CN110265312A - Wire bonding apparatus and method of operation - Google Patents
Wire bonding apparatus and method of operation Download PDFInfo
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- CN110265312A CN110265312A CN201910649202.1A CN201910649202A CN110265312A CN 110265312 A CN110265312 A CN 110265312A CN 201910649202 A CN201910649202 A CN 201910649202A CN 110265312 A CN110265312 A CN 110265312A
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 34
- 238000004891 communication Methods 0.000 claims abstract description 18
- 238000010521 absorption reaction Methods 0.000 claims description 78
- 238000003466 welding Methods 0.000 claims description 69
- 230000005540 biological transmission Effects 0.000 claims description 53
- 238000003825 pressing Methods 0.000 claims description 52
- 210000000078 claw Anatomy 0.000 claims description 17
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- 230000007423 decrease Effects 0.000 claims description 3
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- 239000002184 metal Substances 0.000 description 2
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- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
Abstract
Embodiments of the present application relate to a wire bonding apparatus and method of operation. A wire bonding apparatus comprising: a controller configured to send a vacuum chucking instruction; the vacuum adsorption device is in communication connection with the controller and is configured to form vacuum to adsorb and fix the material strips on the vacuum adsorption device when the vacuum adsorption instruction is received; wherein, the material strip is provided with a wafer to be bonded.
Description
Technical field
This application involves Wire Bonding Technology field more particularly to wire bonding apparatus and operating methods.
Background technique
In IC semiconductor package fabrication process, the work of wire bonding is carried out for the chip being mounted in material strip
Skill process will have a direct impact on the yield of semiconductor product and module after encapsulation.In addition, not with IC semiconductor product
The disconnected direction towards miniaturization is developed, and for how to design better lead key closing process equipment and process flow, proposes more
High requirement.
Summary of the invention
According to some embodiments of the present application, a kind of wire bonding apparatus, comprising: controller is configured to send true
The attached instruction of suction；And vacuum absorption device, it is connect with the controller communication, and be configured to and receive the vacuum suction
Vacuum is formed when attached instruction to adsorb and fix the material strip on the vacuum absorption device；Wherein, it is arranged in the material strip
There is chip to be bonded.
According to some embodiments of the present application, a kind of operating method, applied to the wire bonding apparatus, including it is following
Step: controller sends vacuum suction instruction；And vacuum absorption device forms vacuum when receiving vacuum suction instruction
To adsorb and fix the material strip on the vacuum absorption device.
According to some embodiments of the present application, a kind of wire bonding apparatus, comprising: loading attachment is used to load described
Material strip, wherein being provided with chip to be bonded in the material strip；Controller is configured to send vacuum suction instruction；And it is true
Suction adsorption device is connect with the controller communication, and is configured to when receiving vacuum suction instruction and is formed very
Sky is to adsorb and fix the material strip on the loading attachment on the vacuum absorption device.
According to some embodiments of the present application, a kind of operating method, applied to the wire bonding apparatus, including it is following
Step: controller sends vacuum suction instruction；And vacuum absorption device forms vacuum when receiving vacuum suction instruction
To adsorb and fix the material strip on the vacuum absorption device；Wherein, the material strip is located in loading attachment.
Detailed description of the invention
Hereinafter will be briefly explained attached drawing necessary in order to describe the embodiment of the present application or the prior art in order to
Embodiments herein is described.It should be evident that the attached drawing in being described below is merely the section Example in the application.To this
For the technical staff of field, under the premise of not needing creative work, still can according to these attached drawings in illustrated by tie
Structure obtains the attached drawings of other embodiments.
Fig. 1 is the functional block diagram of the wire bonding apparatus of some embodiments of the present application.
Fig. 2 is the structural schematic diagram of the pressing device of some embodiments of the present application.
Fig. 3 is the pressing device of some embodiments of the present application and the structural schematic diagram of material strip.
Fig. 4 is the pressing device of some embodiments of the present application and the structural schematic diagram of vacuum absorption device.
Fig. 5 is the vacuum absorption device of some embodiments of the present application and the structural schematic diagram of material strip.
Fig. 6-8 is the transmission device of some embodiments of the present application and the structural schematic diagram of material strip.
Fig. 9 is the flow chart of the operating method of the wire bonding apparatus of some embodiments of the present application.
Figure 10 is the functional block diagram of the wire bonding apparatus of some embodiments of the present application.
Figure 11 and 12 is the structural representation of the vacuum absorption device, loading attachment and material strip of some embodiments of the present application
Figure.
Figure 13 and 14 is the structural schematic diagram of the support plate of some embodiments of the present application.
Figure 15 is the structural schematic diagram of the cover board of some embodiments of the present application.
Figure 16 is the flow chart of the operating method of the wire bonding apparatus of some embodiments of the present application.
Specific embodiment
Embodiments herein will be shown hereinafter by detailed retouch.In present specification full text, by identical or
Similar component and component with the same or similar function are indicated by like reference numerals.It is described herein to have
Closing the embodiment of attached drawing is illustrative, graphic nature and the basic comprehension for providing to the application.The reality of the application
It applies example and is not construed as limitation to the application.
The 4G epoch will lower the curtain, and the 5G epoch will open, and also most keen competition will be unfolded in the 5G epoch in various countries.According to state
The plan that family formulates, 5G network are expected in 2019 in the pre- commercialization in selected areas of China, and the year two thousand twenty can formal spread overwide areas
It carries out comprehensively commercial.Advanced base station design is to realize an important ring for 5G communication, and the base station 5G is (slight using small cells
Area) design, because each small cell transmission range is short, base station demand is big, and future can generate very big market scale and warp
Ji benefit.
