CN110265312B - Wire bonding apparatus and method of operation - Google Patents

Wire bonding apparatus and method of operation Download PDF

Info

Publication number
CN110265312B
CN110265312B CN201910649202.1A CN201910649202A CN110265312B CN 110265312 B CN110265312 B CN 110265312B CN 201910649202 A CN201910649202 A CN 201910649202A CN 110265312 B CN110265312 B CN 110265312B
Authority
CN
China
Prior art keywords
vacuum adsorption
instruction
material strip
vacuum
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910649202.1A
Other languages
Chinese (zh)
Other versions
CN110265312A (en
Inventor
周猛
林子翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Riyuexin Semiconductor Suzhou Co ltd
Original Assignee
Riyuexin Semiconductor Suzhou Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riyuexin Semiconductor Suzhou Co ltd filed Critical Riyuexin Semiconductor Suzhou Co ltd
Priority to CN201910649202.1A priority Critical patent/CN110265312B/en
Publication of CN110265312A publication Critical patent/CN110265312A/en
Application granted granted Critical
Publication of CN110265312B publication Critical patent/CN110265312B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Embodiments of the present application relate to a wire bonding apparatus and method of operation. A wire bonding apparatus comprising: a controller configured to send a vacuum adsorption instruction; and a vacuum adsorption device communicatively connected to the controller and configured to form a vacuum to adsorb and fix a strand located on the vacuum adsorption device upon receipt of the vacuum adsorption instruction; wherein, the material strip is provided with wafers to be bonded.

