WO2021240840A1 - Pickup device and pickup method - Google Patents

Pickup device and pickup method Download PDF

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Publication number
WO2021240840A1
WO2021240840A1 PCT/JP2020/041013 JP2020041013W WO2021240840A1 WO 2021240840 A1 WO2021240840 A1 WO 2021240840A1 JP 2020041013 W JP2020041013 W JP 2020041013W WO 2021240840 A1 WO2021240840 A1 WO 2021240840A1
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WO
WIPO (PCT)
Prior art keywords
chip
adhesive sheet
sheet body
target chip
adjacent
Prior art date
Application number
PCT/JP2020/041013
Other languages
French (fr)
Japanese (ja)
Inventor
信裕 永元
Original Assignee
キヤノンマシナリー株式会社
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Filing date
Publication date
Application filed by キヤノンマシナリー株式会社 filed Critical キヤノンマシナリー株式会社
Publication of WO2021240840A1 publication Critical patent/WO2021240840A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the present invention relates to a pickup device and a pickup method.
  • a diced semiconductor chip hereinafter, simply referred to as a chip
  • an adhesive sheet body As a conventional pickup device, there is a device provided with a stage for holding an adhesive sheet body, a push-up table for advancing and retreating with respect to this stage, and a needle pushed up by the push-up table. That is, it is configured so that the adhesive sheet body of the stage is pierced from the back surface side by the needle pushed up by the push-up table to separate the chip from the adhesive sheet body.
  • the tip of the needle may be worn, damaged, or bent when the needle breaks through the adhesive sheet body and pushes up the tip to peel it off from the adhesive sheet body. ..
  • the damaged needle may damage the back surface of the tip when pushing up the tip.
  • the length of each needle will be different due to abrasion or breakage, and the tips will be tilted and pushed up, and there is a risk that adjacent tips will collide with each other and be damaged.
  • the chip is adsorbed by the collet and taken out.
  • the tip is tilted and pushed up, a mistake in sucking the tip by the collet occurs. If a collet chip adsorption error occurs, it will hinder the subsequent work. In addition, the tip may be damaged by pushing up the needle.
  • this pickup device includes a stage 3 that holds the adhesive sheet body 2 to which the chip 1 is attached. Further, the stage 3 is provided with a receiving portion (sliding body) 4 whose upper surface 4a protrudes from the stage upper surface 3a. Therefore, on the outer peripheral side of the receiving portion 4, a gap 6 is formed between the receiving portion 4 and the adhesive sheet body 2 as shown in FIG. Further, the stage 3 is provided with a suction hole 5 that communicates with the gap 6. A part of the suction holes 5 and 5 protrudes outward from the first side 8a of the chip 1 in a plan view.
  • the adhesive sheet body 2 is sucked through the suction hole 5 in a state where the chip 1 is sucked (held) by the collet (suction collet) 7 from above.
  • the air in the gap 6 is sucked as shown by the arrow A1
  • the adhesive sheet body 2 around the receiving portion 4 is sucked, and the adhesive sheet body 2 is peeled off on the outer peripheral side of the chip 1.
  • the receiving portion 4 is moved in the direction of the arrow B1. That is, it is moved to the second side 8b facing the first side 8a.
  • the receiving area of the chip 1 received by the receiving portion 4 decreases, the suction (suction) area of the adhesive sheet body 2 increases, and finally the adhesive sheet body 2 from the chip 1 increases. Can be completely peeled off
  • the present invention provides a pickup device and a pickup method that can effectively prevent deformation of chips other than the chip to be peeled off.
  • the pickup device of the present invention separates the chips from an adhesive sheet body to which a plurality of rectangular chips are attached by peeling them off, and sequentially peels off the target chips to be separated from the plurality of chips.
  • the device is provided with a support surface for supporting an adjacent chip adjacent to the target chip via the adhesive sheet body, and a recess is provided along the opposite side of the adjacent chips facing the target chip.
  • the concave portion constitutes a deformation preventing means that acts on a negative pressure that can alleviate or cancel the force applied to the adjacent chip from the adhesive sheet body. ..
  • the force applied from the adhesive sheet body to the adjacent chip can be relaxed or canceled by the deformation preventing means.
  • deformation of adjacent chips can be effectively prevented.
  • the deformation in this case is a deformation with respect to the free state shape of the chip.
  • the recess of the support surface can be configured to communicate with the negative pressure chamber. With such a configuration, a negative pressure can be applied to the concave portion via the negative pressure chamber, and the device configuration can be simplified.
  • a receiver that supports the target chip is provided via the adhesive sheet body, and by moving the receiver, the adhesive sheet body and the target chip can be peeled off by the negative pressure in the negative pressure chamber. .. With such a configuration, it is possible to avoid pushing up the tip by the needle, and it is possible to stably peel off the target tip without damaging or deforming it.
  • the receiver is a slide body arranged on a stage on which the adhesive sheet body is placed and movable in a direction parallel to the adhesive sheet body, and the movement of the receiver causes the receiver to move. It may be the one that peels off the target chip and the adhesive sheet body. With this configuration, when the target chip is peeled off, it can be stably peeled off by sliding it with the slide body which is the receiver.
  • the receiver is a block body that is arranged on a stage on which the pressure-sensitive adhesive sheet body to which a plurality of chips are attached and is movable in a direction perpendicular to the pressure-sensitive adhesive sheet body.
  • the target chip and the adhesive sheet body may be peeled off by the movement of the receiver.
  • the receiver facing surface of the support surface is located at a lower position than the upper surface of the receiver, and the height difference is from the receiver to the edge of the recess on the anti-target chip side. It is preferable to increase the size.
  • a negative pressure is applied to the pressure-sensitive adhesive sheet body adhered to the adjacent chip by the deformation preventing means, so that this peeling is performed when the pressure-sensitive adhesive sheet body is peeled off from the adjacent chip.
  • the allowable space can be secured, and the deformation of the adjacent chip can be stably prevented without impairing the deformation prevention function of the adjacent chip by the deformation preventing means.
  • the pressure-sensitive adhesive sheet body is provided in a region corresponding to the adjacent chip on the stage, and has an inclined plane that is inclined upward along a direction away from the target chip from a predetermined depth position deeper than the target chip.
  • Adjacent chips may be configured to follow the inclined plane. With this configuration, when the target chip is peeled off, the adjacent chip follows the inclined plane, so that the deformation of the adjacent chip can be effectively prevented.
  • the stage is provided in a region corresponding to the adjacent chip centered on a position corresponding to the target chip, and is provided along any direction away from the target chip from a predetermined depth position as compared with the target chip. Also may be provided with an inverted truncated cone or an inverted truncated cone-shaped recess arranged so as to be tilted upward, and an adjacent tip may be made to imitate the inverted truncated cone surface of the recessed portion via the adhesive sheet body. .. With this configuration, when the target chip is peeled off, the adjacent chip follows the inverted conical base surface. Therefore, the chip corresponds to a curved chip and can be prevented from being deformed with respect to the curved shape peculiar to the chip.
  • the pickup method of the present invention separates the chips from an adhesive sheet body to which a plurality of rectangular chips are attached by peeling them off, and sequentially peels off the target chips to be separated from the plurality of chips.
  • the target chip is used so as to alleviate or cancel the force applied from the adhesive sheet body to the adjacent chip adjacent to the target chip. It will peel off.
  • the force applied from the adhesive sheet body to the adjacent chip can be relaxed or canceled.
  • deformation of adjacent chips can be effectively prevented.
  • the present invention can prevent deformation of an adjacent chip during the pickup operation of the target chip, and therefore, bending stress does not occur in the adjacent chip, cracks and internal defects do not occur, and a high-quality chip can be provided. Therefore, the chip is most suitable for a device and a method of picking up a 3D multilayer memory chip having a weak insulating film.
  • the pickup device of this invention is shown, and it is a simplified sectional view before the start of a peeling operation. It is a simplified cross-sectional view which shows the pickup device of this invention, and has finished peeling. It is a simplified cross-sectional view which shows the pickup device of this invention, and is in the state of picking up a peeled chip. It is a simplified plan view which shows the relationship between the chip attached to the adhesive sheet body, and the slide body as a receiver. It is a simplified perspective view of a stage. It is a top view of the pickup device using the stage which has the mortar-shaped depression part. FIG. 4 is a cross-sectional view of FIG.
  • This pickup device is a device for sequentially peeling and taking out a plurality of rectangular thin-walled chips (semiconductor chips) 11 attached on the adhesive sheet body 12 from the adhesive sheet body 12.
  • the chip 11 is made of a wafer Wa as a material, and is a final product by cutting this material into a rectangular shape. Therefore, the chip 11 has a square shape, a strip shape, or the like. That is, the wafer Wa is circular as a whole, is divided into individual chips 11 by dicing, and the chips 11 are attached to the adhesive sheet body 12. Further, a frame 13 made of a ring body is attached to the outer peripheral side of the adhesive sheet body 12. That is, the frame 13 and the adhesive sheet body 12 are integrated. Then, the chip 11 is taken out by this pickup device in a state where the frame 13 and the adhesive sheet body 12 are integrated.
  • the pickup device includes a stage 16 on which the adhesive sheet body 12 is placed, and a slide body 17 as a receiver R having a chip receiving portion 31 that receives the chip 11 via the adhesive sheet body 12. To prepare for.
  • This pickup device further includes an air suction means 18 for sucking air from negative pressure portions 35 and 36, which will be described later, formed in the lower part of the tip receiving portion 31 of the slide body 17, and a drive (not shown) for moving the slide body 17.
  • a holding means 15 is arranged above the chip 11 to be picked up, and the holding means 15 maintains the height position of the chip 11 to be peeled off from above.
  • the holding means 15 is composed of a suction member (collet) 21 having a head 20 for sucking the chip 11.
  • the head 20 has a suction hole opened in the lower end surface 20a thereof, the tip 11 is vacuum-sucked through the suction hole, and the tip 11 is sucked in the lower end surface 20a of the head 20. Therefore, if this vacuum suction (evacuation) is released, the tip 11 will be detached from the head 20.
  • the collet 21 is connected to, for example, the arm of the robot, and as will be described later, the vertical direction (arrows A, B, C, D in FIG. 9), the horizontal direction (arrows E, F in FIG. 9), and It is possible to move in a direction that combines these.
  • the pickup device is used for a die bonder (bonding device) as shown in FIG.
  • the bonding apparatus picks up the chip 11 as a work cut out from the wafer Wa by the collet (suction collet) 21 at the pickup position P, and transfers (mounts) it to the bonding position Q of the substrate 22 such as a lead frame.
  • the drive mechanism can be configured by a robot arm mechanism, an XYZ ⁇ -axis stage, or the like.
  • the collet 21 is capable of ascending in the arrow A direction and descending in the arrow B direction on the pickup position P by a driving means (not shown).
  • the collet 21 is capable of ascending in the arrow C direction and descending in the arrow D direction on the bonding position Q by a driving means (not shown).
  • the collet 21 is capable of reciprocating in the directions of arrows E and F between the pickup position P and the bonding position Q by a driving means (not shown).
  • this driving means the movement of the arrows A, B, C, D, E, and F is controlled by a control means (not shown).
  • the control means is, for example, a microcomputer in which a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus.
  • the ROM stores programs and data executed by the CPU.
  • the stage 16 in this case has a flat V-shaped groove 25 formed on the upper surface 34 thereof.
  • the flat V-shaped groove 25 has a slide body side tapered surface 26 that tilts downward from the slide body side toward the anti-slide body side, and also anti-slides from a predetermined depth position (bottom line portion 25a which is the bottom portion of the slide body side tapered surface 26). It has an anti-slide body side tapered surface 27 that tilts upward toward the body side.
  • the inclination angles of the tapered surface 26 and the tapered surface 27 are set to be the same.
  • the size (width dimension, length dimension, depth, inclination angle, etc.) of the flat V-shaped groove 25 can be variously set according to the size, thickness dimension, and the like of the chip to be picked up (peeled).
  • the flat V-shaped groove 25 can form a first negative pressure portion 35 whose bottom surface is a tapered surface 26 on the slide body side, and a second negative pressure portion 36 whose bottom surface is a tapered surface 27 on the opposite slide body side. ..
  • a vacuum generator 19 such as a vacuum pump or an ejector constituting the air suction means 18 is connected to the first negative pressure portion 35 and the second negative pressure portion 36. Therefore, the first negative pressure portion 35 and the second negative pressure portion 36 form the negative pressure chamber 37 by air suction by the air suction means 18.
  • the stage 16 is provided with a suction hole 14 that opens in the flat V-shaped groove 25, and the vacuum generator 19 is connected to the suction hole 14.
  • the stage 16 is formed with a concave groove 30 for the slide body 17 on the tapered surface 26 side to slide (reciprocate) in the directions of arrows X1 and X2. That is, the slide body 17 includes the rectangular flat plate-shaped chip receiving portion 31 that fits into the concave groove 30, and the slide body main body 32 that hangs down from the outer end portion of the chip receiving portion 31.
  • the stage 16 is provided with a recess 40 along the opening of the recess 30.
  • the recess 40 is formed along the tapered surface from the pair of first recesses 40a and 40a provided on the tapered surface side of the upper surface portion 34b on the tapered surface 26 side of the upper surface 34 of the stage 16 and the first recesses 40a and 40a. It is composed of a pair of second recesses 40b and 40b that tilt downward, and a third recess 40c that connects the second recesses 40b and 40b on the bottom line portion 25a side of the flat V-shaped groove 25 of the second recesses 40b and 40b. Will be done.
  • the recess 40 has a rectangular cross section and communicates with the negative pressure chamber 37.
  • the upper surface of the slide body 17 (upper surface 33 of the chip receiving portion 31) and the upper surface 34 (34a, 34b) of the stage 16 is preferable to set to be at the same height.
  • the same height includes a range within the dimensional tolerance.
  • the width dimension W (width dimension of the chip receiving portion 31) of the slide body 17 is set to be smaller than the width dimension W1 of the chip 11 to be peeled off. That is, W ⁇ W1.
  • W1-W is set to, for example, 600 ⁇ m or more and 1500 ⁇ m or less.
  • the tip edge 11a (the side facing the tapered surface 27 on the non-slide side) of the tip 11 to be peeled is on the bottom line portion 25a of the flat V-shaped groove 25 in a plan view. ..
  • the side sides 11b and 11b of the chip 11 protrude from the side sides 31b and 31b of the receiving portion 31 of the slide body 17 in a plan view.
  • the amount of protrusion from each side side 31b, 31b is (W1-W) / 2.
  • the tip edge (tip side) 11a of the tip 11 also protrudes from the tip edge (tip side) 31a of the receiving portion 31 of the slide body 17 in a plan view.
  • the protrusion amount W2 is, for example, about (W1-W) / 2.
  • the tip edge (tip side) 31a of the receiving portion 31 of the slide body 17 and the tip end side 11a of the tip 11 are maintained in parallel via a driving means (not shown), and the directions are arrows X1 and X2. It reciprocates to. That is, the slide body 17 is arranged on the stage 16 so as to be slidable.
  • the driving means various mechanisms such as a reciprocating mechanism and a cylinder mechanism including a bolt shaft member and a nut member screwed thereto can be used.
  • the wafer Wa in which the frame 13 and the adhesive sheet body 12 are integrated is arranged on the stage 16.