Power amplifier in the base station 5G can be divided into two kinds, and one kind is one-stage amplifier transistor, and another kind is power amplification
Device module, the former is relatively easy because being routed, and often uses leadframe design, and the latter often uses substrate because wiring is complicated
Design, when using substrate as power amplifier support plate, traditional claw is easy to damage by pressure substrate.Further, since the base station 5G
Smallerization the characteristics of, the requirement of miniaturization is equally improved to semiconductor product and module.It would therefore be highly desirable to which one kind is needed to have
The wire bonding apparatus of effect.
Fig. 1 is the wire bonding apparatus of some embodiments of the present application.Wire bonding apparatus 100 includes 101 He of controller
Vacuum absorption device 104.Controller 100 is configured to send vacuum suction instruction.Vacuum absorption device 104 and controller 101
Communication connection, and vacuum is formed when receiving vacuum suction instruction to adsorb and fix on vacuum absorption device 104
Material strip.Wherein, the chip of lead to be bonded is provided in material strip.Material strip includes substrate or lead frame since material strip has passed through very
The attached fixation of suction is fixed material strip without fixing device using other, avoids material strip and be subject to crushing.It therefore, can be with
Effective wire bonding welding is carried out to the chip in the material strip being adsorbed by vacuum.
Some in the application are in embodiment, and wire bonding apparatus 100 includes pressing device 105.As in Figure 2-4,
Pressing device 105 can also drop to the top of material strip 200 after receiving vacuum suction instruction simultaneously, thus with vacuum suction dress
It is opposite to set 104.The pressing device 105 includes pressing main body 1051 and tentacle 1052.Wherein, pressing main body 1051 has window,
Window is for appearing chip to be bonded in material strip when pressing device 105 drops to above material strip 200.Tentacle 1052
One end is placed in pressing main body, and the other end of tentacle 1052 is contacted by window with the upper surface of material strip 200.The application's
In some embodiments, contacted between the other end and the upper surface of material strip 200 of tentacle 1052, but without interaction force.That is, only
It is contacted without and pressure is formed to material strip, can be filled in this way when bearing the adsorption capacity of adsorbent equipment with vacuum suction to avoid material strip
The position for setting contact, which sticks out, leads to surrounding warpage.In some embodiments of the present application, the other end of tentacle and the material strip
Upper surface between it is contactless.
In some embodiments of the present application, window can be using big windowing design and small windowing design.For example, using big
When windowing design, the width of window is more than or equal to the width of material strip wire welding area, and the length of window is greater than single-row chip wire welding area
Length.It can guarantee subsequent only to carry out wirebonding operations in the window of pressing device 105 in this way, it is possible to reduce or avoid
It may be to the risk that other chips damage when welding.In some embodiments of the present application, pressing main body 1051 is metal
Material.
In some embodiments of the present application, vacuum absorption device 104 includes chamber vacuum adsorption structure 1041, and cavity is true
Empty adsorption structure and 200 following table face contact of material strip, vacuum absorption device 104 pass through the sky in chamber vacuum adsorption structure 1041
Between middle formation vacuum to adsorb and fix material strip 200.In some embodiments of the present application, vacuum absorption device 104 further includes
Vacuum line component 1042.Vacuum suction structure 1041 is connected to vacuum line component 1042, and vacuum line component 1042 is used for
Space in chamber vacuum adsorption structure 1041 forms vacuum.
In some embodiments of the present application, as shown in figure 5, having in chamber vacuum adsorption structure 1041 positioned at described true
Vacuum suction plane 1044 on cavity 1043, the vacuum suction plane 1044 have first through hole, vacuum absorption device 104
By vacuum being formed in the vacuum chamber 1043 and several first through hole to adsorb and fix material strip 200.In the application
Some embodiments in, vacuum absorption device 104 be metal material.In some embodiments, the aperture of first through hole is not more than
0.1mm.In some embodiments, the spacing of first through hole is greater than twice of aperture.Wherein, the aperture of first through hole, spacing by
Adsorption capacity, finger size and the cost of material strip determine.
In some embodiments of the present application, wire bonding apparatus 100 further includes transmission device 103.Transmission device 103 with
101 communication connection of controller, and material strip 200 is sent to by vacuum absorption device 104 by track when receiving send instructions
Corresponding position.For example, material strip 200 to be sent to the top of vacuum absorption device 104.
In some embodiments of the present application, transmission device 103 includes transmission needle assemblies, as shown in Figures 6 and 7.Transmit needle
Component is set to the two sides of track.Wherein, transmission needle assemblies include transmission needle 1031.Transmit needle assemblies by transmission needle 1031 with
Stepped aperture 203 in material strip 200 combines mobile with material strip 200 to carry out.Wherein, the material for transmitting needle 1031 is metal.It passes
The stepped aperture 203 for sending needle 1031 to can be inserted in material strip 200.Wherein, material strip 200 includes chip 201 and substrate 202.
In some embodiments of the present application, transmission device 103 includes clip claw assembly, as shown in Figure 8.Clip claw assembly is located at
The two sides of track.Clip claw assembly includes clamping jaw 1032.Clip claw assembly clamps the side of material strip 200 by clamping jaw 1032 to be passed
It send.
In some embodiments of the present application, wire bonding apparatus 100 further includes feeding device 102.Feeding device 102 with
101 communication connection of controller, and material strip is sent into track when receiving feeding instruction.In embodiments herein, feeding
Device 102 includes push rod, and material strip is by push rod orbital injection.
