KR100505340B1 - Device and method for pick up semiconductor chip - Google Patents
Device and method for pick up semiconductor chip Download PDFInfo
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- KR100505340B1 KR100505340B1 KR10-2000-0016177A KR20000016177A KR100505340B1 KR 100505340 B1 KR100505340 B1 KR 100505340B1 KR 20000016177 A KR20000016177 A KR 20000016177A KR 100505340 B1 KR100505340 B1 KR 100505340B1
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- semiconductor chip
- mounting tape
- pick
- vacuum
- tool
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F11/00—Treatment of sludge; Devices therefor
- C02F11/12—Treatment of sludge; Devices therefor by de-watering, drying or thickening
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/02—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B2200/00—Drying processes and machines for solid materials characterised by the specific requirements of the drying good
- F26B2200/18—Sludges, e.g. sewage, waste, industrial processes, cooling towers
Abstract
본 발명은 웨이퍼 상태로부터 소잉되어 마운팅 테이프에 부착되어 있는 개개의 칩을 용이하게 떼어낼 수 있도록 한 반도체 칩 부착장치에 관한 것으로서, 진공홀을 갖는 픽업툴의 주변으로 저면에 에어배출홈을 갖는 에어 블로워 하우징을 형성하여, 반도체 칩에 대한 진공흡착과 동시에 반도체 칩 주변의 마운팅 테이프면에 공기압를 불어줌으로써, 마운팅 테이프로부터 반도체 칩을 용이하게 떼어낼 수 있도록 한 반도체 칩 픽업장치 및 방법을 제공하고자 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor chip attachment device that can be easily removed from a wafer state and attached to a mounting tape, wherein the air has an air discharge groove at the bottom of a pickup tool having a vacuum hole. It is to provide a semiconductor chip pick-up apparatus and method for forming a blower housing, and at the same time by vacuum adsorption to the semiconductor chip and blowing air pressure to the surface of the mounting tape around the semiconductor chip, so that the semiconductor chip can be easily removed from the mounting tape. .
Description
본 발명은 반도체 칩 픽업 장치 및 방법에 관한 것으로서, 웨이퍼 상태로부터 소잉되어 마운팅 테이프에 부착되어 있는 개개의 칩을 용이하게 떼어낼 수 있도록 한 반도체 칩 픽업 장치 및 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip pick-up apparatus and method, and more particularly, to a semiconductor chip pick-up apparatus and method that can be easily detached from a wafer state and attached to a mounting tape.
통상적으로 반도체 패키지는 웨이퍼를 개개의 칩으로 소잉하는 공정과, 소잉된 개개의 칩을 부재의 칩탑재영역에 부착하는 공정과, 칩탑재영역에 부착된 반도체 칩의 본딩패드와 부재의 와이어 본딩영역간을 와이어로 본딩하는 공정과, 반도체 칩과 와이어등을 외부로 부터 보호하기 위하여 수지로 몰딩하는 공정등으로 제조된다.In general, a semiconductor package includes a step of sawing a wafer into individual chips, a step of attaching the sawed individual chips to a chip mounting region of the member, and a bonding pad of the semiconductor chip attached to the chip mounting region and the wire bonding region of the member. And a process of molding with a resin in order to protect the semiconductor chip and the wire from the outside, and the like.
상기 웨이퍼로부터 소잉된 개개의 반도체 칩은 일단 접착력을 갖는 마운팅 테이프에 부착되어 있는 상태로서, 부재의 칩탑재영역에 칩을 부착하는 공정시, 상기 개개의 칩은 첨부한 도 3에 도시한 바와 같이 저면에 진공홀(20)을 갖는 픽업툴(18)의 진공흡착으로 마운팅 테이프(12)로부터 하나씩 떼내어지는 동시에 칩탑재영역으로 이동되어 부착된다.Each semiconductor chip sawed from the wafer is once attached to a mounting tape having an adhesive force. In the process of attaching the chip to the chip mounting region of the member, the individual chips are attached as shown in FIG. The vacuum suction of the pick-up tool 18 having the vacuum hole 20 at the bottom thereof is detached one by one from the mounting tape 12 and moved to and attached to the chip mounting area.
이때, 마운팅 테이프에 부착되어 있는 반도체 칩이 두꺼운 사양인 경우에는 반도체 칩이 픽업툴에 의하여 용이하게 진공으로 흡착되지만, 칩의 두께가 얇고 마운팅 테이프의 접착력이 큰 경우에는 픽업툴에 의하여 진공흡착되는 충격을 이기지 못하고 칩이 깨지게 되는 문제점이 있었다.At this time, when the semiconductor chip attached to the mounting tape has a thick specification, the semiconductor chip is easily adsorbed by the vacuum by the pickup tool, but when the chip is thin and the adhesive force of the mounting tape is large, the vacuum chip is sucked by the pickup tool. There was a problem that the chip is broken without a shock.
따라서, 본 발명은 상기와 같은 점을 감안하여, 진공홀을 갖는 픽업툴의 주변으로 저면에 에어배출홈을 갖는 에어 블로워 하우징을 형성하여, 반도체 칩에 대한 진공흡착과 동시에 반도체 칩 주변의 마운팅 테이프면에 공기압를 불어줌으로써, 마운팅 테이프로부터 반도체 칩을 용이하게 떼어낼 수 있도록 한 반도체 칩 픽업장치 및 방법을 제공하는데 그 목적이 있다. Therefore, in view of the above, the present invention forms an air blower housing having an air discharge groove on the bottom of the pick-up tool having a vacuum hole, and at the same time vacuum suction of the semiconductor chip, and a mounting tape around the semiconductor chip. SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor chip pick-up apparatus and a method which makes it possible to easily detach a semiconductor chip from a mounting tape by blowing air pressure onto the surface.
이하, 본 발명을 첨부도면을 참조로 상세하게 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
본 발명의 장치는 반도체 칩(10)을 진공으로 흡착하도록 저면에 진공홀(20)이 형성된 픽업툴(18)과, 이 픽업툴(18)의 진공홀(20)로 진공을 제공하는 수단으로 구성된 반도체 칩 픽업장치에 있어서, 상기 픽업툴(18)의 사방 주변에 에어공급수단과 연결되며 다수의 에어 배출홈(24)이 저면에 형성된 에어 블로워 하우징(22)을 형성한 것을 특징으로 한다.The apparatus of the present invention is a pickup tool (18) having a vacuum hole (20) formed at the bottom to suck the semiconductor chip (10) by vacuum, and means for providing a vacuum to the vacuum hole (20) of the pickup tool (18). In the configured semiconductor chip pick-up device, it is characterized in that the air blower housing 22 is formed on the bottom of the pick-up tool 18 and connected to the air supply means around the plurality of air discharge grooves 24.
본 발명의 방법은 마운팅테이프에 웨이퍼를 부착하는 공정과, 웨이퍼를 개개의 칩을 소잉하는 공정과, 마운팅테이프를 늘려서 개개의 칩 간격을 넓혀주는 공정과, 마운팅테이프의 저면을 니들핀으로 눌러서 칩의 테두리 저면이 마운팅테이프로부터 분리되도록 하는 동시에 칩의 상면을 픽업툴로 진공흡착시켜 마운팅테이프로부터 완전히 분리하는 공정으로 이루어진 반도체 칩 픽업 방법에 있어서, 상기 칩(10)의 상면을 픽업툴(18)로 진공흡착하는 공정과 동시에 칩(10) 주변의 마운팅테이프(12)면에 대하여 에어를 불어줌으로써, 반도체 칩(10)이 마운팅테이프(12)로부터 용이하게 분리되도록 한 것을 특징으로 한다.The method of the present invention comprises the steps of attaching the wafer to the mounting tape, sawing the wafer into individual chips, extending the mounting tape to widen the individual chip spacing, and pressing the bottom surface of the mounting tape with a needle pin. In the semiconductor chip pick-up method, the bottom surface of the chip is separated from the mounting tape and the upper surface of the chip is vacuum-adsorbed with the pick-up tool to completely separate the mounting tape from the mounting tape. The semiconductor chip 10 is easily separated from the mounting tape 12 by blowing air to the surface of the mounting tape 12 around the chip 10 at the same time as the vacuum suction process.
여기서 본 발명을 실시예로서, 첨부도면을 참조로 더욱 상세하게 설명하면 다음과 같다.Herein, the present invention will be described in more detail with reference to the accompanying drawings.
첨부한 도 1a,1b는 본 발명에 따른 반도체 칩 픽업장치를 나타내는 일부 단면 사시도로서, 상기 반도체 칩 부착장치는 진공을 제공하는 수단과, 이 진공을 제공하는 수단과 연결되도록 중앙에 관통홀이 형성되고 고무 재질로 된 저면 중앙에 진공홀(20)이 형성된 픽업툴(18)로 구성되되, 상기 픽업툴(18)의 사방 주변으로 일정공간을 갖으며 저면에는 다수의 에어 배출홈(24)이 등간격으로 형성된 에어블로워 하우징(22)이 일체로 형성되어 달성된다.1A and 1B are partial cross-sectional perspective views showing a semiconductor chip pick-up apparatus according to the present invention, wherein the semiconductor chip attaching apparatus has a means for providing a vacuum and a through hole formed at the center thereof to be connected to the means for providing the vacuum. And a pickup tool 18 in which a vacuum hole 20 is formed at the center of the bottom of the rubber material, and has a predetermined space around all sides of the pickup tool 18, and a plurality of air discharge grooves 24 are formed on the bottom of the pickup tool 18. The air blower housing 22 formed at equal intervals is formed integrally.
또한, 상기 에어블로워 하우징(22)의 상부는 에어공급수단과 연결되도록 개방되어 형성된다.In addition, the upper portion of the air blower housing 22 is open to be connected to the air supply means.
여기서 상기와 같이 설치된 반도체 칩 픽업장치에 의하여 이루어지는 반도체 칩 부착공정을 첨부한 도 2를 참조로 설명하면 다음과 같다.Referring to FIG. 2 with the semiconductor chip attaching process performed by the semiconductor chip pick-up apparatus installed as described above as follows.
먼저, 반도체 칩(10)의 재료가 되는 웨이퍼(14)를 마운팅테이프(12)에 접착한 후, 개개의 칩으로 소잉(sawing)을 하고, 마운팅테이프 늘림수단(26)으로 상기 마운팅테이프(12)를 사방으로 당기게 되면, 소잉된 개개의 반도체 칩(10)의 간격이 더 크게 벌어진다.First, the wafer 14, which is a material of the semiconductor chip 10, is adhered to the mounting tape 12, and then sawing is performed with individual chips, and the mounting tape 12 is stretched by the mounting tape extension means 26. ), The gap between the sawed individual semiconductor chips 10 becomes larger.
상기와 같은 상태에서, 마운팅테이프(12)의 저면을 니들핀(16)으로 밀어 올리게 되면, 해당 위치에 부착되어 있는 반도체 칩(10)의 저면중 사방 테두리면은 마운팅테이프(12)로부터 떨어지게 되고, 중앙 저면은 계속 마운팅테이프(12)에 부착된 상태가 된다.In the above state, when the bottom surface of the mounting tape 12 is pushed up with the needle pin 16, all four edges of the bottom surface of the semiconductor chip 10 attached to the corresponding position are separated from the mounting tape 12. , The center bottom is still attached to the mounting tape 12.
이와 동시에, 저면의 사방 테두리면이 마운팅테이프(12)로부터 떨어진 상태로 있는 상기 반도체 칩(10)의 상면에 반도체 칩 부착장치의 픽업툴(18)을 밀착시키는 바, 즉 픽업툴(18)의 저면에 형성된 진공홀(20)이 밀착되도록 하여 진공흡착을 실시함으로써, 반도체 칩의 중앙 저면도 마운팅테이프(12)로부터 분리된다.At the same time, the pick-up tool 18 of the semiconductor chip attaching device is brought into close contact with the upper surface of the semiconductor chip 10 with the four-sided edges of the bottom face away from the mounting tape 12. By performing vacuum suction by bringing the vacuum holes 20 formed in the bottom surface into close contact with each other, the center bottom surface of the semiconductor chip is also separated from the mounting tape 12.
이때, 진공흡착으로 반도체 칩(10)을 마운팅 테이프(12)로부터 분리됨을 보조하여 반도체 칩(10)이 더욱 용이하게 분리되도록 상기 진공흡착과 동시에 상기 픽업툴(18)의 사방에 형성된 에어 블로워 하우징(22)으로 에어공급수단에 의하여 에어가 공급되고, 이 에어는 에어배출홈(24)으로 빠져나가 반도체 칩의 사방 주변, 즉 마운팅 테이프면에 에어압으로 작용하게 된다.At this time, the air blower housing formed on all sides of the pick-up tool 18 simultaneously with the vacuum suction so as to assist the semiconductor chip 10 to be separated from the mounting tape 12 by vacuum suction so that the semiconductor chip 10 is more easily separated. Air is supplied to the air by the air supply means, and the air escapes to the air discharge groove 24 to act as air pressure on all sides of the semiconductor chip, that is, on the mounting tape surface.
좀 더 상세하게는, 반도체 칩(10)의 상면에는 진공흡착으로 상방향으로 이동하는 모멘트가 작용되고, 반도체 칩(10)이 부착된 마운팅테이프(12)에는 에어압에 의하여 하방향으로 이동하는 모멘트가 작용된다.In more detail, a moment moving upwards by vacuum suction is applied to the upper surface of the semiconductor chip 10, and downward movement by air pressure is applied to the mounting tape 12 to which the semiconductor chip 10 is attached. The moment is applied.
따라서, 상기 마운팅테이프(12)상의 반도체 칩(10)은 픽업툴(18)의 진공흡착과 에어배출홈으로 빠져나와 마운팅테이프(12)면에 작용하는 에어압으로 인하여 더욱 용이하게 분리된다.Therefore, the semiconductor chip 10 on the mounting tape 12 is more easily separated due to the vacuum suction of the pick-up tool 18 and the air pressure acting on the surface of the mounting tape 12 by escaping to the air discharge groove.
이에따라, 두께, 크기, 무게에 따른 각종 사양의 반도체 칩이라도 상기와 같은 진공흡착 외에 마운팅테이프면에 작용되는 에어압으로 인하여 마운팅테이프(12)로부터 용이하게 분리시킬 수 있다.Accordingly, even semiconductor chips having various specifications according to thickness, size, and weight can be easily separated from the mounting tape 12 due to the air pressure applied to the mounting tape surface in addition to the vacuum adsorption as described above.
다음으로, 상기 마운팅테이프(12)에서 용이하게 분리된 반도체 칩(10)을 진공 흡착으로 고정하고 있는 픽업툴(18)이 부재의 칩탑재영역으로 이동을 하여 반도체 칩을 부착하는 공정이 실시된다.Next, a process of attaching the semiconductor chip by moving the pick-up tool 18 which secures the semiconductor chip 10 easily separated from the mounting tape 12 by vacuum adsorption to the chip mounting region of the member is performed. .
이상에서 본 바와 같이, 본 발명에 따른 반도체 칩 픽업장치 및 방법에 의하면 진공홀을 갖는 반도체 칩 부착장치의 픽업툴 주변으로 저면에 에어배출홈을 갖는 에어 블로워 하우징을 형성하여, 반도체 칩에 대한 진공홀의 진공흡착과, 반도체 칩 주변의 마운팅 테이프면에 작용되도록 에어배출홈으로 배출된 공기압에 의하여 마운팅 테이프로부터 반도체 칩을 손상됨없이 용이하게 떼어낼 수 있는 효과가 있다.As described above, according to the semiconductor chip pick-up apparatus and method according to the present invention by forming an air blower housing having an air discharge groove on the bottom around the pickup tool of the semiconductor chip attachment device having a vacuum hole, vacuum for the semiconductor chip There is an effect that the semiconductor chip can be easily removed from the mounting tape by the vacuum suction of the hole and the air pressure discharged into the air discharge groove to act on the surface of the mounting tape around the semiconductor chip.
도 1a,1b는 본 발명에 따른 반도체 칩 픽업 장치를 나타내는 사시도,1A and 1B are perspective views illustrating a semiconductor chip pickup device according to the present invention;
도 2는 본 발명에 따른 반도체 칩 픽업 장치의 작동상태를 순서대로 나타낸 도면,2 is a view showing in sequence the operating state of the semiconductor chip pickup device according to the present invention;
도 3은 종래의 반도체 칩 픽업 장치와 그 사용상태를 나타내는 단면도.3 is a cross-sectional view showing a conventional semiconductor chip pickup device and its use state.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
10 : 반도체 칩 12 : 마운팅 테이프10 semiconductor chip 12 mounting tape
14 : 웨이퍼 16 : 니들핀14 wafer 16 needle pin
18 : 픽업툴(Pick-up tool) 20 : 진공홀18: Pick-up tool 20: Vacuum hole
22 : 에어 블로워 하우징(Air blower housing)22: air blower housing
24 : 에어 배출홈 26 : 마운팅테이프 늘림수단24: air discharge groove 26: mounting tape extension means
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0016177A KR100505340B1 (en) | 2000-03-29 | 2000-03-29 | Device and method for pick up semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0016177A KR100505340B1 (en) | 2000-03-29 | 2000-03-29 | Device and method for pick up semiconductor chip |
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| Publication Number | Publication Date |
|---|---|
| KR20010093521A KR20010093521A (en) | 2001-10-29 |
| KR100505340B1 true KR100505340B1 (en) | 2005-08-04 |
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| KR10-2000-0016177A KR100505340B1 (en) | 2000-03-29 | 2000-03-29 | Device and method for pick up semiconductor chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100796189B1 (en) * | 2006-03-23 | 2008-01-21 | 한미반도체 주식회사 | Tape attach equipment for semiconductor production |
| KR101322571B1 (en) * | 2012-05-02 | 2013-10-28 | 세메스 주식회사 | Apparatus for picking up semiconductor devices |
| KR101322531B1 (en) * | 2012-05-21 | 2013-10-28 | 세메스 주식회사 | Apparatus for picking up semiconductor devices |
| WO2020262729A1 (en) * | 2019-06-26 | 2020-12-30 | 주식회사 윈텍오토메이션 | Composite tool system of product transfer device for press molding of carbide insert |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5587454A (en) * | 1978-12-26 | 1980-07-02 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPH03283633A (en) * | 1990-03-30 | 1991-12-13 | Sumitomo Electric Ind Ltd | Picking-up device for chip component |
| KR960005682U (en) * | 1994-07-30 | 1996-02-17 | Ignition display circuit of gas stove | |
| KR0150704B1 (en) * | 1995-06-29 | 1998-12-01 | 김광호 | A semiconductor separation apparatus and separation method |
| KR20000046802A (en) * | 1998-12-31 | 2000-07-25 | 김영환 | Apparatus for picking up semiconductor chip |
-
2000
- 2000-03-29 KR KR10-2000-0016177A patent/KR100505340B1/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5587454A (en) * | 1978-12-26 | 1980-07-02 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPH03283633A (en) * | 1990-03-30 | 1991-12-13 | Sumitomo Electric Ind Ltd | Picking-up device for chip component |
| KR960005682U (en) * | 1994-07-30 | 1996-02-17 | Ignition display circuit of gas stove | |
| KR0150704B1 (en) * | 1995-06-29 | 1998-12-01 | 김광호 | A semiconductor separation apparatus and separation method |
| KR20000046802A (en) * | 1998-12-31 | 2000-07-25 | 김영환 | Apparatus for picking up semiconductor chip |
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| Publication number | Publication date |
|---|---|
| KR20010093521A (en) | 2001-10-29 |
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