CN100377323C - Method for back-repairing pin packaging free device - Google Patents
Method for back-repairing pin packaging free device Download PDFInfo
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- CN100377323C CN100377323C CNB2004100443951A CN200410044395A CN100377323C CN 100377323 C CN100377323 C CN 100377323C CN B2004100443951 A CNB2004100443951 A CN B2004100443951A CN 200410044395 A CN200410044395 A CN 200410044395A CN 100377323 C CN100377323 C CN 100377323C
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Abstract
The present invention discloses a back-repairing method of a no pin packing device, which is used for solving the problem of poor tin printing quality which exists during the back-repairing time of the no pin packing device in the prior art. The method comprises the following steps: a steel mesh gasket, a tin printing steel mesh and a pressing sheet of a steel mesh are arranged in a tin printing frock clamp. The no pin packing device to be printed with tin is laid to a steel mesh opening area of the steel mesh gasket, and the welding end of the device is aligned to and is attached to the opening of the tin printing steel mesh. Tin paste is printed on the tin printing steel mesh, and the tin paste is printed on the welding end of the no pin packing device by the opening of the tin printing steel mesh. The no pin packing device is taken off and is stuck on a welding disk of a back-repairing plate. Finally, the no pin packing device is welded on the welding disk of the back-repairing plate according to requirements of the welding temperature and the return temperature.
Description
Technical field
The present invention relates to the electronic device technology, relate in particular to a kind of repair method that does not have pin package class device.
Background technology
Along with the development of product to high speed, high density direction, no pin package device, as: micro lead frame frame encapsulation (Micro LeadFrame, MLF) device, salient point soldered ball chip carrier packages (Bump Chip Carrier, BCC) device and no pin lead-frame packages (Leadless leadframe Package, LLP) application of device is more and more, and such encapsulation is to adapt to this development trend and the novel encapsulated that occurs.The packaging appearance of MLF, BCC, LLP is roughly similar with structure, is extensively used by the industry communication products at present, especially portable product such as mobile phone, notebook computer.
1, MLF (Micro LeadFrame) encapsulation
The MLF encapsulation is a kind of and the close Plastic Package with copper lead frame of CSP (Chip Scale Package), pin is positioned at around the package bottom, there is a bigger pad at the package bottom center, can directly be welded in printed circuit board (PCB) (Printed Circuit Board, PCB) on, can realize heat radiation and grounding function, profile and internal structure are as shown in Figure 1.
The MLF packaging is mainly used in mobile phone, PDA and other gently little, high performance product at present.MLF be encapsulated as Amkor company all, also there is use (as Intel etc.) in other company.
2, BCC (Bump Chip Carrier) encapsulation
BCC (Bump Chip Carrier) encapsulation is a kind of surface mount encapsulation (approaching the chip size), and the pad of this encapsulation is less, and good thermal characteristics is arranged.The pin of this encapsulation is different with traditional pin, the gold-plated metal welding end of a cover is arranged in package bottom.This structure makes relative other encapsulation of BCC encapsulation have different technology and size advantage.The weldering end is inner directly to link to each other with gold thread binding (wire bond) with chip (die), so parasitic parameter is less.
The profile of BCC encapsulation and internal structure as shown in Figure 2, the BCC encapsulation is mainly used in the RF device, is applied in the wireless product.This encapsulation is produced by Fujitsu company, the existing application.
3, LLP (Leadless leadframe Package) encapsulation
LLP encapsulation is the device of no pin, a big weldering end of bottom-exposed equally, have package dimension little, save PCB arrangement space characteristics, profile that LLP encapsulates and internal structure are as shown in Figure 3.
The LLP packaging is mainly used in light little portable products such as mobile phone, PDA and notebook, and this is encapsulated as American National Instrument Semiconductor company and produces, existing certain applications.
Because the application of this type of packaged device on product is more and more, from the analysis of surface installation technique (SMT) assembling application facet, the assembling defective of three kinds of encapsulation shows as Lian Xi and snaps.Because defect rate is higher relatively, all there is the problem more rambunctious of reprocessing in these three kinds of encapsulation at present, even also do not find a kind of feasible repair method for the device of size≤5mm*5mm.