Description

Wire bonding apparatus and method of operation
Technical Field
The present application relates to the field of wire bonding technology, and in particular, to wire bonding apparatus and methods of operation.
Background
In the process of manufacturing integrated circuit semiconductor packages, the process flow of wire bonding the die attached to the strip directly affects the yield of packaged semiconductor products and modules. In addition, as integrated circuit semiconductor products continue to move toward miniaturization, higher demands are being placed on how to design better wire bonding process equipment and process flows.
Disclosure of Invention
According to some embodiments of the present application, a wire bonding apparatus includes: a controller configured to send a vacuum adsorption instruction; and a vacuum adsorption device communicatively connected to the controller and configured to form a vacuum to adsorb and fix a strand located on the vacuum adsorption device upon receipt of the vacuum adsorption instruction; wherein, the material strip is provided with wafers to be bonded.
According to some embodiments of the present application, a method of operation, applied to the wire bonding apparatus, comprises the steps of: the controller sends a vacuum adsorption instruction; and the vacuum adsorption device forms vacuum to adsorb and fix the material strips on the vacuum adsorption device when receiving the vacuum adsorption instruction.
According to some embodiments of the present application, a wire bonding apparatus includes: loading means for loading the strand on which wafers to be bonded are provided; a controller configured to send a vacuum adsorption instruction; and a vacuum adsorption device communicatively connected to the controller and configured to form a vacuum upon receipt of the vacuum adsorption command to adsorb and secure the strip on the loading device on the vacuum adsorption device.
According to some embodiments of the present application, a method of operation, applied to the wire bonding apparatus, comprises the steps of: the controller sends a vacuum adsorption instruction; the vacuum adsorption device forms vacuum to adsorb and fix the material strip on the vacuum adsorption device when receiving the vacuum adsorption instruction; wherein the material strip is positioned in the loading device.
Drawings
The drawings that are necessary to describe embodiments of the present application or the prior art will be briefly described below in order to describe the embodiments of the present application. It is apparent that the figures in the following description are only some of the embodiments in this application. It will be apparent to those skilled in the art that other embodiments of the drawings may be made in accordance with the structures illustrated in these drawings without the need for inventive faculty.
Fig. 1 is a functional block diagram of a wire bonding apparatus according to some embodiments of the present application.
Fig. 2 is a schematic structural diagram of a pressing device according to some embodiments of the present application.
Fig. 3 is a schematic structural diagram of a pressing device and a strip according to some embodiments of the present application.
Fig. 4 is a schematic structural diagram of a pressing device and a vacuum adsorption device according to some embodiments of the present application.
Fig. 5 is a schematic structural diagram of a vacuum adsorption device and a material strip according to some embodiments of the present application.
Fig. 6-8 are schematic structural diagrams of a conveyor and a strip according to some embodiments of the present application.
Fig. 9 is a flow chart of a method of operation of a wire bonding apparatus according to some embodiments of the present application.
Fig. 10 is a functional block diagram of a wire bonding apparatus according to some embodiments of the present application.
Fig. 11 and 12 are schematic structural views of a vacuum adsorption device, a loading device and a strand according to some embodiments of the present application.
Fig. 13 and 14 are schematic structural views of carrier plates according to some embodiments of the present application.
Fig. 15 is a schematic structural view of a cover plate according to some embodiments of the present application.
Fig. 16 is a flow chart of a method of operation of a wire bonding apparatus according to some embodiments of the present application.
Detailed Description
Embodiments of the present application will be described in detail below. Throughout the specification, identical or similar components and components having identical or similar functions are denoted by similar reference numerals. The embodiments described herein with respect to the drawings are of illustrative nature, of diagrammatic nature and are used to provide a basic understanding of the present application. The examples of the present application should not be construed as limiting the present application.
The 4G age is about to fall on the screen, the 5G age is about to open, and each country will also develop the most vigorous competition in the 5G age. According to the plan made by the country, the 5G network is expected to be pre-commercialized in the China part of China in 2019, and formally spread in large areas for comprehensive business in 2020. The advanced base station design is an important ring for realizing 5G communication, and the 5G base station adopts a small cell design, so that the large market scale and economic benefit can be generated in the future due to the short transmission distance of each small cell and the large base station demand.
The power amplifier in the 5G base station can be divided into two types, namely a single-stage amplifier transistor and a power amplifier module, wherein the power amplifier module is relatively simple in wiring, lead frame design is adopted, the lead frame design is complex in wiring, substrate design is adopted, and when the substrate is used as a power amplifier carrier plate, the substrate is easy to crush by a traditional pressing claw. In addition, due to the miniaturization of 5G base stations, the miniaturization requirements for semiconductor products and modules are also increased. Accordingly, there is a need for an efficient wire bonding apparatus.
Fig. 1 is a wire bonding apparatus of some embodiments of the present application. The wire bonding apparatus 100 includes a controller 101 and a vacuum suction device 104. The controller 100 is configured to send a vacuum chucking instruction. The vacuum adsorption device 104 is communicatively connected to the controller 101 and forms a vacuum to adsorb and fix the strand located on the vacuum adsorption device 104 upon receiving a vacuum adsorption command. Wherein, the wafer of the wire to be bonded is arranged on the material strip. The material strip comprises a substrate or a lead frame, and the material strip is fixed through vacuum adsorption, so that other fixing devices are not required to fix the material strip, and the material strip is prevented from being crushed. Therefore, the wafer on the strand adsorbed by the vacuum can be effectively wire-bonded.
