JPH03283633A - Picking-up device for chip component - Google Patents

Abstract

PURPOSE:To shorten predetermined time needed to pick up chip components by blowing off gas from a tape adhering surface side in a direction where the tape is isolated from a collet. CONSTITUTION:Once a tape 11 to which chip components 12 are adhered and fixed is set to a pick-up device, one chip components 12 are positioned with respect to a projector part 13a and a collet 17. The tape 11 is irradiated with ultraviolet rays 20 from the projector 13a to severely reduce the adhesion of the region irradiated. In succession, the collet 17 goes down and vacuum-attract the components 12. Simultaneously, a nozzle 18 also lowers and injects N2. The adhering tape 11 located near the components 12 is biassed in a direction (downward) where it is isolated from the collet 17, and the collet 27 is biassed oppositely to the direction where gas is injected. After the components air separated from the tape 11, the nozzle 17 is elevated. With this construction, the time to pick up the chip components can be shortened with a simplified structure.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a method for peeling off chip-shaped parts such as semiconductor chips, chip capacitors, and chip resistors that are adhesively fixed to an adhesive tape such as an expandable tape from the adhesive tape. Regarding the device for picking up.

[Conventional technology]

When picking up chip-like parts that are adhesively fixed on an adhesive tape by peeling them off one by one from the adhesive tape, the adhesive strength of the adhesive tape is reduced by irradiating the part of the adhesive tape where the chip parts are fixed with ultraviolet rays. and
A chip-shaped component fixed to an adhesive tape is pushed up from the opposite side of the adhesive tape to partially peel it off from the adhesive tape.

A pickup device shown in FIG. 2 is known as a device that performs such work. In the pickup device shown in this figure, ultraviolet rays 4 are irradiated by ultraviolet irradiation means 3 to a portion of adhesive tape 1 to which chip-shaped component 2 is fixed, and the adhesive force of adhesive tape 1 is partially reduced.

Then, after the chip-shaped component 2 fixed to the part where the adhesive force has decreased is moved and positioned with respect to the push-up pin 5, the chip-shaped component 2 is pushed up from the back side of the adhesive tape 1 by the push-up pin 5. , the adhesive tape 1 is partially peeled off. At the same time, the chip-shaped component 2 is held by the suction collet 6 and picked up from the adhesive tape 1.

[Problem to be solved by the invention]

However, with the above-mentioned pickup device, it is not possible to simultaneously reduce the adhesive strength of the adhesive tape 1 by irradiating it with ultraviolet rays and partially peel off the chip-shaped component 2 from the adhesive tape using the push-up pin. It is necessary to move and position the chip-shaped component 2 between the irradiation position and the push-up position. It is preferable if the ultraviolet irradiation work and the peeling work using push-up pins can be performed simultaneously in one step, since the time required to pick up the chip-shaped parts can be shortened.

In order to be able to perform these operations simultaneously, it is conceivable to arrange the ultraviolet ray irradiation means and the push-up pin in one place and irradiate the adhesive tape with ultraviolet rays from behind the push-up pin.

However, in this case, the shadow of the push-up pin is formed on the adhesive tape, and some parts are not irradiated with ultraviolet rays, making it impossible to reduce the adhesive force sufficiently. Further, the combination of the ultraviolet irradiation means and the push-up pin is undesirable because the structure becomes complicated.

Therefore, in view of the above-mentioned circumstances, an object of the present invention is to provide a pickup device that does not have a complicated structure and can shorten the time required to pick up chip-shaped components.

[Means to solve the problem]

In order to achieve the above-mentioned object, the pickup device according to the present invention is equipped with a gas blowing means for blowing gas onto the adhesive tape from the adhesive side thereof to urge the adhesive tape in a direction away from the collet. ing.

[Effect]

With this configuration, the chip-like component can be peeled off from the adhesive tape by working from the adhesive surface side to which the chip-like component is adhesively fixed.

〔Example〕

Embodiments of the present invention will be described below with reference to FIG.

FIG. 1 is a partially cutaway side view schematically showing characteristic parts of a pickup device according to an embodiment of the present invention. The illustrated pickup device includes ultraviolet irradiation means 13. The ultraviolet irradiation means 13 applies adhesive tape to each part of the adhesive tape 11, such as an expandable tape, to which a plurality of chip-like parts 12 such as semiconductor chips are fixed. Ultraviolet rays 20 are irradiated as energy rays that reduce the force. The ultraviolet irradiation means 13 includes, for example, a light source (not shown) that emits ultraviolet light, a light guide 15 optically coupled to the light source at one end, and a light guide 15 provided at the other end of the light guide 15.
and a lens 16 that focuses the ultraviolet rays guided by the adhesive tape 11 onto the adhesive tape 11.

A collet 17 is disposed at a distance from and facing the light projecting section 13a of the ultraviolet irradiation means 13, which is constituted by the other end of the light guide 15 and the lens 16. The collet 17 has a structure for arranging the chip-shaped component 12 by vacuum suction, and its structure itself is conventionally known.

An adhesive tape 11 is attached between the ultraviolet irradiation means 13 and the collet 17 of the pickup device, and the adhesive tape 11 to which a plurality of chip-shaped parts 12 are adhesively fixed is attached to the back surface (chip the side on which the shaped part 12 is not fixed) is connected to the light emitting part 1 of the ultraviolet irradiation means 13.
It is attached to the pickup device in a state facing 3a. The adhesive tape 11 is made of a light-transmitting resin or the like, and its adhesive surface is coated with an adhesive whose adhesive strength decreases when irradiated with ultraviolet rays. Therefore, the adhesive force of the adhesive surface is reduced by being irradiated with ultraviolet rays from the back side.

Adhesive tape 11 is attached to the side near the lower end of the collet 17.
A nozzle 18 is provided that sprays a gas such as dry air or N2 gas onto the adhesive surface of the collet 17 to urge the adhesive tape 11 away from the collet 17. The nozzle 18 can move up and down together with the collet, and the collet 17
The collet 17 and the nozzle 18 are moved up and down by driving means (not shown), respectively. This nozzle 18 communicates with a gas source such as a near compressor or a gas tank via a control valve, and high pressure gas such as dry air or N2 gas is supplied from this gas source to the nozzle 18 through piping such as a gas tube. Then, the gas guided to the nozzle 18 is blown from the lower end of the nozzle 18 against the adhesive surface of the adhesive tape.

Next, the operation of the above-mentioned pickup device will be explained. First, as shown in FIG. 1, when the adhesive tape 11 on which a plurality of chip-shaped components 12 are adhesively fixed is set in the pickup device, the chip-shaped components are Part 12 is positioned.

Then, ultraviolet rays 20 are irradiated from the light projecting section 13a to the adhesive tape 11 at the portion where the chip-shaped component 12 is fixed. As a result, the adhesive strength of the portion exposed to ultraviolet rays decreases. In this example, it was possible to reduce the adhesive strength of the adhesive tape 11 from 20 g/dragon to 1 g/dragon 2 or less. The collet 17 descends from above and vacuum-chucks the chip-shaped component 12. At the same time as the collet 17 descends, the nozzle 18 also descends, and gas such as N2 gas is sprayed from the nozzle 18 onto the adhesive tape 11 from its adhesive side. As a result, the adhesive tape 11 near the chip-shaped component 12 held by the collet 17 is urged in a direction (downward in the drawing) away from the collet 17. Then, the collet 17 causes gas to be ejected from the nozzle 18. The adhesive tape 11 is driven in the opposite direction (upward in the drawing) relative to the nozzle 18. In this way, the adhesive tape 11 is smoothly peeled off from the outer periphery of the chip-shaped component 12 held by the collet 17. After the chip-like component 12 is peeled off from the adhesive tape 11, the nozzle 1
8 is driven upward from the lower end surface of the collet 17. This is because if the nozzle 18 continues to protrude downward from the lower end surface of the collet 17, the nozzle 18 will get in the way during subsequent bonding and the like. The chip-shaped component 12 picked up from the adhesive tape 11 in this way is die-bonded to a predetermined substrate or the like, or is stored in a predetermined tray.

The above-described operation is then repeated in sequence for each chip-shaped component 12 adhesively fixed on the adhesive tape 11.

By the way, in the above-mentioned embodiments, ultraviolet rays are used as the energy rays, but it is preferable to use energy rays that can efficiently reduce the adhesive force depending on the adhesive used in the adhesive tape. For example, For adhesive tapes coated with adhesives whose adhesive strength is effectively reduced by irradiation with infrared rays, it is preferable to use infrared rays as the energy beam.

〔Effect of the invention〕

As explained above, according to the present invention, the work of peeling the chip-like component from the adhesive tape can be performed from the adhesive side of the adhesive tape to which the chip-like component is adhesively fixed. Therefore, the work of reducing the adhesive strength of the adhesive tape by irradiating energy rays such as ultraviolet rays from the side opposite to the adhesive side of the adhesive tape, and the work of peeling the chip-shaped parts from the adhesive tape from both sides of the adhesive tape are performed simultaneously. This makes it possible to reduce the time required to pick up chip-shaped parts.

Furthermore, unlike the case in which the push-up pins and the ultraviolet ray irradiation means are formed in combination, the gas blowing means and the energy ray irradiation means are arranged separately on both sides of the adhesive tape, even though the respective operations are performed simultaneously. Since the energy beam irradiation means and the gas blowing means are formed in combination and there is no need to arrange them on one side of the adhesive tape, the structure of the pickup device does not become complicated.

Furthermore, even if the work to reduce the adhesive strength and the work to peel the chip-like parts from the adhesive tape are performed at the same time, there will be no areas that are not exposed to UV rays due to shadows of push-up pins, and the adhesive strength will always be maintained. It can be lowered sufficiently. Therefore, the chip-shaped component can be smoothly peeled off from the adhesive tape, and almost no adhesive remains attached to the chip-shaped component that has been peeled off.

In addition, in the past, when a chip-like part was pushed up by a push-up bin, the chip-like part would tilt and be held by the collet in the tilted state, or chipping (chipping) would occur in the chip-like part. , such problems no longer occur.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway side view showing an embodiment of a pickup device according to the present invention, and FIG. 2 is a partially cutaway side view showing a conventional pickup device. 11... Adhesive tape, 12... Chip-shaped component, 13
...Ultraviolet irradiation means, 13a...Light projection part, 15...
・Light guide, 16... Lens, 17... Collet, 18... Nozzle, 20... Ultraviolet light. Actual 7i value example Figure 1

Claims (1)

[Scope of Claims] A device for picking up a chip-shaped component adhesively fixed to the adhesive surface of an adhesive tape whose adhesive strength is reduced by irradiation with energy rays by holding it with a collet and peeling it off from the adhesive tape, the device comprising: A pick-up device for chip-shaped parts, comprising a gas blowing means for blowing gas onto the tape from the adhesive side thereof to urge the adhesive tape in a direction away from the collet.