CN214291291U - High-weather-resistance vacuum mechanism for reflow oven - Google Patents
High-weather-resistance vacuum mechanism for reflow oven Download PDFInfo
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- CN214291291U CN214291291U CN202023275964.7U CN202023275964U CN214291291U CN 214291291 U CN214291291 U CN 214291291U CN 202023275964 U CN202023275964 U CN 202023275964U CN 214291291 U CN214291291 U CN 214291291U
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Abstract
The utility model discloses a high weatherability vacuum mechanism for reflow oven, including setting up the vacuum mechanism body in the reflow oven, the vacuum mechanism body includes the base, lift seat and lift drive assembly, the base is fixed in the reflow oven, the lift seat is located the base top and can be close to/keep away from the base under the lift drive assembly effect, lift seat lid closes when on the base, form seal space, be provided with the sealing washer of sealed both junctions between base and the lift seat, the annular groove has been seted up perpendicularly downwards from its up end to the base, the sealing washer inlays to be established in annular groove, the terminal surface still is provided with carries out refrigerated water cooling plant to it under the base. The sealing performance is guaranteed, meanwhile, the service life of the sealing ring is prolonged, and the weather resistance is improved.
Description
Technical Field
The utility model relates to a reflow oven technical field especially relates to a high weatherability vacuum mechanism for reflow oven.
Background
In the SMT electronic industry, reflow soldering technology is not strange, components on various board cards used in computers are all soldered on circuit boards through the process, a heating circuit is arranged in the equipment, air or nitrogen is heated to a high enough lead-free soldering hot air reflow soldering machine, the temperature of the hot air reflow soldering machine is blown to the circuit boards with the attached components, and solder on two sides of the components is melted and then bonded with the main boards. A Reflow Oven (Reflow Oven) is an apparatus for soldering a circuit board carrying electronic components. It makes the solder paste be heated and melts through providing a heating environment thereby let surface mounted's components and parts and circuit board combine together through the solder paste alloy reliably. The soldering paste used for soldering is prepared by making grease-shaped soldering flux and powder solder into paste, coating the paste on the soldering position of each component of the circuit board by printing, accurately mounting electronic components on the paste, and heating and melting by using a heating module of a reflow oven to achieve reliable soldering of the components.
In order to meet the new market demand, the product defects caused by welding are reduced, and the product productivity and the qualified rate are improved. The reflow oven is added with the vacuum mechanism, so that the welding reliability of the product can be improved, the defects can be reduced, the size and the number of soldering tin cavities can be effectively reduced, and the welding quality can be improved. In order to realize the sealing of the vacuum mechanism, a sealing ring is often adopted for sealing, most of the existing high-temperature difficult sealing rings are made of perfluoroether, polytetrafluoroethylene and the like, the working temperature of common perfluororubber is about 240 ℃, and the high temperature resistance of the FFM can reach 330 ℃. The high temperature resistance of the polytetrafluoroethylene can reach 300 ℃. But the temperature of the high-temperature area in the reflow furnace can reach 350 +/-5 ℃, and the sealing ring works in the environment, so the service life is seriously reduced. However, the vacuum furnace has high sealing requirements, and once the sealing requirements cannot be met, the sealing ring needs to be replaced. And the furnace is cooled from a high-temperature environment, the sealing ring is replaced, and the furnace is restarted, which takes 4 to 8 hours and wastes time and labor. And reflow soldering is carried out at the rear section of the semiconductor process, and once the operation is stopped, other processes are affected, so that the processing efficiency is greatly reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects, the utility model aims to provide a high weatherability vacuum mechanism for reflow oven, when guaranteeing the leakproofness, prolong the life of sealing washer, improve the weatherability.
In order to achieve the above purpose, the utility model discloses a technical scheme is: a high weatherability vacuum mechanism for reflow oven, including setting up the vacuum mechanism body in the reflow oven, its characterized in that: the vacuum mechanism body comprises a base, a lifting seat and a lifting driving assembly, the base is fixed in a reflow soldering furnace, the lifting seat is located above the base and can be close to/far away from the base under the action of the lifting driving assembly, a sealing space is formed when the lifting seat covers the base, a sealing ring for sealing the joint of the base and the lifting seat is arranged between the base and the lifting seat, an annular groove is vertically and downwards formed in the upper end face of the base, the sealing ring is embedded in the annular groove, and a water cooling device for cooling the base is further arranged on the lower end face of the base.
The beneficial effects of the utility model reside in that: a sealing space is formed between the lifting seat and the base through the sealing ring, the sealing ring is embedded in the annular groove, only the upper surface of the sealing ring is in contact with high-temperature air in the reflow soldering furnace, the water cooling device is additionally arranged on the lower end face of the base, the water cooling device directly cools the base, and then the sealing ring embedded in the base is cooled, so that the sealing effect is ensured, and meanwhile, the service life of the sealing ring is greatly prolonged.
