KR102490394B1 - Die bonding apparatus, manufacturing method of semiconductor apparatus and peeling apparatus - Google Patents

Abstract

It is providing the technique of improving the peeling speed.
An adsorbing unit used together with a collet adsorbing the upper surface of the die to adsorb the lower surface of the dicing tape under the die, and a needle protruding from the upper surface of the adsorbing unit, wherein the adsorbing unit is configured to adsorb the dicing tape. A concave portion is provided, the needle has a hole for supplying gas from the tip of the needle between the lower surface of the die and the upper surface of the dicing tape, and the concave portion has an opening for sucking gas to adsorb the lower surface of the dicing tape. technology is provided.

Description

Die bonding apparatus, semiconductor device manufacturing method, and peeling apparatus

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonder having a peeling unit for supplying a gas between a die and a dicing tape.

In a die bonder for mounting a semiconductor chip, generally referred to as a die, on the surface of, for example, a wiring board or a lead frame (hereinafter collectively referred to as a substrate), a suction nozzle such as a collet is generally used to secure the die. The operation (work) of performing bonding by heating the bonding material while conveying it onto the substrate and applying a pressing force is repeatedly performed.

Among the die bonding processes by a die bonding apparatus such as a die bonder, there is a separation process of separating a die divided from a semiconductor wafer (hereinafter referred to as a wafer). In the peeling step, the dies are pushed up from the back of the dicing tape by a pushing unit, peeled one by one from the dicing tape held in the die supply unit, and transported onto the substrate using a suction nozzle such as a collet.

For example, according to Japanese Unexamined Patent Publication No. 2005-117019 (Patent Document 1), when peeling a die to be peeled from among a plurality of dies attached to a dicing tape from the dicing tape by pushing it up, a suction member (pushing unit) ) is peeling from the dicing tape with low stress from the periphery of the die by pushing up a plurality of stages of blocks in a pyramid shape.

Japanese Unexamined Patent Publication No. 2005-117019 Japanese Unexamined Patent Publication No. 2008-53260

In Patent Literature 1, when the adsorption collet is rapidly pulled up while a part of the chip (die) is in close contact with the dicing tape, a gap is created between the bottom surface of the adsorption collet and the upper surface of the chip (die), and the vacuum level inside the adsorption collet decreases. , the force to attract the chip (die) is reduced. Therefore, when removing the die from the dicing tape, it is necessary to slowly remove it over time.

The subject of this indication is providing the technique of improving a peeling rate.

A brief outline of representative ones of the present disclosure is as follows.

That is, according to the present disclosure, an adsorption unit used together with a collet adsorbing the upper surface of a die to adsorb the lower surface of the dicing tape under the die, and a needle having a tip protruding from the upper surface of the adsorption unit, The adsorbing portion has a concave portion for adsorbing the dicing tape, the needle has a hole for supplying gas from the tip of the needle between the lower surface of the die and the upper surface of the dicing tape, the concave portion, A technique having an opening for sucking gas in order to adsorb the lower surface of the dicing tape is provided.

According to the present disclosure, it is possible to improve the rate of peeling.

1 is a top view showing an outline of a die bonder in an embodiment.
Fig. 2 is a view explaining the operation of the pickup head and the bonding head when viewed from the direction of arrow A in Fig. 1;
FIG. 3 is a diagram illustrating an external perspective view of the die supply unit of FIG. 1 .
Fig. 4 is a schematic sectional view showing a main part of the die supply section in Fig. 1;
5 is a top view of the peeling unit of FIG. 1;
Fig. 6 is a diagram showing the configuration of a collet portion of a peeling unit and a pick-up head in the embodiment.
FIG. 7 is a diagram for explaining a pick-up operation of the die bonder of FIG. 1 .
FIG. 8 is a flowchart for explaining a pick-up operation of the die bonder of FIG. 1 .
FIG. 9 is a flowchart illustrating a method of manufacturing a semiconductor device using the die bonder of FIG. 1 .
10 is a top view for explaining a peeling unit in a first modified example.
11 is a diagram for explaining a peeling unit in a second modified example.
12 is a cross-sectional view for explaining a peeling unit in a third modified example.
13 is a top view for explaining the peeling unit in the fourth.
14 is a top view for explaining a peeling unit in a fifth modified example.
15 is a top view for explaining a peeling unit in a sixth modified example.
Fig. 16 is a cross-sectional view along line AA of Fig. 15;
17 is a diagram for explaining a peeling unit in a seventh modified example.
Fig. 18 is a sectional view taken along line BB in Fig. 17;
Fig. 19 is a diagram explaining the relationship between the needle of the peeling unit of Fig. 17 and the dicing tape.

Hereinafter, examples and modified examples will be described using drawings. However, in the following description, the same reference numerals are given to the same components, and repeated explanations may be omitted. In addition, although the drawing may show schematically about the width, thickness, shape, etc. of each part compared with an actual aspect for clearer explanation, it is only an example and does not limit the interpretation of this invention.

[Example]

1 is a top view showing an outline of a die bonder in an embodiment. Fig. 2 is a view explaining the operation of the pick-up head and the bonding head when viewed from the direction of arrow A in Fig. 1 .

