JPS6229896B2 - - Google Patents

Info

Publication number
JPS6229896B2
JPS6229896B2 JP56074027A JP7402781A JPS6229896B2 JP S6229896 B2 JPS6229896 B2 JP S6229896B2 JP 56074027 A JP56074027 A JP 56074027A JP 7402781 A JP7402781 A JP 7402781A JP S6229896 B2 JPS6229896 B2 JP S6229896B2
Authority
JP
Japan
Prior art keywords
capillary
motor
bonding
head frame
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56074027A
Other languages
Japanese (ja)
Other versions
JPS57188839A (en
Inventor
Nobuhito Yamazaki
Kazuo Sugiura
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56074027A priority Critical patent/JPS57188839A/en
Publication of JPS57188839A publication Critical patent/JPS57188839A/en
Publication of JPS6229896B2 publication Critical patent/JPS6229896B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/786Means for supplying the connector to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 本発明はワイヤボンデイング装置においてキヤ
ピラリを上下動させるキヤピラリ上下動機構に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a capillary vertical movement mechanism for vertically moving a capillary in a wire bonding apparatus.

従来、かかるキヤピラリ上下動機構として、特
開昭54−154273号公報及び特開昭55−24403号公
報に示すものが知られている。この構造はキヤピ
ラリを保持したボンデイングアームが上下動ブロ
ツクに回転自在に保持され、この上下動ブロツク
がモータによつて回転させられる雄ねじブロツク
に螺合して上下動させられる雌ねじブロツクによ
つて上下にスライドするようになつている。この
ように、ボンデイングアームを上下動させるの
に、駆動部であるモータの回転を一度雌ねじブロ
ツクの上下運動に変えなければならないので、モ
ータに負荷がかかり、ボンデイングアームの動き
を速くすることができない。また雌ねじブロツク
の上下動機構が複雑でコスト高になると共に、組
立調整に時間がかかる欠点を有する。
Conventionally, as such a capillary vertical movement mechanism, those shown in Japanese Patent Application Laid-Open Nos. 54-154273 and 55-24403 are known. In this structure, the bonding arm holding the capillary is rotatably held by a vertically moving block, and this vertically moving block is screwed into a male threaded block rotated by a motor and moved up and down by a female threaded block that moves up and down. It's designed to slide. In this way, in order to move the bonding arm up and down, the rotation of the motor, which is the drive unit, must be changed to the up and down movement of the female thread block, which puts a load on the motor and makes it impossible to move the bonding arm quickly. . Furthermore, the vertical movement mechanism of the female screw block is complicated, resulting in high cost, and also has the disadvantage that assembly and adjustment takes time.

本発明の目的は上記従来技術の欠点をなくし、
モータの負荷を減少させ、キヤピラリ上下動速度
を速くすることが可能で、かつ機構が簡単なキヤ
ピラリ上下動機構を提供することにある。
The purpose of the present invention is to eliminate the drawbacks of the above-mentioned prior art,
It is an object of the present invention to provide a capillary vertical movement mechanism that can reduce the load on a motor, increase the speed of capillary vertical movement, and has a simple mechanism.

以下、本発明を図示の実施例により説明する。 Hereinafter, the present invention will be explained with reference to illustrated embodiments.

第1図は本発明になるキヤピラリ上下動機構の
一実施例を示す一部断面側面図、第2図は第1図
の2―2線断面図である。一端にキヤピラリ10
を保持したボンデイングアーム11はXY方向に
平面移動するXYフイーダー12に固定されたヘ
ツド枠13にベアリング14を介して回転自在に
取付けられた支軸15に固定されている。前記ヘ
ツド枠13には支軸15と同心の円筒部13aが
内側に突出しており、ベアリング16を介して駆
動ブロツク17が回転自在に取付けられている。
前記駆動ブロツク17には接点棒18を保持した
絶縁ブロツク19が固定され、ボンデイングアー
ム11は支軸15のフツク20と駆動ブロツク1
7のフツク21に掛けられたばね22により反時
計方向に付勢されて接点棒18に接触している。
また駆動ブロツク17にはクランパー23を保持
したクランプアーム24が固定されている。
FIG. 1 is a partially sectional side view showing an embodiment of a capillary vertical movement mechanism according to the present invention, and FIG. 2 is a sectional view taken along the line 2--2 in FIG. Capillary 10 at one end
The bonding arm 11 holding the bonding arm 11 is fixed to a support shaft 15 rotatably attached via a bearing 14 to a head frame 13 fixed to an XY feeder 12 that moves in the XY direction. A cylindrical portion 13a concentric with the support shaft 15 projects inward from the head frame 13, and a drive block 17 is rotatably mounted via a bearing 16.
An insulating block 19 holding a contact rod 18 is fixed to the drive block 17, and the bonding arm 11 is connected to the hook 20 of the support shaft 15 and the drive block 1.
It is urged counterclockwise by a spring 22 hooked on the hook 21 of No. 7 to contact the contact rod 18.
Further, a clamp arm 24 holding a clamper 23 is fixed to the drive block 17.

前記ヘツド枠13の側板にはロータリーエンコ
ーダ30を備えたモータ31が固定されており、
モータ31の駆動軸31aには先端にベアリング
32が取付けられた偏心量eよりなる偏心軸33
が固定されている。前記ベアリング32は駆動ブ
ロツク17に固定されている駆動アーム34に固
定した2本の連結ピン35,36で挾持されてい
る。
A motor 31 equipped with a rotary encoder 30 is fixed to the side plate of the head frame 13.
The drive shaft 31a of the motor 31 has an eccentric shaft 33 having an eccentricity e with a bearing 32 attached to the tip.
is fixed. The bearing 32 is held between two connecting pins 35 and 36 fixed to a drive arm 34 fixed to the drive block 17.

また前記ヘツド枠13にはスプールレバー40
が固定されており、このスプールレバー40の端
部にはワイヤ41が巻回されたスプール42が取
付けられている。スプール42に巻回されたワイ
ヤ41はガイドパイプ43及びクランパー23を
通してキヤピラリ10に挿通されている。またペ
レツト50が付いたリードフレーム51はフレー
ムフイーダー52で案内移送されるようになつて
いる。
Further, a spool lever 40 is attached to the head frame 13.
is fixed, and a spool 42 around which a wire 41 is wound is attached to the end of the spool lever 40. The wire 41 wound around the spool 42 is inserted into the capillary 10 through the guide pipe 43 and the clamper 23. Further, the lead frame 51 with the pellets 50 attached thereto is guided and transported by a frame feeder 52.

次にかかる構成よりなる本機構の作用について
説明する。第1図はキヤピラリ10がボンデイン
グ面に当つた瞬間を示しているが、ワイヤー接続
前は、キヤピラリ10はボンデイング面上方にあ
り、キヤピラリ10の先端よりワイヤ41の先端
は突出している。そこで、XYフイーダー12に
よりヘツド枠13が平面上を移動し、キヤピラリ
10が第1ボンド点の上方に位置すると、モータ
31が回転する。モータ31の回転により偏心軸
33に取付けられたベアリング32は偏心量eだ
け上昇運動する。これにより、駆動ブロツク17
は連結ピン35,36及び駆動アーム34を介し
てヘツド枠13の円筒部13aを中心として矢印
A方向に回転し、接点棒18及びクランプアーム
24に取付けられたクランパー23は下降する。
接点棒18が下降すると、ばね22の付勢力でボ
ンデイングアーム11は接点棒18に圧接した状
態で支軸15を中心としてA方向に回転し、キヤ
ピラリ10が下降する。そして、第1図に示すよ
うにキヤピラリ10がボンデイング面に当つた瞬
間に接点棒18はボンデイングアーム11よりわ
ずかに離れ、これによりボンデイングアーム11
と接点棒18は導通しなくなるので、ボンデイン
グ面の高さが検出される。この状態より更にモー
タ31はわずかに回転して停止する。そして、キ
ヤピラリ10でワイヤ41を第1点目のボンデイ
ング点にボンデイングする。
Next, the operation of this mechanism having such a configuration will be explained. FIG. 1 shows the moment when the capillary 10 hits the bonding surface, but before the wire is connected, the capillary 10 is above the bonding surface, and the tip of the wire 41 protrudes from the tip of the capillary 10. Therefore, when the head frame 13 is moved on a plane by the XY feeder 12 and the capillary 10 is positioned above the first bond point, the motor 31 is rotated. The rotation of the motor 31 causes the bearing 32 attached to the eccentric shaft 33 to move upward by an amount of eccentricity e. As a result, the drive block 17
rotates in the direction of arrow A around the cylindrical portion 13a of the head frame 13 via the connecting pins 35, 36 and the drive arm 34, and the clamper 23 attached to the contact rod 18 and the clamp arm 24 descends.
When the contact rod 18 is lowered, the bonding arm 11 is rotated in the direction A about the support shaft 15 while being in pressure contact with the contact rod 18 due to the biasing force of the spring 22, and the capillary 10 is lowered. Then, as shown in FIG. 1, the moment the capillary 10 hits the bonding surface, the contact rod 18 is slightly separated from the bonding arm 11, and as a result, the bonding arm 11
Since the contact rod 18 is no longer electrically conductive, the height of the bonding surface is detected. From this state, the motor 31 rotates slightly and then stops. Then, the wire 41 is bonded to the first bonding point using the capillary 10.

