JPS6220692B2 - - Google Patents

Info

Publication number
JPS6220692B2
JPS6220692B2 JP56007749A JP774981A JPS6220692B2 JP S6220692 B2 JPS6220692 B2 JP S6220692B2 JP 56007749 A JP56007749 A JP 56007749A JP 774981 A JP774981 A JP 774981A JP S6220692 B2 JPS6220692 B2 JP S6220692B2
Authority
JP
Japan
Prior art keywords
capillary
block
bonding
motor
head frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56007749A
Other languages
Japanese (ja)
Other versions
JPS57121241A (en
Inventor
Nobuhito Yamazaki
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56007749A priority Critical patent/JPS57121241A/en
Publication of JPS57121241A publication Critical patent/JPS57121241A/en
Publication of JPS6220692B2 publication Critical patent/JPS6220692B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 本発明はワイヤボンデイング装置においてキヤ
ピラリを上下動させるキヤピラリ上下動機構に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a capillary vertical movement mechanism for vertically moving a capillary in a wire bonding apparatus.

従来、かかるキヤピラリ上下動機構として、特
開昭54−154273号公報及び特開昭55−24403号公
報に示すものが知られている。この構造はキヤピ
ラリを保持したボンデイングアームが上下動ブロ
ツクに回転自在に保持され、この上下動ブロツク
がモータによつて上下動させられる雌ねじブロツ
クによつて上下にスライドするようになつてお
り、キヤピラリがボンデイング面に当ると接点又
はマイクロホンによりボンデイング面の高さが検
出され、モータが更に若干回転してキヤピラリは
ボンデイング面に当つたままで上下動ブロツクが
更に下降して停止するようになつている。このよ
うに、ボンデイングアームは上下動ブロツクに回
転自在に支承され、かつ上下動ブロツクと共に上
下動するので、キヤピラリがボンデイング面に当
つた瞬間と上下動ブロツクが更に下降して停止し
た時とでは、ボンデイングアームの回転中心であ
る支軸に位置ずれが生じる。このため、キヤピラ
リはわずかに位置ずれを起してワイヤー切れ等が
生じてボンダビリテイーに悪影響を及ぼす欠点が
あつた。
Conventionally, as such a capillary vertical movement mechanism, those shown in Japanese Patent Application Laid-Open Nos. 54-154273 and 55-24403 are known. In this structure, the bonding arm holding the capillary is rotatably held by a vertically moving block, and this vertically moving block is slid up and down by a female screw block that is moved up and down by a motor. When the capillary hits the bonding surface, the height of the bonding surface is detected by a contact point or a microphone, and the motor rotates a little further so that the capillary remains in contact with the bonding surface and the vertical movement block further lowers and stops. In this way, the bonding arm is rotatably supported by the vertically movable block and moves up and down together with the vertically movable block, so the moment when the capillary hits the bonding surface and the moment when the vertically movable block further descends and stops are different. Misalignment occurs in the support shaft, which is the center of rotation of the bonding arm. As a result, the capillary is slightly misaligned, resulting in wire breakage, etc., which has a negative effect on bondability.

本発明は上記従来技術の欠点に鑑みなされたも
ので、キヤピラリの位置ずれが生じないキヤピラ
リ上下動機構を提供することを目的とする。
The present invention was made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a capillary vertical movement mechanism that does not cause displacement of the capillary.

以下、本発明を図示の実施例により説明する。 Hereinafter, the present invention will be explained with reference to illustrated embodiments.

第1図は本発明になる装置の一実施例を示す一
部断面側面図、第2図は第1図の2−2線断面図
である。一端にキヤピラリ10を保持したボンデ
イングアーム11はXY方向に平面移動するXYフ
イーダー12に固定されたヘツド枠13にベアリ
ング14を介して回転自在に取付けられた支軸1
5に固定されている。前記ヘツド枠13には支軸
15と同心の円筒部13aが内側に突出してお
り、ベアリング16を介して駆動ブロツク17が
回転自在に取付けられている。前記駆動ブロツク
17には接点棒18を保持した絶縁ブロツク19
が固定され、ボンデイングアーム11は支軸15
のフツク20と駆動ブロツク17のフツク21に
掛けられたばね22により反時計方向に付勢され
て接点棒18に接触している。また駆動ブロツク
17にはクランパー23を保持したクランプアー
ム24が固定されている。
FIG. 1 is a partially sectional side view showing an embodiment of the apparatus according to the present invention, and FIG. 2 is a sectional view taken along the line 2--2 in FIG. A bonding arm 11 holding a capillary 10 at one end is rotatably attached to a support shaft 1 via a bearing 14 to a head frame 13 fixed to an XY feeder 12 that moves in the XY direction.
It is fixed at 5. A cylindrical portion 13a concentric with the support shaft 15 projects inward from the head frame 13, and a drive block 17 is rotatably mounted via a bearing 16. The driving block 17 includes an insulating block 19 holding a contact rod 18.
is fixed, and the bonding arm 11 is attached to the support shaft 15.
The contact rod 18 is biased counterclockwise by a spring 22 applied to the hook 20 of the drive block 17 and the hook 21 of the drive block 17. Further, a clamp arm 24 holding a clamper 23 is fixed to the drive block 17.