In some embodiments of the present application, the wire bonding apparatus 100 includes a bonding device 105. As shown in fig. 2-4, the pressing device 105 is also lowered above the material strip 200 after receiving the vacuum suction instruction, so as to be opposite to the vacuum suction device 104. The bonding apparatus 105 includes a bonding body 1051 and a tentacle 1052. Wherein the bonding body 1051 has a window for exposing the wafers to be bonded in the strip when the bonding device 105 is lowered over the strip 200. One end of the feeler 1052 is disposed on the pressing body, and the other end of the feeler 1052 is in contact with the upper surface of the strip 200 through the window. In some embodiments of the present application, there is no interaction force, but there is contact between the other end of the feeler 1052 and the upper surface of the strip 200. That is, only contact is performed without pressing the strip, so that the strip can be prevented from warping around due to bulge of the contact position with the vacuum adsorption device when the strip bears the adsorption force of the adsorption device. In some embodiments of the present application, there is no contact between the other end of the tentacle and the upper surface of the strand.
In some embodiments of the present application, the window may employ a large fenestration design and a small fenestration design. For example, when a large window is adopted, the width of the window is larger than or equal to the width of the material strip bonding wire area, and the length of the window is larger than the length of the single-row chip bonding wire area. This ensures that the subsequent wire bonding operation is only performed within the window of the compression device 105, reducing or avoiding the risk of damage to other wafers during soldering. In some embodiments of the present application, the pressing body 1051 is made of metal.
In some embodiments of the present application, the vacuum adsorption device 104 includes a cavity vacuum adsorption structure 1041 in contact with the lower surface of the strand 200, and the vacuum adsorption device 104 adsorbs and fixes the strand 200 by forming a vacuum in the space in the cavity vacuum adsorption structure 1041. In some embodiments of the present application, the vacuum adsorption apparatus 104 further comprises a vacuum line assembly 1042. The vacuum adsorption structure 1041 is in communication with a vacuum line assembly 1042, the vacuum line assembly 1042 being configured to form a vacuum in a space within the cavity vacuum adsorption structure 1041.
In some embodiments of the present application, as shown in fig. 5, a vacuum adsorption plane 1044 located on the vacuum chamber 1043 is provided in the chamber vacuum adsorption structure 1041, and the vacuum adsorption plane 1044 has first through holes, and the vacuum adsorption device 104 adsorbs and fixes the material strip 200 by forming a vacuum in the vacuum chamber 1043 and the first through holes. In some embodiments of the present application, the vacuum adsorption device 104 is a metal material. In some embodiments, the aperture of the first through hole is no greater than 0.1mm. In some embodiments, the pitch of the first vias is greater than twice the aperture. The aperture of the first through hole and the distance are determined by the adsorption capacity of the material strip, the finger size and the cost.
In some embodiments of the present application, the wire bonding apparatus 100 further comprises a transfer device 103. The conveying device 103 is in communication connection with the controller 101, and conveys the material strip 200 to a position corresponding to the vacuum adsorption device 104 through a track when receiving a conveying instruction. For example, the strip 200 is transported over the vacuum suction device 104.
In some embodiments of the present application, the delivery device 103 includes a delivery needle assembly, as shown in fig. 6 and 7. The conveying needle components are arranged on two sides of the track. Wherein the delivery needle assembly comprises a delivery needle 1031. The transfer needle assembly engages the stepped bore 203 in the strip 200 through the transfer needle 1031 to effect movement of the strip 200. The material of the transfer needle 1031 is metal. The transfer needle 1031 may be inserted into the stepped bore 203 in the strip 200. Wherein the strip 200 comprises a wafer 201 and a substrate 202.
In some embodiments of the present application, the transfer device 103 includes a jaw assembly, as shown in fig. 8. The clamping jaw assemblies are positioned on two sides of the rail. The jaw assembly includes a jaw 1032. The jaw assembly grips the sides of the strip 200 by the jaws 1032 for transport.
In some embodiments of the present application, the wire bonding apparatus 100 further includes a loading device 102. The feeding device 102 is in communication connection with the controller 101 and feeds the strip into the track upon receiving a feeding command. In an embodiment of the present application, the loading device 102 includes a push rod, and the bar is pushed into the track by the push rod.
In some embodiments of the present application, wire bonding apparatus 100 further includes wire bonding device 106. The wire bonding apparatus 106 performs wire bonding of the die 201 on the bar 200 held by the vacuum suction apparatus 104 and the bonding apparatus 105 upon receiving a bonding start instruction. Wherein, bonding wire operation device 106 includes the welding module, the welding module includes: the wire clip, the welding needle, the transduction rod and the wire feeding device are used for conducting wire bonding on the wafer 201 in the current operation area on the material strip 200 through the welding module. After the wafer 201 in the current working area of the strip is welded, the controller 101 controls the vacuum suction device 104 to be converted into a blowing state to separate the vacuum suction device 104 from the strip 200, and simultaneously lifts the pressing device 105. Then, the controller 101 controls the conveying device 103 to convey the die to be soldered of the next operation area of the bar 200 to the soldering area of the wire bonding operation device 106, so that the wire bonding operation device 106 performs soldering on the die 201 to be soldered, and repeats the above-mentioned process until the soldering of the die 201 of all operation areas of the bar 200 is completed. After the wire bonding is completed on the current bar 200, the feeding device 102 pushes the next bar into the track through the push rod, so as to perform the wire bonding operation of the next bar through the wire bonding apparatus 100.
Fig. 9 is a flow chart of a method of operation of some embodiments of the present application. An operation method applied to the wire bonding apparatus 100 of the above embodiment includes the steps of:
in step 1001, the feeding device 102 sends the strip 200 into the track after receiving the feeding command sent by the controller 101.
Step 1002, after the controller 101 sends a transfer instruction after the loading is completed, when the transfer instruction sent by the controller is received by the transfer device 103, the material strip 200 is transferred to a position corresponding to the vacuum adsorption device 104. The corresponding location is above the vacuum suction device 104, i.e., the wire bonding area.
In step 1003, the controller 101 sends a vacuum suction instruction after the material bar 200 is transferred to the target position, and the vacuum suction device 104 rises and forms a vacuum to suck and fix the material bar 200 located above the vacuum suction device 104 when receiving the vacuum suction instruction.
