JPS53144262A - Bonding unit for semiconductor device - Google Patents

Bonding unit for semiconductor device

Info

Publication number
JPS53144262A
JPS53144262A JP5875777A JP5875777A JPS53144262A JP S53144262 A JPS53144262 A JP S53144262A JP 5875777 A JP5875777 A JP 5875777A JP 5875777 A JP5875777 A JP 5875777A JP S53144262 A JPS53144262 A JP S53144262A
Authority
JP
Japan
Prior art keywords
semiconductor device
bonding unit
junction
timing load
ensure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5875777A
Other languages
Japanese (ja)
Other versions
JPS5933259B2 (en
Inventor
Kenji Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP52058757A priority Critical patent/JPS5933259B2/en
Publication of JPS53144262A publication Critical patent/JPS53144262A/en
Publication of JPS5933259B2 publication Critical patent/JPS5933259B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To ensure a good-quality and high-speed junction by reducing the timing load at the minimum limit (lowest point of junction capillary) of the timing load.
COPYRIGHT: (C)1978,JPO&Japio
JP52058757A 1977-05-23 1977-05-23 Bonding equipment for semiconductor devices Expired JPS5933259B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52058757A JPS5933259B2 (en) 1977-05-23 1977-05-23 Bonding equipment for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52058757A JPS5933259B2 (en) 1977-05-23 1977-05-23 Bonding equipment for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS53144262A true JPS53144262A (en) 1978-12-15
JPS5933259B2 JPS5933259B2 (en) 1984-08-14

Family

ID=13093399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52058757A Expired JPS5933259B2 (en) 1977-05-23 1977-05-23 Bonding equipment for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5933259B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary
JP2022057676A (en) * 2020-09-30 2022-04-11 キヤノントッキ株式会社 Film deposition device, adjusting method, and electronic device manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary
JPS6229896B2 (en) * 1981-05-15 1987-06-29 Shinkawa Kk
JP2022057676A (en) * 2020-09-30 2022-04-11 キヤノントッキ株式会社 Film deposition device, adjusting method, and electronic device manufacturing method

Also Published As

Publication number Publication date
JPS5933259B2 (en) 1984-08-14

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