第1ボンデイング終了後、モータ31は前記と
逆方向に回転して前記と逆の動作によつてキヤピ
ラリ10は上昇する。この上昇量は第2点目まで
の距離(ワイヤ長)により決定される。続いて前
記したと同様にXYフイーダー12によつてキヤ
ピラリ10は平面移動して第2ボンデイング点の
上方に位置する。次いでモータ31が回転してキ
ヤピラリ10が下降して第2ボンデイング点に圧
接し、ワイヤー接続作業が終了する。そして、次
の接続作業に移る時、キヤピラリ10が上昇する
が、この時クランパー23が閉じてワイヤ41を
切断する。ここで、前記したキヤピラリ10、ク
ランパー23の上下量、即ちモータ31の回転量
はロータリーエンコーダ30によつて計測及び制
御される。
After the first bonding is completed, the motor 31 rotates in the opposite direction to the above, and the capillary 10 is raised by the reverse operation. This amount of increase is determined by the distance (wire length) to the second point. Subsequently, in the same manner as described above, the capillary 10 is moved in a plane by the XY feeder 12 and positioned above the second bonding point. Next, the motor 31 rotates, and the capillary 10 descends and presses into contact with the second bonding point, completing the wire connection work. Then, when moving on to the next connection operation, the capillary 10 rises, but at this time the clamper 23 closes and cuts the wire 41. Here, the vertical amounts of the capillary 10 and the clamper 23, ie, the amount of rotation of the motor 31, are measured and controlled by the rotary encoder 30.

このように、ボンデイングアーム11を上下動
させる駆動アーム34をモータ31によつて回転
駆動する偏心軸33により行う簡単な機構よりな
るので、装置のコストダウンが図れると共に、組
立調整が容易となる。また従来のようにねじを回
す必要がないので、モータ31の負荷が小さくな
り、キヤピラリ10の上下動速度を速くすること
ができ、ワイヤボンデイングが高速化される。
In this way, the drive arm 34 that moves the bonding arm 11 up and down is driven by the eccentric shaft 33, which is rotated by the motor 31. Since the mechanism is simple, the cost of the device can be reduced, and assembly and adjustment can be facilitated. Further, since there is no need to turn a screw as in the conventional case, the load on the motor 31 is reduced, the vertical movement speed of the capillary 10 can be increased, and wire bonding can be performed at high speed.

なお、駆動ブロツク17はヘツド枠13に上下
動自在に設けてもよい。
Note that the drive block 17 may be provided on the head frame 13 so as to be vertically movable.

以上の説明から明らかな如く、本発明になるキ
ヤピラリ上下動機構によれば、機構が簡単でコス
トダウンが図れると共に、組立調整が容易とな
る。またモータの負荷が小さくワイヤボンデイン
グの高速化が図れる。
As is clear from the above description, according to the capillary vertical movement mechanism of the present invention, the mechanism is simple and costs can be reduced, and assembly and adjustment can be facilitated. In addition, the load on the motor is small and wire bonding can be performed at high speed.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明になるキヤピラリ上下動機構の
一実施例を示す一部断面側面図、第2図は第1図
の2―2線断面図である。 10……キヤピラリ、11……ボンデイングア
ーム、13……ヘツド枠、15……支軸、17…
…駆動ブロツク、18……接点棒、19……絶縁
ブロツク、30……モータ、33……偏心軸、3
4……駆動アーム、41……ワイヤ。
FIG. 1 is a partially sectional side view showing an embodiment of a capillary vertical movement mechanism according to the present invention, and FIG. 2 is a sectional view taken along the line 2--2 in FIG. 10... Capillary, 11... Bonding arm, 13... Head frame, 15... Support shaft, 17...
... Drive block, 18 ... Contact rod, 19 ... Insulation block, 30 ... Motor, 33 ... Eccentric shaft, 3
4... Drive arm, 41... Wire.

Claims (1)

【特許請求の範囲】[Claims] 1 XY方向に平面移動可能なヘツド枠に固定さ
れたモータと、このモータによつて回転駆動され
る偏心軸と、ワイヤの挿通されたキヤピラリを保
持し前記ヘツド枠に揺動自在に設けられたボンデ
イングアームと、このボンデイングアームの下降
方向を防止するようにボンデイングアームの面に
延在して前記ヘツド枠に揺動又は上下動自在に支
承され前記偏心軸で揺動又は上下動させられる駆
動部材とからなるキヤピラリ上下動機構。
1. A motor fixed to a head frame capable of plane movement in the XY directions, an eccentric shaft rotationally driven by the motor, and a capillary with a wire inserted therein, which is swingably mounted on the head frame. a bonding arm, and a drive member that extends on the surface of the bonding arm so as to prevent the bonding arm from descending, is supported by the head frame so as to be swingable or vertically movable, and is swingable or vertically movable about the eccentric shaft. A capillary vertical movement mechanism consisting of.
JP56074027A 1981-05-15 1981-05-15 Vertical moving mechanism for capillary Granted JPS57188839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56074027A JPS57188839A (en) 1981-05-15 1981-05-15 Vertical moving mechanism for capillary

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074027A JPS57188839A (en) 1981-05-15 1981-05-15 Vertical moving mechanism for capillary

Publications (2)

Publication Number Publication Date
JPS57188839A JPS57188839A (en) 1982-11-19
JPS6229896B2 true JPS6229896B2 (en) 1987-06-29

Family

ID=13535232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074027A Granted JPS57188839A (en) 1981-05-15 1981-05-15 Vertical moving mechanism for capillary

Country Status (1)

Country Link
JP (1) JPS57188839A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124971A (en) * 1973-04-02 1974-11-29
JPS5055263A (en) * 1973-09-12 1975-05-15
JPS53144262A (en) * 1977-05-23 1978-12-15 Toshiba Corp Bonding unit for semiconductor device
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS5773933U (en) * 1980-10-21 1982-05-07

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124971A (en) * 1973-04-02 1974-11-29
JPS5055263A (en) * 1973-09-12 1975-05-15
JPS53144262A (en) * 1977-05-23 1978-12-15 Toshiba Corp Bonding unit for semiconductor device
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS5773933U (en) * 1980-10-21 1982-05-07

Also Published As

Publication number Publication date
JPS57188839A (en) 1982-11-19

Similar Documents

Publication Publication Date Title
US3734386A (en) Wiring apparatus with wire path forming means
US4603803A (en) Wire bonding apparatus
JPS5855663B2 (en) bonding equipment
JPS6229896B2 (en)
US5170928A (en) Bonding head
JPS6139733B2 (en)
JPS6229897B2 (en)
JPS6220692B2 (en)
JPS6256657B2 (en)
US5340010A (en) Bonding apparatus
JPS6021533A (en) Circuit element bonding method and apparatus thereof
JPH0755002Y2 (en) Load control structure of wire bonder
JPS6364274B2 (en)
JPH0110929Y2 (en)
SU437592A1 (en) Welding head
KR920010689B1 (en) Bonding apparatus
JP2584331Y2 (en) Driven roller structure of wire feeder
JPH0213818B2 (en)
JPH0141023B2 (en)
JPS60239Y2 (en) Mechanical press slide position adjustment upper and lower limit detection device
JPS6227741B2 (en)
JP2558717B2 (en) Wire bonding equipment
JPH0427168Y2 (en)
JPH029557Y2 (en)
JPS61290731A (en) Wire bonding apparatus