In some embodiments of the present application, wire bonding apparatus 100 further includes bonding wire apparatus for work 106.Bonding wire operation
Device 106 receive start welding instruction when to by the fixed material strip 200 of vacuum absorption device 104 and pressing device 105
Chip 201 carry out lead welding.Wherein, bonding wire apparatus for work 106 include welding mould group, the welding mould group include: wire clamp,
Capillary, transducing bar, wire-sending device carry out lead weldering by chip 201 of the welding mould group to the current work area in material strip 200
It connects.After the completion of the chip 201 in the current work area to material strip welds, controller 101 controls vacuum absorption device 104 and is converted to
Air blowing state is so that vacuum absorption device 104 is separated with material strip 200, while increase pressing device 105.Later, controller 101
The chip to be welded of next operation area of material strip 200 is sent to the welding section of bonding wire apparatus for work 106 by control transmission device 103
Domain, so that bonding wire apparatus for work 106 welds chip 201 to be welded, and repeats above-mentioned process, until by the material strip 200
All operation areas chip 201 weld complete.After completing wire bonding welding to current material strip 200, feeding device 102 is logical
Push rod is crossed by next material strip orbital injection, to carry out the wire bonding of next material strip by above-mentioned wire bonding apparatus 100
Weld job.
Fig. 9 is the flow chart of the operating method of some embodiments of the present application.A kind of operating method is applied to above-mentioned implementation
The wire bonding apparatus 100 of example, comprising the following steps:
Material strip 200 is sent into rail after the feeding instruction for receiving the transmission of controller 101 by step 1001, feeding device 102
Road.
Step 1002, controller 101 send send instructions after the completion of feeding, and transmission device 103 is receiving controller
Material strip 200 is sent to the corresponding position of vacuum absorption device 104 when the send instructions of transmission.The corresponding position is vacuum suction
The top of adsorption device 104, i.e. wire welding area.
Step 1003, controller 101 send vacuum suction instruction after material strip 200 is transferred into target position, and vacuum is inhaled
Adsorption device 104 rises when receiving vacuum suction instruction and forms vacuum to adsorb and fix positioned at vacuum absorption device 104
The material strip 200 of top.
Step 1004, pressing device 105 drop to the top of material strip 200 after receiving vacuum suction instruction, and with it is true
Suction adsorption device 104 is opposite.In some embodiments of the present application, pressing device 105 be bonded material strip 200, and with not to material strip
200 generate pressure.In this way, both it is possible to prevente effectively from generating damage to material strip 200.In some embodiments of the present application, pressing
Device 105 is bonded material strip 200 and generates pressure to material strip 200.When the middle section of material strip 200 is in the vacuum of vacuum absorption device
Be possible to occur under pressure it is recessed cause 200 edge of material strip can warpage, the flat of material strip 200 can be guaranteed by pressing device 105
Whole degree guarantees subsequent effective wire bonding.
Step 1005, controller 101 are completed to send after command adapted thereto in vacuum absorption device 104 and pressing device 105
Start welding instruction, bonding wire apparatus for work 106 receive start welding instruction after to the chip in the current work area of material strip 200
Lead welding is carried out, to complete the wire bonding welding to the chip in current work area.
Step 1006, controller 101 send separation command, vacuum absorption device 104 after receiving end welding instruction
It blows after receiving separation command so that material strip 200 is separated with vacuum absorption device 104.
Step 1007, controller 101 control on pressing device 105 after material strip 200 is separated with vacuum absorption device 104
Rise, vacuum absorption device 104 declines, and the next of material strip 200 be sent to welding section to operation area by transmission device 103, with to
Carry out lead welding.
Step 1008, repeat the above steps 1003-1007, until complete the chip 201 of all operation areas of material strip 200
Lead welding.
In some embodiments of the present application, the operating method further include: after completing step 1008, repeat above-mentioned
Step carries out wire bonding welding with the material strip to wire bonding a piece of under.
Figure 10 is the functional block diagram of the wire bonding apparatus of some embodiments of the present application.Wire bonding apparatus 100 includes
Loading attachment 107, controller 101 and vacuum absorption device 104.Loading attachment 107 is for loading material strip 200, wherein in material strip
It is provided with the chip to wire bonding.Controller 101 is configured to send vacuum suction instruction.Vacuum absorption device 104 and control
101 communication connection of device processed, and vacuum is formed when receiving vacuum suction instruction to adsorb and fix positioned at vacuum absorption device
The material strip 200 in loading attachment 107 on 104.Since material strip 200 has been fixed by vacuum suction, without using other
Material strip 200 is fixed in fixed device, avoids material strip and is subject to crushing.It therefore, can be to the material strip 200 being adsorbed by vacuum
On chip 201 carry out effective wire bonding welding.In addition, by loading attachment 107 can with effective protection material strip 200 and its
In chip 201 before welding with after welding during be not damaged.
Some in the application are in embodiment, and wire bonding apparatus 100 includes pressing device 105.As Figure 2-3,
Pressing device 105 can also drop to the top of material strip 200 after receiving vacuum suction instruction simultaneously, thus with vacuum suction dress
It sets opposite.The pressing device 105 includes pressing main body 1051 and tentacle 1052.Wherein, pressing main body 1051 has window, window
For appearing chip to be bonded in material strip when pressing device 105 drops to above material strip 200.One end of tentacle 1052
It is placed in pressing main body 1051, the other end of tentacle 1052 is contacted by window with the upper surface of material strip 200.The application's
In some embodiments, contacted between the other end of tentacle and the upper surface of the material strip, but without interaction force.That is, only connecing
Touching without to material strip 200 formed pressure, in this way can to avoid material strip 200 bear vacuum absorption device 104 adsorption capacity
When the position that is contacted with vacuum absorption device 104 stick out and lead to surrounding warpage.In some embodiments of the present application, tentacle
It is contactless between 1052 other end and the upper surface of material strip 200.