The die bonder 10 is largely divided into a die supply unit 1 that supplies a die D to be mounted on a substrate S, a pick-up unit 2, an intermediate stage unit 3, a bonding unit 4, and a transfer unit. It has a unit 5, a substrate supply unit 6, a substrate carrying unit 7, and a control unit 8 that monitors and controls the operation of each unit. The Y-axis direction is the front-back direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is disposed on the front side of the die bonder 10, and the bonding unit 4 is disposed on the inside side. Here, on the substrate S, one or a plurality of product areas (hereinafter, referred to as package areas P), which constitute one final package, are printed.

First, the die supply unit 1 supplies the die D to be mounted in the package area P of the substrate S. The die supply unit 1 has a wafer holder 12 holding the wafer 11 and a peeling unit 13 indicated by a dotted line that peels the die D from the wafer 11 . The die supply unit 1 is moved in the XY-axis direction by a drive unit (not shown) to move the die D to be picked up to the position of the peeling unit 13 .

The pick-up unit 2 includes a pick-up head 21 that picks up the die D, a Y drive part 23 of the pick-up head that moves the pick-up head 21 in the Y-axis direction, and a collet 22 that lifts, rotates, and It has each driving part (not shown) which moves in the X-axis direction. The pick-up head 21 has a collet 22 (see also FIG. 2 ) for adsorbing and holding the peeled die D at its tip, picks up the die D from the die supply unit 1, and loads it on the intermediate stage 31. . The pick-up head 21 has respective drive units (not shown) that lift, rotate, and move the collet 22 in the X-axis direction.

The intermediate stage unit 3 has an intermediate stage 31 for temporarily loading the die D, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31 .

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it onto the package area P of the substrate S being transported, or laminates it on a die that has already been bonded onto the package area P of the substrate S. bond with The bonding unit 4 includes a bonding head 41 provided with a collet 42 (see also FIG. 2 ) for adsorbing and holding the die D at its tip, similarly to the pickup head 21, and the bonding head 41 is Y. It has a Y drive unit 43 that moves in the axial direction and a substrate recognition camera 44 that recognizes the bonding position by capturing an image of a position recognition mark (not shown) of the package area P of the substrate S. With this configuration, the bonding head 41 corrects the pick-up position and posture based on the image data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and Die D is bonded to the substrate based on the imaging data of .

The transport section 5 has substrate transport claws 51 that hold and transport the substrate S, and transport lanes 52 through which the substrate S moves. The substrate S is moved by the substrate transport claw 51 provided in the transport lane 52 driving a nut (not shown) with a ball screw (not shown) provided along the transport lane 52 . With this configuration, the substrate S moves from the substrate supply unit 6 along the transfer lane 52 to the bonding position, and after bonding, moves to the substrate delivery unit 7, and the substrate S is transported to the substrate delivery unit 7. hand over

The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each unit of the die bonder 10 and a central processing unit (CPU) for executing the program stored in the memory.

Next, the configuration of the die supply unit 1 will be described using FIGS. 3 and 4 . FIG. 3 is a diagram showing an external perspective view of the die supply unit in FIG. 1 . Fig. 4 is a schematic sectional view showing a main part of the die supply section in Fig. 1;

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY-axis direction) and a separation unit 13 that moves in the vertical direction. The wafer holding table 12 holds an expander ring 15 holding the wafer ring 14 and a dicing tape 16 held by the wafer ring 14 and to which a plurality of dies D are bonded horizontally. It has a support ring 17 for positioning. The peeling unit 13 is disposed inside the support ring 17 .

The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 in order to separate the die D. As a result, the dicing tape 16 held by the wafer ring 14 is pulled, the gap between the die D is widened, and the peeling unit 13 adsorbs the dicing tape 16 from below the die D. The pickup property of die D is improved. In addition, the adhesive for adhering the die to the substrate changes from liquid to film, and a film-like adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. . In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the separation process, the wafer 11 and the die attach film 18 are separated from the dicing tape 16 . In the following, the peeling process is described assuming that the die attach film 18 is included in the die D.

Next, the peeling unit 13 is demonstrated using FIGS. 5 and 6 . FIG. 5 is a top view of the peeling unit of FIG. 1 . 6 (a) (b) is a cross-sectional view of a collet portion in a peeling unit and a pick-up head for explaining the configuration of the peeling unit of FIG. 1 and the pick-up operation of the die bonder of FIG. 1 .

The peeling unit 13 includes a suction pad 13a and needles 13b penetrating the center of the suction pad 13a in the vertical direction. The suction pad 13a has a circular shape when viewed from the top, and has a bowl-shaped portion 13d as a concave portion positioned at the top and a columnar portion 13e positioned at the bottom. The suction pad 13a has a suction hole 13c having an opening on the upper surface of the bowl-shaped portion 13d. The bowl-shaped portion 13d has a peripheral flat portion 13f and a central curved portion 13g. The needle 13b is located at the center of the curved portion 13db, and the suction hole 13c is located between the center and the periphery of the curved portion 13db. The needle 13b is composed of an ultra-fine (φ1 mm or less) metal tube like an injection needle, and a hole for passing gas such as air into the needle extends in the vertical direction (longitudinal direction of the needle). The outer diameter of the flat portion 13f of the bowl-shaped portion 13d is formed to be smaller than any size of the dies used so that it can be used for dies of various sizes.

The needle 13b is connected to a pipe 91a through which gas is supplied from the gas supply unit 91 through the valve 91b. The suction hole 13c is connected to a pipe 92a through which gas around the bowl-shaped portion 13d is sucked by the vacuum device 92 through the valve 92b.

Next, a pick-up operation by the peeling unit 13 having the above configuration will be described using FIGS. 6 and 7 . 7(a) to (c) are cross-sectional views of a collet portion in a peeling unit and a pickup head for explaining a pickup operation of the die bonder of FIG. 1 . FIG. 8 is a flowchart showing a processing flow of a pick-up operation of the die bonder of FIG. 1 .

(Step PS1: Moving the pick-up position)

As shown in (a) of FIG. 6, the control unit 8 moves the wafer holder 12 so that the die Dp, which is a pickup target (separation target), is positioned directly above the separation unit 13, and the collet ( 22) just above the die Dp. As shown in FIG. 6(b), the control unit 8 lowers the collet 22 to adsorb the die Dp and fix the die Dp. After that, the control unit 8 moves the peeling unit 13 upward so that the upper surface of the flat portion 13f of the bowl-shaped portion 13d of the suction pad 13a comes into contact with the back surface of the dicing tape 16. move At this time, the needle 13b is inserted into the dicing tape 16 at the center of the back surface of the die Dp, so that only the dicing tape 16 is penetrated. At this time, the controller 8 closes the valves 91b and 92b. In addition, the peeling unit 13 is not in contact with the location of the dicing tape 16 below the die D in the periphery of the die Dp.

(Step PS2: Adsorption of dicing tape)

As shown in (a) of FIG. 7, the controller 8 opens the valve 92b while the valve 91b is closed, and the vacuum device 92 passes through the suction hole 13c and the pipe 92a, The dicing tape 16 is adsorbed by sucking air in the closed space SP1 formed by the bowl-shaped portion 13d of the suction pad 13a and the dicing tape 16 . As a result, the portion of the dicing tape 16 located at the bowl-shaped portion 13d is peeled off from the die Dp, and a closed space SP2 is formed between the dicing tape 16 and the die Dp, and the needle 13b passes through the silver dicing tape 16 reliably. Space SP2 is formed below the center of die Dp.

(Step PS3: Air Blow)

As shown in (b) of FIG. 7 , the control unit 8 opens the valve 92b and sucks the dicing tape 16 while opening the valve 91b and using the gas supply unit 91 to pipe 91a. ) and the needle 13b, while supplying gas into the space SP2, the suction pad 13a is lowered to start the peeling operation. Peeling of the dicing tape 16 is initiated from the central portion of the die Dp.

(Step PS4: Raise the collet)

As shown in (c) of FIG. 7 , the control unit 8 opens the valve 92b and sucks the dicing tape 16, while opening the valve 91b and supplying gas, the suction pad 13a ) is further lowered, and the collet 22 is raised. Peeling of the dicing tape 16 starting from the central portion of the die Dp gradually spreads to the periphery so that the whole is peeled off.

(Step PS5: Adsorption Release/Adsorption Pad Lowering)

The controller 8 closes the valves 91b and 92b to stop gas supply and adsorption of the dicing tape, and further lowers the adsorption pad 13a to extract the needle 13b from the dicing tape 16.

The control unit 8 repeats steps PS1 to PS5 to pick up good quality dies of the wafer 11 .

Next, a method of manufacturing a semiconductor device using a die bonder according to an embodiment will be described with reference to FIG. 9 . FIG. 9 is a flowchart showing a method of manufacturing a semiconductor device using the die bonder of FIG. 1 .

(Step BS11: Wafer/substrate loading process)

The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the die bonder 10 . The controller 8 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette filled with the wafer ring 14 . Further, a substrate S is prepared and loaded into the die bonder 10 . The control unit 8 sets the substrate S to the substrate transfer claw 51 with the substrate supply unit 6 .

(Step BS12: pick-up process)

The controller 8 peels the die D as described above, and picks up the peeled die D from the wafer 11 . In this way, the die D peeled from the dicing tape 16 together with the die attach film 18 is adsorbed and held by the collet 22 and transported to the next step (step BS13). Then, when the collet 22 that transported the die D to the next step returns to the die supply unit 1, the next die D is peeled from the dicing tape 16 according to the above procedure, and then diced according to the same procedure. Dies D are peeled from the tape 16 one by one.

(Step BS13: Bonding Process)

The control unit 8 mounts the picked-up die on the substrate S or laminates it on the already bonded die. The controller 8 loads the die D picked up from the wafer 11 onto the intermediate stage 31, picks up the die D from the intermediate stage 31 again with the bonding head 41, and transfers the die D onto the conveyed substrate S. bond

(Step BS14: Substrate unloading process)

The control unit 8 takes out the substrate S to which the die D is bonded from the substrate transfer claw 51 to the substrate carrying out unit 7 . The substrate S is unloaded from the die bonder 10 .

As described above, the die D is mounted on the substrate S with the die attach film 18 interposed therebetween and taken out of the die bonder. In the case of a laminated package, it is then electrically connected to the electrode of the substrate S through an Au wire in a wire bonding process. Subsequently, the substrate S on which the die D is mounted is carried into the die bonder, the second die D is laminated on the die D mounted on the substrate S through the die attach film 18, and the second die D is unloaded from the die bonder. , electrically connected to the electrode of the substrate S through the Au wire in the wire bonding process. After peeling from the dicing tape 16 by the above-mentioned method, the 2nd die D is conveyed to the pellet sticking process and laminated|stacked on the die D. After the above process is repeated a predetermined number of times, the substrate S is conveyed to the mold process and the plurality of dies D and the Au wire are sealed with a mold resin (not shown) to complete the laminated package.

According to the embodiment, at least one or more of the following effects are exhibited.

(1) The peeling time can be adjusted by the pressure and flow rate of the gas to be supplied. Thereby, there is no need to wait for the dicing tape to peel naturally, and it is possible to shorten the peeling time.

(2) By miniaturizing the suction pad and the needle (smaller than the die size), the peeling unit does not need to be adjusted to the die size, and jigs for each size are unnecessary, so the jig tool can be simplified. As a result, it is easy to cope with a variety of products, and it is possible to reduce the price and shorten the delivery period.

(3) The mechanical part can be simplified by integrating the suction pad and the needle.

(4) Since the dicing tape is peeled from the central portion of the die D while the entire die is adsorbed to the collet, the die is hardly deformed following the deformation of the dicing tape, and the stress applied to the die can be reduced.

In recent years, with the advent of die-stack packages and 3D-NAND (three-dimensional NAND flash), wafers (dies) have become thinner. For example, when assembling a stacked package in which a plurality of dies are three-dimensionally mounted on a substrate, it is required to reduce the thickness of the die to several tens of μm or less in order to prevent an increase in package thickness. On the other hand, since the thickness of the dicing tape is about 100 μm, when the thickness of the die is 20 μm to 25 μm, for example, the thickness of the dicing tape is 4 to 5 times the thickness of the die. When the die becomes thin, the rigidity of the die becomes extremely low compared to the adhesive force of the dicing tape. Therefore, in order to pick up a thin die of several tens of micrometers or less, it is necessary to reduce the stress applied to the die (low stress). If such a thin die is to be peeled off from the dicing tape, deformation of the die following the deformation of the dicing tape is more likely to occur. Deformation of the die can be reduced.

<Example of modification>

Hereinafter, some representative modifications of the examples are illustrated. In the description of the modified example below, it is assumed that the same reference numerals as those in the above-described embodiment can be used for parts having the same configuration and function as those described in the above-mentioned embodiment. And, for the explanation of these parts, it is assumed that the description in the above-described embodiment can be appropriately used within a range that is not technically contradictory. In addition, a part of the above-described embodiment and all or part of a plurality of modified examples can be appropriately applied in combination within a range that is not technically contradictory.

(First modified example)

10 is a top view of the peeling unit in the first modified example. Although the peeling unit 13 in an Example has a circular shape in top view, you may comprise in a rectangular shape. For example, as shown in FIG. 10 , the peeling unit 130 of the first modified example includes a suction pad 130a and needles 13b penetrating the center of the suction pad 130a in the vertical direction. The suction pad 130a has a rectangular shape when viewed from the top, and has a concave portion 130d positioned at the top and a cylindrical portion 13e positioned at the bottom. The concave portion 130d has a peripheral flat portion 130f and a central curved portion 130g.

(Second modified example)

Fig. 11 is a view showing a peeling unit in a second modified example, Fig. 11 (a) is a top view, and Fig. 11 (b) is a cross-sectional view taken along line B-B of Fig. 11 (a) to be.

The stage 231 as an adsorption unit is provided in the peeling unit 230 in the second modification, and in the central portion of the upper surface of the stage 231, a concave portion ( 232) is formed. The concave portion 232 is formed slightly smaller than the die D. The peripheral portion of the stage 231 forms a flat portion. A suction groove 233 as an opening is formed at the periphery of the concave portion 232, and a suction path 234 and a pipe connection portion 235 are connected to the suction groove 233, and the pipe connection portion 235 is connected to the embodiment. A pipe 92a, a valve 92b, and the same as the vacuum device 92 are connected, and the vacuum device sucks gas in the concave portion 232 so that negative pressure is supplied. Accordingly, when negative pressure is supplied to the suction groove 233, the dicing tape 16 is sucked and drawn into the recessed portion 232. In addition, the stage 231 is in contact with the location of the dicing tape 16 below the die D in the vicinity of the die Dp, but is not attracted to the flat portion of the stage 231.

In addition, a plurality of vertically extending holes are provided in the central portion of the concave portion 232, and a pipe connection portion 136 is provided below each hole. A needle 237 having the same structure as the needle 13b of the embodiment is provided in each of the plurality of holes. The pipe connecting portion 235 is connected to the same pipe 91a, valve 91b, and gas supply portion 91 of the embodiment, so that gas such as air is supplied.

Next, a pick-up operation by the peeling unit 230 according to the above configuration will be described using FIGS. 7 and 11 . The pick-up operation by the peeling unit 230 and the collet 22 is basically the same as that of the Example.

(Step PS1: Moving the pick-up position)

The controller 8 moves the wafer holding table 12 so that the die D to be picked up is positioned directly above the peeling unit 230, and moves the collet 22 directly above the die D to be picked up. The controller 8 moves the peeling unit 230 upward so that the upper surface of the flat portion of the stage 231 contacts the back surface of the dicing tape 16 . At this time, the needle 237 is inserted into the dicing tape 16 at the center of the back surface of the die D to be picked up so that only the dicing tape 16 penetrates. Also, the controller 8 lowers the collet 22 to adsorb the die D to be picked up. At this time, in the controller 8, gas is not supplied to the needle 237 and gas is not sucked from the suction groove 233.

(Step PS2: Adsorption of dicing tape)

The control unit 8 is a space formed by the concave portion 232 and the dicing tape 16 through the suction groove 233, the suction path 234, the pipe connecting portion 235, and the pipe by the vacuum device 92. The air inside is sucked in to adsorb the dicing tape 16. As a result, the dicing tape 16 at the portion located in the concave portion 232 is peeled off from the die D, so that a space is formed between the dicing tape 16 and the die D, and the needle 137 is removed from the dicing tape. (16) clearly penetrates.

(Step PS3: Air Blow)

The controller 8 supplies air between the dicing tape 16 and the die D through the pipe, the pipe connection portion 236, and the needle portion 237 by the gas supply device while suctioning the dicing tape 16, and Together, the stage 231 is lowered to start the peeling operation.

(Step PS4: Raise the collet)

The control unit 8 further lowers the stage 231 and raises the collet 22 while sucking the dicing tape 16 and supplying air.

(Step PS5: Adsorption Release/Adsorption Pad Lowering)

The controller 8 stops supply of air and adsorption of the dicing tape 16, and further lowers the stage 231 to extract the needle 237 from the dicing tape 16.

The control unit 8 repeats steps PS1 to PS5 to pick up good quality dies of the wafer 11 .

According to the second modified example, by arranging a plurality of needles according to the size of the die, it is possible to improve the stability of the separation and shorten the time.

(3rd modified example)

12 is a cross-sectional view of a collet portion in a peeling unit and a pick-up head in a third modification.

The peeling unit 330 in the third modification includes the suction pad 13a in the embodiment, needles 13b penetrating the center of the suction pad 13a in the vertical direction, and the suction pad 13a. A plurality of peeling units 13 provided with a suction hole 13c having an opening on the upper surface of the . By such multiplexing of the suction pads, it is possible to uniformize the spread of the gas supplied from the needles 13b. In addition, it is preferable to perform the air blowing in step PS3 described above while moving the die D from the outer periphery (corner) to the center.

(Fourth modified example)

13 is a top view of a peeling unit in a fourth modified example. Although the peeling unit 330 in the 3rd modified example is discretely provided with the peeling unit 13 of Example in multiple numbers, you may configure the some peeling unit 13 of outer side continuously. For example, as shown in FIG. 13 , the peeling unit 430 of the fourth modification includes a central suction pad 430a and an annular suction pad 431a outside the central suction pad 430a. .

The suction pad 430a at the center has the same structure as the suction pad 13a of the embodiment, and the suction pad 430a has a circular shape when viewed from the top, and has a concave portion 430d and a flat portion around the periphery of the concave portion 430d. 430f and a needle 13b vertically penetrating the center of the concave portion 430d, and a suction hole 13c having an opening on the upper surface of the concave portion 430d.

The outer suction pad 431a has an annular shape when viewed from the top, and a plurality of needles ( 13b) and a plurality of suction holes 13c having openings on the upper surface of the concave portion 431d. Although four sets of needles 13b and suction holes 13c are arranged close to each other, it is not limited thereto, and a plurality of sets are sufficient. Although the needle 13b is disposed outside the suction hole 13c in the radial direction, it may be disposed inside or left and right in the circumferential direction. Although the needles 13b and the suction hole 13c are disposed close to each other, they may be disposed apart from each other, for example, the needles 13b and the suction hole 13c may be alternately disposed at substantially equal intervals in the circumferential direction.

According to the fourth modification, as in the third modification, it is possible to uniformize the spread of the gas supplied from the needles 13b by multiplexing the suction pads. In addition, it is preferable to perform the air blowing in step PS3 described above while moving the die D from the outer periphery (corner) to the center.

(Fifth modified example)

14 is a top view of a peeling unit in a fifth modification. Although the peeling unit 430 in the 4th modified example has a circular shape in top view, you may comprise in a rectangular shape. For example, as shown in FIG. 14 , the peeling unit 530 of the fifth modification includes a central suction pad 530a and an annular suction pad 531a outside the central suction pad 530a. . This makes it possible to match the shape of the outside of the suction pad 531a with the shape of the die D, making it possible to facilitate peeling of the dicing tape 16 at the corner of the die D.

(Sixth modified example)

15 is a top view of a peeling unit in a sixth modification. Fig. 16 is a cross-sectional view of the peeling unit along line A-A in Fig. 15 .

In the case of using the die attach film 18, it is necessary to supply gas to the interface between the dicing tape 16 and the die attach film 18. may supply.

As shown in Fig. 15, a stage 631 as an adsorbing portion is provided in the peeling unit 630 in the sixth modification, and on the upper surface of the stage 631, as shown in Fig. 16, a die to be picked up. A concave portion 632 is formed at a site where Dp is loaded. The peripheral portion of the stage 631 forms a flat portion. In the concave portion 632, a suction hole 633 having an opening is formed on the upper surface of the concave portion 632, and a pipe connection portion 635 is connected to the suction hole 633, and the pipe connection portion 635 The pipe 92a, the valve 92b, and the vacuum device 92 of the embodiment are connected to each other, and the vacuum device sucks gas in the concave portion 632 to supply negative pressure. Accordingly, when negative pressure is supplied to the suction hole 633, the dicing tape 16 is sucked and drawn into the concave portion 632.

In addition, a hole extending vertically is provided in the central portion of the concave portion 632, and a pipe connection portion 636 is provided below the hole. A needle 637 is provided in the hole. The pipe connection portion 636 is connected to the same pipe 91a, valve 91b, and gas supply portion 91 of the embodiment, so that gas such as air is supplied.

In the above-described embodiment, the needle 13b has been described as being composed of an ultra-fine (φ1 mm or less) metal tube like an injection needle, but the needle 637 in the sixth modification has an outer diameter of 0.1 mm or more and 0.3 It is composed of microscopic tubules (pipes) that are less than a millimeter in size. Compared with the needle 13b of the embodiment, the outer diameter of the tube penetrating the dicing tape 16 is small, but the outer diameter of the tip is not relatively small and is not pointed. Here, assuming that the thickness of the die D is t1, the thickness of the die attach film 18 is t2, and the thickness of the dicing tape 16 is t3, for example, t1 = 20 μm, t2 = 10 μm, t3 = 100 μm. This makes it easy to penetrate the dicing tape 16, and damage to the die attach film 18 when it reaches the die attach film 18 can be kept within a minimum range.

Usually, since the adhesive force between the die attach film 18 and the die D is stronger than the adhesive force between the dicing tape 16 and the die attach film 18, the die attach film 18 is easy to position. Even if gas is supplied at the interface between the die and the die D, peeling does not occur at the interface between the die attach film 18 and the die D, and the dicing tape 16 and the die attach film ( Gas flows in to the interface of 18), and separation between the dicing tape 16 and the die attach film 18 becomes possible. Further, in order to make this phenomenon remarkable, a groove may be formed on the side surface of the needle 637 from the tip of the pipe to the position of the die attach film 18.

According to this modified example, the needle 637 can be mechanically stopped between the die D having a large hardness difference and the die attach film 18, and the hole pierced in the die attach film 18 can also be removed by an ultra-fine pipe. , it becomes possible to suppress it to an unaffected size.

(Seventh modified example)

Fig. 17 (a) is a top view of a peeling unit in a seventh modified example. Fig. 17(b) is a side view seen from the direction A of Fig. 17(a). Fig. 18 is a cross-sectional view along line B-B of Fig. 17; FIG. 19 is a diagram explaining the relationship between the needle of the peeling unit of FIG. 17 and the dicing tape.

In the sixth modification, one needle 637 and the suction hole 633 are provided in the center of the concave portion 632 of the stage 631, but in the seventh modification, as shown in FIG. 17, the needle ( 737) and suction holes 733 are arranged in a plurality of sets around the concave portion 732 of the stage 731 in a circumferential shape.

As shown in FIG. 18, the needle 737 penetrating the dicing tape 16 of the peeling unit 730 in the seventh modification is configured in an oblique shape such as cutting the tip of a metal tube, , as shown in FIG. 19, the dicing tape 16 is obliquely disposed at an angle θ equal to the angle of the tip portion, and the hole through which gas such as air passes at the tip portion of the needle 737 is the dicing tape ( 16) is formed to be parallel. The angle θ is preferably 15 degrees or more and 45 degrees or less, for example.

When the needle 737 penetrates the dicing tape 16, the stage 731 is rotated in the direction of the diagonally arranged needle, as indicated by the arrow in Fig. (=t3/tanθ). Because of this, even when penetrating the thin dicing tape 16, the tip of the needle 737 can run in parallel with the die D and the dicing tape 16, so that the gas supply hole at the tip of the needle 737 It is possible to prevent chips from dicing tape 16 from penetrating, and since the movement amount of the tip of the needle 737 can be increased compared to when it is vertical, the positional accuracy of the tip of the needle 737 can be improved. there is.

In the above, the invention made by the present inventors has been specifically described based on examples and modifications, but the present invention is not limited to the above examples and modifications, and various modifications are possible.

For example, in the second modified example, an example in which the portion of the dicing tape 16 under the die D around the die Dp is not adsorbed in the flat portion of the stage 231 has been described, but the die around the die Dp has been described. You may adsorb the dicing tape 16 below D.

Further, in the embodiment, an example using a die attach film has been described, but it is not necessary to use a die attach film by providing a preform portion for applying an adhesive to a substrate.

Further, in the embodiment, the needle 13b is inserted into the dicing tape 16 at the center of the back surface of the die Dp so as to penetrate only the dicing tape 16, but when the die attach film is not used, In order to prevent damage to the die at this time, a cushion material or the like having a rebound strength that is greater than the penetrating power of the dicing tape and suppresses damage to the die may be provided under the needle so that the needle is operated with a stroke that penetrates the dicing tape reliably. .

Furthermore, this cushion member may be constituted by an air spring or the like, and may be freely set according to the penetrating force of the dicing tape to be used or the strength of the die.

In addition, although an elastic material such as rubber is used as the material of the commonly used collet, the material of the portion where the needle 13b penetrates the dicing tape is a metal or a resin having low elastic force so that the die does not deform due to the penetrating needle 13b. etc. can also be used. This makes it possible to reflect the height (position) precision of the needle as it is to the penetrating position of the dicing tape.

Further, in order to remove debris from the dicing tape 16 and/or the die attach film 18 that have penetrated into the tips of the needles, gas may be blown at a high pressure at a position that does not cause problems with the product.

Also, in the embodiment, a die bonder that picks up dies from the die supply unit with a pick-up head, loads them on an intermediate stage, and bonds the dies loaded on the intermediate stage to a substrate with a bonding head has been described, but is not limited thereto, and is not limited thereto. Applicable to semiconductor manufacturing equipment that picks up dies.

It is not limited thereto, and is applicable to a die bonder that does not have an intermediate stage and a pick-up head and bonds a die of a die supply unit to a substrate with a bonding head.

It is also applicable to a flip chip bonder that does not have an intermediate stage, picks up a die from a die supply unit, rotates the die pick-up head up, transfers the die to a bonding head, and bonds the die to a substrate with the bonding head.

It is also applicable to a die sorter that does not have an intermediate stage or bonding head and loads dies picked up from a die supply unit with a pick-up head onto a tray or the like.

10: die bonder (die bonding device)
13 peeling unit (peeling device)
13a: suction pad (adsorption unit)
13d: bowl-shaped part (concave part)
13b: saliva
13c: suction hole (opening)
16: dicing tape
22: collet
8: control unit
D: die

Claims (19)