  • the plurality of chips 11 are arranged in a matrix by arranging them in a plane like a vertical and horizontal grid. Between each chip 11, a gap S1 in a plurality of rows and a gap S2 in a plurality of columns are formed when dicing.
  • the row gap S1 and the column gap S2 have the same dimensions.
  • the chips 11 of b, c, d, e, and f are arranged around the chip 11 of a to be peeled off. Further, the chip 11 of g is arranged on the anti-slide side of the chip 11 of c, the chip 11 of h is arranged on the anti-slide side of the chip 11 of d, and the chip 11 of i is arranged on the anti-slide side of the chip 11 of e. ing.
  • the adsorption collet 21 is adsorbed on the chip 11 of a to be peeled off.
  • the chip 11 of a maintains its planar shape while maintaining its height position.
  • the adhesive sheet body 12 covers the openings of the negative pressure portions 35 and 36 composed of the flat V-shaped grooves 25, and in this state, the air of the negative pressure portions 35 and 36 is sucked. , Negative pressure.
  • the slide body 17 is slid as shown by the arrow X1.
  • the adhesive sheet body 12 moves toward the tapered surfaces 26 and 27 at least on the tip side (front side and anti-slide body side) of the slide body 17. Be sucked.
  • the chip 11 is maintained in a horizontal state by the suction collet 21, the adhesive sheet body 12 is peeled off from the chip 11.
  • FIG. 1B when the slide body 17 reaches the upper end edge of the tapered surface 26, the adhesive sheet body 12 is separated from the chip 11 adsorbed by the adsorption collet 21. Further, the adhesive sheet body 12 is in a state of being adsorbed on the tapered surface 27.
  • the air suction means 18 can suck the adhesive sheet body to the tapered surface (anti-slide body side tapered surface 27), and the air suction means 18 attaches the tip 11 to the anti-slide body side tapered surface via the adhesive sheet body.
  • the copying means 50 for imitating the above is configured.
  • the second chip 11 on the side opposite to the chip 11 from which the adhesive sheet body 12 has been peeled off is in a state of following the tapered surface 27 together with the adhesive sheet body 12 (see FIG. 1B).
  • the adhesive sheet body 12 is bent, but the bent portion H is formed in the gap S2 between the chip 11 of h and the chip 11 of d on the side opposite to the chip 11 of d.
  • the size of the chip 11 and the size of the gap S2 are limited.
  • the chip 11 of d can maintain a planar shape without forming a bent portion or a curved portion.
  • the chips 11 and 11 of b and f (the peripheral chips in the direction orthogonal to the slide body slide direction in the chip 11 to be peeled off follow the slide body side tapered surface 26, and a bent portion or a curved portion is formed.
  • the planar shape can be maintained without the problem.
  • the chip 11 of c and e is in a state of imitating the tapered surface 27 like the chip 11 of d.
  • the g on the anti-sliding body side of the chip 11 of c The tip 11 of c and the tip 11 of e are also flat. The shape can be maintained.
  • the chips 11 of g, h, and i are placed on the upper surface on the non-slide body side which is the flat surface of the stage 16, the chips 11 also have a planar shape. Can be maintained.
  • the chip 11 peeled off from the adhesive sheet body 12 has a collet 21 raised as shown in FIG. 1C, and the peeled chip 11 is picked up from the stage and is in a bonding position. Will be carried to.
  • the peeled chip 11 is bonded to the substrate 22 or the like at the ponding position.
  • the order of the chips 11 picked up from the stage 16 is arbitrary. That is, when a plurality of chips 11 are arranged in a matrix on the adhesive sheet body 12, they can be picked up sequentially according to a row or by skipping an arbitrary number, or can be picked up sequentially according to a column or by skipping an arbitrary number.
  • the chip 11 can be picked up in a concentric or spiral shape sequentially or by skipping an arbitrary number, or can be picked up at random.
  • the chip 11 often selectively picks up a chip 11 conforming to the standard based on inspection data (inspection result map or the like), and it is preferable to pick up the chip 11 corresponding to this.
  • the tip 11 on the non-sliding body side of the tip 11 to be peeled off is tapered via the adhesive sheet body 12 while maintaining the flat state. It imitates the surface 27. Further, the chips 11 arranged along the direction orthogonal to the slide direction of the slide body with respect to the chips 11 to be peeled off follow the tapered surface 26 via the adhesive sheet body 12 while maintaining a flat state. be. Therefore, no external force such as bending is applied to the peripheral (peripheral) chip 11 to be peeled off.
  • the peripheral chip 11 can always be maintained in a planar shape, and the chip 11 can be effectively prevented from being deformed. Can be done. Therefore, the chip 11 is most suitable for a device and a method of picking up a 3D multilayer memory chip having a fragile insulating film.
  • the bent portion H in the adhesive sheet body 12 that bends when the chip 11 follows the tapered surface 27 is the boundary between the chips (between the gaps S2).
  • the negative pressure portions 35 and 36 have a simple symmetrical shape, which is excellent in productivity.
  • the facing side 11d on the slide body side protrudes toward the slide body side from the bottom line portion 25a of the flat V-shaped groove 25. It is preferable to set it so that it does not. With this configuration, the tip 11 that imitates the tapered surface 27 of the second negative pressure portion 36 does not come into contact with the tapered surface 26 on the slide body side, and it is possible to prevent the tip 11 from bending due to this contact.
  • the relaxation or cancellation of the force applied to the adjacent chip 11B is for the chip 11 in the free state.
  • the HF is about 0.15 mm to 0.60 mm.
  • the slide body side of the adjacent tip 11B is lifted by the adhesive sheet body 12. If it is lifted in this way, the end portion (slide body side) of the adjacent chip 11B may be damaged or damaged, and further, a defect may occur inside the chip.
  • the adhesive sheet body 12 is pulled toward the recess 40c as shown in FIGS. 1B and 1C, and the adjacent tip 11B is provided. Does not exert the force to lift. As a result, deformation of the adjacent chip 11B can be effectively prevented.
  • the recesses 40b and 40b are provided along the tapered surface 26, when the target tip 11A is peeled off, the recesses 40b and 40b are transferred from the adhesive sheet body 12 to the adjacent tip 11B and b. It is possible to configure the deformation preventing means M that acts on a negative pressure that makes it possible to relax or cancel the force applied to the adjacent chip 11B.
  • the chip 11 is most suitable for a device and a method of picking up a 3D multilayer memory chip having a weak insulating film.
  • the deformation in this case is a deformation with respect to the shape of the chip in the free state.
  • the negative pressure chamber 37 that generates a peeling force between the target tip 11A and the adhesive sheet body 12 by applying a negative pressure is provided, stable peeling of the target tip 11A is possible.
  • the recess 40c of the support surface 23 is configured to communicate with the negative pressure chamber 37, a negative pressure can be applied to the recess 40c via the negative pressure chamber 37, and the device configuration can be simplified. It becomes.
  • a receiver R that supports the target chip 11A via the adhesive sheet body 12 is provided, and by moving the receiver R, the adhesive sheet body 12 and the target chip 11A are peeled off by the negative pressure in the negative pressure chamber 37. be able to. With such a configuration, it is possible to avoid pushing up the tip 11A by the needle, and it is possible to stably peel off the target tip 11A without damaging or deforming it.
  • FIGS. 4 and 5 show a pickup device using a stage 51 of a recess 54 having a mortar shape (flat cone shape or flat cone shape).
  • the slide body 52 as the receiver R is provided in the recessed portion 54, and the fitting concave groove 53 is fitted so as to be reciprocating in the directions of arrows X3 and X4 in FIG.
  • the recessed portion 54 of the stage 51 is provided in a region corresponding to the adjacent chip 11B with the position corresponding to the target chip 11A as the center, and any of the recessed portions 54 away from the target chip 11A from a predetermined depth position as compared with the target chip 11A. It is arranged so that it tilts upward even along the direction.
  • a recess 55 surrounding the tip end portion of the slide body 52 is provided in a plan view.
  • the recess 55 has a first recess 55a on the adjacent chip side of b, a second recess 55b on the adjacent chip side of f, and a third recess 55c on the adjacent chip side of d.
  • the first recess 55a has a size in a range extending over a part of the target chip 11 of a and a part of the adjacent chip 11 of b
  • the second recess 55b is a part of the target chip 11 of a and f.
  • the third recess 55c is the size of the range covering a part of the adjacent chip 11 of a and the size of the range covering a part of the target chip 11 of a and the part of the adjacent chip 11 of d.
  • the HF is set to about 0.15 mm to 0.60 mm.
  • this pickup device also has a negative pressure chamber (not shown) that generates a peeling force between the target chip 11A and the adhesive sheet body 21 by applying a negative pressure.
  • a negative pressure chamber is communicated with the recess 55.
  • the negative pressure chamber is communicated with the recess 55. Therefore, the recess 55 constitutes the deformation preventing means M that acts on the negative pressure that enables the force applied from the adhesive sheet body 21 to the adjacent chip 11B to be relaxed or canceled.
  • the mechanism for reciprocating the slide body 52 in the horizontal direction and the control means for controlling the operation of this mechanism are not shown.
  • the mechanism for reciprocating the slide body 58 in the horizontal direction can be configured by a known and publicly available mechanism, and the control means can also be configured by a microcomputer as described above.
  • the slide body 52 as the receiving body R is in a state of receiving the target chip 11A via the adhesive sheet 12.
  • the end portion (protruding portion) of the target tip 11A on the adjacent tip 11B side of the target tip 11A is in a state of protruding toward the adjacent tip 11B side from the slide body 52. Therefore, the protruding portion of the target chip 11A corresponds to the third recess 55c of the recess 55.
  • a suction collet 21 is arranged above the target chip 11A, and the target chip 11A is in a state of being sucked by the suction collet 21, and the target chip 11A is maintained at that position.
  • the recess 55 is in a negative pressure state.
  • the adhesive sheet 21 at the protruding portion of the target chip 11A is sucked downward and peeled off from the target chip 11A.
  • the adhesive sheet 21 is sucked toward the recess 55c in the range from the end of the slide body 52 to the end of the recess 55c on the anti-target chip side. That is, the deformation preventing means M can exert a negative pressure that can alleviate or cancel the force applied from the adhesive sheet body to the adjacent chip.
  • the slide body 52 is slid in the arrow X3 method.
  • a gap in a negative pressure state is formed below the pressure-sensitive adhesive sheet 21 adhered to the target chip 11A, and this gap gradually expands as the slide body 52 slides, and finally, this gap is expanded.
  • the adhesive sheet 21 can be peeled off from the target chip 11A. After that, the suction collet 21 is raised to convey the target chip 11A to the bonding position.
  • FIG. 6 shows a pickup device using a slide body 58 that can move up and down.
  • the slide body 58 as the receiver R is fitted in the fitting concave groove 57 of the stage 56 so as to be movable up and down.
  • the mechanism for reciprocating the slide body 58 in the horizontal direction in the direction of the arrow along the fitting concave groove 57, the mechanism for moving the slide body 58 up and down, the control means for controlling the operation of these mechanisms, and the like are shown. It is omitted.
  • the mechanism for reciprocating in the horizontal direction and the mechanism for moving the slide body 58 up and down can be configured by a known public mechanism, and the control means can also be configured by the above-mentioned microcomputer.
  • a recess 60 communicating with the fitting recess 57 is provided.
  • a recess 60 is provided which communicates with the fitting recess 57. Also in this case, a negative pressure chamber (not shown) is provided between the target chip 11A and the pressure-sensitive adhesive sheet body 12 by applying a negative pressure. The negative pressure chamber is communicated with the recess 60.
  • the pickup of the target chip 11A has the slide body 58 as shown in FIG. 6B from the state shown in FIG. 6A (that is, the upper surface 56a of the stage 56 and the upper surface 58a of the slide body 58 are arranged on the same surface (horizontal plane)). As shown by the arrow, raise it by a predetermined size. As a result, a step of a predetermined size is generated between the upper surface 56a of the stage 56 and the upper surface 58a of the slide body 58.
  • the negative pressure chamber is in a negative pressure state and the inside of the recess 60 is in a negative pressure state. Therefore, since the target chip 11 is in a state of protruding from the recess 60 side of the slide body 58, it is pulled downward between the slide body 58 and the end edge portion of the recess 60 on the anti-slide body side. Further, in this state, although not shown, the suction collet 21 is brought into contact with the upper surface of the target chip 11 from above, and the target chip 11 is sucked by the suction collet 21. As a result, as shown in FIG.
  • the adhesive sheet body 12 adhered to the end portion of the target chip 11 protruding from the slide body 58 is peeled off while the target chip 11 remains horizontal at that position. Further, the adhesive sheet body 12 at the end protruding into the recess 60 of the adjacent chip 11 is peeled off.
  • the recess 60 constitutes the deformation preventing means M that acts on a negative pressure that can alleviate or cancel the force applied from the adhesive sheet body 12 to the adjacent tip 11B.
  • FIG. 7 shows a pickup device using the block body 62 in which the receiver moves up and down.
  • the block body 62 is fitted in the first block 63 of the rectangular tubular body, the second block 64 of the rectangular tubular body that is loosely fitted in the first block 63, and the second block 64. It is composed of a plate-shaped third block 65.
  • the block body 62 is loosely fitted to the fitting recess 67 of the stage 66, and a gap 68 is provided between the outer surface of the first block 63 and the inner surface of the fitting recess 67, and the second block body 62 is provided.
  • a gap 69 is provided between the outer surface of the block 64 and the first block 63, and a gap 70 is provided between the outer surface of the third block 65 and the inner surface of the second block 64.
  • each of the first, second, and third blocks 63, 64, and 65 of the block body 62 can move up and down independently. That is, each of the blocks 63, 64, and 65 can be moved up and down by a publicly known and publicly used vertical movement mechanism. Further, the vertical movement mechanism of each block 63, 64, 65 is controlled by a control means (not shown) composed of a microcomputer or the like.
  • a recess 71 is formed in the upper opening of the fitting recess 67 of the stage 66. Further, it is provided with a negative pressure chamber (not shown) that generates a peeling force between the target chip 21A and the adhesive sheet body 21 by applying a negative pressure. A negative pressure chamber is communicated with each of the gaps 68, 69, 70 and the recess 71.
  • the entire block body 62 is raised by a predetermined size from the upper surface 66a of the stage 66.
  • the gaps 68, 69, 70 and the recess 71 are in a negative pressure state.
  • the target chip 11A is adsorbed and held by the adsorption collet 21.
  • the second block 64 and the third block 65 are further set to a predetermined size (the predetermined size here is a predetermined size obtained by slightly raising the entire block body 62 from the upper surface 66a of the stage 66). It may be the same as or different from.).
  • the collet 21 is raised by this predetermined size, and the adhesive sheet body 12 outside the second block 64 of the target chip 11A is peeled off.
  • the third block 65 is further set to a predetermined size (the predetermined size here may be the same as or different from the predetermined size obtained by slightly raising the entire block body 62 from the upper surface 66a of the stage 66). Only raise. At this time, the suction collet 21 is raised by this predetermined size, and the adhesive sheet body 12 outside the third block 65 of the target chip 11A is peeled off.
  • the adhesive sheet body 12 is in a state of being adhered to the target chip 11A within the range of the upper surface of the third block 65, and by raising the collet 21 from this state, the target chip 11A is attached to the adhesive sheet body 12 Can be completely peeled off from.
