KR20190032180A - Apparatus for manufacturing semiconductor, method of manufacturing semiconductor device and collet - Google Patents

Abstract

When pushing a die up through a pushing-up unit, the die can be deformed and bent. An apparatus for manufacturing a semiconductor has: a die supply unit having a wafer ring holder holding and supporting a dicing tape to which a die is attached; a pushing-up unit having a plurality of pushing-up blocks; and a collet unit absorbing the die from the dicing tape. The collet unit has: a collet; and a collet holder holding and supporting the collet. The collet is made of an elastic body, and has an absorbing hole at a position corresponding to a point in contact with the dicing tape of the pushing-up block.

Description

TECHNICAL FIELD [0001] The present invention relates to a semiconductor manufacturing apparatus, a method of manufacturing a semiconductor device, and a method of manufacturing a semiconductor device,

The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to a die bonder having, for example, a collet.

Generally, in a die bonder that mounts a semiconductor chip, for example, on a surface of a wiring board, a lead frame, or the like (hereinafter collectively referred to as a substrate), a die is generally used, (Operation) that bonding is carried out by heating the bonding material while conveying the substrate onto the substrate, applying a pressing force, and repeating the operation (operation).

During a die bonding process by a semiconductor manufacturing apparatus such as a die bonder, there is a peeling process for peeling a die divided from a semiconductor wafer (hereinafter referred to as a wafer). In the peeling process, the die is pushed up from the back side of the dicing tape by the pushing unit, peeled one by one from the dicing tape held by the die supply unit, and is transported onto the substrate using a suction nozzle such as a collet.

Japanese Patent Application Laid-Open No. 2015-76410

When the die is pushed up by the push-up unit, the die may be deformed and warped.

A problem of the present disclosure is to provide a semiconductor manufacturing apparatus with little die bending.

Other objects and novel features will be apparent from the description of the present specification and the accompanying drawings.

An outline of representative examples of the present disclosure will be briefly described below.

That is, the semiconductor manufacturing apparatus includes a die supply portion having a wafer ring holder for holding a dicing tape with a die, a push-up unit having a plurality of push-up blocks, and a collet portion for sucking the die from the dicing tape Respectively. The collet portion includes a collet and a collet holder for holding the collet. The collet is formed of an elastic body and has a suction hole at a position corresponding to a portion in contact with the dicing tape of the push-up block.

According to the above semiconductor manufacturing apparatus, warping of the die can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conceptual view of a die bonder according to an embodiment viewed from above.
Fig. 2 is a view for explaining the operation of the pick-up head and the bonding head when viewed from the direction of arrow A in Fig.
Fig. 3 is a view showing an external perspective view of the die supply portion of Fig. 1; Fig.
Fig. 4 is a schematic cross-sectional view showing a main part of the die supply portion of Fig. 1; Fig.
Fig. 5 is a view for explaining the lifting unit of Fig. 4; Fig.
6 is a cross-sectional view of a main part of a collet part and a push-up unit according to a comparative example;
7 is a view for explaining a collet according to the embodiment;
8 is a cross-sectional view of a main portion of a collet portion and a push-up unit according to the embodiment;
Fig. 9 is a flowchart for explaining a pick-up operation of the die bonder according to the embodiment; Fig.
10 is a flow chart showing a manufacturing method of a semiconductor device according to an embodiment.
11 is a view for explaining a collet according to Modification 1. Fig.
12 is a view for explaining the push-up unit according to the second modification;
13 is a view for explaining a collet according to Modification 2. Fig.
14 is a view for explaining a collet according to Modification 1-4;

2. Description of the Related Art In recent years, thinning of packages has been progressed for the purpose of promoting high density mounting of semiconductor devices. For example, a multilayer package for three-dimensionally mounting a plurality of dies on a wiring board has been put to practical use. When assembling such a laminated package, it is required to reduce the thickness of the die to 20 占 퐉 or less (for example, 10 to 15 占 퐉) in order to prevent an increase in package thickness, so that the stiffness of the die is liable to bend .

In a three-dimensional NAND type flash memory (3D-NAND), a plurality of thin silicon oxide film / polysilicon thin film layers are continuously stacked on a silicon substrate, but cracks are likely to occur in the internal elements when the die is deflected.

Thus, in the embodiment, a vacuum suction hole (suction hole) is arranged in a collet formed of an elastic body such as rubber, in conformity with the convex portion (position of contact with the die) of the plurality of push-up blocks of the push-up unit. The interval (density) of the plurality of push-up blocks is determined by the thickness of the die and the attraction force of the dicing tape.

