JP2008053260A - Pick-up device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pick-up device that can prevent breakage of a chip to be picked up. <P>SOLUTION: A collet 22 is lowered, the suction face 23 of the collet 22 is brought into contact with the upper face of a semiconductor chip 14, and a negative pressure is supplied to a vacuum hole 31 to suck the semiconductor chip 14. At this time, a compressed gas 65 from sprayers 63 and 64 is sprayed to streets 71 on both sides of the semiconductor chip 14 at an acute angle, and it is absorbed from first and second dischargers 83 and 84 and is discharged from the upper side of a wafer sheet 13, while the collet 22 is slightly elevated. As a result, the compressed gas 65 enters between the semiconductor chip 14 and the wafer sheet 13, and the semiconductor chip 14 can be peeled from the wafer sheet 13 without using a push-up pin. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a pickup device that picks up a workpiece on a sheet.

  2. Description of the Related Art Conventionally, a bonding apparatus that bonds a semiconductor chip to a lead frame is provided with a pickup apparatus that picks up a semiconductor chip attached to a wafer sheet and transfers it to a bonding point.

  In this pickup device, as shown in FIG. 6, the collet 101 is lowered to the semiconductor chip 103 attached to the wafer sheet 102, and negative pressure is supplied to the vacuum hole 104 of the collet 101 to thereby remove the semiconductor chip 103. It is configured to perform vacuum suction.

  At this time, the wafer sheet 102 is fixed on the stage 111 by supplying a negative pressure to the suction holes 112 of the stage 111 disposed on the outer periphery of the semiconductor chip 103. The semiconductor chip 103 can be peeled from the wafer sheet 102 by projecting the push-up pin 113 and pushing up the semiconductor chip 103.

  However, in recent years, the semiconductor chip 103 has been made thinner and larger.

  For this reason, when the semiconductor chip 103 is pushed up by the push-up pin 113, the semiconductor chip 103 may be chipped or cracked.

  The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a pickup device that can prevent a chip to be picked up from being damaged.

  In order to solve the above-mentioned problem, in the pickup device according to claim 1 of the present invention, in the pickup device that picks up a chip attached to a sheet with a collet, a spraying unit that blows compressed gas to the outer peripheral portion of the chip is provided. I have.

  That is, when picking up the chip stuck on the sheet with a collet, compressed air from the spraying part is sprayed on the outer peripheral part of the chip.

  Then, the compressed air enters between the chip and the sheet from the periphery of the chip by the pressure, and a gap is formed between the chip and the sheet.

  According to another aspect of the pickup device of the present invention, the blowing unit sprays compressed gas to the outer peripheral portion of the chip when the chip is attracted to the collet and pulled up.

  That is, when the chip is adsorbed and pulled up by the collet, compressed gas is blown to the outer peripheral portion of the chip.

  Thereby, at the time of peeling of the chip from the sheet, the pulling force by the collet operation and the peeling force by the compressed gas act simultaneously.

  Furthermore, in the pickup device according to claim 3, the spray angle of the compressed gas by the spray part is set to an acute angle directed obliquely from above the chip periphery toward the periphery of the chip.

  That is, the compressed gas is sprayed at an acute angle from obliquely above the periphery of the chip toward the periphery of the chip.

  Thereby, the penetration of the compressed gas into the lower surface of the chip is promoted.

  In addition, in the pickup device of the fourth aspect, a protrusion having a height smaller than the thickness of the chip to be picked up is provided on the peripheral edge of the suction surface of the collet that sucks the chip.

  That is, in a state where the chip is adsorbed on the adsorption surface of the collet, a protrusion provided on the peripheral portion of the adsorption surface is disposed on the outer peripheral portion of the chip.

  For this reason, when the compressed gas is blown, the blowing of the compressed gas to the edge portion of the chip adsorbed on the adsorption surface is suppressed by the protrusion.

  And the said protrusion is set to the height dimension smaller than the thickness dimension of the chip | tip used as pick-up object.

  For this reason, when the chip pick-up where the suction surface of the collet is close to the sheet, interference of the protrusions with the sheet is prevented.

  According to a fifth aspect of the present invention, there is provided an exhaust unit that sucks the compressed gas sprayed by the spraying part onto the outer peripheral part of the chip and discharges the compressed gas from the sheet.

