CN204090333U - A kind of novel solder reflow device - Google Patents
A kind of novel solder reflow device Download PDFInfo
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- CN204090333U CN204090333U CN201420524563.6U CN201420524563U CN204090333U CN 204090333 U CN204090333 U CN 204090333U CN 201420524563 U CN201420524563 U CN 201420524563U CN 204090333 U CN204090333 U CN 204090333U
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- capillary
- discharge pipe
- air
- heater
- solder reflow
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Abstract
The utility model discloses a kind of novel solder reflow device, for welding pcb board, comprise body of heater, air-supply arrangement and heater, air-supply arrangement comprise motor, connecting motor fan blade, cover at the air-supply cavity on fan blade and be arranged at air-supply cavity air outlet place discharge pipe, motor is positioned at outside body of heater, and wind pushing cavity body is positioned at furnace interior; Heater is heater strip, and heater strip is arranged at the air inlet of discharge pipe; Be connected with capillary immediately below discharge pipe, capillary removably connects discharge pipe, and capillary is provided with gas channel, and capillary is communicated with discharge pipe; The solder joint of the corresponding pcb board of syringe needle of capillary; Adopt novel solder reflow device provided by the utility model, the setting of capillary, make whole equipment can carry out welding job in butt welding point region targetedly, other region of pcb board can not be subject to the impact of high temperature and changes or destroy its internal structure, improves the stability of pcb board entirety.
Description
Technical field
The utility model relates to a kind of Novel welding apparatus, specifically, relates to a kind of novel solder reflow device.
Background technology
Solder reflow device is not strange at electronic manufacturing field, element on the various boards used in our computer is all welded on wiring board by this technique, there is a heater circuit inside of this equipment, air or nitrogen are heated to sufficiently high temperature after-blow to the wiring board posting element, allow the solder of elements on either side melt after and mainboard bond.The advantage of this technique is that temperature is easy to control, and can also avoid oxidation in welding process, manufacturing cost also more easily controls.
But traditional solder reflow device, because the air flow method in its an actor's rendering of an operatic tune is even, in the course of processing, for the product that solder joint is few, except solder joint, the temperature in whole all the other regions of PCB also one is in ascendant trend together, when the temperature increases, the internal structure of easy destruction pcb board, is unfavorable for the stability of product.
Utility model content
For solving the problems of the technologies described above, the purpose of this utility model is that providing a kind of can reduce artificial delaying, and reduces costs, the novel solder reflow device of enhancing productivity.
For achieving the above object, the technical solution of the utility model is as follows: a kind of novel solder reflow device, for welding pcb board, comprise body of heater, air-supply arrangement and heater, described air-supply arrangement comprises motor, connects the fan blade of described motor, covers at the air-supply cavity on described fan blade and is arranged at the discharge pipe at described air-supply cavity air outlet place, described motor is positioned at outside described body of heater, and described wind pushing cavity body is positioned at described furnace interior; Described heater is heater strip, and described heater strip is arranged at the air inlet of described discharge pipe; Be connected with capillary immediately below described discharge pipe, described capillary removably connects described discharge pipe, and described capillary is provided with gas channel, and described capillary is communicated with described discharge pipe; The solder joint of the corresponding described pcb board of syringe needle of described capillary.
Adopt technique scheme, the beneficial effect of technical solutions of the utility model is: because heater and heater strip are arranged at the air inlet of discharge pipe, can rapidly by gas-heated, heating effect is good, avoid and the gas in all bodies of heater is carried out preheating, can saves energy, improve practicality; The capillary connected below discharge pipe, the position of the corresponding solder joint of the soldering tip due to capillary, high-temperature gas can directly flow out from soldering tip, and then butt welding point heats, because the diameter of soldering tip is less than normal, high-temperature gas is not easily distributed to remaining non-solder region, ensure that the internal structure of pcb board is not destroyed, substantially increases the stability of product quality; In addition, because capillary is the discharge pipe that removably connects, when solder joint is throughout monoblock pcb board, capillary can be pulled down again, applicability is more extensive.
On the basis of technique scheme, the utility model also can do following improvement:
As preferred scheme, the shape of described capillary is tapered, and the diameter of the air inlet end of capillary is greater than the diameter of its air opening end.
Adopt above-mentioned preferred scheme, the design of taper, can accelerate the flowing of high-temperature gas, a nearly step improves the firing rate of gas.
As preferred scheme, the pin wall of described capillary is double-decker.
Adopt above-mentioned preferred scheme, double-deck setting, the Rigidity and strength of capillary can be improved, extend its useful life.
As preferred scheme, described air-supply cavity is provided with exhausting plate, the air outlet of described exhausting plate connects the air inlet of described discharge pipe.
Adopt above-mentioned preferred scheme, the vibrational power flow of exhausting plate and discharge pipe, make it possible to effectively carry out water conservancy diversion to high-temperature gas.
As preferred scheme, described novel solder reflow device also comprises the resorption plate be arranged in parallel with described exhausting plate, and described resorption plate is provided with some installing holes for installing described discharge pipe, and described discharge pipe passes described installing hole.