The portion where the push-up block and the die are in contact with each other through the dicing tape pulls the die at the time of the lowering of the push-up block due to the attraction force of the dicing tape, thereby causing die deformation.

(1) A vacuum suction hole is disposed at a portion of the collet holding the entire die that touches the convex portion of the push-up block. Thereby, it is selectively strongly attracted, and die deformation (warping) is prevented. The die deformation is caused by the thickness of the die and the attraction force of the convex portion of the push-up block, whereby the adsorption area on the collet side and the area of the push-up block are adjusted. or,

(2) A vacuum suction groove (suction groove) is arranged in the collet in accordance with the positions of the plurality of push-up blocks of the push-up unit. Further, the collet having the suction groove has a suction hole larger than the groove width in conformity with the convex portion (the position of contact with the die) of each push-up block. Since the entire sucking portion corresponding to the position of each push-up block is constituted by the grooves, the adsorption area of the die is increased, and the respective areas are also connected, so that they can be adsorbed effectively.

According to the embodiment, the die deformation (warpage) at the time of peeling the dicing tape and the dicing tape can be reduced, and the defect can be reduced. The die deformation amount is reduced to 1/5 or less as compared with the case where there is no suction hole in the convex portion. The die deformation at the time of the die pick-up is reduced, the defect can be reduced, and a thinner die can be picked up. In addition, it is possible to prevent a crack or the like inside the device of the 3D-NAND.

Hereinafter, embodiments and modifications will be described with reference to the drawings. In the following description, the same constituent elements are denoted by the same reference numerals, and repetitive description thereof may be omitted. In order to make the description more clear, the drawings are schematically expressed in terms of the width, thickness, shape, and the like of each part in comparison with the actual embodiment, but they are merely examples and do not limit the interpretation of the present invention .

[Example]

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top view showing the outline of a die bonder according to an embodiment. Fig. Fig. 2 is a view for explaining the operation of the pick-up head and the bonding head when viewed from the direction of arrow A in Fig.

The die bonder 10 supplies a die D to be mounted on a substrate S on which a product area (hereinafter, referred to as a package area P) as one or more final packages is distinguished A substrate feeding portion 6, a substrate feeding portion 7, and a feeding portion 5 for feeding the substrate 1, the pick-up portion 2, the intermediate stage portion 3, the bonding portion 4, And a control unit 8 for monitoring and controlling the operation. The Y axis direction is the front and back direction of the die bonder 10, and the X axis direction is the left and right direction. The die feeder 1 is disposed in front of the die bonder 10 and the bonding portion 4 is disposed inward.

First, the die supply unit 1 supplies a die D mounted on the package area P of the substrate S. The die feeding section 1 has a wafer holding table 12 for holding a wafer 11 and a lifting unit 13 indicated by a dotted line for pushing the die D from the wafer 11. The die feeder 1 moves in the X and Y directions by driving means (not shown) and moves the pick-up die D to the position of the push-up unit 13.

The pickup unit 2 includes a pickup head 21 for picking up the dies D, a Y-drive unit 23 of a pick-up head for moving the pickup head 21 in the Y-direction, (Not shown) for moving in the X and Y directions. The pick-up head 21 has a collet portion 22 (see also Fig. 2) for sucking and holding the push-up die D at the tip thereof, and picks up the die D from the die supply portion 1, And is loaded on the stage 31. The pick-up head 21 has respective driving portions (not shown) for moving the collet portion 22 up and down, and to move in the X direction.

The intermediate stage portion 3 has an intermediate stage 31 for temporarily loading the die D and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31. [

The bonding section 4 picks up the dies D from the intermediate stage 31 and bonds them onto the package area P of the substrate S to be transported or is already bonded to the package area P ) On the die bonded to the die. The bonding section 4 includes a bonding head 41 having a collet 42 (see also Fig. 2) for holding and holding the die D at the tip thereof, like the pickup head 21, And a substrate recognition camera 44 for picking up a position recognition mark (not shown) of the package area P of the substrate S and recognizing the bonding position.

With this configuration, the bonding head 41 corrects the pickup position / posture based on the image pickup data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, 44 by bonding the die D to the substrate.

The transfer section 5 has a substrate transfer claw 51 for holding and transferring the substrate S and a transfer lane 52 for transferring the substrate S thereon. The substrate S moves by driving a not shown nut of the substrate transfer claw 51 provided on the transfer lane 52 with a not shown ball screw provided along the transfer lane 52. [

With this configuration, the substrate S moves from the substrate supply unit 6 to the bonding position along the conveyance lane 52, moves to the substrate carry-out unit 7 after bonding, and is transferred to the substrate carry- Thereby transferring the substrate S.