前記ヘツド枠13にはロータリーエンコーダ3
0を備えたモータ31が固定されており、このモ
ータ31の出力軸は一端がベアリング32を介し
てヘツド枠13に回転自在に支承された雄ねじ3
3とジヨイント34で結合されている。前記雄ね
じ33には雌ねじブロツク35が螺合しており、
この雌ねじブロツク35は上下方向に移動できる
が回転しないように、雌ねじブロツク35に固定
されたピン36に取付けられたベアリング37が
ヘツド枠13に設けた縦溝13bに摺動自在に嵌
合されている。また雌ねじブロツク35にはベア
リング38が取付けられたピン39が固定されて
おり、前記ベアリング38は駆動ブロツク17に
固定されている駆動アーム40に固定した2本の
連結ピン41,42で挾持されている。
A rotary encoder 3 is installed in the head frame 13.
0 is fixed, and the output shaft of this motor 31 has a male screw 3 that is rotatably supported on the head frame 13 via a bearing 32 at one end.
3 and joint 34. A female thread block 35 is screwed into the male thread 33,
A bearing 37 attached to a pin 36 fixed to the female thread block 35 is slidably fitted into a vertical groove 13b provided in the head frame 13 so that the female thread block 35 can move vertically but not rotate. There is. Further, a pin 39 to which a bearing 38 is attached is fixed to the female thread block 35, and the bearing 38 is held between two connecting pins 41 and 42 fixed to a drive arm 40 fixed to the drive block 17. There is.

また前記ヘツド枠13にはスプールレバー50
が固定されており、このスプールレバー50の端
部にはワイヤ51が巻回されたスプール52が取
付けられている。スプール52に巻回されたワイ
ヤ51はガイドパイプ53及びクランパー23を
通してキヤピラリ10に挿通されている。またペ
レツト60が付いたリードフレーム61はフレー
ムフイーダー62で案内移送されるようになつて
いる。
Further, a spool lever 50 is attached to the head frame 13.
is fixed, and a spool 52 around which a wire 51 is wound is attached to the end of the spool lever 50. The wire 51 wound around the spool 52 is inserted into the capillary 10 through the guide pipe 53 and the clamper 23. Further, the lead frame 61 with pellets 60 attached thereto is guided and transported by a frame feeder 62.

