arch flue gas leading connect respectively is arranged on front and rear the two of the furnace body
On end, the bottom of the trapezoidal waste gas collection box is arranged on the stage casing of the furnace body and is connected with the inside of the furnace body,
The top of the trapezoidal waste gas collection box is with being placed in the lower section of the arch flue gas leading and being connected with the arch flue gas leading, institute
State exhaust fan and be arranged on the side of the arch flue gas leading and be connected by arch flue gas leading described in Guan Zuyu, the exhaust-gas treatment
Device is arranged on the outlet air end of the exhaust fan；It is characterized in that, the reflow soldering further includes cooling-cycle apparatus, it is described cold
But recycle unit includes refrigerator pipes, air exhauster, is additionally provided with clarifier inside the refrigerator pipes, one end of the refrigerator pipes with it is described
The port of export of furnace body is connected by the first snorkel；The other end of the refrigerator pipes is connected by double-skin duct and the air exhauster
Connect；The air exhauster is also connected with cooler；The double-skin duct is connected with radiator, and the radiator is connected with air blower；
The air blower is also connected with the arrival end of furnace body；The Double layer pipeline is described by inner tube and the outer tube for being enclosed in inner tube periphery
Inner tube is connected with air exhauster, and the outer tube is communicated with cooler；
The reflow soldering process comprises the following steps, and comprises the following steps that：
Step 1：Determine the insert hole on plug-in element and corresponding pcb board；
Step 2：Plug-in unit hole site and coplanar SMD components pad are together printed into tin；
Step 3：Coplanar SMD components patch, and the pin of corresponding plug-in components is inserted into insert hole；The insert hole
Between gap be 2.5 millimeters；The pin exposes 1.5 centimetres of pcb board face；
Step 4：The plug-in components in the face and SMD components together are crossed reflow ovens with pcb board to be welded；Welding temperature
For 280 DEG C, weld interval 27s；
Step 5：Check the solder joint of plug-in components and SMD components.
The trapezoidal waste gas collection box is placed in the lower section in the stage casing of the arch flue gas leading, the height of the arch flue gas leading
More than the height of the trapezoidal waste gas collection box, the length of the arch flue gas leading is more than the length of the trapezoidal waste gas collection box
Degree.
The factory bottom surface of the trapezoidal waste gas collection box is connected with the upper wall of the furnace body, the trapezoidal waste gas collection box
Top surface is connected with the stage casing of the arch flue gas leading.
The length of the arch flue gas leading is less than the length of the furnace body.
Although description of this invention combination embodiments above carries out, those skilled in the art
Member can carry out many replacements, modifications and variations according to above-mentioned content, be apparent.Therefore it is all such to substitute, change
In spirit and scope by the claims near being included in change.
Claims (9)
1. a kind of reflow soldering and its reflow soldering process for electronic circuit board, including furnace body, arch flue gas leading, trapezoidal exhaust gas
Collecting box, exhaust fan and exhaust processor, the both ends of the arch flue gas leading connect respectively is arranged on the front and rear of the furnace body
On both ends, the bottom of the trapezoidal waste gas collection box is arranged on the stage casing of the furnace body and is connected with the inside of the furnace body
Logical, the top of the trapezoidal waste gas collection box is with being placed in the lower section of the arch flue gas leading and being connected with the arch flue gas leading
Connect, the side that the exhaust fan is arranged on the arch flue gas leading is connected by arch flue gas leading described in Guan Zuyu, described useless
Treatment apparatus is arranged on the outlet air end of the exhaust fan；It is characterized in that, the reflow soldering further includes cooling-cycle apparatus,
The cooling-cycle apparatus includes refrigerator pipes, air exhauster, and clarifier, one end of the refrigerator pipes are additionally provided with inside the refrigerator pipes
It is connected with the port of export of the furnace body by the first snorkel；The other end of the refrigerator pipes passes through double-skin duct and the pumping
Machine connects；The air exhauster is also connected with cooler；The double-skin duct is connected with radiator, and the radiator connects with air blower
Connect；The air blower is also connected with the arrival end of furnace body；The Double layer pipeline is by inner tube and the outer tube for being enclosed in inner tube periphery, institute
State inner tube with air exhauster to be connected, the outer tube is communicated with cooler；
The reflow soldering process comprises the following steps, and comprises the following steps that：
Step 1：Determine the insert hole on plug-in element and corresponding pcb board,；
Step 2：Plug-in unit hole site and coplanar SMD components pad are together printed into tin；
Step 3：Coplanar SMD components patch, and the pin of corresponding plug-in components is inserted into insert hole；
Step 4：The plug-in components in the face and SMD components together are crossed reflow ovens with pcb board to be welded, welding temperature
For 240 DEG C -280 DEG C, weld interval 20s-30s；
Step 5：Check the solder joint of plug-in components and SMD components.