The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each part of the die bonder 10 and a central processing unit (CPU) for executing a program stored in the memory.

Next, the configuration of the die feeding section 1 will be described with reference to Figs. 3 and 4. Fig. Fig. 3 is a view showing an external perspective view of the die supply portion. Fig. 4 is a schematic sectional view showing the main part of the die supply portion.

The die feeding section 1 includes a wafer holding base 12 moving in the horizontal direction (XY direction) and a lifting unit 13 moving in the vertical direction. The wafer holding support 12 includes an expanding ring 15 for holding the wafer ring 14 and a dicing tape 16 held by the wafer ring 14 and having a plurality of dies D bonded thereto And a support ring 17 for positioning horizontally. The push-up unit 13 is disposed inside the support ring 17.

The die feeder 1 lowers the expander ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched to widen the distance of the dies D, and the dies D are lifted by the lifting unit 13 from below the dies D So that the pickup performance of the die D is improved. The adhesives for adhering the die to the substrate with thinning are made from a liquid to a film and are adhered to each other between the wafer 11 and the dicing tape 16 on a film called a die attach film (DAF) The material is attached. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are separated from the dicing tape 16. In the following, the delamination process will be described by disregarding the presence of the die attach film 18.

Next, the push-up unit will be described with reference to Fig. Fig. 5 (A) is a top view of the lifting unit of Fig. 4. Fig. Fig. 5B is a cross-sectional view of a main part taken along line A1-A2 in Fig. 5A.

The push-up unit 13 has a push-up block portion 131, a peripheral portion 132 surrounding the push-up block portion 131, and a cylindrical dome main body 134. The push-up block section 131 includes a third block (central block) 131c in a plan view, a second block (intermediate block) 131b surrounding the outer side of the third block 131c, And a first block (outermost block) 131a surrounding the outer side of the block 131b. The push-up block portion 131 is rectangular in plan view, and is configured in a planar shape of the die D and a top shape. The upper surface of each of the first block 131a, the second block 131b, and the third block 131c has irregularities. In FIG. 5 (A), convex portions (protrusions) As shown in FIG. And a gap is provided between the first block 131a, the second block 131b, the third block 131c, and the peripheral portion 132.

Each of the plurality of suction holes (not shown) formed in the peripheral portion 132 on the upper surface of the push-up unit 13 lifts the push-up unit 13, When it is brought into contact with the back surface, it is decompressed by a suction mechanism (not shown). At this time, the back surface of the dicing tape 16 is sucked downward so that the upper surface of the lifting unit 13 (the upper surface of the peripheral portion 132 and the upper surface of the first block 131a, the second block 131b, 131c) on the upper surface of the base plate). The peripheral portion 132 closely contacts the dicing tape 16 on the outside of the pick-up die D. (Suction holes) are provided between the first block 131a, the second block 131b, the third block 131c and the peripheral portion 132, and a suction mechanism of the suction holes and a plurality of peripheral portions 132 The suction mechanism of the suction hole of the suction port is common, and at the same time, the suction is turned ON / OFF.

Next, the technique studied by the present inventors (hereinafter referred to as a comparative example) will be described with reference to FIG. 6 is a longitudinal sectional view showing a main part of a collet part and a push-up unit according to a comparative example, Fig. 6 (A) is a view showing a state in which the collet part is lowered and brought into contact with the die D, (B) shows a state in which the push-up unit pushes up the block portion, and (C) in Fig. 6 shows a state in which the collet portion is raised.

As shown in Fig. 6, the collet portion 22R has a collet 25R and a collet holder 24 for holding the collet 25R. A plurality of vacuum suction holes 251R are formed in the collet 25R in an array shape at even intervals. A vacuum suction hole 26 is provided at the center of the collet holder 24 and a vacuum suction groove 27 is provided on the collet 25R of the collet holder 24 on the upper surface side. The vacuum suction hole 251R is connected to the vacuum suction groove 27. The collet 25R is a rectangle similar to the die D in plan view and has the same size as the die D. The collet 25R is an elastic body and has a thickness of about 5 mm. The push-up unit 13 is the same as the push-up unit 13 in the embodiment of Fig.

The pick-up operation according to the comparative example starts from the position where the target die D (the subject to be peeled) on the dicing tape 16 is positioned in the push-up unit 13 and the collet portion 22R. When the positioning is completed, the dicing tape 16 is sucked onto the upper surface of the push-up unit 13 by evacuating through the suction hole of the push-up unit 13. [ As shown in Fig. 6A, in this state, the collet portion 22R descends while being evacuated toward the device surface of the die D, and landing.

