CN211907908U - High-temperature selective wave soldering tin furnace - Google Patents
High-temperature selective wave soldering tin furnace Download PDFInfo
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- CN211907908U CN211907908U CN202020681968.6U CN202020681968U CN211907908U CN 211907908 U CN211907908 U CN 211907908U CN 202020681968 U CN202020681968 U CN 202020681968U CN 211907908 U CN211907908 U CN 211907908U
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Abstract
The utility model discloses a high temperature selectivity wave-soldering tin stove, it includes that inside cavity forms a closed cavity's furnace body, setting is in flourishing molten tin bath in the closed cavity, attached hot plate, the detection on flourishing molten tin bath peripheral surface thermocouple, setting of melting tin temperature are in spout tin mouth on the furnace body, be located in the closed cavity and will the tin liquid of flourishing molten tin bath to the pump body subassembly of spout tin mouth end spewing output, do pump body subassembly provides the rotating electrical machines of pump sending power, detects the level gauge subassembly of tin liquid level in the flourishing molten tin bath, the spout tin mouth is square nozzle or double square nozzle structure. The utility model discloses widen tin wave face width, the adaptability of product is better, and can realize the welding of a plurality of products simultaneously, has improved welding efficiency greatly, can realize that the tin spraying mouth gushes out stable tin spraying height, ensures high accuracy tin sticky quality.
Description
[ technical field ] A method for producing a semiconductor device
The utility model belongs to the technical field of the hot air solder leveling welding, especially, relate to a high temperature selectivity wave-soldering tin stove.
[ background of the invention ]
Selective wave soldering is also called selective soldering, and equipment applying the PCB plug-in through hole soldering field has a popular trend gradually becoming through hole soldering in the recent PCB through hole soldering field due to different soldering advantages, and the application range is not limited to: and (3) welding the multilayer PCB through holes with high welding requirements and complex process, such as military electronics, space ship electronics, automotive electronics, digital cameras, printers and the like.
The manual welding can also realize the welding of the inserting parts, but the quality of the manual welding is too dependent on the working skill and proficiency of operators, the repeatability is poor, and the manual welding is not suitable for automatic production. In the above background, selective welding has been produced.
Selective wave soldering furnaces on the market are low-temperature tin furnaces (less than 350 ℃), with the continuous updating of electronic products, higher reliability, better high-temperature resistance and low-temperature resistance are needed, the size is smaller and smaller, the requirement on soldering tin is higher and higher, some transformer and inductance products need high-temperature selective wave soldering (less than 450 ℃), and the low-temperature tin furnaces on the market cannot meet the soldering requirement; the high-temperature jet soldering tin furnace is usually matched with selective wave soldering equipment for use; the traditional tin furnace adopts a circular nozzle, so that the traditional tin furnace cannot work in a high-temperature environment for a long time, and some elements in the nozzle material can be melted into tin liquid, so that the high tin soldering requirement cannot be met; due to the limitation of a circular structure, the size of the nozzle cannot adapt to more types of soldering tin products; only one product or one PIN can be welded at a time, so that the tin soldering efficiency is low; when the welding device is used for welding high-temperature enameled wires and stranded wires, the problems that the enamel skin is not easy to wash away, the residual enamel skin is large, and the enameled wires are thinned can occur in the traditional tin furnace.
Therefore, there is a need to provide a new high temperature selective wave soldering tin furnace to solve the above problems.
[ Utility model ] content
The utility model discloses a main aim at provides a high temperature selectivity wave-soldering tin stove has widened tin wave surface width, and the adaptability of product is better, and can realize the welding of a plurality of products simultaneously, has improved welding efficiency greatly, can realize that the tin spraying mouth gushes out stable tin spraying height, ensures high accuracy tin sticky quality.
The utility model discloses a following technical scheme realizes above-mentioned purpose: the utility model provides a high temperature selectivity wave soldering tin stove, its includes that inside cavity forms a closed cavity's furnace body, sets up be in the closed cavity hold the molten tin bath, attached on hold the hot plate of molten tin bath peripheral surface, detect the thermocouple of the interior molten tin temperature of tin bath, set up be in tin-spraying nozzle on the furnace body, be located in the closed cavity and with the tin liquid of holding the molten tin bath to spout the pump body subassembly of gushing output, for the pump body subassembly provides the rotating electrical machines of pump sending power, detect the level gauge subassembly of tin liquid level in the tin bath, tin-spraying nozzle is square nozzle or two square nozzle structure.
Further, the pump body assembly and the rotating motor form a pumping structure.