Step 1004, the pressing device 105 descends to the upper side of the material strip 200 after receiving the vacuum adsorption command, and faces the vacuum adsorption device 104. In some embodiments of the present application, the pressing device 105 engages the strip 200 and does not exert pressure on the strip 200. In this way, damage to the strip 200 is effectively avoided. In some embodiments of the present application, the compression device 105 engages the web 200 and applies pressure to the web 200. When the middle part of the material strip 200 is likely to be concave under the vacuum pressure of the vacuum adsorption device, the edge of the material strip 200 can warp, the flatness of the material strip 200 can be ensured through the pressing device 105, and the subsequent effective wire bonding is ensured.
In step 1005, the controller 101 sends a welding start command after the vacuum suction device 104 and the pressing device 105 complete the corresponding commands, and the wire bonding device 106 performs wire bonding on the die of the current working area of the bar 200 after receiving the welding start command, so as to complete wire bonding on the die of the current working area.
In step 1006, the controller 101 sends a separation command after receiving the welding command, and the vacuum suction device 104 blows air after receiving the separation command to separate the material strip 200 from the vacuum suction device 104.
In step 1007, after the material strip 200 is separated from the vacuum adsorption device 104, the controller 101 controls the pressing device 105 to rise and the vacuum adsorption device 104 to descend, and the conveying device 103 conveys the next area to be processed of the material strip 200 to the bonding area for wire bonding.
Step 1008, repeating steps 1003-1007 until the wire bonding of wafer 201 is completed for all working areas of bar 200.
In some embodiments of the present application, the method of operation further comprises: after completion of step 1008, the above steps are repeated to wire bond the next piece of the strip to be wire bonded.
Fig. 10 is a functional block diagram of a wire bonding apparatus according to some embodiments of the present application. The wire bonding apparatus 100 includes a loading device 107, a controller 101, and a vacuum suction device 104. The loading device 107 is used for loading the bar 200 on which the wafer to be wire bonded is arranged. The controller 101 is configured to send a vacuum chucking instruction. The vacuum adsorption device 104 is communicatively connected to the controller 101 and forms a vacuum to adsorb and fix the material strips 200 in the loading device 107 located on the vacuum adsorption device 104 upon receiving a vacuum adsorption command. Because the material strip 200 is fixed through vacuum adsorption, other fixing devices are not needed to fix the material strip 200, and the material strip is prevented from being crushed. Therefore, the die 201 on the bar 200 adsorbed by the vacuum can be effectively wire-bonded. In addition, the loading device 107 can effectively protect the material strip 200 and the wafer 201 therein from damage during the process before and after soldering.
In some embodiments of the present application, the wire bonding apparatus 100 includes a bonding device 105. As shown in fig. 2-3, the pressing device 105 is also lowered above the material strip 200 after receiving the vacuum suction command, so as to be opposite to the vacuum suction device. The bonding apparatus 105 includes a bonding body 1051 and a tentacle 1052. Wherein the bonding body 1051 has a window for exposing the wafers to be bonded in the strip when the bonding device 105 is lowered over the strip 200. One end of the feeler 1052 is disposed on the pressing body 1051, and the other end of the feeler 1052 is in contact with the upper surface of the strip 200 through the window. In some embodiments of the present application, the other end of the tentacle is in contact with the upper surface of the strand, but without interaction forces. That is, only contact is made without pressure being applied to the material strip 200, so that warpage of the periphery caused by bulge of the material strip 200 at the position in contact with the vacuum suction device 104 when the suction force of the vacuum suction device 104 is received can be avoided. In some embodiments of the present application, there is no contact between the other end of the feeler 1052 and the upper surface of the strip 200.
In some embodiments of the present application, the window may employ a large fenestration design and a small fenestration design. For example, when a large window is adopted, the width of the window is larger than or equal to the width of the material strip bonding wire area, and the length of the window is larger than the length of the single-row chip bonding wire area. Thus, the subsequent wire bonding operation can be ensured to be performed only in the window of the pressing device, and the risk that other wafers are possibly damaged during welding can be reduced or avoided. In some embodiments of the present application, the pressing body 1051 is made of metal.
In some embodiments of the present application, the vacuum adsorption device 104 includes a cavity vacuum adsorption structure 1041, the cavity vacuum adsorption structure 1041 being in contact with a lower surface of the loading device 107, and the vacuum adsorption device 104 adsorbs and fixes the strand 200 by forming a vacuum in a space in the cavity vacuum adsorption structure 1041.
In some embodiments of the present application, as shown in fig. 11, the cavity vacuum adsorption structure 1041 has a vacuum cavity 1043 therein, and the loading device 107 is covered on the vacuum cavity 1043, wherein the vacuum adsorption device 104 adsorbs and fixes the material strip 200 by forming a vacuum in the vacuum cavity 1043.
In some embodiments of the present application, as shown in fig. 12, the cavity vacuum adsorption structure 1041 has a vacuum adsorption plane 1044, the vacuum adsorption plane 1044 having a plurality of first through holes, and the vacuum adsorption device 104 adsorbs and fixes the strands by forming a vacuum in the plurality of first through holes. In some embodiments of the present application, the vacuum adsorption device 104 is a metal material. In some embodiments, the aperture of the first through hole is no greater than 0.1mm. In some embodiments, the pitch of the first vias is greater than twice the aperture. Wherein the aperture of the first via, pitch is determined by the adsorption capacity of the substrate 202, finger size, and cost. The cavity vacuum adsorption structure 1041 is in communication with the vacuum line assembly 1042, and the vacuum line assembly 1042 is configured to vacuum the space within the cavity vacuum adsorption structure 1041.
In some embodiments of the present application, the loading device 107 further comprises a carrier plate 1071. As shown in fig. 13 and 14, a carrier plate 1071 is used to carry the strip 200. The carrier 1071 is provided with a plurality of second through holes, which are communicated with the cavity vacuum adsorption structure 1041. Returning to fig. 12, when the chamber vacuum adsorption structure 1041 is provided with a vacuum adsorption plane 1044 having a first through hole, a second through hole on the carrier plate 1071 communicates with the first through hole. In some embodiments, the second via corresponds to the first via. Returning to fig. 11, when the vacuum chamber 1043 is directly provided without the vacuum adsorption plane 1044 having the first through-holes in the chamber vacuum adsorption structure 1041, the second through-holes in the carrier plate 1071 communicate with the vacuum chamber 1043.