2. a kind of reflow soldering and its reflow soldering process for electronic circuit board according to claim 1, its feature exist
In the pcb board is PPA materials.
3. a kind of reflow soldering and its reflow soldering process for electronic circuit board according to claim 1, its feature exist
In the gap between step 3 insert hole is 2-2.5 millimeters.
4. a kind of reflow soldering and its reflow soldering process for electronic circuit board according to claim 1, its feature exist
In the welding temperature in step 4 is 250 DEG C, weld interval 24s.
5. a kind of reflow soldering and its reflow soldering process for electronic circuit board according to claim 1, its feature exist
In the pin in the step 3 exposes 0.5-2 centimetres of pcb board face.
6. a kind of reflow soldering and its reflow soldering process for electronic circuit board according to claim 1, its feature exist
In the trapezoidal waste gas collection box is placed in the lower section in the stage casing of the arch flue gas leading, and the height of the arch flue gas leading is more than
The height of the trapezoidal waste gas collection box, the length of the arch flue gas leading are more than the length of the trapezoidal waste gas collection box.
7. a kind of reflow soldering and its reflow soldering process for electronic circuit board according to claim 1, its feature exist
In the factory bottom surface of the trapezoidal waste gas collection box is connected with the upper wall of the furnace body, the top surface of the trapezoidal waste gas collection box
It is connected with the stage casing of the arch flue gas leading.
8. a kind of reflow soldering and its reflow soldering process for electronic circuit board according to claim 1, its feature exist
In the length of the arch flue gas leading is less than the length of the furnace body.
9. a kind of reflow soldering and its reflow soldering process for electronic circuit board according to claim 1, its feature exist
In the pin in the step 3 exposes 1.5 centimetres of pcb board face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711164365.8A CN107995798A (en) | 2017-11-21 | 2017-11-21 | A kind of reflow soldering and its reflow soldering process for electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711164365.8A CN107995798A (en) | 2017-11-21 | 2017-11-21 | A kind of reflow soldering and its reflow soldering process for electronic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995798A true CN107995798A (en) | 2018-05-04 |
Family
ID=62031909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711164365.8A Pending CN107995798A (en) | 2017-11-21 | 2017-11-21 | A kind of reflow soldering and its reflow soldering process for electronic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107995798A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759661A (en) * | 2018-12-29 | 2019-05-17 | 京信通信技术(广州)有限公司 | Welding method for communication device assembly |
| CN114515881A (en) * | 2022-03-26 | 2022-05-20 | 宁波诚兴道电子科技有限公司 | PCBA circuit board welding equipment and process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0289395A (en) * | 1988-09-27 | 1990-03-29 | Matsushita Electric Ind Co Ltd | Manufacture of electronic circuit board |
| CN102291945A (en) * | 2011-08-11 | 2011-12-21 | 广东威创视讯科技股份有限公司 | Through-hole reflow soldering method |
| CN206366723U (en) * | 2017-01-10 | 2017-08-01 | 珠海市邦普科技有限公司 | A kind of quick heat radiating waste air reflow soldering |
| CN206514713U (en) * | 2017-03-03 | 2017-09-22 | 惠州市泰通电子有限公司 | A kind of reflow soldering cooling-cycle apparatus |
-
2017
- 2017-11-21 CN CN201711164365.8A patent/CN107995798A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0289395A (en) * | 1988-09-27 | 1990-03-29 | Matsushita Electric Ind Co Ltd | Manufacture of electronic circuit board |
| CN102291945A (en) * | 2011-08-11 | 2011-12-21 | 广东威创视讯科技股份有限公司 | Through-hole reflow soldering method |
| CN206366723U (en) * | 2017-01-10 | 2017-08-01 | 珠海市邦普科技有限公司 | A kind of quick heat radiating waste air reflow soldering |
| CN206514713U (en) * | 2017-03-03 | 2017-09-22 | 惠州市泰通电子有限公司 | A kind of reflow soldering cooling-cycle apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759661A (en) * | 2018-12-29 | 2019-05-17 | 京信通信技术(广州)有限公司 | Welding method for communication device assembly |
| CN114515881A (en) * | 2022-03-26 | 2022-05-20 | 宁波诚兴道电子科技有限公司 | PCBA circuit board welding equipment and process |
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Application publication date: 20180504 |