Here, when the push-up block unit 131 (the first block 131a, the second block 131b, and the third block 131c) which is the main part of the push-up unit 13 ascends, And is lifted while being sandwiched between the portion 22R and the push-up block portion 131. [ At this time, the peripheral portion of the dicing tape 16 is vacuum-adsorbed to the peripheral portion 132. For example, the first block 131a is lowered in order to advance the peeling of the dicing tape 16 around the die (D). The dicing tape 16 is curved at the portion where the first block 131a and the die D come into contact with each other when the first block 131a descends due to the adhesive force (attraction force) of the dicing tape 16 The peeling of the dicing tape 16 progresses around the die D.

6 (B), the die D is deformed along the curvature of the dicing tape 16 to form a die D (D), as shown in the portion surrounded by the broken line in Fig. 6 ) Is deformed in the inward direction, and the die D is deflected. Thereby, a gap is formed between the lower surface of the collet and the air is introduced into the vacuum suction system of the collet portion 22R (leakage occurs). Once the die D has been leaked, the die D can not be retracted to a position lower than the adsorption surface, so that even if the collet portion 22R is lifted up as shown in Fig. 6C, The die D can not be picked up.

Next, a collet according to the embodiment will be described with reference to Fig. Fig. 7 is a view for explaining a collet according to the embodiment. Fig. 7 (A) is a top view of the lifting unit, and Fig. 7 (B) is a bottom view of the collet.

As described above, the upper surfaces of the first block (outermost block) 131a, the second block (intermediate block) 131b, and the third block (central block) 131c are concave and convex, Are intermittently arranged. For example, the first block 131a has 18 convex portions, the second block 131b has 12 convex portions, and the third block 131c has 10 convex portions. The vacuum suction hole 251 (see FIG. 8) of the collet 25 according to the embodiment is located at a position corresponding to the convex portion of the first block 131a, the second block 131b, and the third block 131c . The collet 25 has suction holes H1a to H1r which are a part of the vacuum suction hole 251 at positions corresponding to the convex portions P1a to P1r of the first block 131a. The diameter of each suction hole of the collet 25 is smaller than the upper surface of each convex portion of the first block 131a, the second block 131b and the third block 131c and is, for example, the same size.

The collet 25 is provided at a position where the die D contacts the convex portions of the first block 131a, the second block 131b and the third block 131c via the dicing tape 16, Since the die D is sucked by the suction hole 251, warping of the die D can be suppressed. The collet 25 is required to have a suction hole in a portion where the die D contacts the convex portions of the first block 131a and the second block 131b via the dicing tape 16 It is preferable that the die D has a suction hole at a portion where the die D contacts the convex portions of the third block 131c through the dicing tape 16. [

Next, the configuration and pickup operation of the collet portion according to the embodiment will be described with reference to Figs. 8 and 9. Fig. 8 (A) is a view showing a state in which the collet portion is lowered and brought into contact with the die D, and FIG. 8 (B) is a cross- 8B is a view showing a state in which the push-up unit pushes up the block portion, and FIG. 8C is a view showing a state in which the collet portion is raised. 9 is a flowchart showing the processing flow of the pickup operation.

As shown in Fig. 8, the collet portion 22 has a collet 25 and a collet holder 24 for holding the collet 25 therein. A vacuum suction hole 251 is formed in the collet 25. A vacuum suction hole 26 is provided at the center of the collet holder 24 and a vacuum suction groove 27 is provided on the collet 25 of the collet holder 24 on the upper surface side. The vacuum suction hole 251 is connected to the vacuum suction groove 27. As shown in Fig. 7, the collet 25 is a rectangle similar to the die D in plan view, and is of the same size as the die D. The collet 25 is formed of an elastic body (for example, silicone rubber) and has a thickness of about 5 mm.

Step S1: The control unit 8 moves the wafer holding base 12 so that the pick-up die D is located just above the push-up unit 13, and pushes the die to be peeled off from the push- (22).

Step S2: The push-up unit 13 is moved so that the upper surface of the push-up unit 13 comes into contact with the back surface of the dicing tape 16. [ 8 (A), the control unit 8 determines whether or not the first block 131a, the second block 131b, and the third block 131c of the push-up block unit 131 are located in the peripheral portion The dicing tape 16 is adsorbed on the upper surface of the push-up unit 13 by forming the same plane as the surface of the push-up unit 132 and vacuuming through the gap between the suction hole of the peripheral portion 132 and the block.

Step S3: As shown in Fig. 8 (A), the control section 8 lowers the collet section 22 while evacuating it, places it on the die to be peeled D, So that the die D is sucked by the collet 25 having the vacuum suction hole 251.