The loading device 107 further includes a cover 1072, as shown in fig. 15. The cover 1072 is used for covering the carrier 1071 and pressing the non-working area of the strip 200, so that the strip 200 is accommodated in the space covered by the carrier 1071 and the cover 1072. The surface of the strip 200 away from the wafer 201 contacts the carrier 1071, and the wafer 201 is located between the strip 200 and the cover 1072 and in the working area of the strip 200. In some embodiments, the aperture of the end of the second through-hole that is in contact with the slug 200 (i.e., the slug upper end surface) is no greater than the aperture of the end of the second through-hole that is distal from the slug 200 (i.e., the slug lower end surface). For example, the second through-hole has a hole diameter of 0.1mm at the upper end surface of the bar 200 and a hole diameter of 1.0mm at the lower end surface, but is not limited thereto. In some embodiments, the aperture of the end of the second through hole that is in contact with the bar 200 (i.e., the bar upper end surface) is larger than the aperture of the end of the second through hole that is remote from the bar 200 (i.e., the bar lower end surface). In some embodiments, the aperture of the end of the second through hole that is in contact with the slug 200 (i.e., the slug upper end surface) is equal to the aperture of the end of the second through hole that is distal from the slug 200 (i.e., the slug lower end surface).
In some embodiments, the side ends of the carrier plate 1071 have notches 1073. Through this gap 1073, the strip 200 can be manually loaded or unloaded. In some embodiments, the edge region of the carrier plate 1071 is further provided with positioning pins (pins) 1074, which positioning pins 1074 are used for positioning the strip 200 and the cover plate 1072, avoiding misplacement. In some embodiments, the loading device 107 further includes a plurality of magnet blocks 1075, and the magnet blocks 1075 are fixedly disposed on an edge region of the carrier plate 1071. When the cover 1072 is disposed on the carrier 1071, the magnet 1075 attracts to fix the cover 1072. In some embodiments, the magnet block is capable of withstanding a temperature of 300 ℃. In some embodiments, the carrier 1071 is made of aluminum. In some embodiments, the surface of the carrier plate 1071 is anodized. In some embodiments, the side end of the carrier 1071 further has a through hole for automatically loading and unloading the loading device 102. In some embodiments, the cover 1072 is made of blue steel, and the surface is blackened to prevent oxidation of the cover. In some embodiments, a notch (not labeled in the figure) is further provided in the edge area of the cover 1072, so that the two-dimensional code on the strip 200 is exposed, which is convenient for the device to read. In some embodiments, the edge region of the carrier plate 1071 is provided with a stepped hole 1076, which stepped hole 1076 is used for the carrier plate 1071 and the strip 200 to be transported on the track by the transport means. In some embodiments, the cover 1072 further locates the hole 1077. The positioning holes 1077 are used to cooperate with positioning pins 1074 on the carrier plate 1071 for positioning.
In some embodiments of the present application, the wire bonding apparatus 100 further comprises a transfer device 103. The conveying device 103 is in communication connection with the controller 101, and conveys the loading device 107 filled with the material strips to a position corresponding to the vacuum adsorption device 104 through the track when receiving a conveying instruction. For example, the loading device 107 is transferred to above the vacuum adsorption device 104.
In some embodiments of the present application, the delivery device 103 includes a delivery needle assembly, as shown in fig. 6 and 7. The conveying needle components are arranged on two sides of the track. Wherein the delivery needle assembly comprises a delivery needle 1031. The transfer needle assembly is coupled with a stepped bore in the loading device 107 through the transfer needle 1031 to effect movement of the loading device 107. Wherein, the material of conveying needle is the metal. The delivery needle may be inserted into a stepped bore 1076 in the loading device 107.
In some embodiments of the present application, the transfer device 103 includes a jaw assembly, as shown in fig. 8. The clamping jaw assemblies are positioned on two sides of the rail. The jaw assembly includes a jaw 1032. The jaw assembly grips the sides of the loading device 107 by the jaws 1032 for transfer.
In some embodiments of the present application, the wire bonding apparatus 100 further includes a loading device 102. The loading device 102 is in communication with the controller 101 and feeds the loading device 107 into the track upon receiving a loading command. In an embodiment of the present application, the loading device 102 comprises a push rod, and the loading device 107 is pushed into the track by the push rod.
In some embodiments of the present application, wire bonding apparatus 100 further includes wire bonding device 106. The wire bonding apparatus 106 performs wire bonding of the die 201 on the bar 200 held by the vacuum suction apparatus 104 and the bonding apparatus 105 upon receiving a bonding start instruction. It should be noted that, before the pressing device 105 descends, the cover plate of the loading device 107 has been removed and taken away, so that the material strip 200 on the carrier 1071 can be effectively attached by the pressing device 105.
Wherein, bonding wire operation device 106 includes the welding module, the welding module includes: the wire clip, the welding needle, the transduction rod and the wire feeding device are used for conducting wire bonding on the wafer 201 in the current operation area on the material strip 200 through the welding module. After the wafer bonding to the current working area of the web is completed, the controller 101 controls the vacuum suction device 104 to be converted into a blowing state to separate the vacuum suction device 104 from the web 200 while the pressing device 105 is lifted. Then, the controller 101 controls the transfer device 103 to transfer the die to be soldered of the next operation area of the bar 200 on the carrier 1071 to the soldering area of the wire bonding device 106, so that the wire bonding device 106 performs soldering on the die to be soldered, and repeats the above procedure until die soldering of all operation areas of the bar 200 is completed. After the wire bonding of the current strand 200 is completed, the loading device 102 pushes the loading device 107 loaded with the next strand into the track by the push rod to perform the wire bonding operation of the next strand by the wire bonding apparatus 100.
Fig. 16 is a flow chart of a method of operation of some embodiments of the present application. An operation method applied to the wire bonding apparatus 100 of the above embodiment includes the steps of:
in step 2001, the loading device 102 receives a loading command sent by the controller 101, and then sends the loading device 107 loaded with the material strip 200 into the track.
In step 2002, after the controller 101 sends a transfer instruction after the loading is completed, the transfer device 103 transfers the loading device to a position corresponding to the vacuum adsorption device 104 when receiving the transfer instruction sent by the controller. The corresponding location is above the vacuum suction device 104, i.e., the wire bonding area.