Further, the water cooling device comprises a water cooling shell fixed on the lower end face of the base, a water cooling cavity is formed in the water cooling shell, a water inlet and a water outlet communicated with the water cooling cavity are further formed in the water cooling shell, and the water inlet and the water outlet are communicated with a water tank located outside through a water pipe. Cold water continuously enters the water-cooling cavity to take away heat, so that the water-cooling shell is cooled, and heat conduction is formed between the water-cooling shell and the base.
Further, the water-cooling cavity is of a snake-shaped structure, and the water inlet and the water outlet are respectively communicated with two ends of the water-cooling cavity. The flow distance of cold water in the water-cooling cavity is long, and the cooling effect is improved.
Further, the vacuum mechanism body is arranged between the heating cavity and the cooling cavity, and the cooling device is arranged on one side of the base close to the heating cavity.
Further, the height of the sealing ring is larger than the depth of the groove of the ring groove, so that the sealing effect is ensured.
Furthermore, the lifting driving assembly comprises two lifting cylinders fixed in the reflow soldering furnace, the two lifting cylinders are symmetrically arranged on two sides of the base, and the lifting seat moves up and down under the driving of lifting pneumatic.
Furthermore, a supporting rod is fixed on the lifting seat, a lifting plate is fixed at the lower end of the supporting rod, an output shaft of the lifting cylinder is fixedly connected with the lifting plate, the lifting cylinder is fixed in the reflow soldering furnace through a fixing plate, and a guide rod capable of moving up and down along the fixing plate is further arranged on the lifting plate. The guide rod improves the stability that the lift seat reciprocated, improves the sealed effect between lift seat and base, prevents the skew.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is a schematic perspective view of an embodiment of the present invention;
fig. 3 is a side view of an embodiment of the invention;
fig. 4 is a cross-sectional view taken along line a-a of fig. 3.
In the figure:
1-base, 11-annular groove, 2-lifting seat, 3-lifting driving component, 31-lifting cylinder, 32-supporting rod, 33-lifting plate, 34-fixing plate, 35-guide rod, 4-sealing ring, 5-water cooling device, 51-water cooling shell, 52-water cooling cavity, 53-water inlet, and 54-water outlet.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Examples
Referring to fig. 1-4, the high weather resistance vacuum mechanism for reflow soldering furnace of the present invention includes a vacuum mechanism body disposed in the reflow soldering furnace. The vacuum mechanism body comprises a base 1, a lifting seat 2 and a lifting driving assembly 3, wherein the base 1 is fixed in the reflow soldering furnace, the lifting seat 2 is positioned above the base 1 and can be close to/far away from the base 1 under the action of the lifting driving assembly 3, and a sealing space is formed when the lifting seat 2 is covered on the base 1. A sealing ring 4 for sealing the joint of the base 1 and the lifting seat 2 is arranged between the base 1 and the lifting seat, an annular groove 11 is vertically and downwards formed in the upper end face of the base 1, the sealing ring 4 is embedded in the annular groove 11, and a water cooling device 5 for cooling the lower end face of the base 1 is further arranged on the lower end face of the base 1.
The water cooling device 5 comprises a water cooling shell 51 fixed on the lower end surface of the base 1, a water cooling cavity 52 is formed in the water cooling shell 51, a water inlet 53 and a water outlet 54 which are communicated with the water cooling cavity 52 are further arranged on the water cooling shell 51, and the water inlet 53 and the water outlet 54 are communicated with a water tank positioned outside through a water pipe. Cold water continuously enters the water-cooling cavity 52 to take away heat, so as to cool the water-cooling shell 51, and heat conduction is formed between the water-cooling shell 51 and the base 1. The water-cooling cavity 52 is of a snake-shaped structure, and the water inlet 53 and the water outlet 54 are respectively communicated with two ends of the water-cooling cavity 52. The flowing distance of the cold water in the water-cooling cavity 52 is long, and the cooling effect is improved. The height of the sealing ring 4 is larger than the depth of the annular groove 11, so that the sealing effect is ensured.
The vacuum mechanism body is arranged between the heating cavity and the cooling cavity, and the water cooling device is arranged on one side of the base 1 close to the heating cavity. The area of the cooling shell can be communicated with the area of the lower end face of the base 1, and the whole base 1 is cooled. The cooling shell can also be smaller than the area of the lower end face of the base 1 and is fixed on one side of the base 1 close to the heating cavity.
Form sealed space through sealing washer 4 between lift seat 2 and the base 1, sealing washer 4 inlays to be established in annular groove 11, and only the high temperature air contact in upper surface and the reflow oven, add water cooling plant 5 at base 1 terminal surface, and water cooling plant 5 is direct to the cooling of base 1, and then to inlaying the sealing washer 4 cooling of establishing in base 1, when guaranteeing sealed effect, has prolonged sealing washer 4's life greatly.