  • the pickup device includes a stage 16 having tapered surfaces 26 and 27, a stage 51 having a mortar-shaped recess 54, and a cradle R that slides in the horizontal direction and reciprocates in the vertical direction.
  • Various types of devices such as moving ones can be configured. In these types, the tip can be prevented from being pushed up by the needle, and the target tip 11A can be stably peeled off without being damaged or deformed.
  • the stage 16 is a rectangular block body, but other shapes, for example, It may be a disk-shaped body.
  • the second negative pressure portion 36 requires a tapered surface 27 that the tip 11 follows, but the first negative pressure portion 35 does not necessarily require a tapered surface.
  • the suction holes 14 for sucking the air of the negative pressure portions 35 and 36 may be opened in any of the tapered surfaces 26 and 27, and the suction holes 14 opened in the negative pressure portions 35 and 36.
  • the number and diameter of the above are arbitrary.
  • the number of chips 11 is not limited to two. That is, the bent portion H of the adhesive sheet body 12 may be in the gap between the adjacent chips.
  • the depth depth from the stage upper surface 34 to the bottom line portion 25a
  • the depth is, for example, about 0.1 to 3 mm. In this case, it depends on the size and thickness of the chip 11 to be peeled off, the thickness of the adhesive sheet body 12, and the like.
  • the inclination angle between the tapered surface 26 on the slide body side and the tapered surface 27 on the anti-slide body side may be the same angle or different angles.
  • An inclined portion (not shown) that inclines upward from the tapered surface 26 of the slide side body toward the slide body 17 is provided around the periphery of the slide body 17 of the chip 11 to be peeled off in a direction orthogonal to the slide direction. May be good.
  • the deformation preventing means M in each embodiment, a part of the adhesive sheet 12 adhering to the adjacent chip 11B is peeled off, but it may not be peeled off. That is, during the pickup operation of the target chip 11A, the force acting on the adjacent chip 11B from the adhesive sheet 12 is not reduced or canceled, and the adjacent chip 11A may not be deformed.
  • Chip 12 Adhesive sheet body 16, 51, 56 Stage 17, 52, 58 Slide body 23 Support surface 27 Inclined plane (tapered surface on the non-slide body side) 37 Negative pressure chamber 54 Depression 56 Stage 62 Block body M Deformation prevention means P Pickup position Q Bonding position R Receiver

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Abstract

Provided is a pickup device for releasing and separating a plurality of rectangular chips from an adhesive sheet body to which the chips are affixed, the pickup device successively releasing target chips among the plurality of chips that are to be separated. The pickup device is provided with a support surface for supporting an adjacent chip adjacent to a target chip via an adhesive sheet body. A recess is formed on the support surface along an opposing side which is one of the sides of the adjacent chip that opposes the target chip. When the target chip is released, the recess constitutes a deformation-preventing means for providing a negative pressure enabling reduction or cancellation of a force applied to the adjacent chip from the adhesive sheet body.

Description

ピックアップ装置およびピックアップ方法Pickup device and pickup method
　本発明は、ピックアップ装置およびピックアップ方法に関する。 The present invention relates to a pickup device and a pickup method.
　半導体装置の製造工程において、ダイシングされた半導体チップ（以下、単にチップという。）を粘着シート体からピックアップする必要がある。従来のピックアップ装置として、粘着シート体を保持するステージと、このステージに対して進退する突き上げ台と、この突き上げ台によって突き上げられるニードルとを備えたものがある。すなわち、突き上げ台によって突き上げられたニードルによりステージの粘着シート体を裏面側から突いて、チップを粘着シート体から離脱させるように構成されている。 In the manufacturing process of a semiconductor device, it is necessary to pick up a diced semiconductor chip (hereinafter, simply referred to as a chip) from an adhesive sheet body. As a conventional pickup device, there is a device provided with a stage for holding an adhesive sheet body, a push-up table for advancing and retreating with respect to this stage, and a needle pushed up by the push-up table. That is, it is configured so that the adhesive sheet body of the stage is pierced from the back surface side by the needle pushed up by the push-up table to separate the chip from the adhesive sheet body.
　しかしながら、ニードルを使用するピックアップ装置では、ニードルが粘着シート体を突き破ってチップを突き上げて粘着シート体から剥離する際に、ニードルの先端部が磨滅したり破損していたり曲がっていたりする場合がある。このような場合には、破損したニードルがチップ突き上げ時にチップ裏面を傷付けるおそれがある。また、磨滅や破損によって各ニードルの長さが相違することになって、チップが傾いて突き上げられる状態になり、隣合うチップ同士が衝突して傷付け合うおそれがある。 However, in a pickup device that uses a needle, the tip of the needle may be worn, damaged, or bent when the needle breaks through the adhesive sheet body and pushes up the tip to peel it off from the adhesive sheet body. .. In such a case, the damaged needle may damage the back surface of the tip when pushing up the tip. In addition, the length of each needle will be different due to abrasion or breakage, and the tips will be tilted and pushed up, and there is a risk that adjacent tips will collide with each other and be damaged.
　さらに、チップはコレットにて吸着されて取り出される。しかしながら、チップが傾いて突き上げられれば、コレットによるチップの吸着ミスが発生する。コレットのチップ吸着ミスが発生すると、その後の作業に支障を来たすことになる。また、ニードルの突き上げによって、チップが損傷する場合もあった。 Furthermore, the chip is adsorbed by the collet and taken out. However, if the tip is tilted and pushed up, a mistake in sucking the tip by the collet occurs. If a collet chip adsorption error occurs, it will hinder the subsequent work. In addition, the tip may be damaged by pushing up the needle.
　そこで、近年このようなニードルを使用しないピックアップ装置（特許文献１）が提案されている。このピックアップ装置は、図１０～図１２に示すように、チップ１が貼り付けられている粘着シート体２を保持するステージ３を備える。また、ステージ３には、その上面４ａがステージ上面３ａより突出する受け部（スライド体）４が付設される。このため、受け部４の外周側には、粘着シート体２との間に図１１に示すように隙間６が形成される。さらに、ステージ３には、前記隙間６に連通される吸引孔５が設けられている。なお、この吸引孔５、５は、平面視において、その一部がチップ１の第１辺８ａよりも外側に突出している。 Therefore, in recent years, a pickup device (Patent Document 1) that does not use such a needle has been proposed. As shown in FIGS. 10 to 12, this pickup device includes a stage 3 that holds the adhesive sheet body 2 to which the chip 1 is attached. Further, the stage 3 is provided with a receiving portion (sliding body) 4 whose upper surface 4a protrudes from the stage upper surface 3a. Therefore, on the outer peripheral side of the receiving portion 4, a gap 6 is formed between the receiving portion 4 and the adhesive sheet body 2 as shown in FIG. Further, the stage 3 is provided with a suction hole 5 that communicates with the gap 6. A part of the suction holes 5 and 5 protrudes outward from the first side 8a of the chip 1 in a plan view.
　次に、前記ピックアップ装置を使用したピックアップ方法を説明する。まず、図１１に示すように、上方からコレット（吸着コレット）７にてチップ１を吸着（保持）した状態で、吸引孔５を介して粘着シート体２を吸引する。これによって、隙間６のエアが矢印Ａ１のように、吸引され、受け部４の周りの粘着シート体２が吸引され、チップ１の外周側において粘着シート体２が剥離する。 Next, a pickup method using the pickup device will be described. First, as shown in FIG. 11, the adhesive sheet body 2 is sucked through the suction hole 5 in a state where the chip 1 is sucked (held) by the collet (suction collet) 7 from above. As a result, the air in the gap 6 is sucked as shown by the arrow A1, the adhesive sheet body 2 around the receiving portion 4 is sucked, and the adhesive sheet body 2 is peeled off on the outer peripheral side of the chip 1.
　その後、図１２に示すように、受け部４を矢印Ｂ１の方向へ移動させる。つまり、第１辺８ａに対面する第２辺８ｂ側へ移動させる。これによって、受け部４にて受けられているチップ１の受け面積が減少していって、粘着シート体２の吸着（吸引）面積が増加して、最終的にこのチップ１から粘着シート体２を完全に剥離させることができる After that, as shown in FIG. 12, the receiving portion 4 is moved in the direction of the arrow B1. That is, it is moved to the second side 8b facing the first side 8a. As a result, the receiving area of the chip 1 received by the receiving portion 4 decreases, the suction (suction) area of the adhesive sheet body 2 increases, and finally the adhesive sheet body 2 from the chip 1 increases. Can be completely peeled off
特許第３２０９７３６号明細書Japanese Patent No. 3209736
　ところで、ピックアップすべきチップ（ターゲットチップ１Ａ）に他のチップが隣接している場合、図１３に示すように、ターゲットチップ１Ａを剥離する際には、この隣接チップ１Ｂのターゲットチップ側において、粘着シート体２によって上昇する力が付与されることになる。これによって、隣接チップ１Ｂのターゲットチップ側の端部が変形することになる。このように、変形すれば、チップ１Ｂが破損や損傷したりし、またその変形でチップ内部に欠陥が生じるおそれがあった。 By the way, when another chip is adjacent to the chip to be picked up (target chip 1A), as shown in FIG. 13, when the target chip 1A is peeled off, it adheres to the target chip side of the adjacent chip 1B. The rising force is applied by the seat body 2. As a result, the end portion of the adjacent chip 1B on the target chip side is deformed. As described above, if the chip 1B is deformed, the chip 1B may be damaged or damaged, and the deformation may cause a defect inside the chip.
　そこで、本発明は、上記課題に鑑みて、剥離しようとしているチップ以外のチップを、変形するのを有効に防止できるピックアップ装置およびピックアップ方法を提供する。 Therefore, in view of the above problems, the present invention provides a pickup device and a pickup method that can effectively prevent deformation of chips other than the chip to be peeled off.
　本発明のピックアップ装置は、複数の矩形のチップが貼り付けられた粘着シート体から前記チップを剥離して分離するものであり、前記複数のチップのうち分離対象とするターゲットチップを順次剥離するピックアップ装置であって、前記粘着シート体を介して前記ターゲットチップに隣接する隣接チップを支持する支持面を備え、隣接チップの辺のうち前記ターゲットチップに対向する対向辺に沿って凹部を前記支持面に形成し、前記ターゲットチップを剥離する時には、前記凹部が、前記粘着シート体から前記隣接チップに加わる力の緩和乃至打消しを可能とする負圧を作用する変形防止手段を構成するものである。ところで、チップとして、自由状態で平面形状が維持されるものと、チップ固有の変形を伴うものとがある。このため、隣接チップに加わる力の緩和乃至打消しは、自由状態のチップに対するものである。 The pickup device of the present invention separates the chips from an adhesive sheet body to which a plurality of rectangular chips are attached by peeling them off, and sequentially peels off the target chips to be separated from the plurality of chips. The device is provided with a support surface for supporting an adjacent chip adjacent to the target chip via the adhesive sheet body, and a recess is provided along the opposite side of the adjacent chips facing the target chip. When the target chip is peeled off, the concave portion constitutes a deformation preventing means that acts on a negative pressure that can alleviate or cancel the force applied to the adjacent chip from the adhesive sheet body. .. By the way, as a chip, there are a chip whose planar shape is maintained in a free state and a chip which is accompanied by deformation peculiar to the chip. Therefore, the relaxation or cancellation of the force applied to the adjacent chips is for the chips in the free state.
　本発明のピックアップ装置によれば、ターゲットチップを剥離する時には、変形防止手段にて、粘着シート体から隣接チップに加わる力を緩和乃至打消すことができる。これによって、隣接チップの変形を有効に防止できる。この場合の変形は、チップの自由状態の形状に対する変形である。 According to the pickup device of the present invention, when the target chip is peeled off, the force applied from the adhesive sheet body to the adjacent chip can be relaxed or canceled by the deformation preventing means. As a result, deformation of adjacent chips can be effectively prevented. The deformation in this case is a deformation with respect to the free state shape of the chip.
　負圧をかけることにより前記ターゲットチップと前記粘着シート体との間に剥離力を発生させる負圧室を備えるのが好ましい。このように構成することによって、ターゲットチップの安定した剥離が可能となる。 It is preferable to provide a negative pressure chamber that generates a peeling force between the target chip and the adhesive sheet body by applying a negative pressure. With such a configuration, stable peeling of the target chip becomes possible.
　前記支持面の凹部が前記負圧室に連通されているように構成できる。このように構成することによって、負圧室を介して凹部に負圧を作用させることができ、装置構成の簡略化が可能となる。 The recess of the support surface can be configured to communicate with the negative pressure chamber. With such a configuration, a negative pressure can be applied to the concave portion via the negative pressure chamber, and the device configuration can be simplified.
　粘着シート体を介して前記ターゲットチップを支持する受け体を備え、前記受け体を移動させることにより、前記負圧室内の負圧によって前記粘着シート体と前記ターゲットチップ間の剥離を行うことができる。このように構成することによって、ニードルによるチップの突き上げを回避でき、ターゲットチップを損傷や変形等させることなく、安定して剥離していくことができる。 A receiver that supports the target chip is provided via the adhesive sheet body, and by moving the receiver, the adhesive sheet body and the target chip can be peeled off by the negative pressure in the negative pressure chamber. .. With such a configuration, it is possible to avoid pushing up the tip by the needle, and it is possible to stably peel off the target tip without damaging or deforming it.
　前記受け体は、前記粘着シート体が載置されるステージ上に配設され、前記粘着シート体に対して平行方向に移動可能となされたスライド体であって、前記受け体の移動によって、前記ターゲットチップと粘着シート体とを剥離するものであってもよい。このように構成することによって、ターゲットチップの剥離時に、受け体であるスライド体でスライドさせることによって、安定して剥離していくことができる。 The receiver is a slide body arranged on a stage on which the adhesive sheet body is placed and movable in a direction parallel to the adhesive sheet body, and the movement of the receiver causes the receiver to move. It may be the one that peels off the target chip and the adhesive sheet body. With this configuration, when the target chip is peeled off, it can be stably peeled off by sliding it with the slide body which is the receiver.
　前記受け体は、複数のチップが貼り付けられた前記粘着シート体が載置されるステージに配設され、前記粘着シート体に対して垂直方向に移動可能となされたブロック体であって、前記受け体の移動によって、前記ターゲットチップと粘着シート体とが剥離されるものであってもよい。このように構成することによって、ターゲットチップの剥離時に、受け体であるブロック体を動作（上昇）させることによって、安定して剥離していくことができる。 The receiver is a block body that is arranged on a stage on which the pressure-sensitive adhesive sheet body to which a plurality of chips are attached and is movable in a direction perpendicular to the pressure-sensitive adhesive sheet body. The target chip and the adhesive sheet body may be peeled off by the movement of the receiver. With this configuration, when the target chip is peeled off, the block body that is the receiver is operated (raised), so that the block body can be stably peeled off.