Furthermore, a tin adding opening communicated with the tin containing groove is formed in the furnace body.
Furthermore, a protective gas hood which encloses the tin spraying nozzle is arranged on the periphery of the tin spraying nozzle.
Furthermore, an annular space for tin liquid to flow back to the tin containing groove is formed between the protective gas cover and the tin spraying nozzle.
Furthermore, an annular air duct surrounding the annular space is arranged on the protective air cover, and a plurality of air blowing holes communicated with the annular air duct and the annular space are distributed on the inner wall surface of the protective air cover in an annular manner; the protective gas cover is provided with a pipeline communicated with the annular air channel, the other end of the pipeline is communicated with a protective gas source, and protective gas is blown into the surrounding space of the periphery of the tin spraying nozzle.
Further, the protective gas source is a nitrogen gas source heated to a set temperature.
Further, the level gauge assembly includes a first level probe that senses the highest level and a second level probe that senses the lowest level.
Furthermore, the protective gas hood is of a square three-dimensional structure and surrounds tin waves sprayed out by the tin spraying nozzle.
Compared with the prior art, the utility model discloses high temperature selectivity wave-soldering tin stove's beneficial effect lies in: the tin pumping quantity can be accurately controlled by controlling the rotating speed of the rotating motor and matching with the sectional area of a flow passage communicated with the nozzle and the pump body assembly, so that the wave crest is accurately controlled, the high stability of liquid tin sprayed out by the tin spraying nozzle is kept, the continuity, uniformity and stability of the tin pumping are kept, and the tin soldering quality is guaranteed; an annular space communicated with the tin containing tank is formed at the periphery of the tin spraying nozzle, and liquid tin discharged by the pump can fall back to the tin containing tank to realize cyclic utilization, so that the tin consumption is saved; the nitrogen protection assembly is arranged on the periphery of the tin spraying nozzle, so that liquid tin is effectively prevented from being oxidized, the quality of the liquid tin is guaranteed, and the welding quality is further guaranteed; the pump body assembly and the tin containing groove are integrally arranged in a closed cavity, so that the oxidation of tin is further reduced.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention;
fig. 2 is a schematic partial structural view of a first embodiment of the present invention;
FIG. 3 is a schematic structural view of a solder nozzle according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a second embodiment of the present invention;
FIG. 5 is a schematic structural view of a second embodiment of the present invention;
the figures in the drawings represent:
100 high-temperature selective wave soldering tin furnace;
1, a furnace body; 2, a tin containing groove; 3 heating the plate; 4, a thermocouple; 5, a tin spraying nozzle; 6, a pump body component; 7 rotating the electric machine; 8 a level gauge assembly; 9 adding a tin port; 10, a protective gas hood; 11 sealing the cavity; 12 an annular space; 13 pipeline.
[ detailed description ] embodiments
The first embodiment is as follows:
referring to fig. 1 to 3, the present embodiment is a high-temperature selective wave soldering tin furnace 100, which includes a furnace body 1 having a hollow interior to form a closed cavity 11, a tin-containing bath 2 disposed in the closed cavity 11, a heating plate 3 attached to the peripheral surface of the tin-containing bath 2, a thermocouple 4 for detecting the temperature of molten tin in the tin-containing bath 2, a tin-spraying nozzle 5 disposed on the furnace body 1, a pump assembly 6 disposed in the closed cavity 11 and spraying and outputting tin liquid in the tin-containing bath 2 to the tin-spraying nozzle 5, a rotating motor 7 for providing pumping power to the pump assembly 6, and a level gauge assembly 8 for detecting the level of the tin liquid in the tin-containing bath 2.
The hot plate 3 of flourishing molten tin bath 2 periphery, during operating condition, the transmission is for flourishing molten tin bath 2 after the 3 continuous rising of hot plate temperature, and the inside solid-state tin of flourishing molten tin bath 2 melts, and then reaches soldering tin required temperature. The thermocouple 4 sets up between hot plate and flourishing molten tin bath 2, controls the heating of heating module to hot plate 3 through the temperature of melting tin in the flourishing molten tin bath 2 of response, keeps melting tin temperature's stability in the flourishing molten tin bath 2. The heating plate 3 is a ceramic heating plate.
The pump body assembly 6 and the rotating motor 7 form a pumping structure, the principle of the pumping structure is the same as that of the pumping structure on the market, and the rotating motor 7 drives the impeller to rotate to generate negative pressure to pump out liquid.
