CN111295050A - Novel LED lamp panel alignment processing method - Google Patents

Novel LED lamp panel alignment processing method Download PDF

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Publication number
CN111295050A
CN111295050A CN202010123932.0A CN202010123932A CN111295050A CN 111295050 A CN111295050 A CN 111295050A CN 202010123932 A CN202010123932 A CN 202010123932A CN 111295050 A CN111295050 A CN 111295050A
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CN
China
Prior art keywords
led lamp
lamp panel
optical
processing method
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010123932.0A
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Chinese (zh)
Inventor
张学平
戴晖
刘喜科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEIZHOU ZHIHAO ELECTRONIC-TECH CO LTD
Original Assignee
MEIZHOU ZHIHAO ELECTRONIC-TECH CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEIZHOU ZHIHAO ELECTRONIC-TECH CO LTD filed Critical MEIZHOU ZHIHAO ELECTRONIC-TECH CO LTD
Priority to CN202010123932.0A priority Critical patent/CN111295050A/en
Publication of CN111295050A publication Critical patent/CN111295050A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Abstract

The invention discloses a novel LED lamp panel alignment processing method which comprises the steps of manufacturing three optical points on two symmetrical process edges of an LED lamp panel, wherein the three optical points are in a right-angled triangle shape, two optical points are positioned at two ends of one process edge, and the other optical points are positioned at one end of the other process edge; when a CCD milling machine is processed, the optical point is grabbed through a CCD lens, and the expansion and contraction values are measured in an automatic alignment mode; and compensating the position of the welding disc of the lamp bead to the forming edge by the expansion and contraction value so as to realize accurate positioning and processing of the LED lamp panel. According to the novel LED lamp panel alignment processing method provided by the invention, the positioning precision is improved by increasing the optical points on the process edge and increasing the optical points on the process edge, so that the distances from the welding pad of the LED lamp bead to the forming edge are consistent, and the display effect after the LED lamp bead is installed is ensured.