The engineer mainly considers to improve the design of following various aspects in order to overcome the difficult point problem of reprocessing that occurs after the assembling of this type of device after the defective from packaging technology design in early stage: pad, steel mesh, packaging technology parameter are provided with modulates and apparatus and process ability control etc.But because the application power level difference of different company and the influence of other various aspects factors, defective occurs still to have company's tin of device after the assembling and snap etc., still needs to carry out reprocessing of device.
Because the particularity of this type of encapsulating structure, the weldering end of device is hidden in the bottom of device fully, the solder joint of similar BGA Package (BGA), but the soldered ball that can be used as welding material of projection is not arranged as BGA is so reprocess the also suitable complexity of technology at this type of packaging.
The repair method that general industry is recommended roughly has following step:
A, veneer, device bonding pad are handled; B, device seal tin; C, reprocess the platform paster; D, reflow soldering; E, finish and reprocess.
In concrete operations, mainly contain online repair method of so-called SMT and PCB pad point tin method etc.
The key step of the online repair method of SMT is as follows:
(1) dismounting of device.With blowing hot wind the device that will reprocess is heated, by the time scolding tin when melting, is taken off device with tweezers.
(2) processing of breadboard and device.Check the pad locations of institute's device of reprocessing such as BCC, require that no scolding tin is residual on the pad, pad is smooth, device needs to check (new unit then need not to check) too, if out-of-flatness then need with electric iron with suction tin braid it is dragged flat.
(3) device location.With the device bottom surface of reprocessing up, cement with double faced adhesive tape.
(5) steel mesh centering.Above the steel mesh that SMT is assembled usefulness is placed on, make the opening and the device bonding pad centering of this device of steel mesh, need experienced operator's visual inspection.
(6) scrape tin cream.Get a little tin cream with little scraper, on steel mesh, scraped gently.Notice that tin cream is filled and to get well, scrape that steel mesh can not be moved in the process of tin cream.
(7) the tin cream demoulding.Earlier with hand upwards slowly lift steel mesh, then steel mesh is being removed.
(8) the printing situation of inspection tin cream.Whether elder generation's visual inspection has the situation of Lian Xi or few tin, then washes tin cream and prints again if having; If have unfavorable condition is not arranged, detect the printing situation of tin cream with the tin cream thickness gauge.
(9) solidify tin cream (" planting ball ").The device that printing is good is crossed reflow ovens together with substrate, and tin cream is melted, and is welded on the pad.
(10) check device.Whether the device that visual inspection is welded has or not the defective that connects tin, if do not have, even with the solder joint height that the tin cream height tester is tested after solidifying.
(11) secondary welding.Coat weld-aiding cream (immobilising device, go the pad oxidation) on pad, good device centering is placed on the pad manually will " to plant ball " then, is placed in the reflow ovens and heavily melts.
(12) check welding result with 5DX.
There is the shortcoming of following various aspects in the online repair method of above-mentioned so-called SMT:
(1) this method mainly is manual operations; require quite high to the operator; manual operations is difficult to reach precision and the stability that seal tin machine can reach; so just can't guarantee to print the problem of tin quality; through practical operation; find seal tin after regular meeting occurs connecting tin, often need repeatedly to print the success of tin ability, inefficiency.
(2) this method makes that veneer and device to be reprocessed experienced secondary even three high temperature refluxes, thermal shock to veneer or device is bigger, and this method limitation is bigger simultaneously, during as secondary back, remove the device of non-refractory on the veneer, will adapt to some characteristics of reflow ovens etc. in addition.
Adopt PCB pad point tin method also to have more problem, when the actual product plate is reprocessed, other devices are arranged on every side, when on point gum machine, carrying out tin, point tin space is not enough, adopt point gum machine point tin time point tin diameter inconsistent simultaneously, also can cause connecting tin, therefore adopt some tin method can not be successfully applied to reprocessing of no pin package class device MLF, BCC, LLP.
Summary of the invention
There is the problem that is difficult to guarantee to print the tin quality to solve in a kind of repair method that does not have pin package class device of the present invention in no pin class wrapper is reprocessed.