　前記ターゲットチップの剥離動作開始時に、前記受け体の上面より前記支持面の受け体対向面が低位置にあり、この高低差よりも前記受け体から凹部の反ターゲットチップ側の端縁部までの寸法を大きくするのが好ましい。このように構成することによって、隣接チップに粘着されている粘着シート体に対して、変形防止手段にて負圧を作用させることによって、隣接チップから粘着シート体が剥離した際に、この剥離を許容するスペースを確保でき、変形防止手段による隣接チップの変形防止機能が損なわれることなく、安定して隣接チップの変形を防止できる。 At the start of the peeling operation of the target chip, the receiver facing surface of the support surface is located at a lower position than the upper surface of the receiver, and the height difference is from the receiver to the edge of the recess on the anti-target chip side. It is preferable to increase the size. With this configuration, a negative pressure is applied to the pressure-sensitive adhesive sheet body adhered to the adjacent chip by the deformation preventing means, so that this peeling is performed when the pressure-sensitive adhesive sheet body is peeled off from the adjacent chip. The allowable space can be secured, and the deformation of the adjacent chip can be stably prevented without impairing the deformation prevention function of the adjacent chip by the deformation preventing means.
　前記ステージ上の前記隣接チップに対応する領域に設けられ、前記ターゲットチップよりも深い所定の深さ位置から前記ターゲットチップから離れる方向に沿って上傾となる傾斜平面を備え、前記粘着シート体を介して隣接チップを前記傾斜平面に倣わせるように構成してもよい。このように構成することによって、ターゲットチップの剥離時に、隣接チップが傾斜平面に倣うものであるので、この隣接チップの変形を有効に防止できる。 The pressure-sensitive adhesive sheet body is provided in a region corresponding to the adjacent chip on the stage, and has an inclined plane that is inclined upward along a direction away from the target chip from a predetermined depth position deeper than the target chip. Adjacent chips may be configured to follow the inclined plane. With this configuration, when the target chip is peeled off, the adjacent chip follows the inclined plane, so that the deformation of the adjacent chip can be effectively prevented.
　前記ステージは、前記ターゲットチップに対応する位置を中心として、前記隣接チップに対応する領域に設けられ、前記ターゲットチップと比較して所定の深さ位置から前記ターゲットチップから離れるいずれの方向に沿っても上傾となるよう配置された逆円錐台乃至逆円錐体形状の窪み部を備え、前記粘着シート体を介して隣接チップを前記窪み部の逆円錐台面に倣わせるものであってもよい。このように構成することによって、ターゲットチップの剥離時に、隣接チップが逆円錐台面に倣うことになる。このため、チップとして、湾曲したチップに対応し、チップ固有の湾曲形状に対しての変形を防止できる。 The stage is provided in a region corresponding to the adjacent chip centered on a position corresponding to the target chip, and is provided along any direction away from the target chip from a predetermined depth position as compared with the target chip. Also may be provided with an inverted truncated cone or an inverted truncated cone-shaped recess arranged so as to be tilted upward, and an adjacent tip may be made to imitate the inverted truncated cone surface of the recessed portion via the adhesive sheet body. .. With this configuration, when the target chip is peeled off, the adjacent chip follows the inverted conical base surface. Therefore, the chip corresponds to a curved chip and can be prevented from being deformed with respect to the curved shape peculiar to the chip.
　本発明のピックアップ方法は、複数の矩形のチップが貼り付けられた粘着シート体から前記チップを剥離して分離するものであり、前記複数のチップのうち分離対象とするターゲットチップを順次剥離するピックアップ方法であって、前記複数のチップのうち分離対象とするターゲットチップを剥離する時に、前記ターゲットチップに隣接する隣接チップに対して前記粘着シート体から加わる力を緩和乃至打消すようにターゲットチップを剥離していくものである。 The pickup method of the present invention separates the chips from an adhesive sheet body to which a plurality of rectangular chips are attached by peeling them off, and sequentially peels off the target chips to be separated from the plurality of chips. In the method, when the target chip to be separated is peeled off from the plurality of chips, the target chip is used so as to alleviate or cancel the force applied from the adhesive sheet body to the adjacent chip adjacent to the target chip. It will peel off.
　本発明のピックアップ方法によれば、ターゲットチップを剥離する時には、粘着シート体から隣接チップに加わる力を緩和乃至打消すことができる。これによって、隣接チップの変形を有効に防止できる。 According to the pickup method of the present invention, when the target chip is peeled off, the force applied from the adhesive sheet body to the adjacent chip can be relaxed or canceled. As a result, deformation of adjacent chips can be effectively prevented.
　本発明は、ターゲットチップのピックアップ動作時に、隣接チップの変形を防止でき、このため、隣接チップに曲げ応力が発生せず、割れや内部欠陥が生じず、高品質のチップを提供できる。このため、チップが漸弱な絶縁膜を有する３D多層化したメモリチップをピックアップする装置および方法に最適となる。 INDUSTRIAL APPLICABILITY The present invention can prevent deformation of an adjacent chip during the pickup operation of the target chip, and therefore, bending stress does not occur in the adjacent chip, cracks and internal defects do not occur, and a high-quality chip can be provided. Therefore, the chip is most suitable for a device and a method of picking up a 3D multilayer memory chip having a weak insulating film.
本発明のピックアップ装置を示し、剥離動作開始前の簡略断面図である。The pickup device of this invention is shown, and it is a simplified sectional view before the start of a peeling operation. 本発明のピックアップ装置を示し、剥離が終了した状態の簡略断面図である。It is a simplified cross-sectional view which shows the pickup device of this invention, and has finished peeling. 本発明のピックアップ装置を示し、剥離されたチップをピックアップしている状態の簡略断面図である。It is a simplified cross-sectional view which shows the pickup device of this invention, and is in the state of picking up a peeled chip. 粘着シート体に貼り付けられたチップと受け体としてのスライド体との関係を示す簡略平面図である。It is a simplified plan view which shows the relationship between the chip attached to the adhesive sheet body, and the slide body as a receiver. ステージの簡略斜視図である。It is a simplified perspective view of a stage. すり鉢形状の窪み部を有するステージを用いたピックアップ装置の平面図である。It is a top view of the pickup device using the stage which has the mortar-shaped depression part. 図４の断面図である。FIG. 4 is a cross-sectional view of FIG. 上下動が可能なスライド体を用いたピックアップ装置のチップ剥離工程を示し、剥離動作開始時の断面図である。It shows the chip peeling process of the pickup device using the slide body which can move up and down, and is the cross-sectional view at the start of a peeling operation. 上下動が可能なスライド体を用いたピックアップ装置のチップ剥離工程を示し、スライド体を上昇させた状態の断面図である。It is sectional drawing which shows the chip peeling process of the pickup device using the slide body which can move up and down, and the state which the slide body is raised. 上下動が可能なスライド体を用いたピックアップ装置のチップ剥離工程を示し、スライド体を水平方向に移動させている状態の断面図である。It is sectional drawing which shows the chip peeling process of the pickup device using the slide body which can move up and down, and the state which the slide body is moving in the horizontal direction. 受け体が上下動するブロック体を用いたピックアップ装置の断面図である。It is sectional drawing of the pickup device using the block body which the receiver moves up and down. 個片化された複数個のチップが粘着シート体に張り合わされてなるウエハの平面図である。It is a top view of a wafer in which a plurality of individualized chips are bonded to an adhesive sheet body. 本発明に係るピックアップ装置を用いたダイボンダ（ボンディング装置）の簡略図である。It is a simplified drawing of the die bonder (bonding apparatus) using the pickup apparatus which concerns on this invention. 従来のピックアップ装置の簡略平面図である。It is a simplified plan view of the conventional pickup device. 従来のピックアップ装置の簡略断面図である。It is a simplified sectional view of the conventional pickup device. 従来のピックアップ装置を使用した剥離工程を示す簡略断面図である。It is a simplified sectional view which shows the peeling process using a conventional pickup device. 従来のピックアップ装置の課題を説明するための断面図である。It is sectional drawing for demonstrating the problem of the conventional pickup apparatus.
　以下本発明の実施の形態を図１～図９に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 9.
　図１Ａ，図１Ｂ，及び図１Ｃに本発明のピックアップ装置を示す。このピックアップ装置は、粘着シート体１２上に貼り付けられた複数の矩形薄肉のチップ（半導体チップ）１１を、粘着シート体１２から順次剥離して取り出す装置である。 1A, 1B, and 1C show the pickup device of the present invention. This pickup device is a device for sequentially peeling and taking out a plurality of rectangular thin-walled chips (semiconductor chips) 11 attached on the adhesive sheet body 12 from the adhesive sheet body 12.
　チップ１１は、図８に示すように、ウエハＷａを素材とし、この素材を矩形状に切断することによって最終製品となる。このため、チップ１１には正方形や短冊状のもの等がある。すなわち、ウエハＷａは全体として円形であり、ダイシングにより個々のチップ１１に分割され、このチップ１１が粘着シート体１２に貼り付けられている。また、粘着シート体１２の外周側にはリング体からなるフレーム１３が貼着されている。すなわち、このフレーム１３と粘着シート体１２とが一体化されている。そして、フレーム１３と粘着シート体１２とが一体化されている状態で、このピックアップ装置にてチップ１１が取り出される。 As shown in FIG. 8, the chip 11 is made of a wafer Wa as a material, and is a final product by cutting this material into a rectangular shape. Therefore, the chip 11 has a square shape, a strip shape, or the like. That is, the wafer Wa is circular as a whole, is divided into individual chips 11 by dicing, and the chips 11 are attached to the adhesive sheet body 12. Further, a frame 13 made of a ring body is attached to the outer peripheral side of the adhesive sheet body 12. That is, the frame 13 and the adhesive sheet body 12 are integrated. Then, the chip 11 is taken out by this pickup device in a state where the frame 13 and the adhesive sheet body 12 are integrated.
　ピックアップ装置は、図１に示すように、粘着シート体１２が載置されるステージ１６と、チップ１１を粘着シート体１２を介して受けるチップ受け部３１を有する受け体Ｒとしてのスライド体１７とを備える。このピックアップ装置は、さらに、スライド体１７のチップ受け部３１の下部に形成される後述する負圧部３５、３６のエアを吸引するエア吸引手段１８と、スライド体１７を移動させる図示省略の駆動手段とを備える。また、ピックアップすべきチップ１１の上方には、保持手段１５が配置され、この保持手段１５にて、剥離すべきチップ１１を上方からその高さ位置を維持する。 As shown in FIG. 1, the pickup device includes a stage 16 on which the adhesive sheet body 12 is placed, and a slide body 17 as a receiver R having a chip receiving portion 31 that receives the chip 11 via the adhesive sheet body 12. To prepare for. This pickup device further includes an air suction means 18 for sucking air from negative pressure portions 35 and 36, which will be described later, formed in the lower part of the tip receiving portion 31 of the slide body 17, and a drive (not shown) for moving the slide body 17. Provide means. Further, a holding means 15 is arranged above the chip 11 to be picked up, and the holding means 15 maintains the height position of the chip 11 to be peeled off from above.
　保持手段１５は、チップ１１を吸着するヘッド２０を有する吸着部材（コレット）２１にて構成している。ヘッド２０は、その下端面２０ａに吸着孔が開口し、この吸着孔を介してチップ１１が真空吸引され、このヘッド２０の下端面２０ａにチップ１１が吸着する。このため、この真空吸引（真空引き）が解除されれば、ヘッド２０からチップ１１が外れる。そして、このコレット２１は例えばロボットのアームに連結され、後述するように、鉛直方向（図９の矢印Ａ，Ｂ、Ｃ、Ｄ方向）、水平方向(図９の矢印Ｅ、Ｆ方向)、およびこれらを組み合わせた方向の移動が可能とされる。 The holding means 15 is composed of a suction member (collet) 21 having a head 20 for sucking the chip 11. The head 20 has a suction hole opened in the lower end surface 20a thereof, the tip 11 is vacuum-sucked through the suction hole, and the tip 11 is sucked in the lower end surface 20a of the head 20. Therefore, if this vacuum suction (evacuation) is released, the tip 11 will be detached from the head 20. The collet 21 is connected to, for example, the arm of the robot, and as will be described later, the vertical direction (arrows A, B, C, D in FIG. 9), the horizontal direction (arrows E, F in FIG. 9), and It is possible to move in a direction that combines these.
　ピックアップ装置は、図９に示すようなダイボンダ（ボンディング装置）に用いられる。ボンディング装置は、ウエハＷａから切り出されるワークとしてのチップ１１をピックアップポジションＰにてコレット（吸着コレット）２１でピックアップして、リードフレームなどの基板２２のボンディングポジションＱに移送（搭載）するものである The pickup device is used for a die bonder (bonding device) as shown in FIG. The bonding apparatus picks up the chip 11 as a work cut out from the wafer Wa by the collet (suction collet) 21 at the pickup position P, and transfers (mounts) it to the bonding position Q of the substrate 22 such as a lead frame.
　吸着コレット２１が着脱自在に装着されるボンディングアームと、このボンディングアームを、Ｘ、Ｙ、Ｚ及びθ方向に駆動することができる駆動機構とを備える。この場合、駆動機構としては、ロボットアーム機構やＸＹＺθ軸ステージ等で構成できる。 It is provided with a bonding arm to which the suction collet 21 is detachably mounted and a drive mechanism capable of driving the bonding arm in the X, Y, Z and θ directions. In this case, the drive mechanism can be configured by a robot arm mechanism, an XYZ θ-axis stage, or the like.
　コレット２１は、図示省略の駆動手段にて、ピックアップポジションＰ上での矢印Ａ方向の上昇および矢印Ｂ方向の下降が可能とされる。コレット２１は、図示省略の駆動手段にて、ボンディングポジションＱ上での矢印Ｃ方向の上昇および矢印Ｄ方向の下降が可能とされる。コレット２１は、図示省略の駆動手段にて、ピックアップポジションＰとボンディングポジションＱとの間の矢印Ｅ、Ｆ方向の往復動とが可能とされる。この駆動手段は図示省略の制御手段にて前記矢印Ａ、Ｂ、Ｃ、Ｄ、Ｅ、Ｆの移動が制御される。制御手段は、例えば、ＣＰＵ（Central Processing Unit）を中心としてＲＯＭ（Read Only Memory）やＲＡＭ（Random Access Memory）等がバスを介して相互に接続されたマイクロコンピュータである。なお、ＲＯＭには、ＣＰＵが実行するプログラムやデータが格納されている。 The collet 21 is capable of ascending in the arrow A direction and descending in the arrow B direction on the pickup position P by a driving means (not shown). The collet 21 is capable of ascending in the arrow C direction and descending in the arrow D direction on the bonding position Q by a driving means (not shown). The collet 21 is capable of reciprocating in the directions of arrows E and F between the pickup position P and the bonding position Q by a driving means (not shown). In this driving means, the movement of the arrows A, B, C, D, E, and F is controlled by a control means (not shown). The control means is, for example, a microcomputer in which a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus. The ROM stores programs and data executed by the CPU.
