CN205406943U - Full -automatic LD chip eutectic device - Google Patents
Full -automatic LD chip eutectic device Download PDFInfo
- Publication number
- CN205406943U CN205406943U CN201620148980.4U CN201620148980U CN205406943U CN 205406943 U CN205406943 U CN 205406943U CN 201620148980 U CN201620148980 U CN 201620148980U CN 205406943 U CN205406943 U CN 205406943U
- Authority
- CN
- China
- Prior art keywords
- chip
- eutectic
- automatic
- full
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a full -automatic LD chip eutectic device, rest the head on including operation panel and the heat that is used for installing the LD chip, be provided with the chip manipulator that is used for absorbing and removes heat pillow and LD chip on the operation panel, be used for to shoot the location the positioner that shoots, displacement compensation arrangement, be used for installation heat pillow the tube socket, be used for picking up the tube socket the tube socket manipulator, be used for connecing the eutectic solder that heat pillow and LD chip eutectic solder received on the tube socket device, connecing device complex bonding tool to weld power adjusting device with eutectic solder, still weld the drive arrangement that power adjusting device provided power including the servo motor that is used for the whole eutectic device of accurate control with for chip manipulator, displacement compensation arrangement, tube socket manipulator, bonding tool, controlling through servo motor, shooing positioner and displacement compensation arrangement to the heat pillow and the LD chip is absorb and the accurate positioning, high and identity of production automation degree and qualification rate are high, have improved production efficiency.
Description
Technical field
This utility model relates to optical device chip encapsulation technology field, more particularly, it relates to a kind of full-automatic LD chip eutectic device.
Background technology
TO encapsulation is former refers to a kind of transistor outline package, is then evolved into the Laser Devices of a kind of coaxial packaging in laser tube (LD) Packaging Industry；Conventional LD is packaged with TO46 and TO56 two kinds, stem diameter respectively 4.6mm and the 5.6mm of TO46, TO56 encapsulation；The shell overall dimensions of both packing forms is limited, and its heat-sinking capability just determines it and is mainly used in low-power laser encapsulation；Wherein the laser tube of TO56 encapsulation is the most extensive in optical communication sector application；
Eutectic refers to the phenomenon that the eutectic thing of eutectic solder generation at a certain temperature fuses, and eutectic alloy directly becomes liquid from solid-state, and without the plastic stage, is the liquid balancing response that is simultaneously generated two solid-states；LD chip is undertaken being installed on substrate by eutectic technology, will be provided with better heat dispersion, higher luminous efficiency and higher production efficiency；At present, during the base of optical device TO56 produces with heat pillow and LD chip eutectic, domestic production business mostly uses semiautomatic equipment or artificial by operation manual operation, and production efficiency is low and product uniformity and qualified rate variance, adopts overseas equipment then expensive.
Utility model content
The technical problems to be solved in the utility model is in that, for the drawbacks described above of prior art, it is provided that the full-automatic LD chip eutectic device that a kind of cost is low, efficiency is high and automaticity is high.
This utility model solves its technical problem and be the technical scheme is that
A kind of full-automatic LD chip eutectic device of structure, including operating board with for installing the heat pillow of LD chip；Wherein, described operating board is provided with the chip mechanical hand for drawing and move described heat pillow and described LD chip, for the positioner of taking pictures of location of taking pictures, displacement compensation device, for installing the base of described heat pillow, for picking up the base mechanical hand of described base, for the soldering tip that described heat pillow and the described LD chip eutectic eutectic welder that is welded on described base coordinate with described eutectic welder is welded apparatus for adjusting force；Also include the servomotor for accurately controlling whole eutectic device, and the driving device of power is provided for described chip mechanical hand, described displacement compensation device, described base mechanical hand, described soldering tip weldering apparatus for adjusting force.
Full-automatic LD chip eutectic device described in the utility model, wherein, also includes at the oxidation that described heat pillow and described LD chip eutectic are welded in described base eutectic welding process to prevent oxidation.
Full-automatic LD chip eutectic device described in the utility model, wherein, fills just like antioxidation gases such as nitrogen or the mixing gases including nitrogen in described oxidation.
Full-automatic LD chip eutectic device described in the utility model, wherein, described operating board is additionally provided with for resting the head on from described heat and the jacking system of heat pillow and described LD chip described in jack-up on described LD chip material indigo plant film.
Full-automatic LD chip eutectic device described in the utility model, wherein, described jacking system is thimble.