A peeling unit including an adsorbing unit for adsorbing the lower surface of a dicing tape under a die to be peeled having a die attach film, and a needle whose tip protrudes from the upper surface of the adsorbing unit;
A collet adsorbing the upper surface of the die to be peeled;
A controller controlling the peeling unit
to provide,
The adsorbing portion has a concave portion for adsorbing the dicing tape,
The needle has a hole for supplying gas,
The concave portion has an opening for sucking gas,
The needle is composed of a microtube with an outer diameter of 0.3 mm or less,
The control unit penetrates the needle to the interface between the die attach film and the die to be separated, and supplies the gas from the tip of the needle between the lower surface of the die to be separated and the upper surface of the dicing tape, The die bonding device configured to adsorb the lower surface of the dicing tape by the concave portion. According to claim 1,
The die bonding device, wherein the controller is configured to raise the collet in a state where the collet adsorbs the die to be exfoliated, and to pull down the exfoliation unit in a state in which the exfoliation unit adsorbs the dicing tape. . According to claim 1,
The adsorbing portion also has a flat portion,
The width of the upper surface side of the adsorbing portion is smaller than the width of the die to be peeled off;
The die bonding apparatus, wherein the width of the flat portion is smaller than the width of the concave portion. delete A peeling unit having an adsorbing portion for adsorbing the lower surface of the dicing tape under the die to be separated, and a needle whose tip protrudes from the upper surface of the adsorbing portion;
A collet adsorbing the upper surface of the die to be peeled;
A controller controlling the peeling unit
to provide,
The adsorbing portion has a concave portion for adsorbing the dicing tape,
The needle has a hole for supplying gas,
The concave portion has an opening for sucking gas,
A plurality of the adsorbing units are provided;
The control unit,
While supplying the gas from the tip of the needle between the lower surface of the die to be peeled and the upper surface of the dicing tape, the lower surface of the dicing tape is adsorbed by the concave portion,
The die bonding apparatus, wherein the collet is pulled up in a state where the collet adsorbs the die to be separated, and the exfoliation unit is pulled down in a state where the dicing tape is adsorbed. A peeling unit having an adsorbing portion for adsorbing the lower surface of the dicing tape under the die to be separated, and a needle whose tip protrudes from the upper surface of the adsorbing portion;
A collet adsorbing the upper surface of the die to be peeled;
A controller controlling the peeling unit
to provide,
The needle has a hole for supplying gas,
The adsorbing portion has a concave portion and a flat portion for adsorbing the dicing tape,
The concave portion has an opening for sucking gas,
The width of the upper surface side of the adsorbing portion is larger than the width of the die to be peeled off;
The width of the concave portion is smaller than the width of the die to be peeled off;
The control unit is configured to adsorb the lower surface of the dicing tape by the concave portion while supplying the gas from the tip of the needle between the lower surface of the die to be peeled and the upper surface of the dicing tape. Device. According to claim 6,
The concave portion has a rectangular shape in plan view,
A plurality of needles are provided in the central portion of the bottom of the concave portion,
The die bonding device according to claim 1 , wherein the opening is a groove provided on a periphery of a bottom surface of the concave portion. A peeling unit having an adsorbing portion for adsorbing the lower surface of the dicing tape under the die to be separated, and a needle whose tip protrudes from the upper surface of the adsorbing portion;
A collet adsorbing the upper surface of the die to be peeled;
A controller controlling the peeling unit
to provide,
The adsorbing portion has a concave portion for adsorbing the dicing tape,
The needle has a hole for supplying gas,
The concave portion has an opening for sucking gas,
The peeling unit has a plurality of the concave portions under the die to be peeled,
Each of the concave portions has the needle and the opening,
The control unit is configured to adsorb the lower surface of the dicing tape by the concave portion while supplying the gas from the tip of the needle between the lower surface of the die to be peeled and the upper surface of the dicing tape. Device. A peeling unit having an adsorbing portion for adsorbing the lower surface of the dicing tape under the die to be separated, and a needle whose tip protrudes from the upper surface of the adsorbing portion;
A collet adsorbing the upper surface of the die to be peeled;
A controller controlling the peeling unit
to provide,
The adsorbing portion has a concave portion for adsorbing the dicing tape,
The needle has a hole for supplying gas,
The concave portion has an opening for sucking gas,
The tip of the metal pipe is formed in an oblique shape, like a bamboo cut, and is obliquely disposed at the same angle as the tip of the dicing tape, and the opening surface of the hole through which the gas passes through the tip is the dicing tape It is configured to be parallel to the tape,
The control unit is configured to adsorb the lower surface of the dicing tape by the concave portion while supplying the gas from the tip of the needle between the lower surface of the die to be peeled and the upper surface of the dicing tape. Device. According to claim 9,
The die bonding device, wherein the inclination of the needle is configured at an angle of 45° or less with respect to the dicing tape. According to claim 10,
and circumferentially disposing the needle in the peeling unit, and inserting the needle into the dicing tape by rotating the peeling unit by a required amount. According to claim 8,
A first concave portion of the plurality of concave portions is configured to be located in the central portion of the former die to be peeled,
The die bonding apparatus, wherein a second concave portion of the plurality of concave portions is configured to surround the first concave portion. According to claim 12,
The die bonding device, wherein the second concave portion has more needles and openings than the first concave portion. The method of any one of claims 7, 12, and 13,
The die bonding apparatus, wherein the control unit is configured to sequentially supply the gas from an outer concave portion among a plurality of the concave portions. The method of any one of claims 1 to 3 and 5 to 13,
A die bonding device that blows gas at high pressure to remove debris from the dicing tape or die attach film penetrating the tips of the needles. (a) a peeling unit having an adsorbing unit for adsorbing the lower surface of a dicing tape under a die to be separated having a die attach film, and a needle whose tip protrudes from the upper surface of the adsorbing unit; and an upper surface of the die to be separated. and a collet for adsorbing, and a control unit for controlling the peeling unit, wherein the adsorption unit has a concave portion for adsorbing the dicing tape, the needle has a hole for supplying gas, and the needle has a 0.3 A step of carrying in a wafer ring holding the dicing tape into a die bonding apparatus composed of microfine tubes having an outer diameter of less than or equal to mm, and the concave portion having an opening for sucking gas;
(b) step of picking up the die to be peeled with the collet in cooperation with the peeling unit
to provide,
In the step (b), the gas is supplied from the tip of the needle between the lower surface of the die to be separated and the upper surface of the dicing tape by penetrating the needle to the interface between the die attach film and the die to be separated, and a step of adsorbing the lower surface of the dicing tape by the concave portion. According to claim 16,
The step (b) further includes a step of raising the collet in a state where the collet adsorbs the die to be separated, and pulling down the peeling unit in a state where the peeling unit adsorbs the dicing tape. , A method of manufacturing a semiconductor device. delete A peeling device used with a collet that adsorbs the upper surface of a die having a die attach film,
an adsorbing portion adsorbing the lower surface of the dicing tape under the die;
A needle whose tip protrudes from the upper surface of the suction part
to provide,
The adsorbing portion has a concave portion for adsorbing the dicing tape,
The needle is composed of a micro-fine tube having an outer diameter of 0.3 mm or less, penetrates to the interface between the die attach film and the die, and passes gas from the tip of the needle between the lower surface of the die and the upper surface of the dicing tape. has a supply hole;
The peeling device according to claim 1, wherein the concave portion has an opening for sucking gas to adsorb the lower surface of the dicing tape.

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