In some embodiments of the present application, window can be using big windowing design and small windowing design.For example, using big
When windowing design, the width of window is more than or equal to the width of material strip wire welding area, and the length of window is greater than single-row chip wire welding area
Length.It can guarantee subsequent only to carry out wirebonding operations in the window of pressing device in this way, it is possible to reduce or avoid welding
It may be to the risk that other chips damage when connecing.In some embodiments of the present application, pressing main body 1051 is metal material
Matter.
In some embodiments of the present application, vacuum absorption device 104 includes chamber vacuum adsorption structure 1041, and cavity is true
The following table face contact of empty adsorption structure 1041 and loading attachment 107, vacuum absorption device 104 pass through in chamber vacuum adsorption structure
Vacuum is formed in space in 1041 to adsorb and fix material strip 200.
In some embodiments of the present application, as shown in figure 11, there is vacuum chamber in chamber vacuum adsorption structure 1041
1043, loading attachment 107 is covered on vacuum chamber 1043, wherein vacuum absorption device 104 in vacuum chamber 1043 by forming
Vacuum is to adsorb and fix material strip 200.
In some embodiments of the present application, as shown in figure 12, chamber vacuum adsorption structure 1041 is flat with vacuum suction
Face 1044, the vacuum suction plane 1044 have several first through hole, and vacuum absorption device 104 passes through described several first
Vacuum is formed in through-hole to adsorb and fix material strip.In some embodiments of the present application, vacuum absorption device 104 is metal material
Matter.In some embodiments, the aperture of first through hole is not more than 0.1mm.In some embodiments, the spacing of first through hole is greater than
Twice of aperture.Wherein, the aperture of first through hole, spacing are determined by the adsorption capacity, finger size and cost of substrate 202.
Chamber vacuum adsorption structure 1041 is connected to vacuum line component 1042, and vacuum line component 1042 is for adsorbing chamber vacuum
Space in structure 1041 forms vacuum.
In some embodiments of the present application, loading attachment 107 further includes support plate 1071.As shown in Figs. 13 and 14, support plate
1071 for carrying material strip 200.Support plate 1071 is provided with several second through-holes, the second through-hole and chamber vacuum adsorption structure 1041
Connection.It is back to shown in Figure 12, when the setting of chamber vacuum adsorption structure 1041 has the vacuum suction plane 1044 of first through hole
When, the second through-hole on support plate 1071 is connected to first through hole.In some embodiments, the second through-hole is corresponding with first through hole.
Be back to shown in Figure 11, be not provided with the vacuum suction plane 1044 with first through hole when chamber vacuum adsorption structure 1041 and
When vacuum chamber 1043 is directly arranged, the second through-hole on support plate 1071 is connected to the vacuum chamber 1043.
Loading attachment 107 still further comprises cover board 1072, as shown in figure 15.Cover board 1072 is used to cover with support plate 1071
It closes, is pressed on the non-operation area of material strip 200, so that material strip 200 is placed in the space that support plate 1071 and cover board 1072 are coated.
Wherein, the one side of the separate chip 201 of material strip 200 is contacted with support plate 1071, chip 201 be located at material strip 200 and cover board 1072 it
Between, and be located in the operation area of the material strip 200.In some embodiments, one end of the second through-hole contacted with material strip 200
Aperture of the aperture of (that is, material strip upper surface) no more than one end (that is, material strip lower end surface) of the separate material strip 200 of the second through-hole.
For example, the second through-hole is 0.1mm in the aperture of 200 upper surface of material strip, the aperture of lower end surface is 1.0mm, and but not limited to this.
In some embodiments, the aperture of the one end (that is, material strip upper surface) of the second through-hole contacted with material strip 200 is greater than the second through-hole
Separate material strip 200 one end (that is, material strip lower end surface) aperture.In some embodiments, the second through-hole connects with material strip 200
The aperture of one end (that is, material strip upper surface) of touching is equal to one end (that is, material strip lower end surface) of the separate material strip 200 of the second through-hole
Aperture.
In some embodiments, the side of support plate 1071 has notch 1073.By the notch 1073, material strip 200 can be with
It is loaded or is unloaded manually.In some embodiments, the fringe region of support plate 1071 is additionally provided with positioning pin (pin) 1074, should
Positioning pin 1074 is positioned for material strip 200 and cover board 1072, avoids misplacing.In some embodiments, loading attachment 107 further includes
Several magnet blocks 1075, magnet block 1075 are fixedly installed on the fringe region of support plate 1071.When cover board 1072 is covered on support plate
When on 1071, magnet block 1075 attracts to fix cover board 1072.In some embodiments, magnet block can bear 300 DEG C of temperature.
In some embodiments, the material of the support plate 1071 is aluminium.In some embodiments, the surface of the support plate 1071 has carried out anode
Processing.In some embodiments, the side of support plate 1071 also has the through-hole for automatic feeding device 102 up and down.Some
In embodiment, the material of cover board 1072 is blue steel piece, and surface black coating is to prevent cover board from aoxidizing.In some embodiments, cover board
1072 fringe region is additionally provided with notch (not identifying in figure), so that the two dimensional code exposure in material strip 200, facilitates equipment to read
It takes.In some embodiments, the fringe region of support plate 1071 is provided with stepped aperture 1076, which is used for support plate 1071
It is transmitted in orbit by transmission device with material strip 200.In some embodiments, the further location hole of cover board 1072
1077.Location hole 1077 is used to cooperate with the positioning pin 1074 on support plate 1071 to be positioned.