Adopt above-mentioned preferred scheme, the setting of resorption plate, used high-temperature gas can be recycled, energy-conserving and environment-protective, reduce production cost.
As preferred scheme, the surrounding of described installing hole is also arranged at intervals with the return port for reclaiming thermal current, and ringwise, and the number of described return port is at least two to described return port.
Adopt above-mentioned preferred scheme, return port is set to annular, and is distributed in the surrounding of installing hole, such setting, make the water conservancy diversion of high-temperature gas evenly.
As preferred scheme, described novel solder reflow device also comprises the cooling system for cooling described motor fast, described cooling system comprises water supply casing, pipeline, water inlet and delivery port, described water supply casing is sheathed on the output shaft of described motor, the helically line formula distribution of described pipeline, and surround described output shaft.
Adopt above-mentioned preferred scheme, the setting of cooling system, make after completing welding, from water inlet water inlet, enter in spiral pipeline, because pipeline is centered around on the output shaft of motor, therefore in pipeline, cold water is passed into, or other cooling liquid, motor can be cooled fast, to reach cooling-down effect.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment technology, be briefly described to the accompanying drawing used required in the description of embodiment technology below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of novel solder reflow device of the utility model;
Fig. 2 is the structural representation of resorption plate in a kind of novel solder reflow device of the utility model;
Fig. 3 is the enlarged drawing of return port on resorption plate in a kind of novel solder reflow device of the utility model.
Wherein, 1, body of heater, 2, motor, 21, output shaft, 3, fan blade, 4, air-supply cavity, 5, discharge pipe, 6, heater strip, 7, capillary, 8, exhausting plate, 9, resorption plate, 91, installing hole, 92, return port, 101, water supply casing, 102, pipeline.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
In order to reach the purpose of this utility model, as shown in Figure 1, in some embodiments of a kind of novel solder reflow device of the utility model, for welding pcb board, comprise body of heater 1, air-supply arrangement and heater, air-supply arrangement comprise motor 2, connecting motor 2 fan blade 3, cover at the air-supply cavity 4 on fan blade 3 and be arranged at the discharge pipe 5 at air-supply cavity 4 air outlet place, motor 2 is positioned at outside body of heater 1, and it is inner that air-supply cavity 4 is positioned at body of heater 1; Heater is heater strip 6, and heater strip 6 is arranged at the air inlet of discharge pipe 5; Be connected with capillary 7 immediately below discharge pipe 5, capillary 7 removably connects discharge pipe 5, and capillary 7 is provided with gas channel, and capillary 7 is communicated with discharge pipe 5; The solder joint of the corresponding pcb board of syringe needle of capillary 7.
Adopt technique scheme, the beneficial effect of technical solutions of the utility model is: because heater and heater strip 6 are arranged at the air inlet of discharge pipe 5, can rapidly by gas-heated, heating effect is good, avoid and the gas in all bodies of heater 1 is carried out preheating, can saves energy, improve practicality; The capillary 7 connected below discharge pipe 5, the position of the corresponding solder joint of the soldering tip due to capillary 7, high-temperature gas can directly flow out from soldering tip, and then butt welding point heats, because the diameter of soldering tip is less than normal, high-temperature gas is not easily distributed to remaining non-solder region, ensure that the internal structure of pcb board is not destroyed, substantially increases the stability of product quality; In addition, because capillary 7 is the discharge pipes that removably connect, when solder joint is throughout monoblock pcb board, capillary can be pulled down again, applicability is more extensive.
On the basis of technique scheme, the utility model also can do following improvement:
In order to optimize implementation result of the present utility model further, as shown in Figure 1, in the other embodiment of a kind of novel solder reflow device of the utility model, the shape of capillary 7 is tapered, and the diameter of the air inlet end of capillary 7 is greater than the diameter of its air opening end.
Adopt above-mentioned preferred scheme, the design of taper, can accelerate the flowing of high-temperature gas, a nearly step improves the firing rate of gas.
In order to optimize implementation result of the present utility model further, in the other embodiment of a kind of novel solder reflow device of the utility model, the pin wall of capillary 7 is double-decker.
Adopt above-mentioned preferred scheme, double-deck setting, the Rigidity and strength of capillary 7 can be improved, extend its useful life.
In order to optimize implementation result of the present utility model further, as shown in Figure 1, in the other embodiment of a kind of novel solder reflow device of the utility model, air-supply cavity 4 is provided with exhausting plate 8, the air outlet of exhausting plate 8 connects the air inlet of discharge pipe 5.
Adopt above-mentioned preferred scheme, the vibrational power flow of exhausting plate 8 and discharge pipe 5, make it possible to effectively carry out water conservancy diversion to high-temperature gas.
In order to optimize implementation result of the present utility model further, as shown in Figure 1 and Figure 2, in the other embodiment of a kind of novel solder reflow device of the utility model, novel solder reflow device also comprises the resorption plate 9 be arranged in parallel with exhausting plate 8, resorption plate 9 is provided with some installing holes 91 for installing discharge pipe 5, discharge pipe 5 passes installing hole 91.