Full-automatic LD chip eutectic device described in the utility model, wherein, described operating board is additionally provided with eutectic platform；Described heat pillow and described LD chip eutectic are welded to the eutectic welding sequence of described base and complete on described eutectic platform.
Full-automatic LD chip eutectic device described in the utility model, wherein, described in positioner of taking pictures be CCD camera；Described operating board is provided with the CCD mounting seat for positioner of taking pictures described in installing.
Full-automatic LD chip eutectic device described in the utility model, wherein, also includes base charging tray mounting seat and base turning device.
Full-automatic LD chip eutectic device described in the utility model, wherein, described driving device is cylinder.
nullThe beneficial effects of the utility model are in that: be controlled by servomotor，Driving device provides power，Base mechanical hand pickup base is positioned over, after moving, the eutectic welding position specified，It is heated to uniform temperature，Simultaneously，Heat pillow and LD chip are taken pictures location by positioner of taking pictures，It is transferred to appointment position after chip mechanical hand first extract heat pillow and carries out taking pictures after contrast standard masterplate，It is positioned over displacement compensation device to be accurately positioned，Eutectic on the ad-hoc location of base being heated to uniform temperature is rested the head on and be placed with to chip mechanical hand extract heat afterwards，After then LD chip is drawn and adopt the location mode identical with heat pillow to be accurately positioned by positioner of taking pictures with displacement compensation device by chip mechanical hand，LD chip is placed with on the appointment position of heat pillow，Eutectic is carried out by high temperature，To complete base and the packaging technology of LD chip eutectic，Reach automated production，Improve production efficiency，Homogeneity of product and qualification rate are high simultaneously；Overall structure is simple, and cost is low.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below in conjunction with drawings and Examples, the utility model is described in further detail, accompanying drawing in the following describes is only the section Example of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawings according to these accompanying drawings:
Fig. 1 is the full-automatic LD chip eutectic device structural representation of this utility model preferred embodiment；
Fig. 2 is the full-automatic LD chip eutectic device theory diagram of this utility model preferred embodiment.
Detailed description of the invention
In order to make the purpose of this utility model embodiment, technical scheme and advantage clearly, clear, complete description is carried out below in conjunction with the technical scheme in this utility model embodiment, obviously, described embodiment is section Example of the present utility model, rather than whole embodiment.Based on embodiments of the invention, the every other embodiment that those of ordinary skill in the art obtain under the premise not paying creative work, broadly fall into protection domain of the present utility model.
The full-automatic LD chip eutectic device of this utility model preferred embodiment is as it is shown in figure 1, consult Fig. 2 simultaneously, including operating board 1 with for installing the heat pillow 16 of LD chip 2；Operating board 1 is provided with the chip mechanical hand 3 for drawing and move heat pillow 16 and LD chip 2, for the positioner 4 of taking pictures of location of taking pictures, displacement compensation device 5, for installing the base 6 of heat pillow 16, for picking up the base mechanical hand 7 of base 6, for heat being rested the head on 16 and the soldering tip weldering apparatus for adjusting force 9 that coordinates with eutectic welder 8 of the LD chip 2 eutectic eutectic welder 8 that is welded on base 6；Also include the servomotor (not shown) for accurately controlling whole eutectic device, and the driving device (not shown) of power is provided for chip mechanical hand 3, displacement compensation device 4, base mechanical hand 7, soldering tip weldering apparatus for adjusting force 9；nullIt is controlled by servomotor (not shown)，Driving device (not shown) provides power，Base mechanical hand 7 picks up after base 6 moves and is positioned over the eutectic welding position specified，It is heated to uniform temperature，Simultaneously，Positioner 4 of taking pictures heat is rested the head on 16 and LD chip 2 take pictures location，It is transferred to appointment position after chip mechanical hand 3 first extract heat pillow 16 and carries out taking pictures after contrast standard masterplate，It is positioned over displacement compensation device 5 to be accurately positioned，Chip mechanical hand 3 extract heat is rested the head on 16 and is placed with eutectic on the ad-hoc location of base 6 being heated to uniform temperature afterwards，Then LD chip 2 is drawn by take pictures positioner 4 and displacement compensation device 5 and is adopted and rests the head on after 16 identical location modes are accurately positioned with heat by chip mechanical hand 3，LD chip 2 is placed with on the appointment position of heat pillow 16，Eutectic is carried out by high temperature，To complete base 6 and the packaging technology of LD chip 2 eutectic，Reach automated production，Improve production efficiency，Homogeneity of product and qualification rate are high simultaneously；Overall structure is simple, and cost is low.