　そこで、ピックアップポジションＰの本発明に係るピックアップ装置が配置される。この場合のステージ１６は、図３に示すように、その上面３４に扁平Ｖ字溝２５が形成されている。扁平Ｖ字溝２５は、スライド体側から反スライド体側に向かって下傾するスライド体側テーパ面２６を有するとともに、所定深さ位置（スライド体側テーパ面２６の底部である底ライン部２５ａ）から反スライド体側に向かって上傾する反スライド体側テーパ面２７を有する。この場合、テーパ面２６とテーパ面２７の傾斜角度は同一に設定されている。扁平Ｖ字溝２５の大きさ（幅寸法、長寸法、深さ、傾斜角度等）は、ピックアップする（剥離する）チップの大きさ、厚さ寸法等に応じて種々設定できる。 Therefore, the pickup device according to the present invention at the pickup position P is arranged. As shown in FIG. 3, the stage 16 in this case has a flat V-shaped groove 25 formed on the upper surface 34 thereof. The flat V-shaped groove 25 has a slide body side tapered surface 26 that tilts downward from the slide body side toward the anti-slide body side, and also anti-slides from a predetermined depth position (bottom line portion 25a which is the bottom portion of the slide body side tapered surface 26). It has an anti-slide body side tapered surface 27 that tilts upward toward the body side. In this case, the inclination angles of the tapered surface 26 and the tapered surface 27 are set to be the same. The size (width dimension, length dimension, depth, inclination angle, etc.) of the flat V-shaped groove 25 can be variously set according to the size, thickness dimension, and the like of the chip to be picked up (peeled).
　そして、この扁平Ｖ字溝２５は、スライド体側テーパ面２６が底面をなす第１負圧部３５と、反スライド体側テーパ面２７は底面をなる第２負圧部３６とを構成することができる。第１負圧部３５と第２負圧部３６には、エア吸引手段１８を構成する真空ポンプやエジェクタ等の真空発生器１９が接続されている。このため、第１負圧部３５と、第２負圧部３６とで、エア吸引手段１８によるエア吸引にて負圧室３７を構成することになる。なお、ステージ１６には、扁平Ｖ字溝２５に開口する吸引孔１４が設けられ、この吸引孔１４に真空発生器１９が接続される。 The flat V-shaped groove 25 can form a first negative pressure portion 35 whose bottom surface is a tapered surface 26 on the slide body side, and a second negative pressure portion 36 whose bottom surface is a tapered surface 27 on the opposite slide body side. .. A vacuum generator 19 such as a vacuum pump or an ejector constituting the air suction means 18 is connected to the first negative pressure portion 35 and the second negative pressure portion 36. Therefore, the first negative pressure portion 35 and the second negative pressure portion 36 form the negative pressure chamber 37 by air suction by the air suction means 18. The stage 16 is provided with a suction hole 14 that opens in the flat V-shaped groove 25, and the vacuum generator 19 is connected to the suction hole 14.
　また、ステージ１６には、そのテーパ面２６側のスライド体１７が矢印Ｘ１，Ｘ２方向にスライド（往復動）するための凹溝３０が形成されている。すなわち、スライド体１７は、凹溝３０に嵌合する矩形平板形状の前記チップ受け部３１とこのチップ受け部３１の外端部から垂下されるスライド体本体３２とを備える。 Further, the stage 16 is formed with a concave groove 30 for the slide body 17 on the tapered surface 26 side to slide (reciprocate) in the directions of arrows X1 and X2. That is, the slide body 17 includes the rectangular flat plate-shaped chip receiving portion 31 that fits into the concave groove 30, and the slide body main body 32 that hangs down from the outer end portion of the chip receiving portion 31.
　また、ステージ１６には、図３に示すように、凹溝３０の開口部に沿って凹部４０が設けられている。この場合、凹部４０は、ステージ１６の上面３４のテーパ面２６側の上面部３４ｂにおけるテーパ面側に設けられる一対の第１凹部４０ａ、４０ａと、この第１凹部４０ａ、４０ａからテーパ面に沿って下傾する一対の第２凹部４０ｂ、４０ｂと、この第２凹部４０ｂ、４０ｂの扁平Ｖ字溝２５の底ライン部２５ａ側で第２凹部４０ｂ、４０ｂを連結する第３凹部４０ｃとで構成される。また、凹部４０としては、断面矩形状とされ、負圧室３７と連通されている。 Further, as shown in FIG. 3, the stage 16 is provided with a recess 40 along the opening of the recess 30. In this case, the recess 40 is formed along the tapered surface from the pair of first recesses 40a and 40a provided on the tapered surface side of the upper surface portion 34b on the tapered surface 26 side of the upper surface 34 of the stage 16 and the first recesses 40a and 40a. It is composed of a pair of second recesses 40b and 40b that tilt downward, and a third recess 40c that connects the second recesses 40b and 40b on the bottom line portion 25a side of the flat V-shaped groove 25 of the second recesses 40b and 40b. Will be done. Further, the recess 40 has a rectangular cross section and communicates with the negative pressure chamber 37.
　この場合、スライド体１７の上面（チップ受け部３１の上面３３）と、ステージ１６の上面３４（３４ａ、３４ｂ）とが同一高さに設定するのが好ましい。ここで、同一高さとは、寸法公差内に収まる範囲を含むものとする。 In this case, it is preferable to set the upper surface of the slide body 17 (upper surface 33 of the chip receiving portion 31) and the upper surface 34 (34a, 34b) of the stage 16 to be at the same height. Here, the same height includes a range within the dimensional tolerance.
　また、図２に示すように、スライド体１７の幅寸法Ｗ（チップ受け部３１の幅寸法）としては、剥離すべきチップ１１の幅寸法Ｗ１よりも小さく設定される。すなわち、Ｗ＜Ｗ１とされる。この場合、Ｗ１－Ｗとしては、例えば、６００μｍ以上１５００μｍ以下に設定される。剥離動作を開始する初期状態では、その剥離すべきチップ１１の先端縁１１ａ（反スライド側テーパ面２７に対向する辺）が、平面視において、扁平Ｖ字溝２５の底ライン部２５ａ上にある。その状態で、チップ１１の各側辺１１ｂ、１１ｂが、平面視で、スライド体１７の受け部３１の各側辺３１ｂ、３１ｂよりもはみ出している。この場合、各側辺３１ｂ、３１ｂからのはみ出し量は、（Ｗ１－Ｗ）／２となる。また、チップ１１の先端縁（先端辺）１１ａも、スライド体１７の受け部３１の先端縁（先端辺）３１ａよりも、平面視で、はみ出している。この場合のはみ出し量Ｗ２としては、例えば、（Ｗ１－Ｗ）／２程度としている。 Further, as shown in FIG. 2, the width dimension W (width dimension of the chip receiving portion 31) of the slide body 17 is set to be smaller than the width dimension W1 of the chip 11 to be peeled off. That is, W <W1. In this case, W1-W is set to, for example, 600 μm or more and 1500 μm or less. In the initial state in which the peeling operation is started, the tip edge 11a (the side facing the tapered surface 27 on the non-slide side) of the tip 11 to be peeled is on the bottom line portion 25a of the flat V-shaped groove 25 in a plan view. .. In that state, the side sides 11b and 11b of the chip 11 protrude from the side sides 31b and 31b of the receiving portion 31 of the slide body 17 in a plan view. In this case, the amount of protrusion from each side side 31b, 31b is (W1-W) / 2. Further, the tip edge (tip side) 11a of the tip 11 also protrudes from the tip edge (tip side) 31a of the receiving portion 31 of the slide body 17 in a plan view. In this case, the protrusion amount W2 is, for example, about (W1-W) / 2.
　スライド体１７は、図示省略の駆動手段を介して、スライド体１７の受け部３１の先端縁（先端辺）３１ａとチップ１１の先端辺１１ａとが平行状態を維持しつつ、矢印Ｘ１，Ｘ２方向に往復動する。すなわち、スライド体１７は、ステージ１６にスライド可能として配設されている。なお、駆動手段としては、ボルト軸部材とこれに螺合するナット部材からなる往復動機構やシリンダ機構等の種々の機構を用いることができる。 In the slide body 17, the tip edge (tip side) 31a of the receiving portion 31 of the slide body 17 and the tip end side 11a of the tip 11 are maintained in parallel via a driving means (not shown), and the directions are arrows X1 and X2. It reciprocates to. That is, the slide body 17 is arranged on the stage 16 so as to be slidable. As the driving means, various mechanisms such as a reciprocating mechanism and a cylinder mechanism including a bolt shaft member and a nut member screwed thereto can be used.
　次に、上記のように構成されたピックアップ装置を用いてチップ１１をピックアップする方法を説明する。まず、フレーム１３と粘着シート体１２とが一体されたウエハＷａをステージ１６上に配置する。この際、図２に示すａのチップ１１を剥離する場合について説明する。なお、複数個のチップ１１は、平面内に縦横碁盤の目のように整列して配置することにより、マトリックス状に配列している。各チップ１１間には、ダイシングされた際の複数の行の隙間Ｓ１と複数の列の隙間Ｓ２とが形成されている。なお、行の隙間Ｓ１と列の隙間Ｓ２とは同じ寸法となっている。そして、図例では、この剥離するａのチップ１１の周りにｂ、ｃ、ｄ、ｅ、ｆのチップ１１が配置されている。さらに、ｃのチップ１１の反スライド体側にはｇのチップ１１、ｄのチップ１１の反スライド体側にはｈのチップ１１、ｅのチップ１１の反スライド体側にはｉのチップ１１が配設されている。 Next, a method of picking up the chip 11 using the pickup device configured as described above will be described. First, the wafer Wa in which the frame 13 and the adhesive sheet body 12 are integrated is arranged on the stage 16. At this time, a case where the chip 11 of a shown in FIG. 2 is peeled off will be described. The plurality of chips 11 are arranged in a matrix by arranging them in a plane like a vertical and horizontal grid. Between each chip 11, a gap S1 in a plurality of rows and a gap S2 in a plurality of columns are formed when dicing. The row gap S1 and the column gap S2 have the same dimensions. Then, in the illustrated example, the chips 11 of b, c, d, e, and f are arranged around the chip 11 of a to be peeled off. Further, the chip 11 of g is arranged on the anti-slide side of the chip 11 of c, the chip 11 of h is arranged on the anti-slide side of the chip 11 of d, and the chip 11 of i is arranged on the anti-slide side of the chip 11 of e. ing.
　そして、図１Ａに示すように、剥離するａのチップ１１に吸着コレット２１を吸着した状態とする。この状態では、aのチップ１１はその高さ位置を維持した状態で平面形状が維持されている。この状態では、粘着シート体１２にて、扁平Ｖ字溝２５にて構成される負圧部３５、３６の開口部が施蓋され、この状態で、負圧部３５、３６のエアを吸引し、負圧状態とする。 Then, as shown in FIG. 1A, the adsorption collet 21 is adsorbed on the chip 11 of a to be peeled off. In this state, the chip 11 of a maintains its planar shape while maintaining its height position. In this state, the adhesive sheet body 12 covers the openings of the negative pressure portions 35 and 36 composed of the flat V-shaped grooves 25, and in this state, the air of the negative pressure portions 35 and 36 is sucked. , Negative pressure.
　その後、図１Ｃに示すように、スライド体１７を矢印Ｘ１のように、スライドさせていく。この際、負圧部３５、３６が負圧状態となっているので、スライド体１７の少なくとも先端側（前方側であって反スライド体側）において、粘着シート体１２がテーパ面２６，２７側へ吸引される。また、チップ１１が吸着コレット２１にて水平状態が維持さているので、粘着シート体１２がチップ１１から剥がれていく。これにより、図１Ｂのように、スライド体１７がテーパ面２６の上端縁部に達した際に、吸着コレット２１に吸着されたチップ１１からは粘着シート体１２が剥離された状態となる。また、粘着シート体１２がテーパ面２７に吸着された状態となる。 After that, as shown in FIG. 1C, the slide body 17 is slid as shown by the arrow X1. At this time, since the negative pressure portions 35 and 36 are in the negative pressure state, the adhesive sheet body 12 moves toward the tapered surfaces 26 and 27 at least on the tip side (front side and anti-slide body side) of the slide body 17. Be sucked. Further, since the chip 11 is maintained in a horizontal state by the suction collet 21, the adhesive sheet body 12 is peeled off from the chip 11. As a result, as shown in FIG. 1B, when the slide body 17 reaches the upper end edge of the tapered surface 26, the adhesive sheet body 12 is separated from the chip 11 adsorbed by the adsorption collet 21. Further, the adhesive sheet body 12 is in a state of being adsorbed on the tapered surface 27.
　すなわち、エア吸引手段１８は、粘着シート体のテーパ面（反スライド体側テーパ面２７）への吸引が可能となり、このエア吸引手段１８が、チップ１１を粘着シート体を介して反スライド体側テーパ面に倣わせるための倣わせ手段５０を構成する。 That is, the air suction means 18 can suck the adhesive sheet body to the tapered surface (anti-slide body side tapered surface 27), and the air suction means 18 attaches the tip 11 to the anti-slide body side tapered surface via the adhesive sheet body. The copying means 50 for imitating the above is configured.
　このため、粘着シート体１２が剥離されたチップ１１よりも反スライド体側の二のチップ１１が粘着シート体１２とともに、テーパ面２７に倣う状態となる（図１Ｂ参照）。この場合、粘着シート体１２の折れ曲がることになるが、折れ曲がり部Ｈが、ｄのチップ１１よりも反スライド体側のｈのチップ１１とｄのチップ１１との間の隙間Ｓ２に形成されるように、チップ１１の大きさ、隙間Ｓ２の大きさが限定される。 Therefore, the second chip 11 on the side opposite to the chip 11 from which the adhesive sheet body 12 has been peeled off is in a state of following the tapered surface 27 together with the adhesive sheet body 12 (see FIG. 1B). In this case, the adhesive sheet body 12 is bent, but the bent portion H is formed in the gap S2 between the chip 11 of h and the chip 11 of d on the side opposite to the chip 11 of d. , The size of the chip 11 and the size of the gap S2 are limited.
　従って、ｄのチップ１１には、折れ曲がり部乃至湾曲部が形成されずに平面形状を維持することができる。また、ｂ及びｆのチップ１１，１１（剥離すべきチップ１１におけるスライド体スライド方向と直交する方向の周辺のチップは、スライド体側テーパ面２６に倣うことになって、折れ曲がり部乃至湾曲部が形成されずに平面形状を維持できる。また、ｃ及びｅのチップ１１は、ｄのチップ１１と同様、テーパ面２７に倣う状態となる。この場合、ｃのチップ１１よりも反スライド体側のｇのチップ１１との間の隙間Ｓ２、及びホのチップ１１よりも反スライド体側のｉのチップ１１との間の隙間Ｓ２において折れ曲がることになる。このため、ｃのチップ１１及びｅのチップ１１も平面形状を維持することができる。また、ｇ、ｈ、及びｉのチップ１１は、ステージ１６の平坦面である反スライド体側上面に載置されているので、これらのチップ１１においても、平面形状を維持することができる。 Therefore, the chip 11 of d can maintain a planar shape without forming a bent portion or a curved portion. Further, the chips 11 and 11 of b and f (the peripheral chips in the direction orthogonal to the slide body slide direction in the chip 11 to be peeled off follow the slide body side tapered surface 26, and a bent portion or a curved portion is formed. The planar shape can be maintained without the problem. Further, the chip 11 of c and e is in a state of imitating the tapered surface 27 like the chip 11 of d. In this case, the g on the anti-sliding body side of the chip 11 of c The tip 11 of c and the tip 11 of e are also flat. The shape can be maintained. Further, since the chips 11 of g, h, and i are placed on the upper surface on the non-slide body side which is the flat surface of the stage 16, the chips 11 also have a planar shape. Can be maintained.