Step S4: The control unit 8 raises the first block 131a, the second block 131b and the third block 131c of the push-up block unit 131, which is the main part of the push-up unit 13. [ As a result, the die D is held between the collet portion 22 and the push-up block portion 131 while the peripheral portion of the dicing tape 16 is pressed against the peripheral portion 132 of the push-up block portion 131 Vacuum adsorbed.

Step S5: The control unit 8 causes the first block 131a to descend in order to advance the peeling of the dicing tape 16 around the die D. The portion of the first block 131a where the convex portion of the first block 131 is in contact with the die D is a portion of the dicing tape 16 when the first block 131a descends due to the adhering force of the dicing tape 16 Is curved. On the other hand, since the periphery of the die D is sucked by the collet 25 having the suction hole in the portion corresponding to the convex portion of the first block 131a, the occurrence of warping of the die can be reduced, The peeling of the dicing tape 16 proceeds.

Step S6: The control unit 8 causes the second block 131b to descend.

Step S7: The control unit 8 raises the collet unit 22. Thereby, as shown in Fig. 8 (C), the die D is peeled from the dicing tape 16. Fig. The die D is not deformed in accordance with the curvature of the dicing tape 16 (the die D is not inwardly deformed) as in the comparative example of Fig. 6, so that the occurrence of the bending of the die D can be reduced. By doing so, it is possible to suppress the occurrence of a gap between the lower surface of the collet and the air to flow into the vacuum suction system of the collet portion 22 (leakage occurs).

Step S8: The control unit 8 causes the first block 131a, the second block 131b and the third block 131c of the push-up block unit 131 to form the same plane as the surface of the peripheral portion 132 , The suction of the dicing tape 16 by the gap between the suction hole of the peripheral portion 132 and the block is stopped. The control unit 8 moves the lifting unit 13 from the back surface of the dicing tape 16 so that the upper surface of the lifting block unit 131 is spaced apart.

Step S9: The control unit 8 judges whether or not the pick-up from the wafer 11 is finished. If YES, the process is terminated. If NO, the process returns to step S1.

The control section 8 repeats the steps S1 to S9 to pick up a good die of the wafer 11. [

The collet part according to the embodiment is mounted on the pick-up head 21 and picks up the die D from the die supply part 1 and mounts the die D on the intermediate stage 31. The collet part of the bonding head, As shown in FIG.

Next, a method for manufacturing a semiconductor device using a die bonder according to an embodiment will be described with reference to Fig. 10 is a flowchart showing a manufacturing method of a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 with the die D divided from the wafer 11 is stored in a wafer cassette (not shown) Import it. The control unit 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. [ Further, the substrate S is prepared and carried into the die bonder 10. [ The control unit 8 loads the substrate S onto the conveyance lane 52 in the substrate supply unit 6. [

Step S12: The control unit 8 picks up the die D from the dicing tape 16 held on the wafer ring 14. Then,

Step S13: The control unit 8 stacks the picked-up die D on the die mounted on the package area P of the substrate S or already bonded. More specifically, the control unit 8 loads the die D picked up from the dicing tape 16 onto the intermediate stage 31 and transfers the die D from the intermediate stage 31 back to the intermediate stage 31 with the bonding head 41. [ And is bonded to the package area P of the substrate S that has been transported.

Step S14: The control section 8 moves the substrate S to the substrate carry-out section 7 with the substrate transfer claw 51 to transfer the substrate S to the substrate carry-out section 7, (S).

<Modifications>

Hereinafter, some representative examples will be exemplified. In the following description of the modified example, the same reference numerals as in the above-described embodiments can be used for the parts having the same configuration and function as those described in the above-mentioned embodiments. As for the description of these parts, it is assumed that the description in the above-mentioned embodiments can be suitably used within the scope not technically contradictory. In addition, some or all of the above-described embodiments and all or a part of the plurality of modifications may be appropriately and complexly applied within a range not technically contradictory.

[Modified Example 1]

In the modified example 1, the configuration of the push-up block part 131 is the same, but the position of the suction hole of the collet and the like are different.

11 (A) is a bottom view of a collet according to Modification Example 1-1, and Fig. 11 (B) is a side view of a collet according to Modification Example 1-2. Fig. Fig. 11 (C) is a bottom view of the collet according to Modification 1-3, Fig. 11 (D) is a bottom view of the collet according to the embodiment, Fig. 7 is a top view showing the lifting block. Fig.