As depicted in figs. 1 and 2, also include for heat is rested the head on 16 and LD chip 2 eutectic be welded in base 6 eutectic welding process to prevent the oxidation 15 of oxidation, it is ensured that conforming product rate.
As depicted in figs. 1 and 2, fill just like antioxidation gases such as nitrogen or the mixing gases including nitrogen in oxidation 15, it is ensured that conforming product rate.
As depicted in figs. 1 and 2, operating board 1 is additionally provided with for resting the head on the jacking system 10 of jack-up heat pillow 16 and LD chip 2 on 16 and LD chip 2 material indigo plant film from heat.
As it is shown in figure 1, jacking system 10 is thimble, reduce cost.
As depicted in figs. 1 and 2, operating board 1 is additionally provided with eutectic platform 11；Heat pillow 16 and LD chip 2 eutectic are welded to the eutectic welding sequence of base 6 and complete on eutectic platform 11.
As depicted in figs. 1 and 2, positioner 4 is taken pictures for CCD camera；Operating board 1 is provided with the CCD mounting seat 12 for installing positioner 4 of taking pictures.
As depicted in figs. 1 and 2, base charging tray mounting seat 13 and base turning device 14 are also included.
As depicted in figs. 1 and 2, driving device (not shown) is cylinder, reduces cost, and production stability is good, and precision is high.
It should be appreciated that for those of ordinary skills, it is possible to improved according to the above description or converted, and all these are improved and convert the protection domain that all should belong to this utility model claims.
Claims (9)
1. a full-automatic LD chip eutectic device, including operating board with for installing the heat pillow of LD chip；It is characterized in that, described operating board is provided with the chip mechanical hand for drawing and move described heat pillow and described LD chip, for the positioner of taking pictures of location of taking pictures, displacement compensation device, for installing the base of described heat pillow, for picking up the base mechanical hand of described base, for the soldering tip that described heat pillow and the described LD chip eutectic eutectic welder that is welded on described base coordinate with described eutectic welder is welded apparatus for adjusting force；Also include the servomotor for accurately controlling whole eutectic device, and the driving device of power is provided for described chip mechanical hand, described displacement compensation device, described base mechanical hand, described soldering tip weldering apparatus for adjusting force.
2. full-automatic LD chip eutectic device according to claim 1, it is characterised in that also include at the oxidation that described heat pillow and described LD chip eutectic are welded in described base eutectic welding process to prevent oxidation.
3. full-automatic LD chip eutectic device according to claim 2, it is characterised in that fill just like antioxidation gases such as nitrogen or the mixing gases including nitrogen in described oxidation.
4. full-automatic LD chip eutectic device according to claim 1, it is characterised in that be additionally provided with on described operating board for resting the head on from described heat and the jacking system of heat pillow and described LD chip described in jack-up on described LD chip material indigo plant film.
5. full-automatic LD chip eutectic device according to claim 4, it is characterised in that described jacking system is thimble.
6. full-automatic LD chip eutectic device according to claim 1, it is characterised in that be additionally provided with eutectic platform on described operating board；Described heat pillow and described LD chip eutectic are welded to the eutectic welding sequence of described base and complete on described eutectic platform.
7. full-automatic LD chip eutectic device according to claim 1, it is characterised in that described in positioner of taking pictures be CCD camera；Described operating board is provided with the CCD mounting seat for positioner of taking pictures described in installing.
8. full-automatic LD chip eutectic device according to claim 1, it is characterised in that also include base charging tray mounting seat and base turning device.
