JPH08255803A - Semiconductor module and manufacture thereof - Google Patents

Abstract

PURPOSE: To provide a manufacturing method of a semiconductor module on which the repair work for chip replacement can be performed easily. CONSTITUTION: First, a semiconductor chip 3 is tacked by vacuum sucking force to the aperture part 1a of a module substrate 1, and the semiconductor chip 3 and the conductor pattern of the module substrate 1 are connected by a wire 4 in the above-mentioned state. Then,the semiconductor chip 3 is permanently fixed to the module substrate 1 by resin-sealing on the wire connection side of the semiconductor chip 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor module having a semiconductor chip mounted on a module substrate and a method for manufacturing the same.

[0002]

2. Description of the Related Art Among the mounting forms of semiconductor modules,
There is a type called direct bonding in which a semiconductor chip (bare chip) divided into individual pieces from a wafer is directly mounted on a substrate. Conventionally, when manufacturing a semiconductor module of this type, as shown in FIG.
The semiconductor chip 3 is bonded to the upper bonding pad (not shown) via the die bonding agent 2. Next, the conductor pattern (not shown) formed on the module substrate 1 and the semiconductor chip 3 are connected by the wire 4 such as a gold wire, and then the semiconductor chip 3 is sealed with the chip coat resin 5.

[0003]

However, in the above conventional manufacturing method, the semiconductor chip 3 is fixed to the module substrate 1 by the die bonding agent 2, and then the conductor pattern of the module substrate 1 and the semiconductor chip 3 are connected by the wire 4. Because of the connection, there were the following inconveniences. That is,
When a plurality of semiconductor chips 3 are mounted on the module substrate 1 such as a multi-chip module, one defective chip causes the entire module to be defective. Therefore, defective chips are detected by the characteristic measurement after wire bonding. In this case, repair work may be performed to replace the defective chip with a good chip. In such repair work, since the defective chip already fixed by the die bond agent 2 is forcibly peeled off from the module substrate 1, a secondary defect such as scratching the module substrate 1 or another semiconductor chip 3 by mistake during the work. There was a risk of causing. In addition to peeling off the defective chip, the die bonding agent 2 remaining on the module substrate 1 must be removed in order to flatten the bonding pad portion after the chip is peeled off, and a series of repair work is extremely complicated. It was.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method of manufacturing a semiconductor module, which can easily carry out repair work mainly for chip replacement. It is in.

[0005]

The present invention has been made to achieve the above object, and is a method for manufacturing a semiconductor module in which a semiconductor chip is mounted at a predetermined position on a module substrate on which a conductor pattern is formed. First, the semiconductor chip and the conductor pattern are connected by a wire in a state where the semiconductor chip is temporarily fixed by a vacuum suction force at a predetermined position on the module substrate. Then, the wire connection surface side of the semiconductor chip is resin-sealed to permanently fix the semiconductor chip to the module substrate.

[0006]

In the method of manufacturing the semiconductor module according to the present invention, the semiconductor chip is temporarily fixed to a predetermined position of the module substrate by the vacuum suction force, and in this state, the conductor pattern of the module substrate and the semiconductor chip are connected by the wire. It After wire bonding, the wire connection surface side of the semiconductor chip is resin-sealed, whereby the semiconductor chip is permanently fixed at a predetermined position on the module substrate. Therefore, if a defective chip is detected in the characteristic measurement after wire bonding, it becomes possible to remove the defective chip from the module substrate simply by pushing out the defective chip in the direction orthogonal to the substrate surface. After that, a replacement good chip can be mounted without the need for removing the die bonding agent and the like as in the conventional case.

[0007]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a diagram illustrating a first embodiment of a method of manufacturing a semiconductor module according to the present invention.
In the first embodiment, first, as shown in FIG. 1A, the module substrate 1 is placed on the upper surface of a jig board 6 having a through hole 6a for vacuuming. At that time, the module substrate 1 is provided with an opening 1a larger than, for example, the chip diameter in advance corresponding to the chip mounting position. Further, the jig board 6 is provided with a positioning means for the module substrate 1 (for example, a positioning pin (not shown)), and when the module substrate 1 is placed on the upper surface of the board, the opening 1
The through hole 6a is located substantially at the center of a.

Next, the semiconductor chip 3 transferred by a suction collet or the like is placed in the opening 1a of the module substrate 1. As a result, the upper end of the through hole 6 a of the jig board 6 is closed by the back surface of the semiconductor chip 3. At this time, if the projection 6b for chip positioning as shown by the dotted line in the drawing is formed on the jig board 6, the semiconductor chip 3 can be accurately positioned in the opening 1a of the module substrate 1 and the opening 1a can be positioned. The advantage that the lateral displacement of the semiconductor chip 3 can be surely prevented is obtained.