Description

Novel LED lamp panel alignment processing method
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a novel LED lamp panel alignment processing method.
Background
In the printed circuit board manufacturing process, the display effect of installing the LED lamp is concerned to the precision of lamp pearl PAD (PAD) to shaping limit on the lamp plate, and along with lamp pearl PAD to shaping limit required precision more and more high, the counterpoint technique of traditional mechanical hole location shaping gong board has can't satisfy the preparation requirement.
The mechanical through holes are poor in position precision during manufacturing, certain difference exists in the displacement consistency between the mechanical through holes and the circuit alignment process (difference exists between the mechanical through holes and the circuit bonding pads) when the circuit alignment process is caused, therefore, in the circuit alignment process, the alignment degree of the mechanical through holes and the circuit bonding pads is difficult to guarantee at the same time, the mechanical through holes are used for positioning and forming, the bead bonding pads are not consistent to the plate edges, the distance between the LED beads is large or small, and the display effect is influenced.
Disclosure of Invention
The invention provides a novel LED lamp panel alignment processing method, which aims to overcome the defects in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a novel LED lamp panel alignment processing method comprises the following steps:
manufacturing three optical points on two symmetrical process edges of the LED lamp panel, wherein the three optical points are in a right-angled triangle shape, two optical points are located at two ends of one process edge, and the other optical points are located at one end of the other process edge;
when a CCD milling machine is processed, the optical point is grabbed through a CCD lens, and the expansion and contraction values are measured in an automatic alignment mode;
and compensating the position of the welding disc of the lamp bead to the forming edge by the expansion and contraction value so as to realize accurate positioning and processing of the LED lamp panel.
Further, in the novel LED lamp panel alignment processing method, the distance between each optical point and the end part of the technical edge where the optical point is located is 5 mm.
Furthermore, in the novel LED lamp panel alignment processing method, each optical point is a copper metal point.
Furthermore, in the novel LED lamp panel alignment processing method, each optical point is circular, and an annular window is formed in the periphery of each optical point.
Furthermore, in the novel LED lamp panel alignment processing method, the diameter of each optical point is 1mm, and the diameter of the outer circle of the annular window is 2 mm.
According to the novel LED lamp panel alignment processing method provided by the embodiment of the invention, the positioning precision is improved by increasing the optical points on the process edge and increasing the optical points on the process edge, so that the distances from the welding pads of the LED lamp beads to the forming edge are consistent, and the display effect after the LED lamp beads are installed is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic flow chart of a novel LED lamp panel alignment processing method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an optical dot design layout provided by an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an optical spot provided in an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
Referring to fig. 1 to 3, a flow chart of a novel LED lamp panel alignment processing method according to an embodiment of the present invention is shown. The method specifically comprises the following steps:
s101, manufacturing three optical points on two symmetrical process edges of the LED lamp panel, wherein the three optical points are in a right-angled triangle shape, two optical points are located at two ends of one process edge, and the other optical points are located at one end of the other process edge;
s102, when a CCD milling machine is used for processing, the optical points are grabbed through a CCD lens, and the expansion and contraction values are measured in an automatic alignment mode;
s103, compensating the position from the lamp bead welding disc to the forming edge through the expansion and contraction value so as to realize right accurate positioning and processing of the LED lamp panel.
Specifically, according to the alignment method of the pattern position precision, the size difference from the bead pad pattern to the forming edge (the forming edge is formed after the process edge is milled off) is calculated scientifically, compensation processing is carried out on the bead pad to the forming edge (the compensation aims to enable the distance from the pad of the LED bead to the forming edge to be consistent), and the position precision is improved.
Preferably, each optical point is 5mm away from the end of the technical edge on which the optical point is located.
Each of the optical dots is a copper metal dot.
In this embodiment, each optical point is circular, and the periphery is provided with an annular window.
Specifically, the diameter of each optical point is 1mm, and the diameter of the outer circle of the annular window is 2 mm.
According to the novel LED lamp panel alignment processing method provided by the embodiment of the invention, the positioning precision is improved by increasing the optical points on the process edge and increasing the optical points on the process edge, so that the distances from the welding pads of the LED lamp beads to the forming edge are consistent, and the display effect after the LED lamp beads are installed is ensured.
The above embodiments are merely to illustrate the technical solutions of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (5)

1. A novel LED lamp panel alignment processing method is characterized by comprising the following steps:
manufacturing three optical points on two symmetrical process edges of the LED lamp panel, wherein the three optical points are in a right-angled triangle shape, two optical points are located at two ends of one process edge, and the other optical points are located at one end of the other process edge;
when a CCD milling machine is processed, the optical point is grabbed through a CCD lens, and the expansion and contraction values are measured in an automatic alignment mode;
and compensating the position of the welding disc of the lamp bead to the forming edge by the expansion and contraction value so as to realize accurate positioning and processing of the LED lamp panel.
2. The novel LED lamp panel alignment processing method according to claim 1, wherein the distance between each optical point and the end of the technical edge where the optical point is located is 5 mm.
3. The novel LED lamp panel alignment processing method according to claim 1, wherein each optical point is a copper metal point.
4. The novel LED lamp panel alignment processing method according to claim 1, wherein each optical point is circular, and an annular window is formed in the periphery of each optical point.
5. The novel LED lamp panel alignment processing method according to claim 4, wherein the diameter of each optical point is 1mm, and the diameter of the outer circle of the annular window is 2 mm.
CN202010123932.0A 2020-02-27 2020-02-27 Novel LED lamp panel alignment processing method Pending CN111295050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010123932.0A CN111295050A (en) 2020-02-27 2020-02-27 Novel LED lamp panel alignment processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010123932.0A CN111295050A (en) 2020-02-27 2020-02-27 Novel LED lamp panel alignment processing method

Publications (1)