In step 2003, the controller 101 sends a vacuum suction instruction after the loading device 107 is transferred to the target position, and the vacuum suction device 104 rises and forms a vacuum to suction and fix the material strip 200 located above the vacuum suction device 104 when receiving the vacuum suction instruction.
In step 2004, the pressing device 105 descends to above the material strip 200 and faces the vacuum adsorption device 104 after receiving the vacuum adsorption command. Because the material strip 200 is fixed through vacuum adsorption, other fixing devices are not needed to fix the material strip 200, and the material strip 200 is prevented from being crushed. Therefore, the die 201 on the bar 200 adsorbed by the vacuum can be effectively wire-bonded. In addition, the loading device 107 can effectively protect the material strip 200 and the wafer 201 therein from damage during the process before and after soldering. In some embodiments of the present application, the pressing device 105 engages the strip 200 and does not exert pressure on the strip 200. In this way, damage to the strip 200 is effectively avoided. In some embodiments of the present application, the pressing device 105 adheres to the material strip 200 and generates pressure on the material strip 200, and due to the carrier 1071, the middle portion of the material strip 200 will not buckle at the edge of the material strip 200 due to the concave vacuum pressure of the vacuum adsorption device 104, so that the material strip 200 can be effectively protected from deformation.
In step 2005, the controller 101 sends a welding start command after the vacuum suction device 104 and the pressing device 105 complete the corresponding commands, and the wire bonding device 106 performs wire bonding on the die of the current working area of the strip after receiving the welding start command, so as to complete wire bonding on the die of the current working area.
In step 2006, the controller 101 sends a separation command after receiving the welding command, and the vacuum adsorption device blows air to separate the material strip from the vacuum adsorption device 104 after receiving the separation command at 104.
In step 2007, after the material strip 200 is separated from the vacuum adsorption device 104, the controller 101 controls the pressing device 105 to rise, the vacuum adsorption device 104 to descend, and the conveying device 103 conveys the next working area of the material strip to the welding area for wire bonding.
Step 2008, repeating the above steps 2003-2007 until the wire bonding of the die of all working areas of the bar 200 is completed.
In some embodiments of the present application, the method of operation further comprises: after step 2008 is completed, the above steps are repeated to wire bond the next piece of the strip to be wire bonded.
Reference throughout this specification to "some embodiments," "one embodiment," "another example," "an example," "a particular example," or "a partial example" means that at least one embodiment or example in the present application includes the particular feature, structure, or characteristic described in the embodiment or example. Thus, descriptions appearing throughout the specification, for example: "in some embodiments," "in an embodiment," "in one embodiment," "in another example," "in one example," "in a particular example," or "example," which do not necessarily reference the same embodiments or examples in this application.
As used herein, spatially relative terms, such as "under," "below," "lower," "above," "upper," "lower," "left," "right," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, the spatially relative terms are intended to encompass different orientations of the device in use or operation. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present.
As used herein, the terms "approximately," "substantially," and "about" are used to describe and account for minor variations. When used in connection with an event or circumstance, the terms can refer to instances where the event or circumstance occurs precisely and instances where it occurs to the close approximation. As used herein with respect to a given value or range, the term "about" generally means within ±10%, ±5%, ±1% or ±0.5% of the given value or range. Ranges can be expressed herein as from one endpoint to the other endpoint, or between two endpoints. Unless otherwise specified, all ranges disclosed herein include endpoints. The term "substantially coplanar" may refer to two surfaces within a few micrometers (μm) positioned along a same plane, for example, within 10 μm, within 5 μm, within 1 μm, or within 0.5 μm positioned along the same plane. When referring to "substantially" the same value or property, the term may refer to a value that is within ±10%, 5%, 1% or 0.5% of the average value of the values.
As used herein, the terms "approximately," "substantially," and "about" are used to describe and explain minor variations. When used in connection with an event or circumstance, the terms can refer to instances where the event or circumstance occurs precisely and instances where it occurs to the close approximation. For example, when used in conjunction with a numerical value, the term can refer to a range of variation of less than or equal to ±10% of the numerical value, e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two values may be considered to be "substantially" or "about" the same if the difference between the two values is less than or equal to ±10% (e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%) of the average value of the values. For example, "substantially" parallel may refer to a range of angular variation of less than or equal to ±10° relative to 0 °, for example, less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, "substantially" perpendicular may refer to a range of angular variation of less than or equal to ±10° relative to 90 °, for example, less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.
As used herein, the singular terms "a" and "an" may include plural referents unless the context clearly dictates otherwise. In the description of some embodiments, a component provided "on" or "over" another component may encompass the case where the former component is directly on (e.g., in physical contact with) the latter component, as well as the case where one or more intermediate components are located between the former component and the latter component.
Unless otherwise specified, spatial descriptions such as "above," "below," "upper," "left," "right," "lower," "top," "bottom," "vertical," "horizontal," "side," "above," "below," "upper," "on … …," "under … …," "downward," and the like are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustration purposes only, and that the actual implementation of the structures described herein may be spatially arranged in any orientation or manner provided that the embodiments of the present invention have the advantage of not being biased by such arrangement.
Although illustrative embodiments have been shown and described, it will be understood by those skilled in the art that the foregoing embodiments are not to be construed as limiting the application and that changes, substitutions and alterations of the embodiments may be made without departing from the spirit, principles and scope of the application.

