JPS5826524Y2 - Hand tie wire bonder touch - Google Patents
Hand tie wire bonder touchInfo
- Publication number
- JPS5826524Y2 JPS5826524Y2 JP1975166827U JP16682775U JPS5826524Y2 JP S5826524 Y2 JPS5826524 Y2 JP S5826524Y2 JP 1975166827 U JP1975166827 U JP 1975166827U JP 16682775 U JP16682775 U JP 16682775U JP S5826524 Y2 JPS5826524 Y2 JP S5826524Y2
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- wire bonder
- detection device
- touch
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
本考案は半導体結線用ワイヤボンダに関するものである
。[Detailed Description of the Invention] The present invention relates to a wire bonder for connecting semiconductors.
一般に半導体結線に用いるワイヤボンダは金スプールに
巻かれた金線をキャピラリに通し、まず金線先端を水素
トーチにより溶融ボール状にしキャピラリを下げて半導
体基板チップ上に乗せ一定時間加圧して金線とチップを
融着させ、次にキャピラリを上げて半導体基板を移動し
キャピラリ直下位置に半導体基板リード側がくるとキャ
ピラリが下降しリード片に金線を一定時間加圧して融着
させクランプにより金線を切断する。In general, a wire bonder used for semiconductor wiring involves passing a gold wire wound around a gold spool through a capillary, first melting the tip of the gold wire into a ball using a hydrogen torch, lowering the capillary, placing it on a semiconductor substrate chip, and applying pressure for a certain period of time to form a gold wire. The chip is fused, and then the capillary is raised and the semiconductor substrate is moved. When the lead side of the semiconductor substrate is positioned directly below the capillary, the capillary is lowered and the gold wire is fused to the lead piece by pressurizing it for a certain period of time, and the gold wire is attached with a clamp. disconnect.
従来のワイヤボンダではキャピラリ上下運動はカム機構
によって行い融着のための加圧は錘あるいはバネ等を用
いて行っていた。In conventional wire bonders, the capillary is moved up and down by a cam mechanism, and pressure for fusion is applied using a weight, a spring, or the like.
このような従来のワイヤボンダではキャピラリの運動速
度や加圧力を変化させることは容易ではなかった。In such a conventional wire bonder, it is not easy to change the movement speed and pressing force of the capillary.
本考案は上記欠点を解消した半導体ワイヤボンダを提供
することを目的としている。The object of the present invention is to provide a semiconductor wire bonder that eliminates the above-mentioned drawbacks.
以下図面を参照して本考案を説明する。The present invention will be explained below with reference to the drawings.
図において符号１はキャピラリ、２はアーム、３は金線
スプール、４はモータ、５は半導体基板、６はキャピラ
リ位置検出装置、７は発光ダイオード、８はプーリ、９
は半導体基板案内テーブル、１０は金線である。In the figure, 1 is a capillary, 2 is an arm, 3 is a gold wire spool, 4 is a motor, 5 is a semiconductor substrate, 6 is a capillary position detection device, 7 is a light emitting diode, 8 is a pulley, 9
1 is a semiconductor substrate guide table, and 10 is a gold wire.
このワイヤボンダの作動について説明すると、まずキャ
ピラリ１が上死点に停止し半導体基板案内テーブル９上
の半導体基板５のチップが作業位置に置かれる。To explain the operation of this wire bonder, first, the capillary 1 stops at the top dead center, and the chip of the semiconductor substrate 5 on the semiconductor substrate guide table 9 is placed at the working position.
次にモータ４が回転しプーリ８を通してアーム２を駆動
しキャピラリ１が高速で下降し始める。Next, the motor 4 rotates to drive the arm 2 through the pulley 8, and the capillary 1 begins to descend at high speed.
キャピラリ１が半導体基板５に近づくとキャピラリ位置
検出装置６によりモータ４は低速度運転を行う。When the capillary 1 approaches the semiconductor substrate 5, the capillary position detection device 6 causes the motor 4 to operate at a low speed.
キャピラ１月がチップに到達するとモータ４の電流が変
化しこの変化によって加圧時間のタイマ（図示してない
）を作動させ同時にチップに対して一定の加圧力（通常
３０〜３００ｇ）が加わるようにモータ４に定電流を流
し定トルク制御を行う。When the capillary reaches the tip, the current of the motor 4 changes, and this change activates a pressurization time timer (not shown), so that a constant pressure (usually 30 to 300 g) is applied to the tip at the same time. A constant current is applied to the motor 4 to perform constant torque control.
上記タイマにより一定加圧時間経過後金線１０がチップ
に融着するとキャピラリ１は上昇開始し定位置に達する
とキャピラリ位置検出装置６によりモータ４が停止しキ
ャピラリ１も停止する。When the gold wire 10 is fused to the chip after a predetermined pressurizing time has elapsed by the timer, the capillary 1 starts to rise, and when it reaches a fixed position, the motor 4 is stopped by the capillary position detection device 6, and the capillary 1 is also stopped.