Then, vacuuming is performed through the through hole 6a of the jig board 6. As a result, the semiconductor chip 3 is adsorbed on the jig board 6, so that the semiconductor chip 3 is temporarily fixed to the opening 1a at the predetermined position of the module substrate 1, that is, the chip mounting position by its vacuum adsorption force. Next, while temporarily fixing the semiconductor chip 3 as described above, the conductor pattern of the module substrate 1 and the semiconductor chip 3 are connected by the wires 4 by a wire bonding tool (capillary or the like) not shown.

After that, the vacuuming is stopped and the module substrate 1 is removed from the jig board 6. At this time, the semiconductor chip 3 is mechanically connected to the module substrate 1 by a large number of wires 4, and since the chip itself is extremely light, the position of the semiconductor chip 3 is held by the wires 4. Subsequently, as shown in FIG. 1B, the auxiliary substrate 7 is superposed on the lower surface side of the module substrate 1 detached from the jig board 6 to bring them into close contact with each other. Furthermore, in this state, a paste-like chip coating agent (for example, thermosetting resin) 5 is dropped from above the module substrate 1 to form the semiconductor chip 3
The wire connection surface side of is sealed with resin. After that, the chip coating agent 5 is completely cured, and the opening 1 of the module substrate 1 is
The semiconductor chip 3 is permanently fixed to a.

As described above, in the first embodiment, the semiconductor chip 3 is placed in the opening 1a of the module substrate 1 and then vacuum is drawn through the through hole 6a provided in the jig board 6, Since the wire 4 is connected while the semiconductor chip 3 is temporarily fixed by the vacuum suction force, even if a defective chip is detected in the characteristic measurement after wire bonding, the defective chip is simply pushed out in the direction orthogonal to the substrate surface. The defective chip can be easily removed from the module substrate 1. Further, after removing the defective chip, it is not necessary to remove the die-bonding agent or the like as in the conventional case, and the same procedure as described above is used again to replace the opening 1a at the predetermined position of the module substrate 1, that is, the chip mounting position. A good chip can be mounted.

Here, after the semiconductor chip 3 is permanently fixed to the module substrate 1 as described above, the auxiliary substrate 7 may be removed to form a final product, but the auxiliary substrate 7 is left as it is as one component of the semiconductor module. In this case, the auxiliary substrate 7 is previously made of a material having a high thermal conductivity (eg, copper, aluminum, ceramics, etc.), and this is used as a heat dissipation plate on the surface opposite to the wire connection surface of the semiconductor chip 3, that is, a large amount of heat is generated. It is more preferable to bond it to the back surface of the chip. That is, in the module structure thus obtained, not only the repair work accompanying the detection of the defective chip is facilitated in the manufacturing process, but also the heat generated in the semiconductor chip 3 during the module operation is conducted to the heat dissipation plate 7, Since it is efficiently dissipated to the outside, the heat dissipation effect of the entire module is significantly enhanced. If a fin structure is adopted for the heat dissipation plate 7, a larger heat dissipation area can be obtained,
The heat dissipation effect can be further improved. By the way, when the heat sink 7 is joined, the individual heat sinks 7 may be joined to the individual semiconductor chips 3, but if the heat sink 7 is joined over the entire surface of the module substrate 1, the number of assembling steps may be increased. It is advantageous in terms of heat dissipation.

FIG. 2 is a diagram for explaining a second embodiment of the method of manufacturing a semiconductor module according to the present invention. In the second embodiment, first, as shown in FIG. 2A, a planar rectangular recess 1b is formed at a predetermined position of the module substrate 1 corresponding to the chip mounting position at the substrate manufacturing stage, and the recess 1 is further formed.
A through hole 1c for vacuuming is formed in the center of b. At the time of chip mounting, the semiconductor chip 3 transferred by a suction collet or the like is placed in the recess 1b of the module substrate 1. At this time, although not shown, if a projection for chip positioning is formed on the bottom surface of the recess 1b in advance, or if the recess 1b of the module substrate 1 is formed slightly larger than the chip diameter, the module substrate 1 On the other hand, the semiconductor chip 3 can be accurately positioned, and lateral displacement of the chip in the recess 1b can be reliably prevented.

Subsequently, the through hole 1 provided in the module substrate 1
Vacuuming is performed via c, and the semiconductor chip 3 is temporarily fixed to the opening 1a at a predetermined position of the module substrate 1, that is, a chip mounting position by the vacuum suction force. Next, while temporarily fixing the semiconductor chip 3, the conductor pattern of the module substrate 1 and the semiconductor chip 3 are connected by the wires 4 by a wire bonding tool (capillary or the like) not shown.

After that, the vacuuming is stopped and the through hole 1c of the module substrate 1 is closed by the sealing material 8. In this state, the paste chip coating agent 5 is dropped from above the module substrate 1 to connect the semiconductor chip 3 to the wire. The surface side is resin-sealed. Further, completely cure the tip coat agent 5,
The semiconductor chip 3 is permanently fixed to the recess 1b of the module substrate 1.