The furnace body 1 is provided with a tin adding port 9 communicated with the tin containing tank 2, and when the liquid level meter component 8 detects that the tin amount in the tin containing tank 2 is insufficient, a proper amount of manual tin rods are fed into the tin rods for supply.
In this embodiment, the nozzle of the tin spraying nozzle 5 is square, a shielding gas hood 10 surrounding the tin spraying nozzle 5 is disposed around the tin spraying nozzle 5, and an annular space 12 for allowing excess tin liquid to flow back into the tin containing tank 2 is formed between the shielding gas hood 10 and the tin spraying nozzle 5.
An annular air duct (not marked in the figure) surrounding the annular space 12 is arranged on the protective air cover 10, and a plurality of air blowing holes (not marked in the figure) communicating the annular air duct with the annular space 12 are annularly distributed on the inner wall surface of the protective air cover 10; the annular air duct is provided with a pipeline 13, the other end of the pipeline 13 is communicated with a protective air source, and protective air is blown into the surrounding space of the periphery of the tin spraying nozzle 5. The protective gas source is a nitrogen gas source, and the contact between air and liquid tin can be isolated through nitrogen protection, so that the soldering tin quality is improved, and tin oxidation is reduced. The protective gas cover 10 is made of high-temperature-resistant materials, the inner wall of the protective gas cover is made of high-temperature-resistant and corrosion-resistant microporous materials, preheated nitrogen gas uniformly enters the annular space 12 through the annular air blowing hole through the set annular air duct, and the influence of air flow on wave crests (namely the height of tin liquid sprayed by the tin spraying nozzle 5) is reduced to the greatest extent.
In this embodiment, the protection gas source is a nitrogen gas source heated to a set temperature. Through heating nitrogen gas, can effectually avoid cold nitrogen gas to the influence of crest temperature, form, further guarantee soldering tin quality. The liquid tin at the nozzle of the tin spraying nozzle 5 is wrapped by the nitrogen, so that the wave crest is not impacted while the tin soldering is protected.
The level gauge assembly 8 includes a first level probe that senses the highest level and a second level probe that senses the lowest level.
In this embodiment, all the parts in contact with tin are made of high-temperature-resistant and corrosion-resistant metal materials or surface-treated on the surfaces of the corresponding parts.
Example two:
the basic principle of this embodiment is the same as that of the first embodiment, and the difference is that: the tin spraying nozzle 5 comprises two square spraying ports, as shown in fig. 4 and 5; the tin spraying nozzle 5 can be designed in shape according to actual requirements, a plurality of products with small sizes can be welded simultaneously, and welding efficiency is improved. The protective gas cover 10 is a square three-dimensional structure and surrounds the tin waves sprayed by the tin spraying nozzle 5.
The technical scheme meets the industrial requirements of soldering tin products, can meet the higher soldering tin temperature requirement through special specification and process design of part materials, and reaches 450 ℃; through reasonable structural design, wave crests are more stable, and the soldering tin quality is higher; the design of a conventional round nozzle is broken through, and a square or double square nozzle structure is adopted; the tin wave surface of the square nozzle is widened, so that the product has better adaptability; the small-size product can be used for welding a plurality of products simultaneously, and the tin soldering efficiency is higher; the high-speed wave jet welding tin furnace is derived by replacing the high-speed motor, reinforcing the pump body component and optimizing the pump body flow channel, so that the tin flow has higher pressure and higher flow speed; compared with a standard high-temperature jet welding tin furnace, the double-square-shaped nozzle has the advantages that the nozzle is closer to a pump body, tin is discharged from the side surface, the impact force of tin flow is larger, the internal narrow special-shaped flow channel can keep the stability of wave peaks under the condition that the tin flow speed is accelerated, and the tin soldering quality is ensured; the paint can be quickly broken and washed away, and the welding problems that the paint is remained and the enameled wire is washed to be thin are solved.
According to the high-temperature selective wave soldering tin furnace 100, the tin pumping amount can be accurately controlled by controlling the rotating speed of the rotating motor and matching with the cross section area of the flow channel communicated with the nozzle and the pump body assembly, so that the wave crest is accurately controlled, the high stability of liquid tin sprayed out of the tin spraying nozzle is kept, the continuity, uniformity and stability of the tin pumping are kept, and the tin soldering quality is guaranteed; an annular space communicated with the tin containing tank is formed at the periphery of the tin spraying nozzle, and liquid tin discharged by the pump can fall back to the tin containing tank to realize cyclic utilization, so that the tin consumption is saved; the nitrogen protection assembly is arranged on the periphery of the tin spraying nozzle, so that liquid tin is effectively prevented from being oxidized, the quality of the liquid tin is guaranteed, and the welding quality is further guaranteed; the pump body assembly and the tin containing groove are integrally arranged in a closed cavity, so that the oxidation of tin is further reduced.