The lifting driving assembly 3 comprises two lifting cylinders 31 fixed in the reflow soldering furnace, the two lifting cylinders 31 are symmetrically arranged on two sides of the base 1, and the lifting base 2 moves up and down under the lifting pneumatic driving. A supporting rod 32 is fixed on the lifting seat 2, two ends of the lifting seat 2 extend outwards to form connecting lugs, and the upper end of the supporting rod 32 is fixedly connected with the connecting lugs. The lower end of the supporting rod 32 is fixed with a lifting plate 33, an output shaft of the lifting cylinder 31 is fixedly connected with the lifting plate 33, the lifting cylinder 31 is fixed in the reflow soldering furnace through a fixing plate 34, and the lifting plate 33 is further provided with a guide rod 35 capable of moving up and down along the fixing plate 34. The guide rod 35 improves the stability that the lifting seat 2 reciprocated, improves the sealing effect between the lifting seat 2 and the base 1, and prevents the excursion.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (7)
1. A high weatherability vacuum mechanism for reflow oven, including setting up the vacuum mechanism body in the reflow oven, its characterized in that: the vacuum mechanism body comprises a base (1), a lifting seat (2) and a lifting driving assembly (3), wherein the base (1) is fixed in a reflow soldering furnace, the lifting seat (2) is located above the base (1) and can be close to/far away from the base (1) under the action of the lifting driving assembly (3), a sealing space is formed when the lifting seat (2) is covered on the base (1), a sealing ring (4) for sealing the joint of the base (1) and the lifting seat (2) is arranged between the base (1) and the lifting seat (2), an annular groove (11) is vertically and downwards formed in the base (1) from the upper end face of the base, the sealing ring (4) is embedded in the annular groove (11), and a water cooling device (5) for cooling the base (1) is further arranged on the lower end face of the base (1).
2. The high weatherability vacuum mechanism for a reflow oven according to claim 1, wherein: the water cooling device (5) comprises a water cooling shell (51) fixed on the lower end face of the base (1), a water cooling cavity (52) is formed in the water cooling shell (51), a water inlet (53) and a water outlet (54) communicated with the water cooling cavity (52) are further formed in the water cooling shell (51), and the water inlet (53) and the water outlet (54) are communicated with a water tank located outside through a water pipe.
3. The high weatherability vacuum mechanism for a reflow oven according to claim 2, wherein: the water-cooling cavity (52) is of a snake-shaped structure, and the water inlet (53) and the water outlet (54) are respectively communicated with two ends of the water-cooling cavity (52).
4. The high weatherability vacuum mechanism for a reflow oven according to claim 1, wherein: the vacuum mechanism body is arranged between the heating cavity and the cooling cavity, and the water cooling device (5) is arranged on one side, close to the heating cavity, of the base (1).
5. The high weatherability vacuum mechanism for a reflow oven according to claim 1, wherein: the height of the sealing ring (4) is greater than the depth of the annular groove (11).
6. The high weatherability vacuum mechanism for a reflow oven according to claim 1, wherein: the lifting driving assembly (3) comprises two lifting cylinders (31) fixed in the reflow soldering furnace, the two lifting cylinders (31) are symmetrically arranged on two sides of the base (1), and the lifting seat (2) is driven by the lifting cylinders (31) to move up and down.
7. The high weatherability vacuum mechanism for a reflow oven according to claim 6, wherein: a supporting rod (32) is fixed on the lifting seat (2), a lifting plate (33) is fixed at the lower end of the supporting rod (32), an output shaft of the lifting cylinder (31) is fixedly connected with the lifting plate (33), the lifting cylinder (31) is fixed in the reflow soldering furnace through a fixing plate (34), and a guide rod (35) capable of moving up and down along the fixing plate (34) is further arranged on the lifting plate (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023275964.7U CN214291291U (en) | 2020-12-29 | 2020-12-29 | High-weather-resistance vacuum mechanism for reflow oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023275964.7U CN214291291U (en) | 2020-12-29 | 2020-12-29 | High-weather-resistance vacuum mechanism for reflow oven |
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| CN214291291U true CN214291291U (en) | 2021-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202023275964.7U Active CN214291291U (en) | 2020-12-29 | 2020-12-29 | High-weather-resistance vacuum mechanism for reflow oven |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226906A (en) * | 2022-01-13 | 2022-03-25 | 诚联恺达科技有限公司 | Vacuum structure of welding furnace |
| CN116000401A (en) * | 2023-02-24 | 2023-04-25 | 芯朋半导体科技(如东)有限公司 | Soldering vacuum furnace |
-
2020
- 2020-12-29 CN CN202023275964.7U patent/CN214291291U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114226906A (en) * | 2022-01-13 | 2022-03-25 | 诚联恺达科技有限公司 | Vacuum structure of welding furnace |
| CN116000401A (en) * | 2023-02-24 | 2023-04-25 | 芯朋半导体科技(如东)有限公司 | Soldering vacuum furnace |
| CN116000401B (en) * | 2023-02-24 | 2023-09-12 | 芯朋半导体科技(如东)有限公司 | Soldering vacuum furnace |
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