JPS54101667A - Wire bonding unit - Google Patents

Wire bonding unit

Info

Publication number
JPS54101667A
JPS54101667A JP730478A JP730478A JPS54101667A JP S54101667 A JPS54101667 A JP S54101667A JP 730478 A JP730478 A JP 730478A JP 730478 A JP730478 A JP 730478A JP S54101667 A JPS54101667 A JP S54101667A
Authority
JP
Japan
Prior art keywords
bonding
servo
motor
fitted
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP730478A
Other languages
Japanese (ja)
Other versions
JPS612290B2 (en
Inventor
Yuzo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP730478A priority Critical patent/JPS54101667A/en
Publication of JPS54101667A publication Critical patent/JPS54101667A/en
Publication of JPS612290B2 publication Critical patent/JPS612290B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To make always an optimum bonding load by controlling the bonding load according to a bonding state by a program in the wire bonding unit used for production of a semiconductor device, etc.
CONSTITUTION: This unit consists of slim bonding arm 1 which is made slidable by support axis 2 and has cylindrical capillary 3, cam 4 which is rotated by servo-motor 15, lever 5 which is equipped with cam follower 7 and roller 8 which are fitted to support axis 9 slidably, wire 10 where the tip wound around the rotation axis of servo-motor 15 is fitted to arm 1, and driving means 23 of servo-motor 15 which consists of timing signal setting circuit 11, program circuit 12, electromagnetic relay RY1W3, operational amplifier 13 and current amplifier 14.
COPYRIGHT: (C)1979,JPO&Japio
JP730478A 1978-01-27 1978-01-27 Wire bonding unit Granted JPS54101667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP730478A JPS54101667A (en) 1978-01-27 1978-01-27 Wire bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP730478A JPS54101667A (en) 1978-01-27 1978-01-27 Wire bonding unit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP62001601A Division JPS62247538A (en) 1987-01-09 1987-01-09 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS54101667A true JPS54101667A (en) 1979-08-10
JPS612290B2 JPS612290B2 (en) 1986-01-23

Family

ID=11662267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP730478A Granted JPS54101667A (en) 1978-01-27 1978-01-27 Wire bonding unit

Country Status (1)

Country Link
JP (1) JPS54101667A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188840A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Load variable mechanism in wire bonder
JPS6144839U (en) * 1984-08-27 1986-03-25 海上電機株式会社 Fine wire connection device for semiconductor circuits

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179567A (en) * 1975-01-06 1976-07-10 Hitachi Ltd
JPS5279863U (en) * 1975-12-12 1977-06-14
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179567A (en) * 1975-01-06 1976-07-10 Hitachi Ltd
JPS5279863U (en) * 1975-12-12 1977-06-14
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188840A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Load variable mechanism in wire bonder
JPS6229897B2 (en) * 1981-05-15 1987-06-29 Shinkawa Kk
JPS6144839U (en) * 1984-08-27 1986-03-25 海上電機株式会社 Fine wire connection device for semiconductor circuits

Also Published As

Publication number Publication date
JPS612290B2 (en) 1986-01-23

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