In some embodiments of the present application, wire bonding apparatus 100 further includes transmission device 103.Transmission device 103 with
101 communication connection of controller, and be sent to the loading attachment 107 equipped with material strip very by track when receiving send instructions
The corresponding position of suction adsorption device 104.For example, loading attachment 107 to be sent to the top of vacuum absorption device 104.
In some embodiments of the present application, transmission device 103 includes transmission needle assemblies, as shown in Figures 6 and 7.Transmit needle
Component is set to the two sides of track.Wherein, transmission needle assemblies include transmission needle 1031.Transmit needle assemblies by transmission needle 1031 with
Stepped aperture in loading attachment 107 combines mobile with loading attachment 107 to carry out.Wherein, the material for transmitting needle is metal.It passes
The stepped aperture 1076 for sending needle to can be inserted in loading attachment 107.
In some embodiments of the present application, transmission device 103 includes clip claw assembly, as shown in Figure 8.Clip claw assembly is located at
The two sides of track.Clip claw assembly includes clamping jaw 1032.Clip claw assembly by clamping jaw 1032 clamp loading attachment 107 side with into
Row transmission.
In some embodiments of the present application, wire bonding apparatus 100 further includes feeding device 102.Feeding device 102 with
101 communication connection of controller, and loading attachment 107 is sent into track when receiving feeding instruction.In embodiments herein
In, feeding device 102 includes push rod, and loading attachment 107 is by push rod orbital injection.
In some embodiments of the present application, wire bonding apparatus 100 further includes bonding wire apparatus for work 106.Bonding wire operation
Device 106 receive start welding instruction when to by the fixed material strip 200 of vacuum absorption device 104 and pressing device 105
Chip 201 carry out lead welding.It should be noted that the cover board of loading attachment 107 is before the decline of pressing device 105
It is removed and takes away, so that the material strip 200 on support plate 1071 can be effectively bonded by pressing device 105.
Wherein, bonding wire apparatus for work 106 includes welding mould group, and the welding mould group includes: wire clamp, capillary, transducing bar, send
Line apparatus carries out lead welding by chip 201 of the welding mould group to the current work area in material strip 200.Work as to material strip
After the completion of the chip welding of preceding operation area, controller 101 controls vacuum absorption device 104 and is converted to air blowing state so that vacuum is inhaled
Adsorption device 104 is separated with material strip 200, while increase pressing device 105.Later, the control of controller 101 transmission device 103 will
The chip to be welded of next operation area of material strip 200 on support plate 1071 is sent to the welding region of bonding wire apparatus for work 106, with
It welds bonding wire apparatus for work 106 to chip to be welded, and repeats above-mentioned process, until by all works of the material strip 200
The chip in industry area, which welds, to be completed.After completing wire bonding welding to current material strip 200, feeding device 102 will be filled by push rod
It is loaded with 107 orbital injection of loading attachment of next material strip, to carry out next material strip by above-mentioned wire bonding apparatus 100
Wire bonding weld job.
Figure 16 is the flow chart of the operating method of some embodiments of the present application.A kind of operating method is applied to above-mentioned reality
Apply the wire bonding apparatus 100 of example, comprising the following steps:
Step 2001, feeding device 102 will be mounted with material strip 200 after the feeding instruction for receiving the transmission of controller 101
Loading attachment 107 be sent into track.
Step 2002, controller 101 send send instructions after the completion of feeding, and transmission device 103 is receiving controller
Loading attachment is sent to the corresponding position of vacuum absorption device 104 when the send instructions of transmission.The corresponding position is vacuum
The top of adsorbent equipment 104, i.e. wire welding area.
Step 2003, controller 101 send vacuum suction instruction after loading attachment 107 is transferred into target position, very
Suction adsorption device 104 rises when receiving vacuum suction instruction and forms vacuum to adsorb and fix positioned at vacuum absorption device
The material strip 200 of 104 tops.
Step 2004, pressing device 105 drop to the top of material strip 200 after receiving vacuum suction instruction, and with it is true
Suction adsorption device 104 is opposite.Since material strip 200 has been fixed by vacuum suction, without fixing device to material using other
Item 200 is fixed, and avoids material strip 200 and is subject to crushing.It therefore, can be to the chip in the material strip 200 being adsorbed by vacuum
201 carry out effective wire bonding welding.In addition, can be with effective protection material strip 200 and chip therein by loading attachment 107
201 before welding with after welding during be not damaged.In some embodiments of the present application, pressing device 105 is pasted
Close material strip 200, and with not to material strip 200 generate pressure.In this way, both it is possible to prevente effectively from generating damage to material strip 200.In this Shen
In some embodiments please, pressing device 105 is bonded material strip 200 and generates pressure to material strip 200, due to depositing for support plate 1071
Will not occur recessed causing 200 edge of material strip because of the vacuum pressure of vacuum absorption device 104 in the middle section of, material strip 200
The problem of warpage, can not generate deformation with effective protection material strip 200.
Step 2005, controller 101 are completed to send after command adapted thereto in vacuum absorption device 104 and pressing device 105
Start welding instruction, bonding wire apparatus for work 106 receive start welding instruction after to the chip in the current work area of material strip into
Line lead welding, to complete the wire bonding welding to the chip in current work area.
Step 2006, controller 101 send separation command after receiving end welding instruction, and vacuum absorption device is 104
It blows after receiving separation command so that material strip is separated with vacuum absorption device 104.
Step 2007, controller 101 control on pressing device 105 after material strip 200 is separated with vacuum absorption device 104
It rises, vacuum absorption device 104 declines, and the next of material strip is sent to welding section to operation area by transmission device 103, with pending
Lead welding.