For addressing the above problem, the invention provides following technical scheme:
A kind of repair method that does not have pin package class device comprises step:
A, remove no pin package class device from reprocessing plate;
B, open first metal frame and second metal frame of seal tin frock clamp, be installed in steel mesh pad, seal tin steel-screen on second metal frame of anchor clamps successively and make the steel mesh pad and the center of seal tin steel-screen overlaps, build first metal frame and locking, wherein print tin steel-screen and have the opening that is used to print tin, the steel mesh pad has the steel mesh opening district that cooperates with this opening;
C, open the metallic plate on described seal tin frock clamp second metal frame, will wait that the no pin package class device that prints tin is put in the steel mesh opening district of described steel mesh pad, build metallic plate and locking;
Height Adjustment screw on D, the adjusting seal tin frock clamp makes the register and the applying of the weldering end and the seal tin steel-screen of described no pin package class device;
E, print tin cream to the seal tin steel-screen, tin cream is imprinted on the weldering end of no pin package class device by the opening of seal tin steel-screen from the seal tin open region of first metal frame;
F, open the metallic plate on second metal frame of described seal tin frock clamp, described no pin package class device is taken off and is attached on the pad of reprocessing plate;
G, described no pin package class device is welded on the pad of reprocessing plate by welding temperature and reflux temperature requirement.
According to said method:
After welding is finished, also utilize the checkout equipment detection whether to have and snap and company's tin defects.
Carry out also the no pin package class device of reprocessing plate and/or reprocess being checked, being handled before the step B, and when plate is reprocessed in processing, make this reprocess the smooth and noresidue scolding tin of pad on the plate.
In step B, the steel mesh compressing tablet that also will have the open region that cooperates with the seal tin steel-screen is pressed on the seal tin steel-screen, and the center of steel mesh pad, seal tin steel-screen and steel mesh compressing tablet is overlapped, to guarantee that steel mesh pad, seal tin steel-screen and steel mesh compressing tablet are fitted closely.
Step F comprises step: open the metallic plate on second metal frame of described seal tin frock clamp, and the remaining part of these anchor clamps is put into the fixed position of reprocessing platform; The vacuum slot that platform is reprocessed in control picks up device and move to be reprocessed on the plate; Utilization is reprocessed the platform camera device and the pad reprocessed on the plate is carried out the contraposition adjustment, and will not have pin package class device be posted on the pad of reprocessing plate after finishing contraposition.
The present invention has following beneficial effect:
1, once prints tin and reprocess the success rate height, reprocess the efficient height.
2, automaticity height, good stability.
3, utilize the reprocessing of similar components and parts that steel disc, pad, compressing tablet etc. can be realized seriation of reprocessing of design.
4, reduce the repeatedly thermal shock damage of components and parts.
Description of drawings
Fig. 1 is the profile and the internal structure schematic diagram of MLF packaging;
Fig. 2 is the profile and the internal structure schematic diagram of BCC packaging;
Fig. 3 is the profile and the internal structure schematic diagram of LLP packaging;
The seal tin frock clamp pictorial diagram that Fig. 4 adopts for the present invention;
Fig. 5 is a seal tin frock clamp structural representation shown in Figure 4;
Fig. 6 is the compound section schematic diagram of frock, steel mesh compressing tablet, seal tin steel-screen, steel mesh pad and device among the present invention;
Fig. 7 is the schematic diagram behind the seal tin cream on the device;
Fig. 8 is a flow chart of the present invention.
Embodiment
The present invention is conceived to improve the automaticity of seal tin process, consider to utilize have automatically pick up, the hot blast of centering, paster and welding reprocesses platform equipment, by design relevant with reprocess platform equipment and reprocess the difficult point problem of reprocessing that frock, seal tin steel-screen, steel mesh pad and steel mesh compressing tablet etc. solve no pin class packaging with device is corresponding.
Present embodiment uses, and to reprocess platform be that the SUMMIT 1100HR hot blast of SRT company is reprocessed platform, the benefit of this equipment is that the temperature curve of welding is controlled, also having a benefit in addition is that accurate paster center support system is arranged, can satisfy the requirement of close distant element paster, and this equipment there are the anchor clamps of a cover to device weldering end print solder paste.Use this device of reprocessing platform weldering end seal tin frock clamp, design seal tin steel-screen, steel mesh pad, steel mesh compressing tablet voluntarily.
As Fig. 4, Fig. 5 and shown in Figure 6, first, second metal frame (base, midsection) of seal tin frock clamp is used for fixing seal tin steel-screen, seal tin steel-screen pad and steel mesh compressing tablet, and the steel mesh compressing tablet is on the seal tin steel-screen.The metallic plate of second metal frame bottom is used for supporting device, and the pressure shell fragment that intermediate altitude is adjustable is used to adjust element height, and device is well contacted with steel mesh.Pull down the supporting bracket at the device back side behind the Yin Xi, anchor clamps are placed on SRT reprocess the position that the platform device picks up, the vacuum of equipment is inhaled to chew and can be drawn the device paster to PCB, welds then.