半導体基板５が移動しリード側が作業位置に置かれキャ
ピラリ１のボンディング作業が繰返される。The semiconductor substrate 5 is moved and the lead side is placed in the working position, and the bonding work of the capillary 1 is repeated.
リード側ボンディングの場合の加圧力、加圧時間はチッ
プ側とは異るがタイマおよびモータ４の適当な設定によ
り自動的に制御可能である。The pressurizing force and pressurizing time for bonding on the lead side are different from those on the chip side, but can be automatically controlled by appropriate settings of the timer and motor 4.
またキャピラリ位置検出装置６によりキャピラリ１の位
置を検知し金線切断用クランプの作動信号や金の溶融ボ
ール生成用の水素トーチ作動信号を発することも可能で
ある。It is also possible to detect the position of the capillary 1 by the capillary position detection device 6 and to issue an activation signal for a clamp for cutting gold wire or an activation signal for a hydrogen torch for producing a molten gold ball.
キャピラリ位置検出装置６はアーム２上に取付けた発光
ダイオード７の光を検知する形式としたがこれに限定さ
れるものではない。Although the capillary position detection device 6 is of a type that detects light from a light emitting diode 7 mounted on the arm 2, it is not limited thereto.
以上のようにキャピラリ１の位置を検出装置６で検知し
キャピラリ１め駆動用モータ４を制御しまたタイマを組
合せて加圧力、加圧時間の制御を行う半導体ワイヤボン
ダを用いればボンディング作業の信頼度が増加し作業時
間の縮少が遠戚される。As described above, if a semiconductor wire bonder is used that detects the position of the capillary 1 with the detection device 6, controls the motor 4 for driving the first capillary, and controls the pressurizing force and pressurizing time in combination with a timer, the reliability of the bonding work can be increased. This is closely related to the increase in work hours and the decrease in working hours.
図は本考案に係る半導体ワイヤボンダの概略図である。
１・・・・・・キャピラリ、２・・・・・・アーム、４
・・・・・・モータ、６・・・・・・キャピラリ位置検
出装置。The figure is a schematic diagram of a semiconductor wire bonder according to the present invention. 1...Capillary, 2...Arm, 4
...Motor, 6...Capillary position detection device.
Claims (1)
１の先端距離位置をキャピラリ支持アーム２の変位に対
応して検出できるようにしたキャピラリ位置検出装置６
，７を支持アーム部に装備し該検出装置の送信する信号
により上記支持アーム２の駆動用モータ４を制御してキ
ャピラリ１の上昇位置変速切替位置、金線切断位置等を
定めるようにした半導体ワイヤボンダ装置。Capillary position detection device 6 capable of detecting the tip distance position of the wire bonding capillary 1 with respect to the semiconductor substrate surface in accordance with the displacement of the capillary support arm 2
, 7 are mounted on the support arm, and the driving motor 4 of the support arm 2 is controlled by the signal transmitted from the detection device to determine the ascending position of the capillary 1, the shifting position, the gold wire cutting position, etc. Wire bonder equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975166827U JPS5826524Y2 (en) | 1975-12-12 | 1975-12-12 | Hand tie wire bonder touch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975166827U JPS5826524Y2 (en) | 1975-12-12 | 1975-12-12 | Hand tie wire bonder touch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5279863U JPS5279863U (en) | 1977-06-14 |
| JPS5826524Y2 true JPS5826524Y2 (en) | 1983-06-08 |
Family
ID=28645481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975166827U Expired JPS5826524Y2 (en) | 1975-12-12 | 1975-12-12 | Hand tie wire bonder touch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5826524Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54101667A (en) * | 1978-01-27 | 1979-08-10 | Hitachi Ltd | Wire bonding unit |
| US4266710A (en) * | 1978-11-22 | 1981-05-12 | Kulicke And Soffa Industries Inc. | Wire bonding apparatus |
| JPS62247538A (en) * | 1987-01-09 | 1987-10-28 | Hitachi Ltd | Wire bonding device |
| JPH03114239A (en) * | 1990-08-13 | 1991-05-15 | Marine Instr Co Ltd | Bonding surface contact detecting equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5072583A (en) * | 1973-10-29 | 1975-06-16 | ||
| JPS5072853A (en) * | 1973-10-31 | 1975-06-16 | ||
| JPS5258465A (en) * | 1975-11-10 | 1977-05-13 | Mitsubishi Electric Corp | Wire bonding device |
-
1975
- 1975-12-12 JP JP1975166827U patent/JPS5826524Y2/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5072583A (en) * | 1973-10-29 | 1975-06-16 | ||
| JPS5072853A (en) * | 1973-10-31 | 1975-06-16 | ||
| JPS5258465A (en) * | 1975-11-10 | 1977-05-13 | Mitsubishi Electric Corp | Wire bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5279863U (en) | 1977-06-14 |
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