(Modified Example 1-1)

11 (D), the collet 25 is located at a position corresponding to all convex portions of the first block 131a, the second block 131b and the third block 131c 11A, the collet 25A of the modification 1-1 has a suction hole at a position corresponding to all the convex portions of the first block 131a However, no suction hole is provided at a position corresponding to the convex portion of the second block 131b, and a suction hole is provided at a position corresponding to the convex portion of a part of the third block 131c. No suction holes are provided at positions corresponding to the two convex portions at the center of the third block 131c. Since the number of suction holes of the collet 25A is smaller than that of the collet 25 of the embodiment, it is easier to manufacture than the embodiment. Since the collet 25A has suction holes at positions corresponding to all convex portions of the first block 131a, the collet 25A exerts the same operational effects as those of the embodiment.

(Modified Example 1-2)

As shown in Fig. 11B, the collet 25B of the variant 1-2 has a position corresponding to all the convex portions of the first block 131a and all the convex portions of the second block 131b And has a suction hole at a position corresponding to all the convex portions excluding the two positions corresponding to the corresponding positions and the center of the third block 131c. The collet 25B has a suction groove T1 for connecting the suction holes H1a to H1r corresponding to the first block 131a and a suction groove for connecting the suction holes corresponding to the second block 131b T2 and a suction groove T3 for connecting the suction holes corresponding to the third block 131c. The diameter of each suction hole of the collet 25B is smaller than the upper surface of each convex portion of the first block 131a, the second block 131b and the third block 131c and is larger than the width of the suction grooves T1 to T3. The diameter of each suction hole of the collet 25B is, for example, the same size, and the width of each of the suction grooves T1 to T3 is the same.

(Modification 1-3)

As shown in Fig. 11C, the collet 25C of Modification 1-3 is located at a position corresponding to the convex portions P1a, P1f, P1j, P1o of the four corners of the first block 131a H2b, H2c, H2d, H2e, H2f, H2g, H2h, H2i, H2d, H2h, H2i, H2j, H2k, H2l, and has a suction hole at a position corresponding to all the convex portions excluding the two centers at the center of the third block 131c. The collet 25C has a suction groove T1 for connecting the suction holes H1a, H1f, H1j and H1o corresponding to the first block 131a. The diameter of the suction holes H1a, H1f, H1j, H1o is larger than the width of the suction groove T1. The diameter of each suction hole of the collet 25C is smaller than the upper surface of each convex portion of the first block 131a, the second block 131b and the third block 131c and is, for example, the same size.

(Modifications 1-4)

14 (A) is a cross-sectional view of a main portion of a collet portion and a push-up unit according to Modification 1-4, and Fig. 14 (B) 14B is an enlarged schematic view of the main part of Fig. 14B.

In the embodiment and Modifications 1-1 to 1-3, the diameter of each suction hole of the collet is the same, but as shown in Fig. 14, in Modification 1-4, the position corresponding to the first block (outermost peripheral block) The diameter of the suction hole of the collet of the second block is made larger than the diameter of the suction hole at the position corresponding to the other block (the second block and the third block). Thereby, the collet 25G can increase the attraction force of the portion close to the end portion of the die D.

14 (C), the block size of the push-up block 131 (first block 131a) is 2 x d1 (for example, And the size of the collet 25G is set to be larger than the die size by 2 x d2 (for example, about 0.5 mm) so that the outermost periphery of the suction hole 251G of the collet 25G A part of the suction holes H1a to H1r is arranged outside the first block 131a (the push-up block portion 131) by d3 (for example, about 0.25 mm).

Thereby, the collet 25G can increase the attraction force of the portion closer to the end of the die D, so that the deformation of the die D can be further reduced.

In this modified example, the diameter of the suction hole of the collet at the position corresponding to the outermost peripheral block is made larger than the diameter of the suction hole at the position corresponding to the other block, and a part of the suction hole at the outermost periphery of the collet is pushed outward , But either one of them may be used.

Even if some of the suction holes of the collet 25G at the positions corresponding to the second block 131b and the third block 131c are arranged to be shifted to the outside of the second block 131b and the third block 131c do.

Although the arrangement of the suction holes of the collet 25G is the same as the arrangement of the suction holes of the collet 25 of the embodiment, the present invention is also applicable to the modification examples 1-1 to 1-3. It is also applicable to the collet and the push-up unit of Modification Example 2 described later.

[Modified example 2]

The upper surface of the push-up block portion of Modification Example 2 is an intermittent block in which the convex portion is intermittently arranged (the convex portion is plural), but the upper surface of the push- It is a continuous block.