For the opening of seal tin steel-screen, mainly be to design at the A/F and the opening length of printing tin steel-screen, the open design of seal tin steel-screen requires as follows:
A, MLF device
Weldering end steel mesh opening width is 0.9 times that width is held in the device weldering on every side, and length variations is as follows: open inner ends is inner concordant with device weldering end, and open outer end holds the outer end to reduce 0.05mm with respect to the device weldering; The steel mesh opening length of middle heat radiation/ground connection and width contract to 0.90 times in respectively, and when the size of heat radiation/ground connection was big, steel mesh opening need be divided into little opening, and the concrete opening shape reference steel mesh standard of being correlated with is carried out, and thickness is 0.12mm.
B, BCC device (four jiaos are not had square weldering end)
Weldering end steel mesh opening width is 0.9 times that width is held in the device weldering on every side, and length variations is as follows: open inner ends is inner concordant with device weldering end, and open outer end holds the outer end to reduce 0.05mm with respect to the device weldering; The steel mesh opening length of middle heat radiation/ground connection and width contract to 0.90 times in respectively, and when the size of heat radiation/ground connection was big, steel mesh opening need be divided into little opening, the concrete opening shape reference steel mesh standard of being correlated with, and thickness is 0.12mm.
C, LLP device
Weldering end steel mesh opening width is 0.9 times that width is held in the device weldering on every side, and length variations is as follows: open inner ends is inner concordant with device weldering end, and open outer end holds the outer end to reduce 0.05mm with respect to the device weldering; The steel mesh opening length of middle heat radiation ground connection and width contract to 0.90 times in respectively, and when the size of heat radiation/ground connection was big, steel mesh opening need be divided into little opening, and concrete opening shape is with reference to the steel mesh standard of being correlated with, and thickness is 0.12mm.
The situation of D, BCC32 (four jiaos have square weldering end)
Weldering end steel mesh opening width is 0.9 times that width is held in the device weldering on every side, and length variations is as follows: open inner ends is inner concordant with device weldering end, and open outer end holds the outer end concordant with the device weldering; The steel mesh opening length of middle heat radiation/ground connection and width contract to 0.85 times in respectively.More bigger square weldering for place, four angles is held, and the steel mesh opening outer end edges is with other weldering end outward flanges are concordant on every side, and opening shape is a square, and opening size is for welding the length dimension of end opening on every side.Thickness is 0.12mm.
Weldering end steel mesh opening width is 0.9 times that width is held in the device weldering around the situation of E, BCC48 (four jiaos have the square weldering to hold), and length variations is as follows: open inner ends is inner concordant with device weldering end, and open outer end holds the outer end concordant with the device weldering; More bigger square weldering for place, four angles is held, and the steel mesh opening outer end edges is with other weldering end outward flanges are concordant on every side, and opening shape is a square, and opening size is for welding the length dimension of end opening on every side.Thickness is 0.12mm.
Because the steel mesh pad need carry device, opening can not be too little or too big, but must guarantee precision.By 4mm, 5mm, 7mm and 8mm size of devices are measured, the actual size of general device is bigger than nominal size, in order to guarantee the positioning accuracy between the threes such as steel mesh pad, seal tin steel-screen and steel mesh compressing tablet, when designing the size of steel mesh pad, the upper deviation is+0.03, and lower deviation is 0.
Wherein:
The steel mesh opening head of district of MLF is wide: 8.08 (+0.02 ,-0) * 8.08 (+0.02,0) mm;
The steel mesh opening head of district of BCC (comprising that four jiaos are not had square weldering end and BCC32) is wide: 5.10 (+0.05 ,-0) * 5.10 (+0.05 ,-0) mm;
The steel mesh opening head of district of BCC48 is wide: 7.08 (+0.02 ,-0) * 7.08 (+0.02 ,-0) mm;
The steel mesh opening head of district of LLP is wide: 4.10 (+0.05 ,-0) * 4.10 (+0.05 ,-0) mm;
The steel mesh spacer thickness of all devices is 0.5mm, and the thickness of steel mesh pad is less than the height of all devices, and opening four limits of spacer thickness direction are 3～5 degree draw tapers.
Little scraping blade has extra pressure to device weldering end margin zone in order to prevent to print tin, and these pressure can influence the precision of seal tin, brings seal tin bad.Based on this kind situation, design a steel mesh compressing tablet, the steel mesh compressing tablet makes seal tin steel-screen, steel mesh pad and steel mesh compressing tablet fit closely on the seal tin steel-screen when seal tin, wherein, the steel mesh opening zone is of a size of: 50mmx50mm.Compressing tablet thickness is 0.5mm (dimensional tolerance is: the upper deviation is+0.03, and lower deviation is 0).
For the seal tin steel-screen, have and use preceding adopt laser cutting and electropolishing processing, seal tin steel-screen open centre will overlap with the center of firm sheet integral body.After steel mesh pad, steel mesh compressing tablet and seal tin steel-screen were made, three steel mesh centers must overlap, and can not misplace.
Consult shown in Figure 8ly, the detailed process of reprocessing is as follows:
Step 10: remove device.Will plate be reprocessed be placed on SRT and reprocess on the platform, support and reprocess device area, remove temperature curve with the device that pre-sets and heat reprocessing plate, the device of reprocessing afterwards after platform melts solder joint automatically picks up with soup stick.
Step 20: handle and reprocess plate and device.
Check the pad locations of the device of reprocessing, require that no scolding tin is residual on the pad, pad is smooth, device needs to check (new unit then need not to check) too, if out-of-flatness then need with electric iron with suction tin braid it is dragged flat.
Step 30: open anchor clamps, successively steel mesh pad, seal tin steel-screen and steel mesh compressing tablet are installed on second metal frame (MIDSECTION) of anchor clamps, build first metal frame (BASE) and use screw lock.
Step 40: turnover fixture is opened the metallic plate on second metal frame, with waiting to print in the opening that tinware spare is put into the steel mesh pad, builds metallic plate and uses screw lock.
Step 50: regulate the Height Adjustment screw, device weldering end and seal tin steel-screen register are also fitted.
Step 60: counter-rotating anchor clamps, seal tin cream.Weldering end behind the described seal tin as shown in Figure 7.
Step 70: paster.After Yin Xi finishes anchor clamps are overturn, pull down the metallic plate on second metal frame, the remaining part of anchor clamps is put into the fixed position of reprocessing platform, the vacuum slot of reprocessing platform moves device is picked up, by the platform camera of reprocessing that looks up and look down device and PCB pad are carried out contraposition respectively afterwards, after contraposition is adjusted, vacuum slot decline paster.
Step 80: welding.Hot-blast spray nozzle is fallen, and welds according to the temperature curve of setting, and reprocesses peak temperature and meets welding temperature and the reflux temperature requirement that device is recommended.
Step 90: detect.Be to utilize 5DX or X-RAY Equipment Inspection to have or not to snap and company's tin defects.
Step 100: finish and reprocess.
Utilization of the present invention have automatically pick up, the hot blast of centering, paster and welding reprocesses platform equipment, and by design relevant with reprocess platform equipment and print tin with corresponding frock, seal tin steel-screen, steel mesh pad and the steel mesh compressing tablet reprocessed of device, print the ropy problem of tin thereby solved in the reprocessing of no pin class packaging.
Claims (10)
1. repair method that does not have pin package class device is characterized in that comprising step:
A, remove no pin package class device from reprocessing plate;
B, open first metal frame and second metal frame of seal tin frock clamp, be installed in steel mesh pad, seal tin steel-screen on second metal frame of anchor clamps successively and make the steel mesh pad and the center of seal tin steel-screen overlaps, build first metal frame and locking, wherein print tin steel-screen and have the opening that is used to print tin, the steel mesh pad has the steel mesh opening district that cooperates with this opening;
C, open the metallic plate on described seal tin frock clamp second metal frame, will wait that the no pin package class device that prints tin is put in the steel mesh opening district of described steel mesh pad, build metallic plate and locking;
Height Adjustment screw on D, the adjusting seal tin frock clamp makes the register and the applying of the weldering end and the seal tin steel-screen of described no pin package class device;
E, print tin cream to the seal tin steel-screen, tin cream is imprinted on the weldering end of no pin package class device by the opening of seal tin steel-screen from the seal tin open region of first metal frame;
F, open the metallic plate on second metal frame of described seal tin frock clamp, described no pin package class device is taken off and is attached on the pad of reprocessing plate;
G, described no pin package class device is welded on the pad of reprocessing plate by welding temperature and reflux temperature requirement.
2. whether the method for claim 1 is characterized in that, also utilize the checkout equipment detection to have after welding is finished and snap and company's tin defects.
3. the method for claim 1 is characterized in that, carries out also the no pin package class device of reprocessing plate and/or reprocess being checked, being handled before the step B, and makes this reprocess the smooth and noresidue scolding tin of pad on the plate when plate is reprocessed in processing.
4. the method for claim 1, it is characterized in that, in step B, the steel mesh compressing tablet that also will have the open region that cooperates with the seal tin steel-screen is pressed on the seal tin steel-screen, and the center of steel mesh pad, seal tin steel-screen and steel mesh compressing tablet is overlapped, to guarantee that steel mesh pad, seal tin steel-screen and steel mesh compressing tablet are fitted closely.
5. the method for claim 1 is characterized in that, step F comprises step:
Open the metallic plate on second metal frame of described seal tin frock clamp, and the remaining part of these anchor clamps is put into the fixed position of reprocessing platform;
The vacuum slot that platform is reprocessed in control picks up device and move to be reprocessed on the plate;
Utilization is reprocessed the platform camera device and the pad reprocessed on the plate is carried out the contraposition adjustment, and will not have pin package class device be attached on the pad of reprocessing plate after finishing contraposition.
6. the method for claim 1, it is characterized in that, when the no pin package class device of waiting to print tin be button type do not have pin package BCC device, when miniature framework does not have pin package MLF device or does not have leadframe posture encapsulation LLP device, on the width of seal tin steel-screen opening: weldering end steel mesh opening width is 0.9 times of device weldering end width on every side; On the length of seal tin steel-screen opening: open inner ends is inner concordant with device weldering end, and open outer end reduces 0.05mm with respect to device weldering end outer end; The steel mesh opening length of middle heat radiation/ground connection and width contract to 0.90 times in respectively.
7. method as claimed in claim 6 is characterized in that, when the heat radiation/ground connection size of no pin package class device is big, seal tin steel-screen opening is divided into little opening.
8. the method for claim 1, it is characterized in that, when the no pin package class device of waiting to print tin is four jiaos of button types that square weldering end arranged when not having pin package 32 pin BCC32 devices, on the width of seal tin steel-screen opening: weldering end steel mesh opening width is 0.9 times of device weldering end width on every side; On the length of seal tin steel-screen opening: open inner ends is inner concordant with device weldering end, and open outer end is concordant with device weldering end outer end; The steel mesh opening length of middle heat radiation/ground connection and width contract to 0.85 times in respectively.
9. the method for claim 1, it is characterized in that, when the no pin package class device of waiting to print tin is four jiaos of button types that square weldering end arranged when not having pin package 48 pin BCC48 devices, on the width of seal tin steel-screen opening: weldering end steel mesh opening width is 0.9 times of device weldering end width on every side; On the length of seal tin steel-screen opening: open inner ends is inner concordant with device weldering end, and open outer end is concordant with device weldering end outer end.
10. as each described method of claim 1 to 9, it is characterized in that, before the seal tin steel-screen is installed, utilize laser cutting and electropolishing that the seal tin steel-screen is handled.
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| CNB2004100443951A CN100377323C (en) | 2004-05-26 | 2004-05-26 | Method for back-repairing pin packaging free device |
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| CNB2004100443951A CN100377323C (en) | 2004-05-26 | 2004-05-26 | Method for back-repairing pin packaging free device |
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| CN1104329A (en) * | 1993-06-25 | 1995-06-28 | 松下电器产业株式会社 | Apparatus and method for detecting out appearance of electronic elements |
| CN1166912A (en) * | 1995-03-02 | 1997-12-03 | 电路元件股份有限公司 | A low cost, high performance package for microwave circuits in the up to 90 GHZ frequency range |
| JP2000315748A (en) * | 1999-04-30 | 2000-11-14 | Sony Corp | Solder printing device |
| US6548790B1 (en) * | 2000-02-24 | 2003-04-15 | Trucco Horacio Andres | Apparatus for manufacturing solid solder deposit PCBs |
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