Claims (44)

1. A wire bonding apparatus comprising:
a controller configured to send a vacuum adsorption instruction;
the vacuum adsorption device is in communication connection with the controller and is configured to form vacuum to adsorb and fix a material strip positioned on the vacuum adsorption device when receiving the vacuum adsorption instruction, wherein a wafer to be bonded is arranged on the material strip; and
And a pressing device, wherein the pressing device is controlled by the controller and descends to the upper part of the material strip so as to be opposite to the vacuum adsorption device, and the pressing device comprises:
a pressing body having a window for exposing wafers to be bonded in the bar when the pressing device is located above the bar; and
And one end of the tentacle is arranged on the pressing main body, and the other end of the tentacle is contacted with the upper surface of the material strip through the window.
2. The apparatus of claim 1, wherein the other end of the tentacle is in contact with the upper surface of the strand, but without interaction forces.
3. The apparatus of claim 1, the vacuum adsorption device having a vacuum adsorption plane with a number of first through holes; the vacuum adsorption device forms vacuum in the first through holes to adsorb and fix the material strips.
4. A device according to any one of claims 1-3, further comprising:
and the conveying device is in communication connection with the controller and is configured to convey the material strip to a position corresponding to the vacuum adsorption device through a track when receiving a conveying instruction.
5. The apparatus of claim 4, wherein the conveyor further comprises:
the conveying needle assemblies are arranged on two sides of the track;
wherein the delivery needle assembly comprises a delivery needle for engaging a stepped bore in the strip through the delivery needle for delivery.
6. The apparatus of claim 4, wherein the conveyor further comprises:
the clamping jaw assemblies are positioned on two sides of the track;
wherein the clamping jaw assembly comprises clamping jaws, and the clamping jaw assembly is used for clamping the side edge of the material strip through the clamping jaws for conveying.
7. The apparatus of claim 4, further comprising:
and the feeding device is in communication connection with the controller and is configured to send the material strip into the track when receiving a feeding instruction.
8. The apparatus of claim 7, further comprising:
And the wire bonding operation device is in communication connection with the controller and is configured to wire bond the chip on the material strip when a welding starting instruction is received.
9. A wire bonding apparatus comprising:
a loading device for loading a bar on which wafers to be bonded are disposed;
a controller configured to send a vacuum adsorption instruction;
a vacuum adsorption device communicatively connected to the controller and configured to form a vacuum upon receipt of the vacuum adsorption command to adsorb and secure the strip on the loading device on the vacuum adsorption device; and
And a pressing device, wherein the pressing device is controlled by the controller and descends to the upper part of the material strip so as to be opposite to the vacuum adsorption device, and the pressing device comprises:
a pressing body having a window for exposing wafers to be bonded in the bar when the pressing device is located above the bar; and
And one end of the tentacle is arranged on the pressing main body, and the other end of the tentacle is contacted with the upper surface of the material strip through the window.
10. The apparatus of claim 9, wherein the other end of the feeler is in contact with the upper surface but without interaction.
11. The apparatus of claim 9, the vacuum adsorption device comprising a cavity vacuum adsorption structure in contact with a lower surface of the loading device, the vacuum adsorption device adsorbing and securing the strand by forming a vacuum in a space in the cavity vacuum adsorption structure.
12. The apparatus of claim 11, said chamber vacuum adsorption structure having a vacuum chamber therein, said loading device being capped on said vacuum chamber; wherein the vacuum adsorption device adsorbs and fixes the strand by forming vacuum in the vacuum chamber.
13. The apparatus of claim 9, the vacuum adsorption device having a vacuum adsorption plane with a number of first through holes; the vacuum adsorption device forms vacuum in the first through holes to adsorb and fix the material strips.
14. The apparatus of any one of claims 9-13, the loading device comprising:
the carrier plate is used for carrying the material strips; wherein, the support plate is provided with a plurality of second through-holes, second through-hole and absorption cavity structure intercommunication.
15. The apparatus of claim 14, the second through-hole in communication with a vacuum cavity within the cavity vacuum adsorption structure.
16. The apparatus of claim 14, the second through-hole in communication with the first through-hole.
17. The apparatus of claim 14, the loading device further comprising:
the cover plate is used for covering the carrier plate and pressing the carrier plate on the non-operation area of the material strip so that the material strip is contained in the space covered by the carrier plate and the cover plate; one surface of the material strip far away from the wafer is contacted with the carrier plate, and the wafer is positioned in the working area of the material strip.
18. The apparatus of claim 14, wherein an aperture of an end of the second through-hole that contacts the strand is no greater than an aperture of an end of the second through-hole that is remote from the strand.
19. The apparatus of claim 14, wherein the carrier plate has a notch at a lateral end thereof.
20. The apparatus of claim 17, wherein an edge region of the carrier plate is further provided with positioning pins for positioning the strips and cover plates.
21. The apparatus of claim 17, wherein the loading device further comprises a plurality of magnet blocks fixedly disposed at an edge region of the carrier plate; when the cover plate is covered on the carrier plate, the plurality of magnet blocks are attracted to fix the cover plate.
22. The device of claim 17, wherein the edge region of the cover plate is further provided with a notch to expose the two-dimensional code on the strip of material for convenient device reading.
23. The apparatus of claim 14, further comprising:
and the conveying device is in communication connection with the controller and is configured to convey the loading device to a position corresponding to the vacuum adsorption device through a track when receiving a conveying instruction.
24. The apparatus of claim 23, wherein the conveyor further comprises:
the conveying needle assemblies are arranged on two sides of the track;
wherein the delivery needle assembly comprises a delivery needle for delivery through the delivery needle in combination with a stepped bore in the loading device.
25. The apparatus of claim 23, wherein the carrier plate edge region is provided with stepped holes for conveying the carrier plate and the strand on a machine track by the conveying device.
26. The apparatus of claim 23, wherein the conveyor further comprises:
the clamping jaw assemblies are positioned on two sides of the track;
Wherein the jaw assembly comprises a jaw for clamping a side of the loading device by the jaw for transfer.
27. The apparatus of claim 23, further comprising:
and the loading device is in communication connection with the controller and is configured to send the loading device into the track when receiving a loading instruction.
28. The apparatus of claim 27, further comprising:
and the wire bonding operation device is in communication connection with the controller and is configured to wire bond the chip on the material strip when a bonding instruction is received.
29. A method of operation for use with the wire bonding apparatus of claims 1-8, comprising the steps of:
the controller sends a vacuum adsorption instruction; and
The vacuum adsorption device forms vacuum to adsorb and fix the material strip on the vacuum adsorption device when receiving the vacuum adsorption instruction.
30. The method of claim 29, the method further comprising:
and the pressing device descends to the upper part of the material strip after receiving the vacuum adsorption instruction so as to be opposite to the vacuum adsorption device.
31. The method of claim 30, further comprising, prior to the step of the controller sending a vacuum adsorption command:
The controller sends a transmission instruction; and
And the conveying device conveys the material strips to positions corresponding to the vacuum adsorption device through the rails when receiving a conveying instruction.
32. The method of claim 31, further comprising, prior to the step of the controller sending a transfer instruction:
the controller sends a feeding instruction; and
And the feeding device sends the material strip into the track when receiving the feeding instruction.
33. The method of claim 32, further comprising, after the step of the controller sending a vacuum adsorption command:
the controller sends a welding starting instruction; and
And after receiving a welding starting instruction, the wire welding operation device performs wire welding on the wafer in the current operation area on the material strip.
34. The method of claim 33 further including, after the step of wire bonding the die at the current work area of the strand with a wire bonding apparatus, the method further comprising:
the controller sends a welding ending instruction;
the vacuum adsorption device blows air when receiving the welding ending instruction so as to separate the material strip from the vacuum adsorption device.
35. The method of claim 34, further comprising, after the strand is separated from the vacuum adsorption device:
the pressing device is lifted, the vacuum adsorption device is lowered, and the conveying device conveys the next work area to be operated of the material strip to the welding area.
36. The method of claim 35, further comprising, after the step of transferring the next area to be worked of the strand to a welding area:
and repeating the steps after the vacuum adsorption instruction is sent until the welding of the wafers in all the working areas of the material strip is completed.
37. A method of operation for use with the wire bonding apparatus of claims 9-28, comprising the steps of:
the controller sends a vacuum adsorption instruction; and
The vacuum adsorption device forms vacuum to adsorb and fix the material strip on the vacuum adsorption device when receiving the vacuum adsorption instruction;
wherein the material strip is positioned in the loading device.
38. The method of claim 37, the method further comprising:
and the pressing device descends to the upper part of the material strip after receiving the vacuum adsorption instruction so as to be opposite to the vacuum adsorption device.
39. The method of claim 37, further comprising, prior to the step of the controller sending a vacuum adsorption command:
The controller sends a transmission instruction; and
The conveying device conveys the loading device to a position corresponding to the vacuum adsorption device through a track when receiving a conveying instruction.
40. The method of claim 39, further comprising, prior to the step of the controller sending a transfer instruction:
the controller sends a feeding instruction; and
And the loading device sends the loading device into the track when receiving the loading instruction.
41. The method of claim 37, after the step of the controller sending a vacuum adsorption command, the method further comprising:
the controller sends a welding starting instruction; and
And after receiving a welding starting instruction, the wire welding operation device performs wire welding on the wafer in the current operation area on the material strip.
42. The method of claim 41, further comprising, after the wire bonding step of the die at the current work area of the strand is completed by a wire bonding apparatus:
the controller sends a welding ending instruction; and
The vacuum adsorption device blows air when receiving the welding ending instruction so as to separate the material strip from the vacuum adsorption device.
43. The method of claim 42, further comprising, after separating the strand from the vacuum adsorption device:
the pressing device is lifted, the vacuum adsorption device is lowered, and the conveying device conveys the next work area to be operated of the material strip to the welding area.
44. The method of claim 43, after the step of transferring the next area to be worked of the strip to the welding area, the method further comprises:
and repeatedly executing the steps after the vacuum adsorption instruction is sent until the welding of the wafers of all the working areas of the material strip is completed.
CN201910649202.1A 2019-07-19 2019-07-19 Wire bonding apparatus and method of operation Active CN110265312B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910649202.1A CN110265312B (en) 2019-07-19 2019-07-19 Wire bonding apparatus and method of operation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910649202.1A CN110265312B (en) 2019-07-19 2019-07-19 Wire bonding apparatus and method of operation