次にかかる構成よりなる本装置の作用について
説明する。第1図はキヤピラリ10がボンデイン
グ面に当つた瞬間を示しているが、ワイヤー接続
前は、キヤピラリ10はボンデイング面上方にあ
り、キヤピラリ10の先端よりワイヤ51の先端
は突出している。そこで、XYフイーダー12に
よりヘツド枠13が平面上を移動し、キヤピラリ
10が第1ボンド点の上方に位置すると、モータ
31が回転する。モータ31の回転により雌ねじ
ブロツク35が矢印A方向に上動する。駆動ブロ
ツク17には駆動アーム40が固定されているの
で、雌ねじブロツク35が矢印A方向に上動する
と、駆動ブロツク17はベアリング38、連結ピ
ン41,42及び駆動アーム40を介してヘツド
枠13の円筒部13aを中心として矢印B方向に
回転し、接点棒18及びクランプアーム24に取
付けられたクランパー23は下降する。接点棒1
8が下降すると、ばね22の付勢力でボンデイン
グアーム11は接点棒18に圧接した状態で支軸
15を中心としてB方向に回転し、キヤピラリ1
0が下降する。そして、第1図に示すようにキヤ
ピラリ10がボンデイング面に当つた瞬間に接点
棒18はボンデイングアーム11よりわずかに離
れ、これによりボンデイングアーム11と接点棒
18は導通しなくなるので、ボンデイング面の高
さが検出される。この状態より更にモータ31は
わずかに回転して停止する。そして、キヤピラリ
10でワイヤ51を第1点目のボンデイング点に
ボンデイングする。
Next, the operation of this device having such a configuration will be explained. FIG. 1 shows the moment when the capillary 10 hits the bonding surface, but before wire connection, the capillary 10 is above the bonding surface, and the tip of the wire 51 protrudes from the tip of the capillary 10. Therefore, when the head frame 13 is moved on a plane by the XY feeder 12 and the capillary 10 is positioned above the first bond point, the motor 31 is rotated. The rotation of the motor 31 causes the female screw block 35 to move upward in the direction of arrow A. Since the drive arm 40 is fixed to the drive block 17, when the female screw block 35 moves upward in the direction of arrow A, the drive block 17 connects the head frame 13 via the bearing 38, the connecting pins 41 and 42, and the drive arm 40. It rotates in the direction of arrow B around the cylindrical portion 13a, and the clamper 23 attached to the contact rod 18 and the clamp arm 24 descends. Contact rod 1
8 descends, the bonding arm 11 rotates in the direction B around the support shaft 15 while being in pressure contact with the contact rod 18 due to the biasing force of the spring 22, and the capillary 1
0 goes down. As shown in FIG. 1, the moment the capillary 10 hits the bonding surface, the contact rod 18 is slightly separated from the bonding arm 11, and as a result, the bonding arm 11 and the contact rod 18 are no longer electrically conductive, so the height of the bonding surface is is detected. From this state, the motor 31 rotates slightly and then stops. Then, the wire 51 is bonded to the first bonding point using the capillary 10.

第1ボンデイング終了後、モータ31は前記と
逆方向に回転して前記と逆の動作によつてキヤピ
ラリ10は上昇する。この上昇量は第2点目まで
の距離(ワイヤ長)により決定される。続いて前
記したと同様にXYフイーダー12によつてキヤ
ピラリ10は平面移動して第2ボンデイング点の
上方に位置する。次いでモータ31が回転してキ
ヤピラリ10が下降して第2ボンデイング点に圧
接し、ワイヤー接続作業が終了する。そして、次
の接続作業に移る時、キヤピラリ10が上昇する
が、この時クランパー23が閉じてワイヤ51を
切断する。ここで、前記したキヤピラリ10、ク
ランパー23の上下量、即ちモータ31の回転量
はロータリーエンコーダ30によつて計測及び制
御される。
After the first bonding is completed, the motor 31 rotates in the opposite direction to the above, and the capillary 10 is raised by the reverse operation. This amount of increase is determined by the distance (wire length) to the second point. Subsequently, in the same manner as described above, the capillary 10 is moved in a plane by the XY feeder 12 and positioned above the second bonding point. Next, the motor 31 rotates, and the capillary 10 descends and presses against the second bonding point, completing the wire connection work. Then, when moving on to the next connection operation, the capillary 10 rises, but at this time the clamper 23 closes and cuts the wire 51. Here, the vertical amounts of the capillary 10 and the clamper 23, ie, the amount of rotation of the motor 31, are measured and controlled by the rotary encoder 30.

このように、ボンデイングアーム11はヘツド
枠13に揺動自在に支承され、上下動可能な雌ね
じブロツク35によつて揺動させられる駆動ブロ
ツク17によつて揺動させられるように構成して
なるので、キヤピラリ10がボンデイング面に当
つた状態より更に駆動ブロツク17が移動しても
ボンデイングアーム11を保持する支軸15は変
動しなく、キヤピラリ10のすべりが起きなくボ
ンダビリテイーが向上する。
In this way, the bonding arm 11 is swingably supported by the head frame 13, and is configured to be swung by the drive block 17, which is swung by the internally threaded block 35 that is movable up and down. Even if the drive block 17 moves further than the state in which the capillary 10 is in contact with the bonding surface, the support shaft 15 that holds the bonding arm 11 does not move, and the capillary 10 does not slip, improving bondability.