What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.
Claims (9)
1. The utility model provides a high temperature selectivity wave soldering tin stove which characterized in that: the tin melting furnace comprises a furnace body, a tin containing groove, a heating plate, a thermocouple, a tin spraying nozzle, a pump body assembly, a rotating motor and a liquid level gauge assembly, wherein the furnace body is internally hollow to form a closed cavity, the tin containing groove is arranged in the closed cavity, the heating plate is attached to the peripheral surface of the tin containing groove, the thermocouple is used for detecting the temperature of molten tin in the tin containing groove, the tin spraying nozzle is arranged on the furnace body, the pump body assembly is positioned in the closed cavity and is used for spraying and outputting tin liquid in the tin containing groove to the end of the tin spraying nozzle, the rotating motor is used for providing pumping power for the pump body assembly, the liquid level gauge assembly is used for detecting the liquid level.
2. A high temperature selective wave soldering tin furnace as claimed in claim 1, wherein: the pump body assembly and the rotating motor form a pumping structure.
3. A high temperature selective wave soldering tin furnace as claimed in claim 1, wherein: the furnace body is provided with a tin adding opening communicated with the tin containing groove.
4. A high temperature selective wave soldering tin furnace as claimed in claim 1, wherein: and a protective gas hood which encloses the tin spraying nozzle is arranged at the periphery of the tin spraying nozzle.
5. The high temperature selective wave solder tin oven of claim 4, characterized in that: an annular space for tin liquid to flow back to the tin containing groove is formed between the protective gas cover and the tin spraying nozzle.
6. The high temperature selective wave solder tin oven of claim 5, characterized in that: the protective gas cover is provided with an annular air channel surrounding the annular space, and a plurality of air blowing holes communicated with the annular air channel and the annular space are distributed on the surface of the inner wall of the protective gas cover in an annular manner; the protective gas cover is provided with a pipeline communicated with the annular air channel, the other end of the pipeline is communicated with a protective gas source, and protective gas is blown into the surrounding space of the periphery of the tin spraying nozzle.
7. The high temperature selective wave solder tin oven of claim 6, characterized in that: the protective gas source is a nitrogen gas source heated to a set temperature.
8. A high temperature selective wave soldering tin furnace as claimed in claim 1, wherein: the liquid level gauge assembly comprises a first liquid level probe sensing the highest liquid level surface and a second liquid level probe sensing the lowest liquid level surface.
9. The high temperature selective wave solder tin oven of claim 4, characterized in that: the protective gas cover is of a square three-dimensional structure and surrounds tin waves sprayed by the tin spraying nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020681968.6U CN211907908U (en) | 2020-04-29 | 2020-04-29 | High-temperature selective wave soldering tin furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020681968.6U CN211907908U (en) | 2020-04-29 | 2020-04-29 | High-temperature selective wave soldering tin furnace |
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| Publication Number | Publication Date |
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| CN211907908U true CN211907908U (en) | 2020-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020681968.6U Active CN211907908U (en) | 2020-04-29 | 2020-04-29 | High-temperature selective wave soldering tin furnace |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113732425A (en) * | 2021-08-24 | 2021-12-03 | 苏州恊合自动化科技有限公司 | Low-fluctuation tin furnace pump convenient to maintain and wave soldering tin furnace |
| CN113941749A (en) * | 2021-11-29 | 2022-01-18 | 珠海飞创智能科技有限公司 | Liquid tin supply equipment for wave soldering |
| DE202022101918U1 (en) | 2022-04-08 | 2023-07-11 | Ersa Gmbh | Transparent gassing cap, soldering nozzle arrangement, soldering pot unit and selective soldering system with such a gassing cap |
-
2020
- 2020-04-29 CN CN202020681968.6U patent/CN211907908U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113732425A (en) * | 2021-08-24 | 2021-12-03 | 苏州恊合自动化科技有限公司 | Low-fluctuation tin furnace pump convenient to maintain and wave soldering tin furnace |
| CN113941749A (en) * | 2021-11-29 | 2022-01-18 | 珠海飞创智能科技有限公司 | Liquid tin supply equipment for wave soldering |
| DE202022101918U1 (en) | 2022-04-08 | 2023-07-11 | Ersa Gmbh | Transparent gassing cap, soldering nozzle arrangement, soldering pot unit and selective soldering system with such a gassing cap |
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