JPS6094841U

JPS6094841U - semiconductor manufacturing equipment

Info

Publication number: JPS6094841U
Application number: JP18665383U
Authority: JP
Inventors: 小杉　勝正; 船戸　裕和
Original assignee: 日本電気株式会社; 日本電気エンジニアリング株式会社
Priority date: 1983-12-02
Filing date: 1983-12-02
Publication date: 1985-06-28

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図ａ、　ｂは従来突き上げ機構による突き上げ工程
の正面図である。第２図ａ、　ｂは本考案の一実施例に
よる半導体素子を突き上げる場合の工程正面図、第３図
ａ、　ｂは本考案の一実施例に対する第２図ａ、　ｂの
半導体素子とは異なる形状の。半導体素子を突き上げる場合の工程正面図であ′る。１・・・・・・突き上げ軸、２・・・・・・突き上げ針
、３・・・・・・突き上げユニット、４・・・・・・粘
着テープ、５・・・・・・−膜形状の半導体素子、６・
・・・・・突き上げユニットを固定しているベース、７
・・・・・・突き上げ回転用軸、８ａ・・・・・・二般
的突き上げユニット、８ｂ・・・・・・異形状突き上げ
ユニット、９ａ・・・・・・一般的突き上げ、針、９ｂ
・・・・・・２本以上具備、した突き上げ針、１０・・
・・・・９０度回転用駆動装置、１１・・・・・・上下
スライダ一部、１２・・・・・・１８０度回転用駆動装
置、１３・・・・・・シャフト、１４・・・・・・ベア
リング、１５・・・・・・突き上　　・　゛げ機構を固
定するベース、１６ａ・・・・・・一般的半導体素子、
１６ｂ・・・・・・異形状半導体素子、１７・・・・・
・粘着テープ、１８・・・・・・粘着テープが張り付け
であるエキスバンドリングの載置台。FIGS. 1a and 1b are front views of a push-up process using a conventional push-up mechanism. Figures 2a and b are front views of the process when pushing up a semiconductor device according to an embodiment of the present invention, and Figures 3a and b are different from the semiconductor elements shown in Figures 2a and b for an embodiment of the present invention. of shape. FIG. 6 is a front view of a process in which a semiconductor element is pushed up. 1... Push-up shaft, 2... Push-up needle, 3... Push-up unit, 4... Adhesive tape, 5... Film shape semiconductor device, 6.
...Base that fixes the push-up unit, 7
.... Push-up rotation shaft, 8a... Two general push-up units, 8b... Irregular-shaped push-up unit, 9a... General push-up, needle, 9b
...Equipped with 2 or more push-up needles, 10...
...Drive device for 90 degree rotation, 11...Part of upper and lower slider, 12...Drive device for 180 degree rotation, 13...Shaft, 14... ...Bearing, 15...Base for fixing the push-up and tilting mechanism, 16a...General semiconductor element,
16b... Unusual shaped semiconductor element, 17...
・Adhesive tape, 18... A mounting stand for extractor rings that are attached with adhesive tape.

Claims

[Scope of utility model registration request]

(1) In a semiconductor manufacturing device equipped with a semiconductor element attached to an adhesive tape and a push-up mechanism for peeling the semiconductor element from the adhesive tape, the semiconductor element is pushed from below the adhesive tape. A semiconductor manufacturing device characterized by having at least two lifting rods.

(2) There are two push-up rods with different numbers or intervals.
2. The semiconductor manufacturing apparatus according to claim 1, wherein more than one set of push-up rods are prepared, and the push-up rods of each set can be cut and used according to the shape of the semiconductor element.