　また、図１Ｂに示すように、粘着シート体１２から剥離されたチップ１１は、図１Ｃに示すように、コレット２１が上昇して、剥離されたチップ１１がステージ上からピックアップされて、ボンディングポジションに運ばれる。剥離されたチップ１１がポンディングポジションで基板２２等にボンディングされる。なお、ステージ１６上からピックアップするチップ１１の順番としては任意である。すなわち、粘着シート体１２上に複数個のチップ１１がマトリックス状に配列されている場合、行に従って順次又は任意の個数飛ばしでピックアップしたり、列に従って順次又は任意の個数飛ばしでピックアップしたりできる。また、同心円状乃至渦巻状に順次又は任意の個数飛ばしでピックアップしたり、ランダムにピックアップしたりできる。特に、チップ１１は、検査データ（検査結果マップ等）に基づいて、規格に適合したものを選択的にピックアップする場合が多く、これに対応してピックアップするのは好ましい。 Further, as shown in FIG. 1B, the chip 11 peeled off from the adhesive sheet body 12 has a collet 21 raised as shown in FIG. 1C, and the peeled chip 11 is picked up from the stage and is in a bonding position. Will be carried to. The peeled chip 11 is bonded to the substrate 22 or the like at the ponding position. The order of the chips 11 picked up from the stage 16 is arbitrary. That is, when a plurality of chips 11 are arranged in a matrix on the adhesive sheet body 12, they can be picked up sequentially according to a row or by skipping an arbitrary number, or can be picked up sequentially according to a column or by skipping an arbitrary number. Further, it can be picked up in a concentric or spiral shape sequentially or by skipping an arbitrary number, or can be picked up at random. In particular, the chip 11 often selectively picks up a chip 11 conforming to the standard based on inspection data (inspection result map or the like), and it is preferable to pick up the chip 11 corresponding to this.
　このピックアップ装置によれば、負圧部３５，３６を負圧状態とすることによって、剥離すべきチップ１１の反スライド体側のチップ１１を、平面状態を維持しつつ粘着シート体１２を介してテーパ面２７に倣わすものである。また、剥離すべきチップ１１に対してスライド体スライド方向と直交する方向に沿って配設されるチップ１１は、平面状態を維持しつつ粘着シート体１２を介してテーパ面２６に倣わすものである。従って、剥離すべきチップ１１の周囲（周辺）チップ１１には、折れ曲げるような外力が付与されない。すなわち、剥離すべきチップ１１の周辺のチップ１１に折れ曲げるような外力が付与されないので、周辺のチップ１１を常時平面形状に維持することができ、チップ１１が変形することを有効に回避することができる。このため、チップ１１が脆弱な絶縁膜を有する３Ｄ多層化したメモリチップをピックアップする装置および方法に最適となる。 According to this pickup device, by putting the negative pressure portions 35 and 36 into the negative pressure state, the tip 11 on the non-sliding body side of the tip 11 to be peeled off is tapered via the adhesive sheet body 12 while maintaining the flat state. It imitates the surface 27. Further, the chips 11 arranged along the direction orthogonal to the slide direction of the slide body with respect to the chips 11 to be peeled off follow the tapered surface 26 via the adhesive sheet body 12 while maintaining a flat state. be. Therefore, no external force such as bending is applied to the peripheral (peripheral) chip 11 to be peeled off. That is, since no external force such as bending is applied to the chip 11 around the chip 11 to be peeled off, the peripheral chip 11 can always be maintained in a planar shape, and the chip 11 can be effectively prevented from being deformed. Can be done. Therefore, the chip 11 is most suitable for a device and a method of picking up a 3D multilayer memory chip having a fragile insulating film.
　特に、チップ１１がテーパ面２７に倣うことにより折れ曲がる粘着シート体１２における折れ曲がり部Ｈが、チップ間の境界（隙間Ｓ２間）であるのが好ましい。このように設定することによって、剥離すべきチップ１１の反スライド体側のチップ１１を安定して平面状態を維持することができる。 In particular, it is preferable that the bent portion H in the adhesive sheet body 12 that bends when the chip 11 follows the tapered surface 27 is the boundary between the chips (between the gaps S2). By setting in this way, the tip 11 on the non-sliding body side of the tip 11 to be peeled can be stably maintained in a flat state.
　また、扁平Ｖ字溝２５を形成するものでは、各負圧部３５，３６が対称形のシンプル形状となって、生産性に優れる。剥離すべきチップ１１の反スライド体側の隣のチップ１１は、テーパ面２７に倣った状態では、そのスライド体側の対向辺１１ｄは、前記扁平Ｖ字溝２５の底ライン部２５ａよりスライド体側へ突出しないように設定するのが好ましい。このように構成することによって、第２負圧部３６のテーパ面２７に倣わすチップ１１が、スライド体側テーパ面２６に接触せず、この接触によるチップ１１の折れ曲がりを防止することができる。 Further, in the case of forming the flat V-shaped groove 25, the negative pressure portions 35 and 36 have a simple symmetrical shape, which is excellent in productivity. When the chip 11 adjacent to the anti-slide body side of the chip 11 to be peeled is in a state of following the tapered surface 27, the facing side 11d on the slide body side protrudes toward the slide body side from the bottom line portion 25a of the flat V-shaped groove 25. It is preferable to set it so that it does not. With this configuration, the tip 11 that imitates the tapered surface 27 of the second negative pressure portion 36 does not come into contact with the tapered surface 26 on the slide body side, and it is possible to prevent the tip 11 from bending due to this contact.
　ところで、本ピックアップ装置では、隣接チップ１１Ｂ（ｄのチップ）の辺のうちターゲットチップ１１Ａ（ａのチップ）に対向する対向辺に沿って凹部４０の第３凹部４０ｃ）を支持面２３（テーパ面２７）に形成している。この凹部４０には負圧室３７が連通されているので、ａのターゲットチップ１１Ａを剥離する時には、ｄの隣接チップ１１Ｂのイのターゲットチップ１１側の粘着シート体１２が下方へ吸引されることになる。このため、粘着シート体１２から隣接チップ１１Ｂに加わる力の緩和乃至打消しを可能とする負圧を作用する変形防止手段Ｍが構成される。ところで、チップ１１として、自由状態で平面形状が維持されるものと、チップ固有の変形を伴うものとがある。このため、隣接チップ１１Ｂに加わる力の緩和乃至打消しは、自由状態のチップ１１に対するものである。 By the way, in this pickup device, the support surface 23 (tapered surface) of the third recess 40c of the recess 40 along the opposite side of the adjacent chip 11B (chip of d) facing the target chip 11A (chip a). It is formed in 27). Since the negative pressure chamber 37 is communicated with the recess 40, when the target tip 11A of a is peeled off, the adhesive sheet body 12 on the target tip 11 side of the adjacent tip 11B of d is sucked downward. become. Therefore, the deformation preventing means M that acts on a negative pressure that enables relaxation or cancellation of the force applied from the adhesive sheet body 12 to the adjacent chip 11B is configured. By the way, as the chip 11, there are a chip 11 having a planar shape maintained in a free state and a chip 11 having a deformation peculiar to the chip. Therefore, the relaxation or cancellation of the force applied to the adjacent chip 11B is for the chip 11 in the free state.
　また、扁平Ｖ字溝２５の深さをＦとし、スライド体１７から凹部４０の隣接チップ１１Ｂ側の端部までの寸法をＨとしたときに、Ｆ＜Ｈとする。この場合、Ｈ－Ｆとしては、０．１５ｍｍ～０．６０ｍｍ程度とする。 Further, when the depth of the flat V-shaped groove 25 is F and the dimension from the slide body 17 to the end of the recess 40 on the adjacent tip 11B side is H, F <H. In this case, the HF is about 0.15 mm to 0.60 mm.
　ところで、凹部４０ｃが無ければ、粘着シート体１２によって、隣接チップ１１Ｂのスライド体側が持ち上げられることになる。このように持ち上げられれば、隣接チップ１１Ｂの端部（スライド体側）が破損や損傷したり、さらには、チップ内部に欠陥が生じたりする。 By the way, if there is no recess 40c, the slide body side of the adjacent tip 11B is lifted by the adhesive sheet body 12. If it is lifted in this way, the end portion (slide body side) of the adjacent chip 11B may be damaged or damaged, and further, a defect may occur inside the chip.
　これに対して、実施形態のように、負圧状態となる凹部４０ｃが設けられていれば、図１Ｂ，図１Ｃのように、この凹部４０ｃ側に粘着シート体１２が引っ張られ、隣接チップ１１Ｂを持ち上げようとする力を作用させない。これによって、隣接チップ１１Ｂの変形を有効に防止できる。 On the other hand, if the recess 40c in a negative pressure state is provided as in the embodiment, the adhesive sheet body 12 is pulled toward the recess 40c as shown in FIGS. 1B and 1C, and the adjacent tip 11B is provided. Does not exert the force to lift. As a result, deformation of the adjacent chip 11B can be effectively prevented.
　ところで、実施形態では、テーパ面２６に沿って凹部４０ｂ、４０ｂが設けられているので、ターゲットチップ１１Ａを剥離する時には、凹部４０ｂ、４０ｂが、粘着シート体１２からロの隣接チップ１１Ｂ及びへの隣接チップ１１Ｂに加わる力を緩和乃至打消しを可能とする負圧を作用する変形防止手段Ｍを構成することができる。 By the way, in the embodiment, since the recesses 40b and 40b are provided along the tapered surface 26, when the target tip 11A is peeled off, the recesses 40b and 40b are transferred from the adhesive sheet body 12 to the adjacent tip 11B and b. It is possible to configure the deformation preventing means M that acts on a negative pressure that makes it possible to relax or cancel the force applied to the adjacent chip 11B.
　本発明によれば、ターゲットチップ１１Ａのピックアップ動作時に、隣接チップ１１Ｂの変形を防止でき、このため、隣接チップ１１Ｂに曲げ応力が発生せず、割れや内部欠陥が生じず、高品質のチップ１１を提供できる。このため、チップ１１が漸弱な絶縁膜を有する３D多層化したメモリチップをピックアップする装置および方法に最適となる。ここで、この場合の変形は、チップの自由状態の形状に対する変形である。 According to the present invention, it is possible to prevent deformation of the adjacent chip 11B during the pickup operation of the target chip 11A, so that bending stress does not occur in the adjacent chip 11B, cracks and internal defects do not occur, and the chip 11 is of high quality. Can be provided. Therefore, the chip 11 is most suitable for a device and a method of picking up a 3D multilayer memory chip having a weak insulating film. Here, the deformation in this case is a deformation with respect to the shape of the chip in the free state.
　負圧をかけることによりターゲットチップ１１Ａと粘着シート体１２との間に剥離力を発生させる負圧室３７を備えているので、ターゲットチップ１１Ａの安定した剥離が可能となる。 Since the negative pressure chamber 37 that generates a peeling force between the target tip 11A and the adhesive sheet body 12 by applying a negative pressure is provided, stable peeling of the target tip 11A is possible.
　支持面２３の凹部４０ｃが負圧室３７に連通されているように構成しているので、負圧室３７を介して凹部４０ｃに負圧を作用させることができ、装置構成の簡略化が可能となる。 Since the recess 40c of the support surface 23 is configured to communicate with the negative pressure chamber 37, a negative pressure can be applied to the recess 40c via the negative pressure chamber 37, and the device configuration can be simplified. It becomes.
　粘着シート体１２を介してターゲットチップ１１Ａを支持する受け体Ｒを備え、受け体Ｒを移動させることにより、負圧室３７内の負圧によって粘着シート体１２とターゲットチップ１１Ａ間の剥離を行うことができる。このように構成することによって、ニードルによるチップ１１Ａの突き上げを回避でき、ターゲットチップ１１Ａを損傷や変形等させることなく、安定して剥離していくことができる。 A receiver R that supports the target chip 11A via the adhesive sheet body 12 is provided, and by moving the receiver R, the adhesive sheet body 12 and the target chip 11A are peeled off by the negative pressure in the negative pressure chamber 37. be able to. With such a configuration, it is possible to avoid pushing up the tip 11A by the needle, and it is possible to stably peel off the target tip 11A without damaging or deforming it.
　次に、図４と図５は、すり鉢形状（扁平円錐台乃至扁平円錐体形状）の窪み部５４のステージ５１を用いたピックアップ装置を示している。この場合も、受け体Ｒとしてのスライド体５２が、窪み部５４に設けられ、嵌合凹溝５３が図４の矢印Ｘ３，Ｘ４方向の往復動可能として嵌合している。ステージ５１の窪み部５４は、ターゲットチップ１１Ａに対応する位置を中心として、隣接チップ１１Ｂに対応する領域に設けられ、ターゲットチップ１１Ａと比較して所定の深さ位置からターゲットチップ１１Ａから離れるいずれの方向に沿っても上傾となるよう配置されたものである。 Next, FIGS. 4 and 5 show a pickup device using a stage 51 of a recess 54 having a mortar shape (flat cone shape or flat cone shape). Also in this case, the slide body 52 as the receiver R is provided in the recessed portion 54, and the fitting concave groove 53 is fitted so as to be reciprocating in the directions of arrows X3 and X4 in FIG. The recessed portion 54 of the stage 51 is provided in a region corresponding to the adjacent chip 11B with the position corresponding to the target chip 11A as the center, and any of the recessed portions 54 away from the target chip 11A from a predetermined depth position as compared with the target chip 11A. It is arranged so that it tilts upward even along the direction.
　また、図４に示すように、スライド体５２の初期状態で、平面視において、スライド体５２の先端部を囲む凹部５５が設けられている。この凹部５５は、ｂの隣接チップ側の第１凹部５５ａと、ｆの隣接チップ側の第２凹部５５ｂと、ｄの隣接チップ側の第３凹部５５ｃとを有する。この場合、第１凹部５５ａは、ａのターゲットチップ１１の一部とロの隣接チップ１１の一部に亘る範囲の大きさで、第２凹部５５ｂは、ａのターゲットチップ１１の一部とｆの隣接チップ１１の一部に亘る範囲の大きさで、第３凹部５５ｃは、ａのターゲットチップ１１の一部とｄの隣接チップ１１の一部に亘る範囲の大きさである。 Further, as shown in FIG. 4, in the initial state of the slide body 52, a recess 55 surrounding the tip end portion of the slide body 52 is provided in a plan view. The recess 55 has a first recess 55a on the adjacent chip side of b, a second recess 55b on the adjacent chip side of f, and a third recess 55c on the adjacent chip side of d. In this case, the first recess 55a has a size in a range extending over a part of the target chip 11 of a and a part of the adjacent chip 11 of b, and the second recess 55b is a part of the target chip 11 of a and f. The third recess 55c is the size of the range covering a part of the adjacent chip 11 of a and the size of the range covering a part of the target chip 11 of a and the part of the adjacent chip 11 of d.
　この場合、窪み部５の深さをＦとし、スライド体５２から凹部５５ｂの隣接チップ側の端部までの寸法をＨとすると、Ｆ＜Ｈとする。この場合も、Ｈ－Ｆとしては、０．１５ｍｍ～０．６０ｍｍ程度とする。 In this case, if the depth of the recess 5 is F and the dimension from the slide body 52 to the end of the recess 55b on the adjacent tip side is H, then F <H. Also in this case, the HF is set to about 0.15 mm to 0.60 mm.