Step 2008, repeat the above steps 2003-2007, until completing drawing for the chip of all operation areas of material strip 200
Wire bonding.
In some embodiments of the present application, the operating method further include: after completing step 2008, repeat above-mentioned
Step carries out wire bonding welding with the material strip to wire bonding a piece of under.
To " some embodiments ", " section Example ", " one embodiment ", " another citing ", " act in the whole instruction
The reference of example ", " concrete example " or " some examples ", representated by mean at least one embodiment in this application or
Citing contains a particular feature, structure, or characteristic described in the embodiment or citing.Therefore, throughout the specification each
Place occur description, such as: " in some embodiments ", " in embodiment ", " in one embodiment ", " at another
In citing ", " in a citing ", " in particular examples " or " citing " are not necessarily identical in reference the application
Embodiment or example.
As used herein, spatially relative term, for example, " under ", " lower section ", " lower part ", " top ", " top ",
" lower part ", " left side ", " right side " and fellow can be used to describe simple to describe one as illustrated in FIG. herein
The relationship of elements or features and another elements or features.Other than orientation discribed in figure, spatially relative term is intended to contain
The device of lid in use or operation is differently directed.Equipment can orient in other ways (to be rotated by 90 ° or in other fixed
To), and space relative descriptors used herein equally can be explained correspondingly.It should be understood that when an element is referred to as
When " being connected to " or " being coupled to " another element, it can be connected or coupled to another element, or intermediary element may be present.
As used herein, term " approximatively ", " substantially ", " basic " and " about " is for describing and considering small change
Change.When being used in combination with event or situation, the term can refer to the example that event or situation accurately occur and event or
The example that situation pole approximatively occurs.As used herein in relation to given value or range, term " about " generally means
In ± 10%, ± 5%, ± 1% or ± the 0.5% of given value or range.Range can be denoted herein as from an endpoint
To another endpoint or between the two endpoints.Unless specified otherwise herein, otherwise all ranges disclosed herein include endpoint.Art
Language " substantially coplanar " can refer to along two in a few micrometers (μm) the surface that same plane positions, for example, along same plane
Positioning in 10 μm, in 5 μm, in 1 μm or in 0.5 μm.When with reference to " substantially " identical numerical value or characteristic, term be can refer to
Value in ± 10%, ± 5%, ± 1% or ± 0.5% of average value in described value.
As used herein, term " approximatively ", " substantially ", " basic " and " about " is for describing and explaining small change
Change.When being used in combination with event or situation, the term can refer to the example that event or situation accurately occur and event or
The example that situation pole approximatively occurs.For example, when being used in combination with numerical value, term can refer to be less than or equal to the numerical value
± 10% variation range, for example, be less than or equal to ± 5%, be less than or equal to ± 4%, be less than or equal to ± 3%, be less than
Or it is equal to ± 2%, is less than or equal to ± 1%, is less than or equal to ± 0.5%, is less than or equal to ± 0.1%, or be less than or equal to
± 0.05%.For example, if difference between two values be less than or equal to the average value of described value ± 10% (for example,
Less than or equal to ± 5%, be less than or equal to ± 4%, be less than or equal to ± 3%, be less than or equal to ± 2%, being less than or equal to ±
1%, it is less than or equal to ± 0.5%, is less than or equal to ± 0.1%, or is less than or equal to ± 0.05%), then it is assumed that described
Two values " substantially " or " about " identical.For example, can " substantially " refer in parallel relative to 0 ° be less than or equal to ±
10 ° of angle change range, for example, being less than or equal to ± 5 °, being less than or equal to ± 4 °, be less than or equal to ± 3 °, be less than or wait
In ± 2 °, be less than or equal to ± 1 °, be less than or equal to ± 0.5 °, be less than or equal to ± 0.1 °, or be less than or equal to ± 0.05 °.
For example, it " substantially " can vertically refer to the angle change range for being less than or equal to ± 10 ° relative to 90 °, for example, being less than
Or be equal to ± 5 °, be less than or equal to ± 4 °, be less than or equal to ± 3 °, be less than or equal to ± 2 °, be less than or equal to ± 1 °, be less than or
Equal to ± 0.5 °, be less than or equal to ± 0.1 °, or be less than or equal to ± 0.05 °.
As used herein, unless context is in addition clearly stipulate that otherwise singular references " one (a/an) " and " described "
It may include plural referents.In the description of some embodiments, the component for being provided in another component "upper" or " top " can be covered
Previous component is directly on latter component (for example, with latter assemblies physical contact) the case where and one or more intermediate modules
The case where between previous component and latter component.
Unless specified otherwise herein, otherwise for example " top ", " lower section ", "upper", "left", "right", "lower", " top ", " bottom ",
" vertical ", "horizontal", " side ", " being higher than ", " being lower than ", " top ", " ... on ", " ... under ", " downward " etc.
Spatial description is indicated relative to orientation shown in figure.It should be understood that spatial description used herein is merely for saying
Bright purpose, and the actual implementation scheme of structure described herein can by it is any orientation or in a manner of be spatially arranged,
On condition that the advantages of the embodiment of the present invention is that will not have deviation because of such arrangement.
Although having demonstrated and having described illustrative embodiments, those skilled in the art should understand that above-described embodiment cannot
It is interpreted the limitation to the application, and can be in the case where not departing from spirit herein, principle and range to implementation
Example is changed, alternatives and modifications.
Claims (48)
1. a kind of wire bonding apparatus, comprising:
Controller is configured to send vacuum suction instruction；And
Vacuum absorption device is connect with the controller communication, and be configured to receive the vacuum suction instruction when
Vacuum is formed to adsorb and fix the material strip on the vacuum absorption device；
Wherein, chip to be bonded is provided in the material strip.