Publication Number Publication Date
CN111295050A true CN111295050A (en) 2020-06-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010123932.0A Pending CN111295050A (en) 2020-02-27 2020-02-27 Novel LED lamp panel alignment processing method

Country Status (1)

Country Link
CN (1) CN111295050A (en)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101424706A (en) * 2008-11-28 2009-05-06 深圳华为通信技术有限公司 Test anchor point making method and test anchor point and veneer
CN202143302U (en) * 2011-07-13 2012-02-08 龚晓刚 PCB jointed board
CN102858096A (en) * 2012-09-12 2013-01-02 梁锦贤 Method and device for SMT (surface mount technology) preprocessing of POP (package on package) devices
CN202738277U (en) * 2012-09-12 2013-02-13 梁锦贤 SMT preprocessing device for POP package
CN204518232U (en) * 2015-04-02 2015-07-29 广东威创视讯科技股份有限公司 A kind of LED shows the SMT positioner of lamp plate PCB
CN105142342A (en) * 2015-08-29 2015-12-09 歌尔声学股份有限公司 Camera module group flexible plate protection layer manufacturing method and camera module group flexible plate protection layer
CN105407658A (en) * 2015-12-10 2016-03-16 深圳崇达多层线路板有限公司 Fabrication method of rigid-flex board for preventing gold finger of flexible board from deviation
CN106900139A (en) * 2017-04-20 2017-06-27 胜宏科技(惠州)股份有限公司 It is a kind of high-accuracy without technique edges LED circuit board moulding process
CN207266385U (en) * 2017-09-20 2018-04-20 惠州市浩嘉兴实业有限公司 Automatic contraposition device
CN207927021U (en) * 2018-03-14 2018-09-28 成都市德科立菁锐光电子技术有限公司 A kind of PCB jigsaw promoting SMT patch efficiency
CN109348625A (en) * 2018-10-16 2019-02-15 欣强电子(清远)有限公司 A kind of LED lamp panel shaping process
CN110446354A (en) * 2019-08-23 2019-11-12 惠州中京电子科技有限公司 A kind of pcb board high-precision size forming method applied to LED

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101424706A (en) * 2008-11-28 2009-05-06 深圳华为通信技术有限公司 Test anchor point making method and test anchor point and veneer
CN202143302U (en) * 2011-07-13 2012-02-08 龚晓刚 PCB jointed board
CN102858096A (en) * 2012-09-12 2013-01-02 梁锦贤 Method and device for SMT (surface mount technology) preprocessing of POP (package on package) devices
CN202738277U (en) * 2012-09-12 2013-02-13 梁锦贤 SMT preprocessing device for POP package
CN204518232U (en) * 2015-04-02 2015-07-29 广东威创视讯科技股份有限公司 A kind of LED shows the SMT positioner of lamp plate PCB
CN105142342A (en) * 2015-08-29 2015-12-09 歌尔声学股份有限公司 Camera module group flexible plate protection layer manufacturing method and camera module group flexible plate protection layer
CN105407658A (en) * 2015-12-10 2016-03-16 深圳崇达多层线路板有限公司 Fabrication method of rigid-flex board for preventing gold finger of flexible board from deviation
CN106900139A (en) * 2017-04-20 2017-06-27 胜宏科技(惠州)股份有限公司 It is a kind of high-accuracy without technique edges LED circuit board moulding process
CN207266385U (en) * 2017-09-20 2018-04-20 惠州市浩嘉兴实业有限公司 Automatic contraposition device
CN207927021U (en) * 2018-03-14 2018-09-28 成都市德科立菁锐光电子技术有限公司 A kind of PCB jigsaw promoting SMT patch efficiency
CN109348625A (en) * 2018-10-16 2019-02-15 欣强电子(清远)有限公司 A kind of LED lamp panel shaping process
CN110446354A (en) * 2019-08-23 2019-11-12 惠州中京电子科技有限公司 A kind of pcb board high-precision size forming method applied to LED

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Application publication date: 20200616