Adopt above-mentioned preferred scheme, the setting of resorption plate 9, used high-temperature gas can be recycled, energy-conserving and environment-protective, reduce production cost.
In order to optimize implementation result of the present utility model further, as Figure 2-3, in the other embodiment of a kind of novel solder reflow device of the utility model, the surrounding of installing hole 91 is also arranged at intervals with the return port 92 for reclaiming thermal current, return port 92 ringwise, and the number of return port 92 is two, or remaining is multiple.
Adopt above-mentioned preferred scheme, return port 92 is set to annular, and is distributed in the surrounding of installing hole 91, such setting, make the water conservancy diversion of high-temperature gas evenly.
In order to optimize implementation result of the present utility model further, as shown in Figure 1, in the other embodiment of a kind of novel solder reflow device of the utility model, novel solder reflow device also comprises the cooling system for quick cooling motor, cooling system comprises water supply casing 101, pipeline 102, water inlet and delivery port, water supply casing 101 is sheathed on the output shaft 21 of motor 2, pipeline 102 helically line formula distribution, and surrounds output shaft 21.
Adopt above-mentioned preferred scheme, the setting of cooling system, make after completing welding, from water inlet water inlet, enter in spiral pipeline 102, because pipeline 102 is centered around on the output shaft of motor, therefore in pipeline 102, cold water being passed into, or other cooling liquid, motor can be cooled fast, to reach cooling-down effect, extend it and benefit from the life-span.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a novel solder reflow device, for welding pcb board, it is characterized in that, comprise body of heater, air-supply arrangement and heater, described air-supply arrangement comprises motor, connects the fan blade of described motor, covers at the air-supply cavity on described fan blade and is arranged at the discharge pipe at described air-supply cavity air outlet place, described motor is positioned at outside described body of heater, and described wind pushing cavity body is positioned at described furnace interior; Described heater is heater strip, and described heater strip is arranged at the air inlet of described discharge pipe; Be connected with capillary immediately below described discharge pipe, described capillary removably connects described discharge pipe, and described capillary is provided with gas channel, and described capillary is communicated with described discharge pipe; The solder joint of the corresponding described pcb board of syringe needle of described capillary.
2. novel solder reflow device according to claim 1, is characterized in that, the shape of described capillary is tapered, and the diameter of the air inlet end of capillary is greater than the diameter of its air opening end.
3. novel solder reflow device according to claim 2, is characterized in that, the pin wall of described capillary is double-decker.
4. novel solder reflow device according to claim 3, is characterized in that, described air-supply cavity is provided with exhausting plate, and the air outlet of described exhausting plate connects the air inlet of described discharge pipe.
5. novel solder reflow device according to claim 4, it is characterized in that, described novel solder reflow device also comprises the resorption plate be arranged in parallel with described exhausting plate, and described resorption plate is provided with some installing holes for installing described discharge pipe, and described discharge pipe passes described installing hole.
6. novel solder reflow device according to claim 5, is characterized in that, the surrounding of described installing hole is also arranged at intervals with the return port for reclaiming thermal current, and ringwise, and the number of described return port is at least two to described return port.
7. novel solder reflow device according to claim 1, it is characterized in that, described novel solder reflow device also comprises the cooling system for cooling described motor fast, described cooling system comprises water supply casing, pipeline, water inlet and delivery port, described water supply casing is sheathed on the output shaft of described motor, the helically line formula distribution of described pipeline, and surround described output shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420524563.6U CN204090333U (en) | 2014-09-12 | 2014-09-12 | A kind of novel solder reflow device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420524563.6U CN204090333U (en) | 2014-09-12 | 2014-09-12 | A kind of novel solder reflow device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204090333U true CN204090333U (en) | 2015-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201420524563.6U Expired - Fee Related CN204090333U (en) | 2014-09-12 | 2014-09-12 | A kind of novel solder reflow device |
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| CN (1) | CN204090333U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106624256A (en) * | 2016-12-30 | 2017-05-10 | 东莞市圣荣自动化科技有限公司 | Reflow soldering carrier storage table with improved structure |
| DE102022113902A1 (en) | 2022-06-02 | 2023-12-07 | Ersa Gmbh | Reflow soldering system with an air duct that is at least partially curved and free of corners and edges |
-
2014
- 2014-09-12 CN CN201420524563.6U patent/CN204090333U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106624256A (en) * | 2016-12-30 | 2017-05-10 | 东莞市圣荣自动化科技有限公司 | Reflow soldering carrier storage table with improved structure |
| CN106624256B (en) * | 2016-12-30 | 2019-03-15 | 孙美玲 | A kind of improved Reflow Soldering carrier lodging bench of structure |
| DE102022113902A1 (en) | 2022-06-02 | 2023-12-07 | Ersa Gmbh | Reflow soldering system with an air duct that is at least partially curved and free of corners and edges |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20190912 |
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| CF01 | Termination of patent right due to non-payment of annual fee |