Publications (2)

Publication Number Publication Date
CN110265312A CN110265312A (en) 2019-09-20
CN110265312B true CN110265312B (en) 2024-03-01

Family

ID=67926904

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910649202.1A Active CN110265312B (en) 2019-07-19 2019-07-19 Wire bonding apparatus and method of operation

Country Status (1)

Country Link
CN (1) CN110265312B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110773932B (en) * 2019-11-13 2021-04-27 温州大学 Positioning device for welding semiconductor device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006286982A (en) * 2005-03-31 2006-10-19 Kyocera Corp Light-emitting apparatus and image forming apparatus
KR20160059213A (en) * 2014-11-18 2016-05-26 에스케이하이닉스 주식회사 Ground block for wire bonding apparatus
CN206022330U (en) * 2016-08-10 2017-03-15 苏州日月新半导体有限公司 Semiconductor product processes carrier
CN207765419U (en) * 2018-01-29 2018-08-24 上海泰睿思微电子有限公司 Semiconductor leads are bonded frock clamp and its heating block structure
CN207909831U (en) * 2018-01-29 2018-09-25 上海泰睿思微电子有限公司 The suction fixing structure of wire bonding frock clamp
CN210778486U (en) * 2019-07-19 2020-06-16 苏州日月新半导体有限公司 Wire bonding apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006286982A (en) * 2005-03-31 2006-10-19 Kyocera Corp Light-emitting apparatus and image forming apparatus
KR20160059213A (en) * 2014-11-18 2016-05-26 에스케이하이닉스 주식회사 Ground block for wire bonding apparatus
CN206022330U (en) * 2016-08-10 2017-03-15 苏州日月新半导体有限公司 Semiconductor product processes carrier
CN207765419U (en) * 2018-01-29 2018-08-24 上海泰睿思微电子有限公司 Semiconductor leads are bonded frock clamp and its heating block structure
CN207909831U (en) * 2018-01-29 2018-09-25 上海泰睿思微电子有限公司 The suction fixing structure of wire bonding frock clamp
CN210778486U (en) * 2019-07-19 2020-06-16 苏州日月新半导体有限公司 Wire bonding apparatus

Also Published As

Publication number Publication date
CN110265312A (en) 2019-09-20

Similar Documents

Publication Publication Date Title
US8153475B1 (en) Back-end processes for substrates re-use
CN107622955B (en) Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
US20140191381A1 (en) Integrated circuit module with dual leadframe
KR20140086361A (en) Die bonding method and apparatus
KR100639149B1 (en) Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same
KR20190032180A (en) Apparatus for manufacturing semiconductor, method of manufacturing semiconductor device and collet
CN110265312B (en) Wire bonding apparatus and method of operation
JP2015076410A (en) Bonding method and die bonder
US6454153B2 (en) Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
CN210778486U (en) Wire bonding apparatus
KR100245794B1 (en) Lead frame transfer device and wire bonding apparatus comprising such a device
US20240128098A1 (en) Expander and semiconductor manufacturing equipment including the same
US20050196901A1 (en) Device mounting method and device transport apparatus
KR100545374B1 (en) Apparatus for bonding CSP dies
KR101300573B1 (en) Die transferring device for TCNCP
KR101395536B1 (en) Collet module for pick-up semiconductor die
KR100471414B1 (en) alignment apparatus in the equipment for manufacturing semiconductor device
CN216145598U (en) Frame conveying clamp for semiconductor packaging
KR100914986B1 (en) Chip bonding system
KR102690327B1 (en) Substrate unloading apparatus for flip chip bonding
KR102654829B1 (en) Clip bonding apparatus and semiconductor having semiconductor chip bonded clip using the same
KR102590869B1 (en) Wafer loading apparatus for flip chip bonding
CN216015326U (en) Double-station bonding mechanism of bonder
KR100671028B1 (en) Method for bonding semiconductor chips
KR20080088103A (en) Attaching apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province

Applicant after: Riyuexin semiconductor (Suzhou) Co.,Ltd.

Address before: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province

Applicant before: SUZHOU ASEN SEMICONDUCTORS Co.,Ltd.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant