CN102858096B - Device for SMT (surface mount technology) preprocessing of POP (package on package) devices - Google Patents
Device for SMT (surface mount technology) preprocessing of POP (package on package) devices Download PDFInfo
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- CN102858096B CN102858096B CN201210335633.9A CN201210335633A CN102858096B CN 102858096 B CN102858096 B CN 102858096B CN 201210335633 A CN201210335633 A CN 201210335633A CN 102858096 B CN102858096 B CN 102858096B
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- pop
- steel mesh
- smt
- smelting tool
- anchor point
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- 238000007781 pre-processing Methods 0.000 title claims abstract description 21
- 238000005516 engineering process Methods 0.000 title abstract description 9
- 238000003723 Smelting Methods 0.000 claims abstract description 38
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 38
- 239000010959 steel Substances 0.000 claims abstract description 38
- 238000007639 printing Methods 0.000 claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 claims description 54
- 238000004519 manufacturing process Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 18
- 238000003466 welding Methods 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 4
- 238000010079 rubber tapping Methods 0.000 abstract description 4
- 238000003491 array Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 22
- 101000966429 Chlamydomonas reinhardtii Dynein, 70 kDa intermediate chain, flagellar outer arm Proteins 0.000 description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000010586 diagram Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an SMT (surface mount technology) preprocessing device of POP (package on package) devices. The device includes: a printer, a chip mounter, a reflow oven, a steel mesh and a smelting device, wherein the steel mesh is provided with one or multiple tapping arrays arranged in a printing region of the printer, IC (integrated circuit) slots corresponding to the tapping arrays one by one are opened on the smelting device, a lower layer IC is used for housing the POP devices, a center through hole is arranged on the IC slots, and the IC slots include a first ladder and a second ladder arranged under the inside of the first ladder. By using the inventive device, cost and investment are reduced, the defects of conventional processing arts are overcome, surface mount of the POP devices and welding difficulty are simplified, and product reliability is greatly improved.
Description
Technical field
The present invention relates to surface mounting technology field, particularly relate to a kind of POP packaging SMT pre-processing devices.
Background technology
Mobile communication product is just turning to 3G (Third Generation) Moblie (3G) system, it provide more bandwidth (1-2M bi t per second), more data can be transmitted on a wireless network, this not only requires the Digital Signal Processing time faster, also require the memory response time faster, therefore the reliability of packaging is had higher requirement, to this, many schemes are devised in the industry, such as stacked package (POP).
At the 22nd chapters and sections (Fine-pitch of JSTD95 standard, Square Ball grid ArrayPackage (FBGA) Package-on-Package (POP), in September, 2007, B version) in, define POP size and be 21X21mm to the maximum, pin-pitch 0.4mm, 0.5mm, 0.65mm and 0.80mm, have higher requirement to production technology.At present, the upper and lower layer IC (chip) of POP packaging adopts SMT (surface mounting technology) to produce usually, namely these SMT equipment of printing machine, chip mounter, reflow oven are utilized to mount upper and lower layer IC, weld, its concrete grammar is: the preparation first carrying out the attachment of POP packaging, namely special for POP fly to reach be contained on corresponding chip mounter, and fly to reach on pallet at POP and put into the special production auxiliary materials of POP (the special weld-aiding cream of POP or the special tin cream of POP), utilize the scraper flying to reach to be struck off by auxiliary material, after completing above-mentioned preparation, SMT line body drops into PCB and carries out paste solder printing, the lower floor IC that the PCB completing printing carries out POP packaging mounts, then recycling is equipped with the upper strata IC of the special chip mounter pickup POP packaging flying to reach of POP and upper strata IC is moved to POP is special to be flown to reach above pallet, and a certain height be displaced downwardly to according to the parameter that chip mounter is arranged on pallet, the tin ball of the upper strata IC lower surface of POP packaging is made to dip in auxiliary material, chip mounter is positioned over the upper strata IC having dipped in auxiliary material the upper surface of lower floor IC more accurately, the solder joint of the tin ball of upper strata IC lower surface and lower floor IC upper surface is bondd mutually, finally the POP packaging of bonding is sent into reflow oven, complete the welding of ashbury metal.
Adopt above-mentioned existing method, chip mounter upgrading or upgrade, POP specially flies to reach, the special production auxiliary materials of POP all needs higher cost to drop into, and upper strata IC shake-up lower floor IC causes displacement to be the difficult point that production process controls when dipping in amount and the attachment of auxiliary material, be easy to the common deficiency caused in production technology, pillow nest 1 as in Fig. 1: the tin ball 21 of upper strata IC2 and the solder joint 31 of lower floor IC3 become the figure of eight after completing and welding, also has back taper 4: upper and lower layer solder joint in echelon, solder joint is unequal with the bonding area of upper and lower layer IC respectively, differs larger.Thus affect the reliability of product, and the section of desirable solder joint 5 should as column, solder joint is closely equal with the bonding area of upper and lower layer IC respectively, is very beneficial for the raising of product reliability.
Summary of the invention
For the deficiencies in the prior art, object of the present invention is intended to provide a kind of simple and effective, POP packaging SMT pre-processing devices with low cost, of fine qualities.
The present invention adopts following technical scheme for achieving the above object:
A kind of POP packaging SMT pre-processing devices, comprises printing machine, chip mounter, reflow oven, steel mesh and smelting tool, wherein, steel mesh is provided with one or more opening array being positioned at press printing scope; Described smelting tool offers and opening array IC groove one to one, and for the lower floor IC of accommodating POP packaging, IC groove is provided with central through hole, and IC groove comprises the first ladder and the second ladder being positioned at the first ladder side-lower.
Wherein, described printing machine is provided with the CCD para-position system for carrying out exactitude position to steel mesh and smelting tool, corresponding, the periphery of steel mesh is provided with anchor point, the periphery of described smelting tool is provided with the lower anchor point matched with upper anchor point, identifies that upper and lower anchor point carries out exactitude position to steel mesh and smelting tool in process of production by CCD para-position system.
Wherein, described upper anchor point has two at least, is arranged at the diagonal angle place of steel mesh, and described lower anchor point also has two at least, is arranged at the diagonal angle place of smelting tool.
Wherein, the perforate of described opening array is circular or square.
Wherein, described central through hole is circular or square.
A kind of POP packaging SMT pre-processing devices set forth in the present invention, its beneficial effect is: adopt this device, the production auxiliary materials that current SMT can be used general and equipment, without the need to special production auxiliary materials, also without the need to again buying special equipment, thus greatly reduce cost input, and in advance the upper and lower layer IC of POP packaging is processed into one by this device, effectively overcome the defect in conventional P OP packaging processing technology, greatly simplify the attachment of POP packaging, welding difficulty, thus simple and effective, significantly improves the reliability of product.
Accompanying drawing explanation
Fig. 1 is the defect diagram of conventional machining process;
Fig. 2 is the schematic flow sheet of a kind of POP packaging of the present invention SMT pre-process method;
Fig. 3 is the configuration diagram of the steel mesh of a kind of POP packaging of the present invention SMT pre-processing devices;
Fig. 4 is the configuration diagram of the smelting tool of a kind of POP packaging of the present invention SMT pre-processing devices;
Fig. 5 is that the partial structurtes of the smelting tool of a kind of POP packaging of the present invention SMT pre-processing devices amplify diagram;
Fig. 6 be a kind of POP packaging of the present invention SMT pre-processing devices in process of production, lower floor IC is placed in the view in smelting tool IC groove;
Fig. 7 be a kind of POP packaging of the present invention SMT pre-processing devices in process of production, steel mesh is pressed together on the view be equipped with on the smelting tool of lower floor IC;
Fig. 8 be a kind of POP packaging of the present invention SMT pre-processing devices in process of production, the upper strata IC of POP packaging is mounted on the view on lower floor IC by chip mounter;
Fig. 9 be a kind of POP packaging of the present invention SMT pre-processing devices in process of production, the upper and lower layer IC of POP packaging completes the view of welding;
Figure 10 be a kind of POP packaging of the present invention SMT pre-processing devices in process of production, POP packaging after upper and lower layer IC completes welding, the view of finally taking out from IC groove.
Description of reference numerals:
1, nest is rested the head on; 2, upper strata IC; 21, tin ball; 3, lower floor IC; 31, solder joint; 4, back taper; 5, desirable solder joint; 10, printing machine; 20, chip mounter; 30, reflow oven; 40, steel mesh; 41, opening array; 42, upper anchor point; 50, smelting tool; 51, IC groove; 511, central through hole; 512, the first ladder; 513, the second ladder; 52, lower anchor point; 60, upper strata IC; 70, lower floor IC; 71, body; 72, tin ball; 80, POP packaging.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the invention will be further described.
Please refer to shown in Fig. 2, that show the concrete production procedure of a kind of POP of the present invention packaging SMT pre-process method, comprise the steps:
A. the lower floor IC of POP packaging is put into the IC groove of the correspondence that smelting tool is offered;
B. the steel mesh being provided with the opening array corresponding with IC groove is loaded printing machine, add production auxiliary materials at the non-tapping of steel mesh;
C. the smelting tool installing POP packaging lower floor IC is sent into printing machine, steel mesh is pressed together on the upper surface of smelting tool, and the opening array of steel mesh is positioned on the lower floor IC of corresponding IC groove;
D. start printing machine, the scraper of printing machine moves back and forth, and production auxiliary materials is scraped in the perforate of steel mesh, completes the printing of the upper surface solder joint production auxiliary materials of lower floor IC;
E. smelting tool is sent into chip mounter, chip mounter picks up the upper strata IC of POP packaging and it is positioned over accurately on lower floor IC, and the upper surface solder joint that the tin ball of upper strata IC lower surface and lower floor IC are printed with production auxiliary materials bonds, and completes upper and lower layer IC and mounts;
F. sending completing the POP packaging after attachment into reflow oven, completing and the upper and lower layer IC of POP packaging is welded, making it to be combined into one;
G. the POP packaging be welded as a whole is taken out in the IC groove of smelting tool.
Wherein, described production auxiliary materials is tin cream or scaling powder, before print production auxiliary material, the debugging before printing auxiliary material can be carried out in advance in stepb, then in steps d, according to debug results before this, entering production auxiliary materials in steel mesh perforate will be in the altitude range of specifying.
Please refer to shown in Fig. 3 to Figure 10, present invention also offers a kind of POP packaging SMT pre-processing devices, comprise printing machine 10, chip mounter 20, reflow oven 30, steel mesh 40 and smelting tool 50, wherein, as Fig. 3, steel mesh 40 is provided with one or more opening array 41 being positioned at printing machine 10 print range, when opening array 41 is only one, it is preferentially arranged at the center of steel mesh 40, time multiple, opening array 41 is put to surrounding radiation to increase the quantity of opening array 41 centered by steel mesh 40 center, can enhance productivity to greatest extent like this, the perforate of opening array 41 can be circle, square or other shape, if be circular, the aperture of perforate should be less than the diameter of the tin ball of upper strata IC60 lower surface.As Fig. 4, Fig. 5, described smelting tool 50 offers and opening array 41 IC groove 51 one to one, for the lower floor IC70 of accommodating POP packaging 80, IC groove 51 is provided with central through hole 511, central through hole 511 can be circle, square or other shape, and during production, the vacuum pump of printing machine 10 to be stayed a layer IC70 by this central through hole 511 vacuum suction, thus the location realized lower floor IC70, IC groove 51 comprises the first ladder 512 and the second ladder 513 being positioned at the first ladder 512 side-lower.
For ease of positioning steel mesh 40 and smelting tool 50, described printing machine 10 is provided with the CCD para-position system for carrying out exactitude position to steel mesh 40 and smelting tool 50, corresponding, the periphery of steel mesh 40 is provided with anchor point 42, the periphery of smelting tool 50 is provided with the lower anchor point 52 matched with upper anchor point 42, identifies that upper and lower anchor point carries out exactitude position to steel mesh 40 and smelting tool 50 in process of production by CCD para-position system.Upper anchor point 42 at least will have two, be arranged at the diagonal angle place of steel mesh 40, equally, lower anchor point 52 also at least will have two, is arranged at the diagonal angle place of smelting tool 50, certainly, upper anchor point 42 and lower anchor point 52 are not limited to two, and also can be three, four or more, upper anchor point 42 be the mark round dots forming high-contrast with steel mesh 40 true qualities, lower anchor point 52 is the mark round dot forming high-contrast with smelting tool 50 true qualities, both all can identify by CCD para-position system.
When adopting this device to carry out production and processing, its detailed process is consistent with said method: first, the lower floor IC70 of POP packaging 80 is put into the IC groove 51 (as Fig. 6) of the correspondence that smelting tool 50 is offered; Then, the steel mesh 40 being provided with the opening array 41 corresponding with IC groove 51 is loaded printing machine 10, add production auxiliary materials at the non-tapping of steel mesh 40; Then, the smelting tool 50 installing POP packaging 80 lower floor IC70 is sent into printing machine 10, after the contraposition of CCD para-position system, steel mesh 40 is pressed together on the upper surface of smelting tool 50, and the opening array 41 of steel mesh 40 is positioned on the lower floor IC70 of corresponding IC groove 51; Then, start printing machine 10, the scraper of printing machine 10 moves back and forth, and production auxiliary materials is scraped in the perforate of steel mesh 40, completes the printing (as Fig. 7) of the upper surface solder joint production auxiliary materials of lower floor IC70; Again then, smelting tool 50 is sent into chip mounter 20, chip mounter 20 picks up the upper strata IC60 of POP packaging 80 and it is positioned over accurately on lower floor IC70, the upper surface solder joint that the tin ball of upper strata IC60 lower surface and lower floor IC70 are printed with production auxiliary materials bonds, and completes upper and lower layer IC and mounts (as Fig. 8); After this, sending completing the POP packaging 80 after attachment into reflow oven 30, completing and the upper and lower layer IC of POP packaging 80 is welded, making it be combined into one (as Fig. 9); Finally, the POP packaging 80 be welded as a whole is taken out (as Figure 10) in the IC groove 51 of smelting tool 50.Time in the IC groove 51 lower floor IC70 of POP packaging 80 being positioned over smelting tool 50, the body 71 of lower floor IC70 is supported by the first ladder 512 of IC groove 51, 72, the tin ball of lower floor IC70 lower surface is positioned at the second ladder 513, that is: the length of IC groove 51, wide, high identical with lower floor IC70, the height of the first ladder 512 equals body 71 height of lower floor IC70, width is equal to or less than the distance of lower floor IC70 outermost tin ball 72 to body 71 limit, the height of the second ladder 513 is equal to or greater than the height of tin ball 72 on lower floor IC70 lower surface, width is less than body 71 width of lower floor IC70.
Adopt this method or device, the production auxiliary materials that current SMT can be used general and equipment, without the need to special production auxiliary materials, also without the need to again buying special equipment, thus greatly reduce cost input, and in advance the upper and lower layer IC of POP packaging 80 is processed into one by this method or device, effectively overcome the defect in conventional P OP packaging 80 processing technology, greatly simplify the attachment of POP packaging 80, welding difficulty, significantly improve the reliability of product.
The above, it is only present pre-ferred embodiments, not technical scope of the present invention is imposed any restrictions, thus every above embodiment is done according to technical spirit of the present invention any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (5)
1. a POP packaging SMT pre-processing devices, is characterized in that, comprises printing machine, chip mounter, reflow oven, steel mesh and smelting tool, wherein, described steel mesh is provided with one or more opening array being positioned at press printing scope; Described smelting tool offers and opening array IC groove one to one, and for the lower floor IC of accommodating POP packaging, IC groove is provided with central through hole, and IC groove comprises the first ladder and the second ladder being positioned at the first ladder side-lower.
2. a kind of POP packaging SMT pre-processing devices according to claim 1, it is characterized in that, described printing machine is provided with the CCD para-position system for carrying out exactitude position to steel mesh and smelting tool, corresponding, the periphery of steel mesh is provided with anchor point, the periphery of described smelting tool is provided with the lower anchor point matched with upper anchor point, identifies that upper and lower anchor point carries out exactitude position to steel mesh and smelting tool in process of production by CCD para-position system.
3. a kind of POP packaging SMT pre-processing devices according to claim 2, it is characterized in that, described upper anchor point has two at least, is arranged at the diagonal angle place of steel mesh, and described lower anchor point also has two at least, is arranged at the diagonal angle place of smelting tool.
4. a kind of POP packaging SMT pre-processing devices according to claim 1, is characterized in that, the perforate of described opening array is circular or square.
5. a kind of POP packaging SMT pre-processing devices according to claim 1, is characterized in that, described central through hole is circular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210335633.9A CN102858096B (en) | 2012-09-12 | 2012-09-12 | Device for SMT (surface mount technology) preprocessing of POP (package on package) devices |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210335633.9A CN102858096B (en) | 2012-09-12 | 2012-09-12 | Device for SMT (surface mount technology) preprocessing of POP (package on package) devices |
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| CN102858096B true CN102858096B (en) | 2015-04-08 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029506A (en) * | 2014-05-20 | 2014-09-10 | 海门市曼博莱电子发展有限公司 | SMT chip-mounting technology |
| CN105263305A (en) * | 2015-10-30 | 2016-01-20 | 上海斐讯数据通信技术有限公司 | Feeder and manufacturing method thereof |
| CN105235366B (en) * | 2015-11-09 | 2017-12-22 | 惠州Tcl移动通信有限公司 | The pcb board fixing device of stencil printer |
| CN111295050A (en) * | 2020-02-27 | 2020-06-16 | 梅州市志浩电子科技有限公司 | Novel LED lamp panel alignment processing method |
| CN115250580B (en) * | 2021-04-26 | 2024-09-13 | 深南电路股份有限公司 | Transfer device for solder preform and method for processing electronic device |
| CN113923971B (en) * | 2021-10-18 | 2023-04-25 | 苏州光世代机电设备有限公司 | POP chip integration jig and use method thereof |
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| CN101136343A (en) * | 2006-12-08 | 2008-03-05 | 中兴通讯股份有限公司 | Integrated circuit and heat radiation member connecting method |
| CN201601116U (en) * | 2009-11-06 | 2010-10-06 | 中兴通讯股份有限公司 | Patching unit of POP encapsulating device |
| EP2330621A1 (en) * | 2009-12-02 | 2011-06-08 | MStar Semiconductor, Inc | Package on package method, structure and associated PCB system |
| CN202738277U (en) * | 2012-09-12 | 2013-02-13 | 梁锦贤 | SMT preprocessing device for POP package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011166096A (en) * | 2009-03-06 | 2011-08-25 | Panasonic Corp | Surface-mounted device and printed board, and structure for mounting surface-mounted device using them |
| JP5342422B2 (en) * | 2009-12-10 | 2013-11-13 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
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- 2012-09-12 CN CN201210335633.9A patent/CN102858096B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101136343A (en) * | 2006-12-08 | 2008-03-05 | 中兴通讯股份有限公司 | Integrated circuit and heat radiation member connecting method |
| CN201601116U (en) * | 2009-11-06 | 2010-10-06 | 中兴通讯股份有限公司 | Patching unit of POP encapsulating device |
| EP2330621A1 (en) * | 2009-12-02 | 2011-06-08 | MStar Semiconductor, Inc | Package on package method, structure and associated PCB system |
| CN202738277U (en) * | 2012-09-12 | 2013-02-13 | 梁锦贤 | SMT preprocessing device for POP package |
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Effective date of registration: 20170627 Address after: First No. 8011 C District first building 519100 Guangdong city of Zhuhai province Gaolan Port Pingsha town Mount Everest Road, South River Patentee after: Zhuhai special automation equipment Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Nanshan District Gao Xin Road No. 17 building, 6 floor, South Tower Wanderley Patentee before: Liang Jinxian |
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