9. full-automatic LD chip eutectic device according to claim 1, it is characterised in that described driving device is cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620148980.4U CN205406943U (en) | 2016-02-26 | 2016-02-26 | Full -automatic LD chip eutectic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620148980.4U CN205406943U (en) | 2016-02-26 | 2016-02-26 | Full -automatic LD chip eutectic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205406943U true CN205406943U (en) | 2016-07-27 |
Family
ID=56425380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620148980.4U Active CN205406943U (en) | 2016-02-26 | 2016-02-26 | Full -automatic LD chip eutectic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205406943U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107123927A (en) * | 2017-06-02 | 2017-09-01 | 广东瑞谷光网通信股份有限公司 | LD chip eutectic welding systems |
| CN108418088A (en) * | 2018-03-08 | 2018-08-17 | 中国科学技术大学 | A kind of optical resonator of changeable speculum for free electron laser |
| CN109300797A (en) * | 2018-11-21 | 2019-02-01 | 山东农业工程学院 | A kind of depth chamber leadless chip eutectic welder and method |
| CN109873068A (en) * | 2019-01-08 | 2019-06-11 | 王耀村 | A kind of eutectic machine |
| CN110170785A (en) * | 2019-05-31 | 2019-08-27 | 广东瑞谷光网通信股份有限公司 | A kind of LD chip positioning device |
| CN111394777A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Method for monitoring ejector pin ejection force for chip coating process |
| CN112216632A (en) * | 2020-09-24 | 2021-01-12 | 广东海信宽带科技有限公司 | LD chip eutectic welding platform |
-
2016
- 2016-02-26 CN CN201620148980.4U patent/CN205406943U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107123927A (en) * | 2017-06-02 | 2017-09-01 | 广东瑞谷光网通信股份有限公司 | LD chip eutectic welding systems |
| CN107123927B (en) * | 2017-06-02 | 2023-04-18 | 广东瑞谷光网通信股份有限公司 | Eutectic welding system for LD chip |
| CN108418088A (en) * | 2018-03-08 | 2018-08-17 | 中国科学技术大学 | A kind of optical resonator of changeable speculum for free electron laser |
| CN109300797A (en) * | 2018-11-21 | 2019-02-01 | 山东农业工程学院 | A kind of depth chamber leadless chip eutectic welder and method |
| CN109873068A (en) * | 2019-01-08 | 2019-06-11 | 王耀村 | A kind of eutectic machine |
| CN109873068B (en) * | 2019-01-08 | 2024-03-15 | 王耀村 | Eutectic machine |
| CN110170785A (en) * | 2019-05-31 | 2019-08-27 | 广东瑞谷光网通信股份有限公司 | A kind of LD chip positioning device |
| CN111394777A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Method for monitoring ejector pin ejection force for chip coating process |
| CN111394777B (en) * | 2020-02-19 | 2022-02-22 | 深圳市海铭德科技有限公司 | Method for monitoring ejector pin ejection force for chip coating process |
| CN112216632A (en) * | 2020-09-24 | 2021-01-12 | 广东海信宽带科技有限公司 | LD chip eutectic welding platform |
| CN112216632B (en) * | 2020-09-24 | 2024-04-19 | 广东海信宽带科技有限公司 | LD chip eutectic welding table |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205406943U (en) | Full -automatic LD chip eutectic device | |
| CN102689070B (en) | Eutectic soldering equipment of LED wafer | |
| CN203566033U (en) | Automatic laser tin soldering machine | |
| CN202861569U (en) | Circuit board welding-based welding system | |
| CN206952361U (en) | Jig device | |
| KR102060831B1 (en) | Flip chip packaging method, flux head using the same and flux head manufacturing method thereof | |
| CN202555932U (en) | Laser soft soldering device | |
| CN102881599A (en) | Ball attachment process for ball grid array | |
| CN105689833A (en) | Brazing sealing covering method and structure for shell and cover plate of microcircuit module | |
| CN208772654U (en) | Automatic tin pellet bonding machine | |
| CN110280862A (en) | A kind of welding system and its method of device pin | |
| CN102858096B (en) | Device for SMT (surface mount technology) preprocessing of POP (package on package) devices | |
| CN104201120B (en) | Semiconductor flip packaging method | |
| JP6832675B2 (en) | Pre-soldering system and method | |
| CN102335790B (en) | Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table | |
| CN102528199B (en) | Welding method for sealed package of electronic components | |
| CN205166093U (en) | Laser soldering tin machine | |
| CN105014172A (en) | Novel mobile phone camera welding technology | |
| CN102528357B (en) | Glue-dispensing positioning clamp and method for utilizing glue-dispensing positioning clamp to calibrate glue-dispensing needle head | |
| KR20170017044A (en) | Soldering device for camera module | |
| CN207183791U (en) | A kind of full-automatic impulse welding eutectic devices of LD | |
| CN204893414U (en) | Laser cladding and welding equipment | |
| CN102581410A (en) | Soldering process for diode chip | |
| CN107824939B (en) | A kind of photodetector parallel seam welding device and method | |
| CN203418195U (en) | Laser tin soldering device of micro-electronic circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |