JPS5587454A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5587454A JPS5587454A JP16232278A JP16232278A JPS5587454A JP S5587454 A JPS5587454 A JP S5587454A JP 16232278 A JP16232278 A JP 16232278A JP 16232278 A JP16232278 A JP 16232278A JP S5587454 A JPS5587454 A JP S5587454A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- bonding
- semiconductors
- glued
- result
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To ease the peeling by weakening the bonding effect as the result of cooling off the lower face of the bonding tape on which semiconductors are glued.
CONSTITUTION: A liquid nitrogen 11 is blown up to the lower part of a bonding tape 2 where a number of semiconductors are glued, through a nozzle 9 provided with a mesh 10 being largely opened at the top end. As the result, the bonding strength of the tape 2 is weakened so that the semiconductor 1 can be peeled off from the tape easily by means of a vaccume pincette 6, while there is no variation in the diode pitch due to the local elongation of the tape.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16232278A JPS5587454A (en) | 1978-12-26 | 1978-12-26 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16232278A JPS5587454A (en) | 1978-12-26 | 1978-12-26 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5587454A true JPS5587454A (en) | 1980-07-02 |
Family
ID=15752320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16232278A Pending JPS5587454A (en) | 1978-12-26 | 1978-12-26 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5587454A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094841U (en) * | 1983-12-02 | 1985-06-28 | 日本電気株式会社 | semiconductor manufacturing equipment |
| JPS6392038A (en) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | Chip feeding method |
| KR100378094B1 (en) * | 1998-11-02 | 2003-06-02 | 앰코 테크놀로지 코리아 주식회사 | Method and apparatus for manufacturing a semiconductor package |
| KR100505340B1 (en) * | 2000-03-29 | 2005-08-04 | 앰코 테크놀로지 코리아 주식회사 | Device and method for pick up semiconductor chip |
-
1978
- 1978-12-26 JP JP16232278A patent/JPS5587454A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094841U (en) * | 1983-12-02 | 1985-06-28 | 日本電気株式会社 | semiconductor manufacturing equipment |
| JPS6392038A (en) * | 1986-10-06 | 1988-04-22 | Matsushita Electric Ind Co Ltd | Chip feeding method |
| KR100378094B1 (en) * | 1998-11-02 | 2003-06-02 | 앰코 테크놀로지 코리아 주식회사 | Method and apparatus for manufacturing a semiconductor package |
| KR100505340B1 (en) * | 2000-03-29 | 2005-08-04 | 앰코 테크놀로지 코리아 주식회사 | Device and method for pick up semiconductor chip |
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