2. equipment according to claim 1 further comprises pressing device；Wherein, the pressing device is by the control
Device control processed and the top for dropping to the material strip, with opposite with the vacuum absorption device.
3. equipment according to claim 2, the pressing device include:
Main body is pressed, with window, the window is for appearing described when the pressing device is located above the material strip
Chip to be bonded in material strip；And
Tentacle, one end of the tentacle are placed in the pressing main body, and the other end of the tentacle passes through the window and institute
State the upper surface contact of material strip.
4. equipment according to claim 3 contacts between the other end of the tentacle and the upper surface of the material strip, but nothing
Interaction force.
5. equipment according to claim 1, the vacuum absorption device has vacuum suction plane, and the vacuum suction is flat
Face has several first through hole；The vacuum absorption device forms vacuum in several first through hole to adsorb and fix institute
State material strip.
6. equipment according to claim 1-5, further comprising:
Transmission device is connect with the controller communication, is configured to when receiving send instructions and is passed through track for the material
Item is sent to position corresponding with the vacuum absorption device.
7. equipment according to claim 6, wherein the transmission device further include:
Needle assemblies are transmitted, the transmission needle assemblies are set to the two sides of the track；
Wherein, the transmission needle assemblies include transmission needle, and the transmission needle assemblies are for passing through the transmission needle and the material strip
In stepped aperture combine to be transmitted.
8. equipment according to claim 6, wherein the transmission device further include:
Clip claw assembly, the clip claw assembly are located at the two sides of the track；
Wherein, the clip claw assembly includes clamping jaw, and the clip claw assembly is used to clamp the side of the material strip by the clamping jaw
To be transmitted.
9. equipment according to claim 6, further comprising:
Feeding device is connect with the controller communication, and is configured to when receiving feeding instruction and is sent the material strip
Enter track.
10. equipment according to claim 9, further comprising:
Bonding wire apparatus for work, connect with controller communication, and is configured to and receives when starting welding instruction to the material
Chip on item carries out lead welding.
11. a kind of wire bonding apparatus, comprising:
Loading attachment is used to load the material strip, wherein being provided with chip to be bonded in the material strip；
Controller is configured to send vacuum suction instruction；And
Vacuum absorption device is connect with the controller communication, and be configured to receive the vacuum suction instruction when
Vacuum is formed to adsorb and fix the material strip on the loading attachment on the vacuum absorption device.
12. equipment according to claim 11 further comprises pressing device；Wherein, the pressing device is by described
Controller controls and drops to the top of the material strip, with opposite with the vacuum absorption device.
13. equipment according to claim 12, the pressing device include:
Main body is pressed, with window, the window is for appearing described when the pressing device is located above the material strip
Chip to be bonded in material strip；And
Tentacle, one end of the tentacle are placed in the pressing main body, and the other end of the tentacle passes through the window and institute
State the upper surface contact of material strip.
14. equipment according to claim 13 contacts between the other end of the tentacle and the upper surface, but without phase
Interreaction force.
15. equipment according to claim 11, the vacuum absorption device includes chamber vacuum adsorption structure, the cavity
The following table face contact of vacuum suction structure and the loading attachment, the vacuum absorption device in the chamber vacuum by adsorbing
Vacuum is formed in space in structure to adsorb and fix the material strip.
16. equipment according to claim 15, the chamber vacuum adsorption structure is interior to have vacuum chamber, the loading attachment
It is covered on the vacuum chamber；Wherein, the vacuum absorption device is by forming vacuum in the vacuum chamber to adsorb and consolidate
The fixed material strip.
17. equipment according to claim 11, the vacuum absorption device has vacuum suction plane, the vacuum suction
Plane has several first through hole；The vacuum absorption device forms vacuum in several first through hole to adsorb and fix
The material strip.
18. the described in any item equipment of 1-17 according to claim 1, the loading attachment include:
Support plate, for carrying the material strip；Wherein, the support plate is provided with several second through-holes, second through-hole and absorption
Cavity body structure connection.
19. the vacuum chamber in equipment according to claim 18, second through-hole and the chamber vacuum adsorption structure
Connection.
20. equipment according to claim 18, second through-hole is connected to first through hole.
21. equipment according to claim 18, the loading attachment be may further comprise:
Cover board is pressed on the non-operation area of material strip, so that the material strip is placed in the support plate and cover board for closing with support plate lid
In the space coated；Wherein, the one side of the separate chip of the material strip is contacted with the support plate, and the chip is located at the material
In the operation area of item.
22. equipment according to claim 18, wherein the aperture of the one end of second through-hole contacted with the material strip
No more than the aperture of one end far from the material strip of second through-hole.
23. equipment according to claim 18, wherein the side of the support plate has notch.
24. equipment according to claim 21, wherein the fringe region of the support plate is additionally provided with positioning pin, described fixed
Position pin is for the material strip and cover board positioning.
25. equipment according to claim 21, wherein the loading attachment further includes several magnet blocks, several magnetic
Iron block is fixedly installed on the fringe region of the support plate；When the cover plate lid is set on the support plate, several magnet blocks
Attract with the fixation cover board.
26. equipment according to claim 18, wherein the support plate fringe region is provided with stepped aperture, is used for the load
Plate and the material strip are transmitted on board track by the transmission device.
27. equipment according to claim 18, wherein the fringe region of the cover board is additionally provided with notch, so that material strip
On two dimensional code exposure, facilitate equipment to read.
28. equipment according to claim 18, further comprising:
Transmission device is connect with the controller communication, is configured to when receiving send instructions and is passed through track for the dress
It carries to set and is sent to the corresponding position of the vacuum absorption device.