  That is, the compressed gas blown to the outer peripheral portion of the chip is sucked into the exhaust portion and discharged from the sheet.

  Thereby, even if the foreign matter is scattered by the blowing of the compressed gas, the foreign matter is excluded from the sheet.

  Furthermore, in the pickup device according to claim 6, the spraying part sprays compressed gas onto the upper surface of the chip before picking up.

  That is, the compressed gas is blown onto the upper surface of the chip before picking up.

  For this reason, for example, even if a foreign substance has adhered to the upper surface of the chip, the adhered foreign substance is removed.

  Moreover, as a pick-up method, in the pick-up method which picks up the chip | tip stuck on the sheet | seat with a collet, it has the spraying process which sprays compressed gas on the outer peripheral part of the said chip | tip.

  That is, when picking up the chip attached to the sheet with a collet, compressed air is blown onto the outer periphery of the chip.

  Then, the compressed air enters between the chip and the sheet from the periphery of the chip by the pressure, and a gap is formed between the chip and the sheet.

  Furthermore, in another pick-up method, in the spraying step, compressed gas is sprayed on the outer periphery of the chip when the chip is attracted to the collet and pulled up.

  That is, when the chip is adsorbed and pulled up by the collet, compressed gas is blown to the outer peripheral portion of the chip.

  Thereby, at the time of peeling of the chip from the sheet, the pulling force by the collet operation and the peeling force by the compressed gas act simultaneously.

  In addition, in another pickup method, in the spraying step, the compressed gas is sprayed at an acute angle directed obliquely from above the chip periphery toward the periphery of the chip.

  That is, the compressed gas is sprayed at an acute angle from obliquely above the periphery of the chip toward the periphery of the chip.

  Thereby, the penetration of the compressed gas into the lower surface of the chip is promoted.

  In another pick-up method, the chip is adsorbed by the collet provided with a protrusion having a height smaller than the thickness of the chip to be picked up on the peripheral edge of the end face.

  That is, in a state where the chip is adsorbed on the adsorption surface of the collet, a protrusion provided on the peripheral portion of the adsorption surface is disposed on the outer peripheral portion of the chip.

  For this reason, when the compressed gas is blown, the blowing of the compressed gas to the edge portion of the chip adsorbed on the adsorption surface is suppressed by the protrusion.

  And the said protrusion is set to the height dimension smaller than the thickness dimension of the chip | tip used as pick-up object.

  For this reason, when the chip pick-up where the suction surface of the collet is close to the sheet, interference of the protrusions with the sheet is prevented.

  Furthermore, in another pickup method, in the spraying step, the compressed gas sprayed on the outer peripheral portion of the chip is sucked and discharged from the sheet.

  That is, the compressed gas blown to the outer peripheral portion of the chip is sucked and discharged from the sheet.

  Thereby, even if the foreign matter is scattered by the blowing of the compressed gas, the foreign matter is excluded from the sheet.

  In addition, other pick-up methods have a pre-process of blowing compressed gas onto the top surface of the chip before pick-up.

  That is, the compressed gas is blown onto the upper surface of the chip before picking up.

  For this reason, for example, even if a foreign substance has adhered to the upper surface of the chip, the adhered foreign substance is removed.

  As described above, in the pickup device according to the first aspect of the present invention, when the chip attached to the sheet is picked up by the collet, the compressed air is blown to the outer peripheral portion of the chip, thereby compressing the compressed air. Can be made to enter between the chip and the sheet from the periphery of the chip, and the chip can be peeled off from the sheet.

  For this reason, it is possible to peel off the chip from the sheet without applying an impact from the push-up pin to the chip as compared with the conventional case where the chip stuck to the sheet is pushed up by the push-up pin and peeled off from the sheet. .

  Therefore, even when a large-sized chip or a thinned chip is peeled off from the sheet and picked up, the chip can be reliably picked up while preventing damage to the chip due to impact input.

  Further, the push-up pin for pushing up the chip becomes unnecessary, and a stage for holding the sheet at the time of push-up can be eliminated.

  In the pickup device according to claim 2, when the chip is attracted to the collet and pulled up, compressed gas is blown to the outer peripheral portion of the chip.

  For this reason, when peeling the chip from the sheet, the pulling force by the collet operation and the peeling force by the compressed gas can be applied simultaneously. Thereby, peeling time can be shortened.

  Furthermore, in the pickup device according to a third aspect, the compressed gas can be sprayed at an acute angle from obliquely above the periphery of the chip toward the periphery of the chip.

  Thereby, the approach to the said chip | tip lower surface of the said compressed gas can be accelerated | stimulated, and the peeling ease by the said compressed gas can be improved.

  In addition, in the pickup device according to claim 4, in a state where the chip is adsorbed on the adsorption surface of the collet, a protrusion provided on a peripheral portion of the adsorption surface may be arranged on the outer periphery of the chip. it can.

  For this reason, when the compressed gas is sprayed, the compressed gas can be prevented from being sprayed to the edge of the chip adsorbed on the adsorption surface.

  And the said protrusion is set to the height dimension smaller than the thickness dimension of the chip | tip used as pick-up object.

  For this reason, at the time of chip pickup in which the suction surface of the collet is close to the sheet, it is possible to prevent interference of the protrusions with the sheet.

  In the pickup device of the fifth aspect, the compressed gas blown to the outer peripheral portion of the chip can be sucked and discharged from the sheet.

  Thereby, even if the foreign matter is scattered by the blowing of the compressed gas, the foreign matter can be excluded from the sheet.

  Furthermore, in the pickup device according to claim 6, by blowing the compressed gas onto the upper surface of the chip before picking up, for example, even when foreign matter is attached to the upper surface of the chip, the attached foreign matter is removed. Can be removed.

  As a result, it is possible to eliminate a factor that hinders pickup due to foreign matter adhering to the upper surface of the chip.

  In each pickup method given as an example, the same effect as described above can be obtained.

  (First embodiment)

  A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing a pickup apparatus 1 according to the present embodiment for executing the pickup method. The pickup device 1 is provided in a bonding device that bonds a semiconductor chip to a lead frame, and is a device that picks up a semiconductor chip attached to a wafer sheet and transfers it to a bonding point.

  The pickup device 1 is configured around a control unit 11, and a wafer ring control unit 12 is connected to the control unit 11. As shown in FIG. 2, the wafer ring control unit 12 includes a mechanism for moving the wafer ring on which the stretchable wafer sheet 13 is stretched in the XY direction. Are mounted with a plurality of semiconductor chips 14,... Formed by dicing the adhered wafer vertically and horizontally. As a result, the wafer ring control unit 12 controls the movement of the wafer ring so that the semiconductor chip 14 to be picked up on the wafer sheet 13 can be moved in accordance with the pickup point 15.

  A pickup control unit 21 is connected to the control unit 11, and the pickup control unit 21 is configured to control a pickup mechanism (not shown) that picks up the semiconductor chip 14. The pickup mechanism includes a collet 22 that picks up the semiconductor chip 14, and a lower end surface of the collet 22 constitutes an adsorption surface 23 that adsorbs the semiconductor chip 14.

  The suction surface 23 is formed of, for example, a rectangular flat surface, and a vacuum hole 31 to which negative pressure is supplied is provided at the center. An air guard 32 as a protrusion having a height smaller than the thickness of the semiconductor chip 14 to be picked up is provided at the peripheral edge of the suction surface 23, and the air guard 32 is provided on four sides of the suction surface 23. It has been.

  Further, a suction control unit 41 is connected to the control unit 11, and the suction control unit 41 is used in second and third embodiments described later.

  That is, as shown in FIG. 4 showing the second embodiment and FIG. 5 showing the third embodiment, in these embodiments, a stage 51 is provided below the wafer sheet 13. On the upper surface of the stage 51, a recess 52 is formed at the site of the pickup point 15. A suction hole 53 is connected to the recess 52, and a negative pressure is supplied to the suction hole 53. Thus, when a negative pressure is supplied to the suction hole 53 by the suction control unit 41, the wafer sheet 13 is sucked and pulled into the recess 52.