12 is a view showing the push-up unit according to the second modification, and Fig. 12 (A) is a top view of the push-up unit. Fig. 12B is a cross-sectional view of the main part taken along the line A1-A2 in Fig. 12A. 13A is a bottom view of a collet of Modification Example 2-1, and FIG. 13B is a side view of a collet according to Modification Example 2-2; Fig. 13C is a bottom view of the collet of Modification 2-3, and Fig. 13D is a top view of the push-up block. Fig.

The structure and operation of the push-up unit according to Modification 2 are the same as those of the embodiment except for the shape of the upper face of the push-up block portion 131D. The upper surface of each of the first block 131a, the second block 131b and the third block 131c is a continuous block in which convex portions are continuously arranged without any unevenness as in the embodiment.

When the back surface of the dicing tape 16 is sucked downward by the push-up unit 13D, the upper surfaces of the first block 131Da, the second block 131Db, and the third block 131Dc are in close contact with each other.

(Modified Example 2-1)

As shown in Fig. 13A, the collet 25D of Modification Example 2-1 includes suction holes H11 to H14 at the positions corresponding to the four corners of the first block 131Da, suction holes H11 to H14, And suction holes H31 to H34 at positions corresponding to the four corners of the suction holes H21 to H24 and the third block 131Dc at positions corresponding to the four corners of the first block 131Db. The collet 25D has a suction groove T1 for connecting the suction holes H11 to H14 corresponding to the first block 131Da and suction holes H21 to H24 corresponding to the second block 131Db And a suction groove T3 for connecting the suction holes H31 to H34 corresponding to the suction groove T2 to be connected and the third block 131Dc. The diameter of each suction hole of the collet 25D is smaller than the width of the upper surface of the first block 131a, the second block 131b and the third block 131c and is larger than the width of the suction grooves T1 to T3. The diameter of each suction hole of the collet 25D is, for example, the same size, and the width of each of the suction grooves T1 to T3 is the same.

(Variation Example 2-2)

As shown in Fig. 13B, the collet 25E of Modification 2-2 has a suction (H11, H21, H31) connecting the suction holes H11, H21, H31 to the collet 25D of Modification Example 2-1 A suction groove T5 for connecting the suction hole H12 to the suction hole H12 and a suction groove H24 for connecting the suction hole H13 to the suction hole H23, , And H34, respectively. The widths of the suction grooves T4 to T7 are the same as the widths of the suction grooves T1 to T3.

(Modification 2-3)

As shown in Fig. 13C, the collet 25F of the modified example 2-3 has the suction holes H11 to H14 at the positions corresponding to the four corners of the first block 131Da, the suction holes H11 to H14, And suction holes H31 to H34 at positions corresponding to the four corners of the suction holes H21 to H24 and the third block 131Dc at positions corresponding to the four corners of the first block 131Db. The collet 25D has a suction groove T11 for connecting the suction holes H14, H11, H12, H13, H21, H22, H23, H34, H32 and H33 in a spiral shape in a plan view. The diameter of each suction hole of the collet 25D is smaller than the width of the upper surface of the first block 131a, the second block 131b and the third block 131c and is larger than the width of the suction groove T11. The diameter of each suction hole of the collet 25D is, for example, the same size.

Although the invention made by the present inventors has been specifically described based on the embodiments and the modified examples, the present invention is not limited to the above-mentioned embodiments and the modified examples.

For example, in the embodiment, the example in which the push-up block unit is composed of three blocks of the first block to the third block has been described, but the present invention is not limited to this, and a plurality of blocks may be used.

In the embodiment, each suction hole of the collet is connected to the vacuum suction groove of the collet holder, but the vacuum suction groove may be divided so that the vacuum suction can be independently performed for each suction hole or suction groove of the collet.

In the embodiment, the intermittent convex portions (protruding portions) of the first block, the second block and the third block do not have the suction holes connected to the dome main body, but the intermittent convex portions The projecting portion may be formed with a suction hole so as to be sucked.

In Modification 1-4, the diameter of the collet suction hole at the position corresponding to the first block (outermost peripheral block) is made larger than the diameter of the suction hole at the position corresponding to the other block (the second block and the third block) May be larger than the block size (block width) of the first block. In the modified example, each suction groove of the collet has the same width, but the width of the suction groove may be approximated to the block size of the first block or wider than the block size.

Although an example using a die attach film is described in the embodiment, a die attach film may not be used by providing a preform section for applying an adhesive to a substrate.

Further, in the embodiment, the die bonder has been described in which the die is picked up from the die supply portion by the pick-up head, is mounted on the intermediate stage, and the die mounted on the intermediate stage is bonded to the substrate by the bonding head. However, The present invention is applicable to a semiconductor manufacturing apparatus that picks up a die from a die supply section.