29. equipment according to claim 28, wherein the transmission device further include:
Needle assemblies are transmitted, the transmission needle assemblies are set to the two sides of the track；
Wherein, the transmission needle assemblies include transmission needle, and the transmission needle assemblies are used for through the transmission needle and the loading
Stepped aperture in device is combined to be transmitted.
30. equipment according to claim 29, wherein the transmission device further include:
Clip claw assembly, the clip claw assembly are located at the two sides of the track；
Wherein, the clip claw assembly includes clamping jaw, and the clip claw assembly is used to clamp the loading attachment by the clamping jaw
Side is to be transmitted.
31. equipment according to claim 28, further comprising:
Feeding device is connect with the controller communication, and is configured to when receiving feeding instruction and is filled the loading
Set feeding track.
32. equipment according to claim 31, further comprising:
Bonding wire apparatus for work, connect with controller communication, and is configured to when receiving welding instruction in the material strip
Chip carry out lead welding.
33. a kind of operating method, applied to wire bonding apparatus described in claim 1-10, comprising the following steps:
Controller sends vacuum suction instruction；And
Vacuum absorption device forms vacuum when receiving vacuum suction instruction and is inhaled with adsorbing and fixing positioned at the vacuum
Material strip on adsorption device.
34. method as claimed in claim 33, the method also includes:
Pressing device drops to the top of the material strip after receiving vacuum suction instruction, with the vacuum suction
Device is opposite.
35. method as claimed in claim 34, before the step of controller sends vacuum suction instruction, the method
Further include:
The controller sends send instructions；And
The material strip is sent to when receiving send instructions by track corresponding with the vacuum absorption device by transmission device
Position.
36. method as claimed in claim 35, before the step of controller sends send instructions, the method is also wrapped
It includes:
The controller sends feeding instruction；And
The material strip is sent into the track when receiving feeding instruction by feeding device.
37. method as claimed in claim 36, after the step of controller sends vacuum suction instruction, the method
Further include:
The controller transmission starts welding instruction；And
Bonding wire apparatus for work is receiving the chip progress started after welding instructs to the current work area in the material strip
Lead welding.
38. method as claimed in claim 37 completes the crystalline substance in the current work area of the material strip in bonding wire apparatus for work
After the step of lead welding of piece, the method also includes:
The controller, which is sent, terminates welding instruction；
The vacuum absorption device is blown when receiving the end welding instruction so that the material strip and the vacuum suction
Device separation.
39. method as claimed in claim 38, after the material strip is separated with the vacuum absorption device, the method is also
Include:
Pressing device rises, vacuum absorption device decline, and the next of the material strip is sent to by transmission device to operation area
Welding section.
40. method as claimed in claim 39, in next the step of being transferred into welding section to operation area of the material strip
Later, the method also includes:
The step of repeating after sending vacuum suction instruction, until completing the weldering of the chip of all operation areas of the material strip
It connects.
41. a kind of operating method, applied to wire bonding apparatus described in claim 11-32, comprising the following steps:
Controller sends vacuum suction instruction；And
Vacuum absorption device forms vacuum when receiving vacuum suction instruction and is inhaled with adsorbing and fixing positioned at the vacuum
Material strip on adsorption device；
Wherein, the material strip is located in loading attachment.
42. method as claimed in claim 41, the method also includes:
Pressing device drops to the top of the material strip after receiving vacuum suction instruction, with the vacuum suction
Device is opposite.
43. method as claimed in claim 41, before the step of controller sends vacuum suction instruction, the method
Further include:
The controller sends send instructions；And
The loading attachment is sent to and the vacuum absorption device when receiving send instructions by track by transmission device
Corresponding position.
44. method as claimed in claim 43, before the step of controller sends send instructions, the method is also wrapped
It includes:
The controller sends feeding instruction；And
The loading attachment is sent into the track when receiving feeding instruction by feeding device.
45. method as claimed in claim 41, after the step of controller sends vacuum suction instruction, the method
Further include:
The controller transmission starts welding instruction；And
Bonding wire apparatus for work is receiving the chip progress started after welding instructs to the current work area in the material strip
Lead welding.
46. method as claimed in claim 45 completes the crystalline substance in the current work area of the material strip in bonding wire apparatus for work
After the step of lead welding of piece, the method also includes:
The controller, which is sent, terminates welding instruction；And
The vacuum absorption device is blown when receiving the end welding instruction so that the material strip and the vacuum suction
Device separation.
47. method as claimed in claim 46, after the material strip is separated with the vacuum absorption device, the method is also
Include:
Pressing device rises, vacuum absorption device decline, and the next of the material strip is sent to by transmission device to operation area
Welding section.
48. method as claimed in claim 47, in next the step of being transferred into welding section to operation area of the material strip
Later, the method also includes:
The step of repeating after sending vacuum suction instruction, until completing to the chip of all operation areas of the material strip
Welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910649202.1A CN110265312B (en) | 2019-07-19 | 2019-07-19 | Wire bonding apparatus and method of operation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910649202.1A CN110265312B (en) | 2019-07-19 | 2019-07-19 | Wire bonding apparatus and method of operation |
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| CN110265312A true CN110265312A (en) | 2019-09-20 |
| CN110265312B CN110265312B (en) | 2024-03-01 |
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| CN201910649202.1A Active CN110265312B (en) | 2019-07-19 | 2019-07-19 | Wire bonding apparatus and method of operation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110773932A (en) * | 2019-11-13 | 2020-02-11 | 温州大学 | Positioning device for welding semiconductor device |
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| CN110265312B (en) | 2024-03-01 |
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