  As shown in FIGS. 1 and 2, the control unit 11 is connected to a first spray control unit 61 and a second spray control unit 62, and the first spray control unit 61 is connected to the pickup point. 15 is provided with the 1st spraying part 63 provided in 15 vicinity. The second spray control unit 62 includes a second spray unit 64 provided in the vicinity of the pickup point 15, and each spray unit 63, 64 is a compressed gas sent from a supply source outside the figure. 65 is blown to the outer peripheral portion of the semiconductor chip 14 disposed at the pickup point 15.

  The first spraying part 63 is provided on the upper left side of the left edge of the semiconductor chip 14 disposed at the pickup point 15 in FIG. 2, and the first spraying part 63 is oblique to the left edge of the semiconductor chip 14. Dicing between the semiconductor chip 14 arranged at the pickup point 15 and the semiconductor chip 14 arranged at the left side of the semiconductor chip 14 arranged at the pickup point 15 from the upper edge side of the semiconductor chip 14 arranged at the pickup point 15 from above. The compressed gas 65 is ejected toward the formed street 71.

  The second spraying portion 64 is provided on the upper right side of the right edge of the semiconductor chip 14 to be the pickup point 15 in FIG. 2, and the second spraying portion 64 is obliquely above the right edge of the semiconductor chip 14. It is formed by dicing between the semiconductor chip 14 arranged at the pickup point 15, specifically, between the semiconductor chip 14 arranged at the pickup point 15 and the semiconductor chip 14 arranged on the right side thereof. The compressed gas 65 is ejected toward the street 71.

  Further, the compressed gas 65, 65 sprayed from the both spray parts 63, 64 toward the periphery of the semiconductor chip 14 has a predetermined spray angle α to the wafer sheet 13 to which the semiconductor chip 14 is adhered. (The right side is not shown), and the spray angle α is set to an acute angle. And each said spray control part 61 and 62 is comprised so that the compressed gas 65 and 65 supplied to each said spray part 63 and 64 may be controlled, and can control the spray timing of the said compressed gas 65 and 65, respectively. It is configured as follows.

  Further, a first exhaust control unit 81 and a second exhaust control unit 82 are connected to the control unit 11. The first exhaust control unit 81 includes a first exhaust unit 83 formed in a bowl shape, and the first exhaust unit 83 is provided on the left side of the first blowing unit 63 in FIG. It arrange | positions so that it may open toward the said 1st spraying part 63 side. The first exhaust part 83 is configured to be supplied with a negative pressure from the hose connection part 85, and the supply of this negative pressure can be controlled by the first exhaust control part 81.

  The second exhaust control unit 82 also includes a second exhaust unit 84 formed in a bowl shape, and the second exhaust unit 84 is provided on the right side of the second spray unit 64 in FIG. It arrange | positions so that it may open toward the said 2nd spraying part 64 side. The second exhaust part 84 is configured such that a negative pressure is supplied from the hose connection part 91, and the supply of this negative pressure can be controlled by the second exhaust control part 82.

  The hoses connected to the exhaust parts 81 and 82 are piped to the apparatus main body side (not shown), and are connected to the outer peripheral part of the semiconductor chip 14 disposed at the pickup point 15 from the blowing parts 63 and 64. The compressed gas 65, 65 sprayed is sucked by the exhaust parts 83, 84 and can be removed from the wafer sheet 13.

  The control unit 11 is mainly composed of a microcomputer incorporating a ROM and a RAM. The ROM stores a program indicating a processing procedure, and the RAM is configured to store data used in the processing. Thus, the pickup device 1 is configured to operate when the microcomputer operates according to a program stored in the ROM.

  The operation of the pickup device 1 according to the present embodiment having the above configuration will be described with reference to FIG.

  That is, at the start of pickup, the control unit 11 outputs a control signal to the wafer ring control unit 12 to move the wafer ring in the XY direction as shown in step S1 of FIG. The upper semiconductor chip 14 to be picked up is moved to the pick-up point 15.

  In this movement process, the wafer ring is controlled to move so that the semiconductor chip 14 to be picked up passes under the first spraying part 63. At this time, by outputting a control signal to the first spray control unit 61 and the first exhaust control unit 81, the compressed gas 65 from the first spray unit 63 is sprayed on the upper surface of the semiconductor chip 14 to be picked up, and The compressed gas 65 sprayed on the upper surface of the semiconductor chip 14 is sucked from the first exhaust part 83 and discharged from the wafer sheet 13.

  At this time, a silicon piece generated by chipping or the like may adhere to the upper surface of the semiconductor chip 14. However, the compressed gas 65 from the first blowing part 63 is blown onto the upper surface of the semiconductor chip 14, and the compressed gas 65 is sucked from the first exhaust part 83 and discharged from the wafer sheet 13, whereby the semiconductor chip 14. Foreign matter such as silicon pieces adhering to the surface can be removed.

  Thereby, the upper surface of the semiconductor chip 14 to be picked up can be cleaned, and the obstruction factor of the pickup due to the foreign matter adhering to the upper surface of the semiconductor chip 14 can be eliminated.

  When the semiconductor chip 14 to be picked up moves to the pick-up point 15, it moves onto the pick-up point 15 by outputting a control signal to the pick-up controller 21 as shown in step S2 of FIG. The collet 22 is lowered toward the semiconductor chip 14 and, as shown in step S3 of FIG. 3, the vacuum hole 31 of the collet 22 with the suction surface 23 of the collet 22 in close contact with the upper surface of the semiconductor chip 14. A negative pressure is supplied to the semiconductor chip 14 to hold it by suction.

  At this time, by outputting a control signal to each of the spray control units 61 and 62 and each of the exhaust control units 81 and 82, the compressed gas 65 and 65 from each of the spray units 63 and 64 is arranged at the pickup point 15. Further, the semiconductor chip 14 is sprayed to the left and right streets 71 and 71 in the drawing at a spray angle α set at an acute angle, and the compressed gas 65 sprayed from the spray parts 63 and 64 is discharged to the first and second exhausts. The air is sucked from the portions 83 and 84 and discharged from the wafer sheet 13. At the same time, by outputting a control signal to the pickup control unit 21, the collet 22 that has adsorbed the semiconductor chip 14 is slightly raised.

  Then, as shown in step S4 of FIG. 3, the compressed gas 65 blown from the first blowing part 63 is bent from the left edge of the semiconductor chip 14 while bending the elastic wafer sheet 13 downward. It enters between the semiconductor chip 14 and the wafer sheet 13. Further, the compressed gas 65 blown from the second blowing part 64 also bends the elastic wafer sheet 13 downward, while the semiconductor chip 14 and the wafer sheet 13 are connected to the semiconductor chip 14 from the right edge of the semiconductor chip 14. Get in between.

  Thereby, as shown in step S5 of FIG. 3, a gap 95 is formed between the semiconductor chip 14 and the wafer sheet 13, and the semiconductor chip 14 adhered to the wafer sheet 13 is replaced with the wafer sheet 13. The collet 22 makes it easy to pick up.

  Therefore, even when the enlarged semiconductor chip 14 or the thinned semiconductor chip 14 is peeled off from the wafer sheet 13 and picked up, the semiconductor chip 14 is prevented from being damaged by impact input, and the semiconductor chip 14 is prevented from being damaged. 14 can be reliably picked up.

  As compared with the prior art, the push-up pin for pushing up the semiconductor chip 14 is not required, and the movable part of the push-up pin is not required, so that the life can be extended. It is also possible to eliminate the stage for holding the wafer sheet 13 when pushing up.

  Further, when the compressed gas 65 is sprayed on the outer periphery of the semiconductor chip 14, the collet 22 that has adsorbed the semiconductor chip 14 is pulled up at the same time.

  For this reason, when the semiconductor chip 14 is peeled from the wafer sheet 13, the pulling force due to the collet 22 operation and the peeling force due to the compressed gas 65 can be applied simultaneously, so that the semiconductor chip 14 is peeled off. Time can be shortened.

  Further, the compressed gas 65 blown to the outer peripheral portion of the semiconductor chip 14 is blown at an acute angle from obliquely above the periphery of the semiconductor chip 14 toward the peripheral portion of the semiconductor chip 14.

  For this reason, compared with the case where the compressed gas 65 is sprayed at a right angle to the wafer sheet 13, it is possible to promote the entry of the compressed gas 65 into the lower surface of the semiconductor chip 14. The ease can be increased.

  In addition, air guards 32 having a height smaller than the thickness of the semiconductor chip 14 to be picked up are provided on the four sides of the suction surface 23 at the periphery of the suction surface 23 of the collet 22 that sucks the semiconductor chip 14. The air guard 32 can be disposed on the outer periphery of the semiconductor chip 14 in a state where the semiconductor chip 14 is adsorbed on the adsorption surface 23.

  For this reason, when the compressed gas 65 is sprayed, the air guard 32 can prevent the compressed gas 65 from being sprayed to the edge of the semiconductor chip 14 adsorbed on the adsorption surface 23. Thereby, careless detachment of the semiconductor chip 14 from the suction surface 23 due to the compressed gas 65 can be prevented.

  The air guard 32 is set to a height dimension smaller than the thickness dimension of the semiconductor chip 14 to be picked up.

  For this reason, at the time of chip pick-up in which the suction surface 23 of the collet 22 is close to the wafer sheet 13, as shown in step S3 of FIG. it can.

  Further, the compressed gas 65 blown to the outer peripheral portion of the semiconductor chip 14 can be sucked from the exhaust portions 83 and 84 and discharged from the wafer sheet 13.

As a result, even if foreign matter such as silicon pieces on the semiconductor chip 14 is scattered by blowing the compressed gas 65, the foreign matter can be removed from the wafer sheet 13.

  (Second Embodiment)

  FIG. 4 is a diagram showing a second embodiment of the present invention, where parts that are the same as or equivalent to those in the first embodiment are given the same reference numerals and explanations are omitted, and parts that are different are attached. Only explained.

  That is, in the pickup apparatus 1 according to the present embodiment, the stage 51 described above is provided below the wafer sheet 13, and a recess 52 is formed on the upper surface of the stage 51 at the site of the pickup point 15. ing. A suction hole 53 is connected to the recess 52, and a negative pressure is supplied to the suction hole 53. Thus, when a negative pressure is supplied to the suction hole 53 by the suction control unit 41, the wafer sheet 13 is sucked and pulled into the recess 52.

  When the pickup is started in the pickup apparatus 1, the control unit 11 outputs a control signal to the wafer ring control unit 12 to perform wafer ringing as described in step S1 of FIG. 3 of the first embodiment. Moving in the XY direction, the semiconductor chip 14 to be picked up on the wafer sheet 13 is moved in accordance with the pick-up point 15.

  In this movement process, the wafer ring is controlled to move so that the semiconductor chip 14 to be picked up passes under the first spraying part 63. At this time, by outputting a control signal to the first spray control unit 61 and the first exhaust control unit 81, the compressed gas 65 from the first spray unit 63 is sprayed on the upper surface of the semiconductor chip 14 to be picked up, and The compressed gas 65 sprayed on the upper surface of the semiconductor chip 14 is sucked from the first exhaust part 83 and discharged from the wafer sheet 13.

  As a result, the upper surface of the semiconductor chip 14 to be picked up is cleaned, and the obstructive factor of the pickup due to the foreign matter adhering to the upper surface of the semiconductor chip 14 is eliminated (not shown).

  When the semiconductor chip 14 to be picked up moves to the pick-up point 15, the semiconductor chip 14 is arranged above the concave portion 52 of the stage 51 as shown in step SB 1 in FIG.

  In this state, a control signal is output to the pickup control unit 21, the collet 22 moved to the pickup point 15 is lowered toward the semiconductor chip 14, and as shown in step SB2 of FIG. With the suction surface 23 in close contact with the upper surface of the semiconductor chip 14, negative pressure is supplied to the vacuum hole 31 of the collet 22 to hold the semiconductor chip 14 on the suction surface 23. Simultaneously with the suction of the semiconductor chip 14 to the suction surface 23, a control signal is output to the suction controller 41, whereby a negative pressure is supplied into the recess 52 from the suction hole 53 of the stage 51, and the pickup point 15 The wafer sheet 13 below the semiconductor chip 14 arranged in the vacuum is sucked and fixed.

  At this time, by outputting a control signal to each of the spray control units 61 and 62 and each of the exhaust control units 81 and 82, the compressed gas 65 and 65 from each of the spray units 63 and 64 is arranged at the pickup point 15. The semiconductor chip 14 is sprayed to the left and right streets 71 and 71 of the semiconductor chip 14 at a spray angle α set at an acute angle (the spray angle α is not shown), and the compressed gas 65 sprayed from the spray parts 63 and 64 is used. Are sucked from the first and second exhaust parts 83 and 84 and discharged from the wafer sheet 13. At the same time, by outputting a control signal to the pickup control unit 21, the collet 22 that has adsorbed the semiconductor chip 14 is slightly raised.

  Then, as shown in step SB3 of FIG. 4, the compressed gas 65 blown from the first blowing portion 63 is bent from the left edge of the semiconductor chip 14 while bending the elastic wafer sheet 13 downward. It enters between the semiconductor chip 14 and the wafer sheet 13. Further, the compressed gas 65 blown from the second blowing part 64 also causes the wafer sheet 13 having elasticity to bend downward, and the semiconductor chip 14 and the wafer sheet 13 from the right edge of the semiconductor chip 14. Get in between.

  Thereby, as shown in step SB4 of FIG. 4, a gap 95 is formed between the semiconductor chip 14 and the wafer sheet 13, and the semiconductor chip 14 adhered to the wafer sheet 13 is replaced with the wafer sheet 13. The collet 22 makes it easy to pick up.

  At this time, the portion of the wafer sheet 13 located below the semiconductor chip 14 is sucked by the negative pressure supplied to the recess 52 and is pulled into the recess 52. Also by this, peeling of the semiconductor chip 14 from the wafer sheet 13 can be promoted, and the peeling time of the semiconductor chip 14 can be shortened.

Therefore, even when the enlarged semiconductor chip 14 or the thinned semiconductor chip 14 is peeled off from the wafer sheet 13 and picked up, the semiconductor chip 14 is prevented from being damaged by impact input, and the semiconductor chip 14 is prevented from being damaged. 14 can be reliably picked up, and the same effect as that of the first embodiment can be obtained.

  (Third embodiment)

  FIG. 5 is a diagram showing a third embodiment of the present invention, where parts that are the same as or equivalent to those in the first embodiment are given the same reference numerals and explanations are omitted, and parts that are different are attached. Only explained.

  That is, in the pickup apparatus 1 according to the present embodiment, a stage 51 is provided below the wafer sheet 13 as described above, and a recess 52 is formed on the upper surface of the stage 51 at the site of the pickup point 15. ing. A suction hole 53 is connected to the recess 52, and a negative pressure is supplied to the suction hole 53. Thus, when a negative pressure is supplied to the suction hole 53 by the suction control unit 41, the wafer sheet 13 is sucked and pulled into the recess 52.

  Further, through holes 97, 97 extending vertically are provided on the side of the collet 22, and the lower ends of the through holes 97, 97 are opened obliquely toward the pickup point 15 side. . Thereby, the 1st and 2nd spraying parts 63 and 64 which consist of another member used in a 1st embodiment are abolished, and the 1st and 2nd spraying parts 63 which flow hole 97 and 97 constitute are formed. , 64 are integrally formed on the side of the collet 22 to reduce the cost.

  When the pickup is started in the pickup apparatus 1, the control unit 11 outputs a control signal to the wafer ring control unit 12 to perform wafer ringing as described in step S1 of FIG. 3 of the first embodiment. Moving in the XY direction, the semiconductor chip 14 to be picked up on the wafer sheet 13 is moved in accordance with the pick-up point 15.

  In this movement process, the movement of the wafer ring is controlled so that the semiconductor chip 14 to be picked up passes under the first blowing part 63. At this time, by outputting a control signal to the first spray control unit 61, the compressed gas 65 from the first spray unit 63 is sprayed on the upper surface of the semiconductor chip 14 to be picked up.

  As a result, the upper surface of the semiconductor chip 14 to be picked up is cleaned, and the obstructive factor of the pickup due to the foreign matter adhering to the upper surface of the semiconductor chip 14 is eliminated (not shown).

  When the semiconductor chip 14 to be picked up moves to the pick-up point 15, the semiconductor chip 14 is arranged above the concave portion 52 of the stage 51 as shown in step SC <b> 1 in FIG. 5.

  In this state, a control signal is output to the pickup control unit 21, and the collet 22 moved to the pickup point 15 is lowered toward the semiconductor chip 14, and as shown in step SC2 of FIG. 5, the collet 22 With the suction surface 23 in close contact with the upper surface of the semiconductor chip 14, negative pressure is supplied to the vacuum hole 31 of the collet 22 to hold the semiconductor chip 14 on the suction surface 23. Simultaneously with the suction of the semiconductor chip 14 to the suction surface 23, a control signal is output to the suction controller 41, whereby a negative pressure is supplied into the recess 52 from the suction hole 53 of the stage 51, and the pickup point 15 The wafer sheet 13 below the semiconductor chip 14 arranged in the vacuum is sucked and fixed.

  At this time, by outputting a control signal to each of the spraying control units 61 and 62, the compressed gas 65 and 65 from each of the spraying units 63 and 64 is shown on the left side in the figure of the semiconductor chip 14 arranged at the pickup point 15 and The right streets 71 and 71 are sprayed at a spray angle α set at an acute angle (the spray angle α is not shown). At the same time, by outputting a control signal to the pickup control unit 21, the collet 22 that has adsorbed the semiconductor chip 14 is slightly raised.

  Then, as shown in step SC3 of FIG. 5, the compressed gas 65 blown from the first blowing part 63 is bent from the left edge of the semiconductor chip 14 while bending the elastic wafer sheet 13 downward. It enters between the semiconductor chip 14 and the wafer sheet 13. Further, the compressed gas 65 blown from the second blowing part 64 also causes the wafer sheet 13 having elasticity to bend downward, and the semiconductor chip 14 and the wafer sheet 13 from the right edge of the semiconductor chip 14. Get in between.

  Thereby, as shown in step SC4 in FIG. 5, a gap 95 is formed between the semiconductor chip 14 and the wafer sheet 13, and the semiconductor chip 14 adhered to the wafer sheet 13 is replaced with the wafer sheet 13. The collet 22 makes it easy to pick up.

  At this time, the portion of the wafer sheet 13 located below the semiconductor chip 14 is sucked by the negative pressure supplied to the recess 52 and is pulled into the recess 52. Also by this, peeling of the semiconductor chip 14 from the wafer sheet 13 can be promoted, and the peeling time of the semiconductor chip 14 can be shortened.

  Therefore, even when the enlarged semiconductor chip 14 or the thinned semiconductor chip 14 is peeled off from the wafer sheet 13 and picked up, the semiconductor chip 14 is prevented from being damaged by impact input, and the semiconductor chip 14 is prevented from being damaged. 14 can be reliably picked up, and the same effect as that of the first embodiment can be obtained.

It is a block diagram which shows the 1st Embodiment of this invention. It is explanatory drawing which shows the principal part of the embodiment. It is explanatory drawing which shows operation | movement of the embodiment. It is explanatory drawing which shows the operation | movement of the 2nd Embodiment of this invention. It is explanatory drawing which shows the operation | movement of the 3rd Embodiment of this invention. It is explanatory drawing which shows the principal part of the conventional pick-up apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pickup apparatus 11 Control part 13 Wafer sheet 14 Chip 21 Pickup control part 22 Collet 23 Adsorption surface 32 Air guard 61 1st spray control part 62 2nd spray control part 63 1st spray part 64 2nd spray part 65 Compressed gas 71 Street 83 First exhaust part 84 Second exhaust part 81 First exhaust control part 82 Second exhaust control part α Spray angle

Claims (6)

In the pickup device that picks up the chip attached to the sheet with a collet,
A pick-up apparatus comprising a spraying section for spraying compressed gas to the outer periphery of the chip.   The pickup device according to claim 1, wherein the spraying unit sprays compressed gas to an outer peripheral portion of the chip when the chip is attracted to the collet and pulled up.   3. The pickup device according to claim 1, wherein a blowing angle of the compressed gas by the blowing unit is set to an acute angle from obliquely above the chip periphery toward the periphery of the chip.   4. The pickup device according to claim 1, wherein a protrusion having a height smaller than a thickness of a chip to be picked up is provided on a peripheral portion of the suction surface of the collet that sucks the chip.   5. The pickup device according to claim 1, further comprising an exhaust unit that sucks the compressed gas sprayed to the outer peripheral portion of the chip and discharges the compressed gas from the sheet. The pickup device according to claim 1, wherein the spraying unit sprays compressed gas onto a chip upper surface before picking up.

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