For example, it is applicable to a die bonder in which there is no intermediate stage and pick-up head, and a die of a die supply portion is bonded to a substrate by a bonding head.

Further, the present invention is applicable to a die sorter that does not have an intermediate stage and a bonding head, and mounts a die picked up by a pick-up head from a die feeder onto a tray or the like.

1:
11: wafer
13: Push-up unit
16: Dicing tape
2: Pickup section
21: Pickup head
22: Collet portion
25: Collet
251: vacuum suction hole
3: intermediate stage part
31: Intermediate stage
4:
41: bonding head
8:
10: die bonder
D: Die
S: substrate

Claims (22)

1. A semiconductor manufacturing apparatus comprising:
A die supply portion having a wafer ring holder for holding a dicing tape with a die attached thereto,
A push-up unit having a plurality of push-up blocks,
And a collet portion for sucking the die from the dicing tape,
The collet unit includes:
The collet,
And a collet holder for holding the collet,
Wherein the collet is formed of an elastic body and has a suction hole at a position corresponding to a portion in contact with the dicing tape of the push-up block. The method according to claim 1,
Wherein the plurality of push-up blocks comprise an outermost block located at the outermost position, a center block located at the center, and an intermediate block positioned between the outer block and the center block,
Wherein the collet has the suction hole at a position corresponding to the outer peripheral block. 3. The method of claim 2,
And the suction hole further has the suction hole at a position corresponding to the center block and the intermediate block. 3. The method of claim 2,
Further comprising a suction groove connected to the suction hole,
And the suction holes are disposed at positions corresponding to the respective four corners of the outer peripheral block in contact with the dicing tape. 5. The method of claim 4,
Wherein the diameter of the suction hole is larger than the width of the suction groove. 5. The method of claim 4,
And the suction hole further has the suction hole at a position corresponding to the center block and the intermediate block. 3. The method of claim 2,
The outer peripheral block has a plurality of convex portions intermittently on its upper surface,
And the suction holes are disposed at respective positions corresponding to the portions of the plurality of convex portions contacting the dicing tape. 8. The method of claim 7,
And the suction hole further has the suction hole at a position corresponding to the center block and the intermediate block. 8. The method of claim 7,
And a suction groove connected to the suction hole. 10. The method of claim 9,
Wherein the diameter of the suction hole is larger than the width of the suction groove. 10. The method of claim 9,
And the suction hole further has the suction hole at a position corresponding to the center block and the intermediate block. 12. The method according to any one of claims 1 to 11,
Further comprising a pick-up head on which the collet is mounted. 13. The method of claim 12,
An intermediate stage for loading a die picked up by the pickup head,
Further comprising a bonding head for bonding the die mounted on the intermediate stage onto a substrate or a die already bonded. 12. The method according to any one of claims 1 to 11,
Wherein the die further comprises a die attach film between the die and the dicing tape. A method of manufacturing a semiconductor device,
(a) a push-up unit having a plurality of push-up blocks, and a collet portion for sucking a die from the dicing tape, wherein the collet portion includes a collet and a collet holder for holding the collet, Preparing a semiconductor manufacturing apparatus which is formed of an elastic body and has a suction groove connected to a suction hole or a suction hole at a position corresponding to a portion in contact with the dicing tape of the push-up block;
(b) preparing a wafer ring holding a dicing tape having a die,
(c) a step of picking up the die with the collet part
And a step of forming the semiconductor device. 16. The method of claim 15,
(d) preparing a substrate,
(e) bonding the die to the substrate or a die to which the die is already bonded. 17. The method of claim 16,
The step (c) further includes the step of loading the picked-up die onto the intermediate stage,
And the step (e) further comprises a step of picking up the die from the intermediate stage. A collet for sucking the die from a dicing tape having a die in cooperation with a push-up unit having a plurality of push-up blocks,
Wherein the collet is formed of an elastic body and has a suction hole at a position corresponding to a portion in contact with the dicing tape of the push-up block. 19. The method of claim 18,
And the suction holes at positions corresponding to the outermost peripheral blocks of the plurality of push-up blocks. 20. The method of claim 19,
Further comprising a suction groove connected to the suction hole,
And the suction holes are arranged at positions corresponding to the respective four corners of the outermost peripheral block in contact with the dicing tape. 21. The method of claim 20,
And the diameter of the suction hole is larger than the width of the suction groove. 20. The method of claim 19,
Wherein the suction hole further comprises a central block located at the center of the plurality of push-up blocks, and a suction hole at a position corresponding to the intermediate block located between the outermost peripheral block and the center block.

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