CN203900685U - Cooling module group for reflow soldering furnace - Google Patents
Cooling module group for reflow soldering furnace Download PDFInfo
- Publication number
- CN203900685U CN203900685U CN201420221114.4U CN201420221114U CN203900685U CN 203900685 U CN203900685 U CN 203900685U CN 201420221114 U CN201420221114 U CN 201420221114U CN 203900685 U CN203900685 U CN 203900685U
- Authority
- CN
- China
- Prior art keywords
- motor
- cooling module
- reflow soldering
- cavity
- cooler bin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 34
- 238000005476 soldering Methods 0.000 title claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000843 powder Substances 0.000 description 12
- 239000007789 gas Substances 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000019771 cognition Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a cooling module group for a reflow soldering furnace, and the cooling module group comprises an air draft motor (1), a motor installation cavity (2), a cooling box (3), and an air backflow assembly. The air backflow assembly comprises a ventilating pipe (4) and a return air inlet (5). The air draft motor (1) is disposed at the upper part of the motor installation cavity (2), and the motor installation cavity (2) is disposed above the cooling box (3) and is in sealing connection with the top surface of the cooling box (3). The return air inlet (5) is disposed on the top surface of the cooling box (3), and is connected with the motor installation cavity (2) through the ventilating pipe (4). Compared with the prior art, the cooling module group is compact in structure, is simple in air pipeline, is convenient to install, disassemble and wash, and can improve the utilization efficiency and production efficiency of the reflow soldering furnace.
Description
Technical field
The utility model relates to a kind of reflow soldering parts, especially relates to the cooling module of a kind of reflow soldering.
Background technology
Reflow soldering is the equipment for the circuit board that is loaded with electronic devices and components being carried out to soldering.It is by providing a kind of heating environment, makes the solder(ing) paste thawing of being heated, thereby allows surface-pasted components and parts and circuit board combine securely by solder(ing) paste alloy.Hot air type reflow soldering, by the laminar motion transferring heat energy of hot blast, utilizes heater strip and blowing motor, makes furnace air constantly heat up and circulate, and weldment is subject to the heating of red-hot gas and melts in stove, thereby realizes welding.Many heating modules of arranging in the burner hearth of existing reflow soldering, for providing components and parts after hot blast and the surface mount after heating by convection type heat-shift, melt solder(ing) paste alloy on circuit board and solidify, thereby for welding component.
In reflow soldering, except heating module, all need cooling module to ensure metallurgy characteristic and reduce plate temperature.Temperature Setting in cooling module is more much lower than heating module, and the wind that temperature is lower circulates in cooling module, and takes away the heat on circuit board, reduces and plate temperature.In air return brazier, scaling powder steam was directly discharged body of heater before cooling, can not leave scaling powder condensate in refrigerating module.
; in nitrogen protection reflow soldering; in order to reduce the consumption of nitrogen (N2); chamber structure seals completely, and internal gas will recycle, and scaling powder steam can not directly be discharged body of heater; therefore scaling powder steam has an opportunity fully to contact with refrigerating module; make its temperature lower than 110 DEG C, and occur condensation, these scaling powder condensate liquids cognition are attached on the impeller of cooling module.Due to impeller High Rotation Speed, these condensed fluids finally can be thrown to the inwall of cooling module, and flow on blowing orifice plate along inwall.In the time that liquid scaling powder is stacked into certain degree, just can form drop, finally drip, and (PCB) is upper probably to drop onto wiring board, causes the off quality of wiring board even to scrap.In order to prevent this type of event, in industry, general way is the scaling powder of regular manual wipping cleaning cooling zone backflow orifice surface, and maintenance is cleaned in return-flow system inside.This work generally need to shut down and arrange the skilled worker with abundant maintenance technology and general knowledge to operate, and also needs to dismantle motor, breaks cooling module, wipes by hand on inwall and the condensed fluid of drying on orifice plate.Can reach like this object of deep clean maintenance, but waste time and energy, increase greatly time and the work difficulty of maintenance downtime, thereby remote-effects are to the production efficiency and the output that use client.
In order to reduce the maintenance downtime time, reduce difficulty and the operation of maintenance, it is quick detachable that our utmost point needs a kind of novel cooling module design to realize, and easy cleaning, to improve service efficiency and the production efficiency of reflow soldering, for enterprise realizes larger economic benefit.
Summary of the invention
The purpose of this utility model is exactly to provide a kind of reflow soldering cooling module in order to overcome the defect that above-mentioned prior art exists.
The purpose of this utility model can be achieved through the following technical solutions:
The cooling module of a kind of reflow soldering, it is characterized in that, this cooling module comprises exhausting motor, motor installation cavity, cooler bin and gas backstreaming assembly, described gas backstreaming assembly comprises air pipeline and return air inlet, described exhausting motor is arranged on motor cavity top is installed, and described motor is installed cavity and is arranged on cooler bin top, and is tightly connected with cooler bin end face, described return air inlet is arranged on cooler bin end face, and by air pipeline connecting motor, cavity is installed.
The impeller of described exhausting motor is placed in motor and installs in cavity.
Described cooler bin is cuboid, and motor is installed cavity and return air inlet is arranged on cooler bin end face two ends, and is communicated with cooler bin sealing.
It is hollow circular cylinder that described motor is installed cavity, and side has flatly and is communicated with air pipeline sealing.
The utility model has changed the installation site of motor, has redesigned motor cavity is installed.The steam that burner hearth includes scaling powder be inhaled into cooling after, can be thrown toward motor cavity is installed, and can directly not get rid of in cooling module.Like this, in cooling module, not having scaling powder assembles.Due to this composite module compact conformation, gas piping is succinct, installs and unpicks and washes conveniently, can improve service efficiency and the production efficiency of reflow soldering.
Compared with prior art, the utlity model has following advantage:
1. cooler bin separates with motor installation cavity, compact conformation, economy and durability;
2. easy to use, only need dismounting exhausting motor, clean motor cavity is installed, and do not need to dismantle whole cooler bin;
3. maintenance is easy to clean.
Brief description of the drawings
Fig. 1 is a kind of cooling module overall structure schematic diagram for reflow soldering of the utility model;
Description of symbols in figure:
1-exhausting motor; 2-motor is installed cavity; 3-cooler bin; 4-air pipeline; 5-return air inlet.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.
Embodiment
As shown in Figure 1, the cooling module of a kind of reflow soldering, this cooling module comprises exhausting motor 1, motor installation cavity 2, cooler bin 3 and gas backstreaming assembly, described gas backstreaming assembly comprises air pipeline 4 and return air inlet 5, exhausting motor 1 and motor are installed cavity 2 and are arranged on cooler bin 3 box top tops, described cooler bin 3 one end are provided with motor cavity 2 are installed, the other end is provided with return air inlet 5, the impeller of described exhausting motor 1 is placed in motor and installs in cavity 2, it is hollow circular cylinder that motor is installed cavity 2, and side has flatly and is communicated with air pipeline 4 sealings; Described motor is installed between cavity 2 and return air inlet 5 and is communicated with by air pipeline 4 sealings, described exhausting motor 1 is arranged on motor cavity 2 tops is installed, described cooler bin 3 is cuboid, motor is installed by cavity 2 and return air inlet 5 is arranged on cooler bin 3 two ends along long limit, and is communicated with cooler bin 3 sealings.
When work, exhausting motor 1 can produce suction, by burner hearth, be rich in the steam suction cooler bin 3 of scaling powder, carry out cooling; Scaling powder steam is adsorbed on exhausting motor 1 impeller, and is thrown toward in motor installation cavity 2, and scaling powder is installed the interior gathering of cavity 2 at motor.Meanwhile, cooled gas is circulated again to note by air pipeline 4 and return air inlet 5 again to be got back in cooler bin 3 and is blown in burner hearth, reduces the plate temperature that of pcb board.When maintaining, only need to dismantle exhausting motor 1, clean motor is installed cavity 2, without the whole cooler bin group 3 of dismounting, reduces the working strength of maintenance washes, has improved operating efficiency.
Claims (4)
1. the cooling module of reflow soldering, it is characterized in that, this cooling module comprises exhausting motor (1), motor is installed cavity (2), cooler bin (3) and gas backstreaming assembly, described gas backstreaming assembly comprises air pipeline (4) and return air inlet (5), described exhausting motor (1) is arranged on motor cavity (2) top is installed, described motor is installed cavity (2) and is arranged on cooler bin (3) top, and be tightly connected with cooler bin (3) end face, described return air inlet (5) is arranged on cooler bin (3) end face, and by air pipeline (4) connecting motor, cavity (2) is installed.
2. the cooling module of a kind of reflow soldering according to claim 1, is characterized in that, the impeller of described exhausting motor (1) is placed in motor and installs in cavity (2).
3. the cooling module of a kind of reflow soldering according to claim 1, it is characterized in that, described cooler bin (3) is cuboid, motor is installed cavity (2) and return air inlet (5) is arranged on cooler bin (3) end face two ends, and is communicated with cooler bin (3) sealing.
4. the cooling module of a kind of reflow soldering according to claim 1, is characterized in that, it is hollow circular cylinder that described motor is installed cavity (2), and side has flatly and is communicated with air pipeline (4) sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420221114.4U CN203900685U (en) | 2014-04-30 | 2014-04-30 | Cooling module group for reflow soldering furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420221114.4U CN203900685U (en) | 2014-04-30 | 2014-04-30 | Cooling module group for reflow soldering furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203900685U true CN203900685U (en) | 2014-10-29 |
Family
ID=51774976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420221114.4U Expired - Lifetime CN203900685U (en) | 2014-04-30 | 2014-04-30 | Cooling module group for reflow soldering furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203900685U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113210784A (en) * | 2021-07-08 | 2021-08-06 | 江苏长实基业电气科技有限公司 | Environment-friendly reflow soldering equipment |
| TWI819097B (en) * | 2018-10-17 | 2023-10-21 | 美商伊利諾工具工程公司 | An exhaust gas purification device |
-
2014
- 2014-04-30 CN CN201420221114.4U patent/CN203900685U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI819097B (en) * | 2018-10-17 | 2023-10-21 | 美商伊利諾工具工程公司 | An exhaust gas purification device |
| CN113210784A (en) * | 2021-07-08 | 2021-08-06 | 江苏长实基业电气科技有限公司 | Environment-friendly reflow soldering equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141029 |