JPS5279863U - - Google Patents

Info

Publication number
JPS5279863U
JPS5279863U JP1975166827U JP16682775U JPS5279863U JP S5279863 U JPS5279863 U JP S5279863U JP 1975166827 U JP1975166827 U JP 1975166827U JP 16682775 U JP16682775 U JP 16682775U JP S5279863 U JPS5279863 U JP S5279863U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1975166827U
Other languages
Japanese (ja)
Other versions
JPS5826524Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975166827U priority Critical patent/JPS5826524Y2/en
Publication of JPS5279863U publication Critical patent/JPS5279863U/ja
Application granted granted Critical
Publication of JPS5826524Y2 publication Critical patent/JPS5826524Y2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1975166827U 1975-12-12 1975-12-12 Hand tie wire bonder touch Expired JPS5826524Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975166827U JPS5826524Y2 (en) 1975-12-12 1975-12-12 Hand tie wire bonder touch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975166827U JPS5826524Y2 (en) 1975-12-12 1975-12-12 Hand tie wire bonder touch

Publications (2)

Publication Number Publication Date
JPS5279863U true JPS5279863U (en) 1977-06-14
JPS5826524Y2 JPS5826524Y2 (en) 1983-06-08

Family

ID=28645481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975166827U Expired JPS5826524Y2 (en) 1975-12-12 1975-12-12 Hand tie wire bonder touch

Country Status (1)

Country Link
JP (1) JPS5826524Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101667A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Wire bonding unit
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS62247538A (en) * 1987-01-09 1987-10-28 Hitachi Ltd Wire bonding device
JPH03114239A (en) * 1990-08-13 1991-05-15 Marine Instr Co Ltd Bonding surface contact detecting equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5072583A (en) * 1973-10-29 1975-06-16
JPS5072853A (en) * 1973-10-31 1975-06-16
JPS5258465A (en) * 1975-11-10 1977-05-13 Mitsubishi Electric Corp Wire bonding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5072583A (en) * 1973-10-29 1975-06-16
JPS5072853A (en) * 1973-10-31 1975-06-16
JPS5258465A (en) * 1975-11-10 1977-05-13 Mitsubishi Electric Corp Wire bonding device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101667A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Wire bonding unit
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS62247538A (en) * 1987-01-09 1987-10-28 Hitachi Ltd Wire bonding device
JPH03114239A (en) * 1990-08-13 1991-05-15 Marine Instr Co Ltd Bonding surface contact detecting equipment

Also Published As

Publication number Publication date
JPS5826524Y2 (en) 1983-06-08

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