　また、このピックアップ装置においても、負圧をかけることによりターゲットチップ１１Ａと粘着シート体２１との間に剥離力を発生させる負圧室（図示省略）を備えている。そして、凹部５５に負圧室が連通されている。そして、この負圧室が凹部５５に連通されている。このため、凹部５５が、粘着シート体２１から隣接チップ１１Ｂに加わる力の緩和乃至打消しを可能とする負圧を作用する変形防止手段Ｍを構成する。なお、スライド体５２を水平方向に往復動させる機構や、この機構の動作を制御する制御手段等の図示を省略している。スライド体５８を水平方向に往復動させる機構としては、公知公用の機構で構成でき、制御手段としても前記したようなマイクロコンピュータで構成できる。 Further, this pickup device also has a negative pressure chamber (not shown) that generates a peeling force between the target chip 11A and the adhesive sheet body 21 by applying a negative pressure. A negative pressure chamber is communicated with the recess 55. The negative pressure chamber is communicated with the recess 55. Therefore, the recess 55 constitutes the deformation preventing means M that acts on the negative pressure that enables the force applied from the adhesive sheet body 21 to the adjacent chip 11B to be relaxed or canceled. The mechanism for reciprocating the slide body 52 in the horizontal direction and the control means for controlling the operation of this mechanism are not shown. The mechanism for reciprocating the slide body 58 in the horizontal direction can be configured by a known and publicly available mechanism, and the control means can also be configured by a microcomputer as described above.
　次に、図４と図５に示すピックアップ装置で、ターゲットチップ１１Ａを粘着シート１２から剥離する方法を説明する。まず、受け体Ｒとしてのスライド体５２にて、ターゲットチップ１１Ａを粘着シート１２を介して受けている状態とする。この場合、イのターゲットチップ１１Ａのニの隣接チップ１１Ｂ側の端部（突出部）が、スライド体５２よりも隣接チップ１１Ｂ側に突出した状態とする。このため、このターゲットチップ１１Ａの突出部が凹部５５の第３凹部５５ｃに対応した状態となっている。また、ターゲットチップ１１Ａの上方には吸着コレット２１が配置され、この吸着コレット２１にて、ターゲットチップ１１Ａが吸着された状態となって、このターゲットチップ１１Ａがその位置に維持される。 Next, a method of peeling the target chip 11A from the adhesive sheet 12 with the pickup devices shown in FIGS. 4 and 5 will be described. First, the slide body 52 as the receiving body R is in a state of receiving the target chip 11A via the adhesive sheet 12. In this case, the end portion (protruding portion) of the target tip 11A on the adjacent tip 11B side of the target tip 11A is in a state of protruding toward the adjacent tip 11B side from the slide body 52. Therefore, the protruding portion of the target chip 11A corresponds to the third recess 55c of the recess 55. Further, a suction collet 21 is arranged above the target chip 11A, and the target chip 11A is in a state of being sucked by the suction collet 21, and the target chip 11A is maintained at that position.
　そして、凹部５５が負圧状態とされる。これによって、ターゲットチップ１１Ａの突出部の粘着シート２１が下方へ吸引され、ターゲットチップ１１Ａから剥離する。また、この状態では、スライド体５２の端部から、凹部５５ｃの反ターゲットチップ側の端部までの範囲において、粘着シート２１が凹部５５ｃ側に吸引される。すなわち、変形防止手段Ｍにて、粘着シート体から隣接チップに加わる力の緩和乃至打消しを可能とする負圧を作用することができる。 Then, the recess 55 is in a negative pressure state. As a result, the adhesive sheet 21 at the protruding portion of the target chip 11A is sucked downward and peeled off from the target chip 11A. Further, in this state, the adhesive sheet 21 is sucked toward the recess 55c in the range from the end of the slide body 52 to the end of the recess 55c on the anti-target chip side. That is, the deformation preventing means M can exert a negative pressure that can alleviate or cancel the force applied from the adhesive sheet body to the adjacent chip.
　そして、この図５に示す状態から、スライド体５２を矢印Ｘ３方法にスライドさせていく。これによって、ターゲットチップ１１Ａに粘着されている粘着シート２１の下方に負圧状態となる隙間が形成され、この隙間がスライド体５２のスライドに伴って、順次拡大していき、最終的に、このターゲットチップ１１Ａから粘着シート２１を剥離することができる。その後は吸着コレット２１を上昇させて、ボンディングポジションへターゲットチップ１１Ａを搬送することになる。 Then, from the state shown in FIG. 5, the slide body 52 is slid in the arrow X3 method. As a result, a gap in a negative pressure state is formed below the pressure-sensitive adhesive sheet 21 adhered to the target chip 11A, and this gap gradually expands as the slide body 52 slides, and finally, this gap is expanded. The adhesive sheet 21 can be peeled off from the target chip 11A. After that, the suction collet 21 is raised to convey the target chip 11A to the bonding position.
　次に、図６は、上下動が可能なスライド体５８を用いたピックアップ装置を示している。この場合、ステージ５６の嵌合凹溝５７に受け体Ｒとしてのスライド体５８を、上下動可能として嵌合させている。なお、スライド体５８を嵌合凹溝５７に沿って矢印の方向に水平方向に往復動させる機構及びスライド体５８を上下動させる機構や、これらの機構の動作を制御する制御手段等の図示を省略している。水平方向に往復動させる機構やスライド体５８を上下動させる機構としては、公知公用の機構で構成でき、制御手段としても前記したようなマイクロコンピュータで構成できる。そして、この嵌合凹溝５７に連通される凹部６０を設けている。 Next, FIG. 6 shows a pickup device using a slide body 58 that can move up and down. In this case, the slide body 58 as the receiver R is fitted in the fitting concave groove 57 of the stage 56 so as to be movable up and down. The mechanism for reciprocating the slide body 58 in the horizontal direction in the direction of the arrow along the fitting concave groove 57, the mechanism for moving the slide body 58 up and down, the control means for controlling the operation of these mechanisms, and the like are shown. It is omitted. The mechanism for reciprocating in the horizontal direction and the mechanism for moving the slide body 58 up and down can be configured by a known public mechanism, and the control means can also be configured by the above-mentioned microcomputer. A recess 60 communicating with the fitting recess 57 is provided.
　そして、この嵌合凹溝５７に連通される凹部６０を設けている。この場合も、負圧をかけることにより前記ターゲットチップ１１Ａと粘着シート体１２との間に剥離力を発生させる負圧室（図示省略）を備えている。そして、この負圧室が凹部６０に連通されている。 Then, a recess 60 is provided which communicates with the fitting recess 57. Also in this case, a negative pressure chamber (not shown) is provided between the target chip 11A and the pressure-sensitive adhesive sheet body 12 by applying a negative pressure. The negative pressure chamber is communicated with the recess 60.
　図６に示すピックアップ装置で、ターゲットチップ１１Ａを粘着シート体１２から剥離していく方法を説明する。ターゲットチップ１１Ａのピックアップは、図６Ａに示す状態（つまり、ステージ５６の上面５６ａとスライド体５８の上面５８ａとが同一面（水平面）上に配置される状態）から、スライド体５８を図６Ｂの矢印のように、所定寸だけ上昇させる。これによって、ステージ５６の上面５６ａとスライド体５８の上面５８ａとに所定寸の段差を生じさせる。 A method of peeling the target chip 11A from the adhesive sheet body 12 with the pickup device shown in FIG. 6 will be described. The pickup of the target chip 11A has the slide body 58 as shown in FIG. 6B from the state shown in FIG. 6A (that is, the upper surface 56a of the stage 56 and the upper surface 58a of the slide body 58 are arranged on the same surface (horizontal plane)). As shown by the arrow, raise it by a predetermined size. As a result, a step of a predetermined size is generated between the upper surface 56a of the stage 56 and the upper surface 58a of the slide body 58.
　この状態では、負圧室を負圧状態として凹部６０内を負圧状態としている。このため、ターゲットチップ１１はスライド体５８の凹部６０側から突出した状態となっているので、スライド体５８と、凹部６０の反スライド体側の端縁部までの間で、下方へ引っ張られる。また、この状態では、図示省略しているが、吸着コレット２１を、上方からターゲットチップ１１の上面に接触させて、ターゲットチップ１１を吸着コレット２１にて吸引している状態としている。これによって、図６Ｂに示すように、ターゲットチップ１１がその位置で水平状を維持しつつ、スライド体５８から突出しているターゲットチップ１１の端部に粘着されていた粘着シート体１２が剥がれる。また、隣接チップ１１の凹部６０へ突出している端部の粘着シート体１２が剥がれる。 In this state, the negative pressure chamber is in a negative pressure state and the inside of the recess 60 is in a negative pressure state. Therefore, since the target chip 11 is in a state of protruding from the recess 60 side of the slide body 58, it is pulled downward between the slide body 58 and the end edge portion of the recess 60 on the anti-slide body side. Further, in this state, although not shown, the suction collet 21 is brought into contact with the upper surface of the target chip 11 from above, and the target chip 11 is sucked by the suction collet 21. As a result, as shown in FIG. 6B, the adhesive sheet body 12 adhered to the end portion of the target chip 11 protruding from the slide body 58 is peeled off while the target chip 11 remains horizontal at that position. Further, the adhesive sheet body 12 at the end protruding into the recess 60 of the adjacent chip 11 is peeled off.
　この状態から、図６Ｃの矢印方向にスライド体５８をスライドさせていく。これにより、順次粘着シート体１２がターゲットチップ１１から剥がれていく。そして、スライド体５８の隣接チップ側の端縁が、ターゲットチップ１１の反隣接チップ側の端縁に達した際に、ターゲットチップ１１からの粘着シート体１２の剥離が完了する。 From this state, slide the slide body 58 in the direction of the arrow in FIG. 6C. As a result, the adhesive sheet body 12 is sequentially peeled off from the target chip 11. Then, when the edge of the slide body 58 on the adjacent chip side reaches the edge of the target chip 11 on the anti-adjacent chip side, the peeling of the adhesive sheet body 12 from the target chip 11 is completed.
　この場合も、凹部６０が、粘着シート体１２から隣接チップ１１Ｂに加わる力を緩和乃至打消しを可能とする負圧を作用する変形防止手段Ｍを構成する。 Also in this case, the recess 60 constitutes the deformation preventing means M that acts on a negative pressure that can alleviate or cancel the force applied from the adhesive sheet body 12 to the adjacent tip 11B.
　次に、図７は、受け体が上下動するブロック体６２を用いたピックアップ装置を示している。ブロック体６２は、矩形筒状体の第１ブロック６３と、この第１ブロック６３に遊嵌状に内嵌される矩形筒状体の第２ブロック６４と、この第２ブロック６４に内嵌される板形状の第３ブロック６５とからなる。 Next, FIG. 7 shows a pickup device using the block body 62 in which the receiver moves up and down. The block body 62 is fitted in the first block 63 of the rectangular tubular body, the second block 64 of the rectangular tubular body that is loosely fitted in the first block 63, and the second block 64. It is composed of a plate-shaped third block 65.
　また、ブロック体６２は、ステージ６６の嵌合凹所６７に遊嵌状に嵌合され、第１ブロック６３の外面と嵌合凹所６７の内面との間に隙間６８が設けられ、第２ブロック６４の外面と第１ブロック６３との間に隙間６９が設けられ、第３ブロック６５の外面と第２ブロック６４の内面との間に隙間７０が設けられている。 Further, the block body 62 is loosely fitted to the fitting recess 67 of the stage 66, and a gap 68 is provided between the outer surface of the first block 63 and the inner surface of the fitting recess 67, and the second block body 62 is provided. A gap 69 is provided between the outer surface of the block 64 and the first block 63, and a gap 70 is provided between the outer surface of the third block 65 and the inner surface of the second block 64.
　この場合、ブロック体６２の各第１・第２・第３ブロック６３，６４，６５はそれぞれ、独立して上下動が可能となっている。すなわち、各ブロック６３，６４、６５は、公知公用の上下動機構で上下動可能となっている。また、各ブロック６３，６４、６５の上下動機構は、マイクロコンピュータ等から構成される図示省略の制御手段で制御される。 In this case, each of the first, second, and third blocks 63, 64, and 65 of the block body 62 can move up and down independently. That is, each of the blocks 63, 64, and 65 can be moved up and down by a publicly known and publicly used vertical movement mechanism. Further, the vertical movement mechanism of each block 63, 64, 65 is controlled by a control means (not shown) composed of a microcomputer or the like.
　この場合、ステージ６６の嵌合凹所６７の上方開口部には、凹部７１が形成されている。また、負圧をかけることによりターゲットチップ２１Ａと粘着シート体２１との間に剥離力を発生させる負圧室（図示省略）を備えている。そして、各隙間６８，６９，７０及び凹部７１に負圧室が連通されている。 In this case, a recess 71 is formed in the upper opening of the fitting recess 67 of the stage 66. Further, it is provided with a negative pressure chamber (not shown) that generates a peeling force between the target chip 21A and the adhesive sheet body 21 by applying a negative pressure. A negative pressure chamber is communicated with each of the gaps 68, 69, 70 and the recess 71.
　次にこのピックアップ装置を用いてターゲットチップ１１の剥離方法を説明する。まず、図７に示すように、ステージ６６の上面６６ａから、ブロック体６２全体を所定寸だけ上昇させた状態とする。この場合、各隙間６８，６９，７０及び凹部７１を負圧状態とする。この場合も、吸着コレット２１にてターゲットチップ１１Ａを吸着保持している。 Next, a method of peeling the target chip 11 using this pickup device will be described. First, as shown in FIG. 7, the entire block body 62 is raised by a predetermined size from the upper surface 66a of the stage 66. In this case, the gaps 68, 69, 70 and the recess 71 are in a negative pressure state. Also in this case, the target chip 11A is adsorbed and held by the adsorption collet 21.
　このため、ターゲットチップ１１Ａと隣接チップ１１との間の粘着シート体１２が凹部７１内に引き込まれる吸引力が付与されることになる。すなわち、隣接チップ１１Ｂに対して、粘着テープ１２からの上昇させる力を受けることがない。 Therefore, a suction force is applied to the adhesive sheet body 12 between the target chip 11A and the adjacent chip 11 to be drawn into the recess 71. That is, the adjacent chip 11B is not subjected to the rising force from the adhesive tape 12.
　次に、第１ブロック６３をそのままで、第２ブロック６４及び第３ブロック６５をさらに所定寸（ここでの所定寸とは、ステージ６６の上面６６ａからブロック体６２全体を小上昇させた所定寸と同一でも相違するものであってもよい。）だけ上昇させる。この際、コレット２１のこの所定寸だけ上昇させ、ターゲットチップ１１Ａの第２ブロック６４より外側の粘着シート体１２を剥がす。 Next, with the first block 63 as it is, the second block 64 and the third block 65 are further set to a predetermined size (the predetermined size here is a predetermined size obtained by slightly raising the entire block body 62 from the upper surface 66a of the stage 66). It may be the same as or different from.). At this time, the collet 21 is raised by this predetermined size, and the adhesive sheet body 12 outside the second block 64 of the target chip 11A is peeled off.