なお、上記実施例においては、ボンデイングア
ーム11の下面に駆動ブロツク17と一体の接点
棒18を圧接させたが、ボンデイングアーム11
を支軸15の他側に延在させ、この延在部の上面
側に接点棒18を配設し、ボンデイングアーム1
1の延在部上面を接点棒18に圧接させてもよ
い。また駆動ブロツク17は揺動に限らず、上下
動自在に構成してもよい。またボンデイング面の
高さ検出はホトセンサーを使用した光学的検出方
法及びマイクロホンを使用した音波的検出方法で
もよい。またキヤピラリ10の上下量の計測はロ
ータリーエンコーダ30に代えてリニアーエンコ
ーダ等でもよい。
In the above embodiment, the contact rod 18 integrated with the drive block 17 was brought into pressure contact with the lower surface of the bonding arm 11.
is extended to the other side of the support shaft 15, and the contact rod 18 is disposed on the upper surface side of this extended portion, and the bonding arm 1
The upper surface of the extension part 1 may be brought into pressure contact with the contact rod 18. Further, the drive block 17 is not limited to swinging, but may be configured to be vertically movable. Further, the height of the bonding surface may be detected by an optical detection method using a photo sensor or a sonic detection method using a microphone. Further, the vertical amount of the capillary 10 may be measured by a linear encoder or the like instead of the rotary encoder 30.

以上の説明から明らかな如く、本発明になるキ
ヤピラリ上下動機構によれば、キヤピラリのすべ
りが生じないので、ボンダビリテイーが向上す
る。
As is clear from the above description, according to the capillary vertical movement mechanism of the present invention, the capillary does not slip, so bondability is improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明になるキヤピラリ上下動機構の
一実施例を示す一部断面側面図、第2図は第1図
の2−2線断面図である。 10…キヤピラリ、11…ボンデイングアー
ム、13…ヘツド枠、15…支軸、17…駆動ブ
ロツク、30…ロータリーエンコーダ、31…モ
ータ、33…雄ねじ、35…雌ねじブロツク、4
0…駆動アーム、51…ワイヤ。
FIG. 1 is a partially sectional side view showing an embodiment of a capillary vertical movement mechanism according to the present invention, and FIG. 2 is a sectional view taken along line 2-2 in FIG. 10... Capillary, 11... Bonding arm, 13... Head frame, 15... Support shaft, 17... Drive block, 30... Rotary encoder, 31... Motor, 33... Male thread, 35... Female thread block, 4
0... Drive arm, 51... Wire.

Claims (1)

【特許請求の範囲】[Claims] 1 ワイヤの挿通されたキヤピラリを上下動させ
る駆動部を構成する上下動可能な雌ねじブロツク
と、この雌ねじブロツクに螺合し回転する雄ねじ
と、XY方向に平面移動可能なヘツド枠に固定さ
れ前記雄ねじを回転駆動するモータと、このモー
タの回転量を制御するエンコーダとを備えたキヤ
ピラリ上下動機構において、前記キヤピラリを保
持し前記ヘツド枠に揺動自在に支承されたボンデ
イングアームと、このボンデイングアームの下降
方向を防止するようにボンデイングアームの面に
延在して前記ヘツド枠に揺動又は上下動自在に支
承され前記雌ねじブロツクで揺動又は上下動させ
られる駆動部材とを設けてなるキヤピラリ上下動
機構。
1. A vertically movable female screw block constituting a drive unit for vertically moving a capillary through which a wire is inserted, a male screw that is screwed into this female screw block and rotates, and a male screw fixed to a head frame that is movable in plane in the X and Y directions. The capillary vertical movement mechanism includes a motor that rotationally drives the capillary, and an encoder that controls the amount of rotation of the motor. A capillary for vertical movement, which is provided with a driving member extending on the surface of the bonding arm so as to prevent the bonding arm from moving in the downward direction, supported by the head frame so as to be swingable or vertically movable, and swingable or vertically movable by the female thread block. mechanism.
JP56007749A 1981-01-21 1981-01-21 Capillary up-and-down motion mechanism Granted JPS57121241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56007749A JPS57121241A (en) 1981-01-21 1981-01-21 Capillary up-and-down motion mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56007749A JPS57121241A (en) 1981-01-21 1981-01-21 Capillary up-and-down motion mechanism

Publications (2)

Publication Number Publication Date
JPS57121241A JPS57121241A (en) 1982-07-28
JPS6220692B2 true JPS6220692B2 (en) 1987-05-08

Family

ID=11674339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56007749A Granted JPS57121241A (en) 1981-01-21 1981-01-21 Capillary up-and-down motion mechanism

Country Status (1)

Country Link
JP (1) JPS57121241A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124280U (en) * 1988-02-16 1989-08-24

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124971A (en) * 1973-04-02 1974-11-29
JPS5055263A (en) * 1973-09-12 1975-05-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124971A (en) * 1973-04-02 1974-11-29
JPS5055263A (en) * 1973-09-12 1975-05-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124280U (en) * 1988-02-16 1989-08-24

Also Published As

Publication number Publication date
JPS57121241A (en) 1982-07-28

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