As described above, in the second embodiment, after the semiconductor chip 3 is arranged in the recess 1b of the module substrate 1, the semiconductor chip 3 is vacuum-sucked by vacuuming through the through hole 1c of the substrate. Since the wire 4 is connected in a state of being temporarily fixed by force, even if a defective chip is detected in the characteristic measurement after wire bonding, the defective chip is simply pushed out in the direction orthogonal to the substrate surface through the through hole 1c. Thus, the defective chip can be easily removed from the module substrate 1. Further, after the defective chip is removed, there is no need to remove the die-bonding agent or the like as in the conventional case, and the same procedure as described above is used again to replace the concave portion 1b at the predetermined position of the module substrate 1, that is, the chip mounting position with a good product for replacement. A chip can be mounted.

FIG. 3 is a view for explaining a third embodiment of the semiconductor module manufacturing method according to the present invention. The third embodiment differs from the above-described first and second embodiments in the method of resin encapsulation, which is performed after wire bonding.

That is, in the method shown in FIG. 3 (a), the semiconductor chip 3 is temporarily fixed to the opening 1a of the module substrate 1 by the vacuum suction force as in the first embodiment, and the conductor pattern of the module substrate 1 is formed. After connecting the semiconductor chip 3 with the wire 4, the module substrate 1 is dipped in a paste-like chip coating agent 5 placed in a box-shaped case 9 with the module substrate 1 facing downward. As a result, the wire connection surface side of the semiconductor chip 3 is resin-sealed with the chip coating agent 5, and the chip coating agent 5 is completely cured to permanently fix the semiconductor chip 3 in the opening 1 a of the module substrate 1.

Further, in the method shown in FIG. 3B, the semiconductor chip 3 is temporarily fixed to the recess 1b of the module substrate 1 by the vacuum suction force as in the second embodiment, and the conductor pattern of the module substrate 1 and the semiconductor After connecting the chip 3 and the wire 4 to each other, the module substrate 1 is dipped in a paste-like chip coating agent 5 placed in a box-shaped case 9 with the module substrate 1 facing downward. As a result, the wire connection surface side of the semiconductor chip 3 is resin-sealed with the chip coating agent 5, and the chip coating agent 5 is completely cured to form the recess 1 b
The semiconductor chip 3 is permanently fixed to.

As described above, in the third embodiment, the module substrate is not provided with the resin leakage preventing means such as the auxiliary substrate 7 and the sealing material 8 at the time of resin sealing as in the first and second embodiments. Since a plurality (two in the illustrated example) of semiconductor chips 3 mounted on one can be collectively resin-sealed and fixed permanently at a predetermined position (opening 1a, recess 1b, etc.), Simplification is achieved. The case 9 may be removed after the chip coating agent 5 is cured, or may be directly attached to the module substrate 1 to form the final product.

[0021]

As described above, according to the present invention,
The semiconductor chip is temporarily fixed to a predetermined position of the module substrate by a vacuum suction force, and in this state, the conductor pattern of the module substrate and the semiconductor chip are connected by a wire, and after wire bonding, the wire connection surface side of the semiconductor chip is made of resin. Even if a defective chip is detected in the characteristic measurement after wire bonding, because the semiconductor chip is sealed and the semiconductor chip is permanently fixed at a predetermined position on the module substrate,
The defective chip can be removed from the module substrate by a simple operation such as pushing out the defective chip in a direction orthogonal to the surface of the substrate. Further, even after the defective chip is removed from the module substrate, it is possible to mount a good replacement chip without the need for complicated work such as removing the die bonding agent and the like as in the conventional case. As a result, in the repair work (chip replacement work) of a multi-chip module etc. due to a chip defect, there is no secondary defect such as damage to the module substrate or other semiconductor chips when the defective chip is removed from the module substrate. Therefore, it is possible to improve the total yield as a semiconductor module and reduce the cost. Further, since the repair work is extremely simple as described above, it is possible to standardize the work and improve the efficiency.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a second embodiment of the present invention.

FIG. 3 is a diagram illustrating a third embodiment of the present invention.

FIG. 4 is a diagram illustrating a conventional example.

[Explanation of symbols]

 1 Module Board 1a Opening 3 Semiconductor Chip 4 Wire 5 Chip Coating Agent 7 Auxiliary Board (Heat Radiating Plate)

Claims (2)

[Claims] 1. A method of manufacturing a semiconductor module in which a semiconductor chip is mounted at a predetermined position on a module substrate having a conductor pattern formed thereon, wherein the semiconductor chip is temporarily fixed at a predetermined position on the module substrate by a vacuum suction force. A semiconductor module characterized in that the semiconductor chip and the conductor pattern are connected by a wire with a wire, and then the wire connection surface side of the semiconductor chip is resin-sealed to permanently fix the semiconductor chip to the module substrate. Manufacturing method. 2. A module substrate having an opening at a chip mounting position, a semiconductor chip arranged in the opening of the module substrate and connected to a conductor pattern of the module substrate via a wire, and arranged in the opening. A semiconductor module, comprising: a chip coating agent for fixing the formed semiconductor chip; and a heat dissipation plate bonded to a surface of the semiconductor chip opposite to a wire connection surface.