　その後、第３ブロック６５のみをさらに所定寸（ここでの所定寸とは、ステージ６６の上面６６ａからブロック体６２全体を小上昇させた所定寸と同一でも相違するものであってもよい。）だけ上昇させる。この際、吸着コレット２１のこの所定寸だけ上昇させ、ターゲットチップ１１Ａの第３ブロック６５より外側の粘着シート体１２を剥がす。 After that, only the third block 65 is further set to a predetermined size (the predetermined size here may be the same as or different from the predetermined size obtained by slightly raising the entire block body 62 from the upper surface 66a of the stage 66). Only raise. At this time, the suction collet 21 is raised by this predetermined size, and the adhesive sheet body 12 outside the third block 65 of the target chip 11A is peeled off.
　これによって、粘着シート体１２は、第３ブロック６５の上面の範囲でターゲットチップ１１Ａに粘着されている状態となり、この状態から、コレット２１を上昇させることによって、ターゲットチップ１１Ａをこの粘着シート体１２から完全に剥離することができる。 As a result, the adhesive sheet body 12 is in a state of being adhered to the target chip 11A within the range of the upper surface of the third block 65, and by raising the collet 21 from this state, the target chip 11A is attached to the adhesive sheet body 12 Can be completely peeled off from.
　このように、ピックアップ装置として、テーパ面２６、２７を備えたステージ１６、すり鉢形状の窪み部５４を有するステージ５１を備えたもの、受け台Ｒとして、水平方向にスライドするもの、垂直方向に往復動するもの等の種々のタイプの装置を構成できる。これらのタイプは、ニードルによるチップの突き上げを回避でき、ターゲットチップ１１Ａを損傷や変形等させることなく、安定して剥離していくことができる。 As described above, the pickup device includes a stage 16 having tapered surfaces 26 and 27, a stage 51 having a mortar-shaped recess 54, and a cradle R that slides in the horizontal direction and reciprocates in the vertical direction. Various types of devices such as moving ones can be configured. In these types, the tip can be prevented from being pushed up by the needle, and the target tip 11A can be stably peeled off without being damaged or deformed.
　本発明は前記実施形態に限定されることなく種々の変形が可能であって、例えば、図１のピックアップ装置において、ステージ１６として、矩形形状のブロック体であったが、他の形状、例えば、円盤形状体であってもよい。第２負圧部３６では、チップ１１が倣うテーパ面２７を必要とするが、第１負圧部３５では、必ずしもテーパ面を必要としない。また、負圧部３５，３６のエアを吸引するための吸引孔１４としても、いずれのテーパ面２６，２７に開口してもよく、また、この負圧部３５，３６に開口する吸引孔１４の数や口径等は任意である。 The present invention is not limited to the above embodiment, and various modifications can be made. For example, in the pickup device of FIG. 1, the stage 16 is a rectangular block body, but other shapes, for example, It may be a disk-shaped body. The second negative pressure portion 36 requires a tapered surface 27 that the tip 11 follows, but the first negative pressure portion 35 does not necessarily require a tapered surface. Further, the suction holes 14 for sucking the air of the negative pressure portions 35 and 36 may be opened in any of the tapered surfaces 26 and 27, and the suction holes 14 opened in the negative pressure portions 35 and 36. The number and diameter of the above are arbitrary.
　テーパ面２７に倣うチップ１１として、スライド体１７のスライド方向に沿って複数枚有する場合、２枚に限るものではない。すなわち、粘着シート体１２の折れ曲がり部Ｈが、隣り合うチップ間の隙間にあればよい。 When a plurality of chips 11 following the tapered surface 27 are provided along the slide direction of the slide body 17, the number of chips 11 is not limited to two. That is, the bent portion H of the adhesive sheet body 12 may be in the gap between the adjacent chips.
　また、ステージ１６上に扁平Ｖ字溝２５を設ける場合、その深さ（ステージ上面３４から底ライン部２５ａまでの深さ）としては、例えば、０．１～３ｍｍ程度である。この場合、剥離しようとするチップ１１の大きさや厚さ、さらには、粘着シート体１２の厚さ等によって相違する。図例のような扁平Ｖ字溝２５を設ける場合、スライド体側テーパ面２６と反スライド体側テーパ面２７との傾斜角度としては、同じ角度であっても、相違する角度であってもよい。剥離すべきチップ１１のスライド体１７のスライド方向と直交する方向における周辺に、スライド側体テーパ面２６からスライド体１７に向かって上傾となる傾斜部（図示省略）を設けたものであってもよい。 When the flat V-shaped groove 25 is provided on the stage 16, the depth (depth from the stage upper surface 34 to the bottom line portion 25a) is, for example, about 0.1 to 3 mm. In this case, it depends on the size and thickness of the chip 11 to be peeled off, the thickness of the adhesive sheet body 12, and the like. When the flat V-shaped groove 25 as shown in the figure is provided, the inclination angle between the tapered surface 26 on the slide body side and the tapered surface 27 on the anti-slide body side may be the same angle or different angles. An inclined portion (not shown) that inclines upward from the tapered surface 26 of the slide side body toward the slide body 17 is provided around the periphery of the slide body 17 of the chip 11 to be peeled off in a direction orthogonal to the slide direction. May be good.
　なお、スライド体１７、５２，５８をスライドさせる場合、負圧室３７のエアを吸引しつつスライドさせても、負圧室３７が予定の負圧状態となった状態で、スライドを開始しても、スライドが完了した後、負圧室３７のエアの吸引を開始してもよい。 When sliding the slide bodies 17, 52, 58, even if the slide body 37 is slid while sucking the air in the negative pressure chamber 37, the slide is started with the negative pressure chamber 37 in the planned negative pressure state. Also, after the slide is completed, the suction of air in the negative pressure chamber 37 may be started.
　変形防止手段Ｍとして各実施形態では、隣接チップ１１Ｂに粘着している粘着シート１２の一部を剥離するものであったが、剥離させないものであってもよい。すなわち、ターゲットチップ１１Ａのピックアップ動作中に、粘着シート１２から隣接チップ１１Ｂを作用する力が軽減乃至打消されず、この隣接チップ１１Ａが変形しなければよい。 As the deformation preventing means M, in each embodiment, a part of the adhesive sheet 12 adhering to the adjacent chip 11B is peeled off, but it may not be peeled off. That is, during the pickup operation of the target chip 11A, the force acting on the adjacent chip 11B from the adhesive sheet 12 is not reduced or canceled, and the adjacent chip 11A may not be deformed.
　矩形のチップ（半導体チップ）を、粘着シートから剥離して分離するピックアップ装置およびピックアップ方法に用いる。ピックアップしようとするターゲットチップのピックアップ動作時に、隣接チップの変形を防止でき、このため、隣接チップに曲げ応力が発生せず、割れや内部欠陥が生じず、高品質のチップを提供できる。 Used for pickup devices and pickup methods that separate rectangular chips (semiconductor chips) from the adhesive sheet. When the target chip to be picked up is picked up, deformation of the adjacent chip can be prevented, so that bending stress does not occur in the adjacent chip, cracks and internal defects do not occur, and a high quality chip can be provided.
１１   チップ
１２   粘着シート体
１６、５１、５６     ステージ
１７、５２，５８     スライド体
２３   支持面
２７   傾斜平面（反スライド体側テーパ面）
３７   負圧室
５４   窪み部
５６   ステージ
６２   ブロック体
Ｍ     変形防止手段
Ｐ     ピックアップポジション
Ｑ     ボンディングポジション
Ｒ     受け体 11 Chip 12 Adhesive sheet body 16, 51, 56 Stage 17, 52, 58 Slide body 23 Support surface 27 Inclined plane (tapered surface on the non-slide body side)
37 Negative pressure chamber 54 Depression 56 Stage 62 Block body M Deformation prevention means P Pickup position Q Bonding position R Receiver

Claims (10)

  1. 　複数の矩形のチップが貼り付けられた粘着シート体から前記チップを剥離して分離するものであり、前記複数のチップのうち分離対象とするターゲットチップを順次剥離するピックアップ装置であって、
    　前記粘着シート体を介して前記ターゲットチップに隣接する隣接チップを支持する支持面を備え、隣接チップの辺のうち前記ターゲットチップに対向する対向辺に沿って凹部を前記支持面に形成し、前記ターゲットチップを剥離する時には、前記凹部が、前記粘着シート体から前記隣接チップに加わる力を緩和乃至打消しを可能とする負圧を作用する変形防止手段を構成することを特徴とするピックアップ装置。     It is a pickup device that peels off the chips from an adhesive sheet body to which a plurality of rectangular chips are attached and separates them, and sequentially peels off the target chips to be separated from the plurality of chips.
    A support surface for supporting an adjacent chip adjacent to the target chip is provided via the adhesive sheet body, and a recess is formed in the support surface along the opposite side of the adjacent chips facing the target chip. A pickup device characterized in that when the target chip is peeled off, the concave portion constitutes a deformation preventing means that exerts a negative pressure that can alleviate or cancel the force applied to the adjacent chip from the adhesive sheet body.
  2. 　負圧をかけることにより前記ターゲットチップと前記粘着シート体との間に剥離力を発生させる負圧室を備えることを特徴とする請求項１に記載のピックアップ装置。 The pickup device according to claim 1, further comprising a negative pressure chamber that generates a peeling force between the target chip and the adhesive sheet body by applying a negative pressure.
  3. 　前記支持面の凹部が前記負圧室に連通されていることを特徴とする請求項２に記載のピックアップ装置。 The pickup device according to claim 2, wherein the concave portion of the support surface is communicated with the negative pressure chamber.
  4. 　粘着シート体を介して前記ターゲットチップを支持する受け体を備え、前記受け体を移動させることにより、前記負圧室内の負圧によって前記粘着シート体と前記ターゲットチップ間の剥離を行うことを特徴とする請求項２又は請求項３に記載のピックアップ装置。 It is characterized in that a receiver that supports the target chip is provided via the adhesive sheet body, and by moving the receiver, the adhesive sheet body and the target chip are peeled off by the negative pressure in the negative pressure chamber. The pickup device according to claim 2 or 3.
  5. 　前記受け体は、前記粘着シート体が載置されるステージ上に配設され、前記粘着シート体に対して平行方向に移動可能となされたスライド体であって、前記受け体の移動によって、前記ターゲットチップと粘着シート体とを剥離することを特徴とする請求項４に記載のピックアップ装置。 The receiver is a slide body arranged on a stage on which the adhesive sheet body is placed and movable in a direction parallel to the adhesive sheet body, and the movement of the receiver causes the receiver to move. The pickup device according to claim 4, wherein the target chip and the adhesive sheet body are peeled off from each other.
  6. 　前記受け体は、複数のチップが貼り付けられた前記粘着シート体が載置されるステージに配設され、前記粘着シート体に対して垂直方向に移動可能となされたブロック体であって、前記受け体の移動によって、前記ターゲットチップと粘着シート体とが剥離されることを特徴とする請求項４に記載のピックアップ装置。 The receiver is a block body that is arranged on a stage on which the pressure-sensitive adhesive sheet body to which a plurality of chips are attached and is movable in a direction perpendicular to the pressure-sensitive adhesive sheet body. The pickup device according to claim 4, wherein the target chip and the adhesive sheet body are peeled off by the movement of the receiver.
  7. 　前記ターゲットチップの剥離動作開始時に、前記受け体の上面より前記支持面の受け体対向面が低位置にあり、この高低差よりも前記受け体から凹部の反ターゲットチップ側の端縁部までの寸法を大きくしたことを特徴とする請求項４～請求項６のいずれか１項に記載のピックアップ装置。 At the start of the peeling operation of the target chip, the receiver facing surface of the support surface is located at a lower position than the upper surface of the receiver, and the height difference is from the receiver to the edge of the recess on the anti-target chip side. The pickup device according to any one of claims 4 to 6, wherein the size is increased.
  8. 　前記ステージ上の前記隣接チップに対応する領域に設けられ、前記ターゲットチップよりも深い所定の深さ位置から前記ターゲットチップから離れる方向に沿って上傾となる傾斜平面を備え、前記粘着シート体を介して隣接チップを前記傾斜平面に倣わせることを特徴とする請求項７に記載のピックアップ装置。 The pressure-sensitive adhesive sheet body is provided in a region corresponding to the adjacent chip on the stage, and has an inclined plane that is inclined upward along a direction away from the target chip from a predetermined depth position deeper than the target chip. The pickup device according to claim 7, wherein the adjacent chips are made to imitate the inclined plane.
  9. 　前記ステージは、前記ターゲットチップに対応する位置を中心として、前記隣接チップに対応する領域に設けられ、前記ターゲットチップと比較して所定の深さ位置から前記ターゲットチップから離れるいずれの方向に沿っても上傾となるよう配置された逆円錐台乃至逆円錐体形状の窪み部を備え、前記粘着シート体を介して隣接チップを前記窪み部の逆円錐台面に倣わせることを特徴とする請求項７に記載のピックアップ装置。 The stage is provided in a region corresponding to the adjacent chip centered on a position corresponding to the target chip, and is provided along any direction away from the target chip from a predetermined depth position as compared with the target chip. The claim is characterized in that it is provided with an inverted truncated cone or an inverted truncated cone-shaped recess arranged so as to be tilted upward, and an adjacent chip is made to imitate the inverted truncated cone surface of the recessed portion via the adhesive sheet body. Item 7. The pickup device according to item 7.
  10. 　複数の矩形のチップが貼り付けられた粘着シート体から前記チップを剥離して分離するものであり、前記複数のチップのうち分離対象とするターゲットチップを順次剥離するピックアップ方法であって、
    　前記複数のチップのうち分離対象とするターゲットチップを剥離する時に、前記ターゲットチップに隣接する隣接チップに対して前記粘着シート体から加わる力を緩和乃至打消すようにターゲットチップを剥離していくことを特徴とするピックアップ方法。     The chip is peeled off and separated from the adhesive sheet body to which a plurality of rectangular chips are attached, and is a pickup method in which the target chip to be separated is sequentially peeled off from the plurality of chips.
    When peeling off the target chip to be separated from the plurality of chips, the target chip is peeled off so as to alleviate or cancel the force applied from the adhesive sheet body to the adjacent chip adjacent to the target chip. A pickup method featuring.
PCT/JP2020/041013 2020-05-26 2020-11-02 Pickup device and pickup method WO2021240840A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007073778A (en) * 2005-09-07 2007-03-22 Sharp Takaya Denshi Kogyo Kk Method and device for picking up semiconductor chip
WO2008004270A1 (en) * 2006-07-03 2008-01-10 Canon Machinery Inc. Method of pickup and pickup apparatus
JP2009289785A (en) * 2008-05-27 2009-12-10 Renesas Technology Corp Manufacturing method of semiconductor integrated circuit device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014011416A (en) * 2012-07-03 2014-01-20 Panasonic Corp Pickup device and method for semiconductor chip
JP5479546B2 (en) * 2012-08-24 2014-04-23 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
JP2014165301A (en) * 2013-02-25 2014-09-08 Toray Eng Co Ltd Pick-up device for semiconductor chip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007073778A (en) * 2005-09-07 2007-03-22 Sharp Takaya Denshi Kogyo Kk Method and device for picking up semiconductor chip
WO2008004270A1 (en) * 2006-07-03 2008-01-10 Canon Machinery Inc. Method of pickup and pickup apparatus
JP2009289785A (en) * 2008-05-27 2009-12-10 Renesas Technology Corp Manufacturing method of semiconductor integrated circuit device

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