JPS57188840A - Load variable mechanism in wire bonder - Google Patents

Load variable mechanism in wire bonder

Info

Publication number
JPS57188840A
JPS57188840A JP56074028A JP7402881A JPS57188840A JP S57188840 A JPS57188840 A JP S57188840A JP 56074028 A JP56074028 A JP 56074028A JP 7402881 A JP7402881 A JP 7402881A JP S57188840 A JPS57188840 A JP S57188840A
Authority
JP
Japan
Prior art keywords
load
arm
wire bonder
driving
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56074028A
Other languages
Japanese (ja)
Other versions
JPS6229897B2 (en
Inventor
Nobuhito Yamazaki
Kazuo Sugiura
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56074028A priority Critical patent/JPS57188840A/en
Publication of JPS57188840A publication Critical patent/JPS57188840A/en
Publication of JPS6229897B2 publication Critical patent/JPS6229897B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain the load variable mechanism in the wire bonder capable of setting the best bonding load at every bonding point by utilizing an electromagnetic magnet. CONSTITUTION:In a wire bonder mechanism having a bonding arm 11 holding a capillary 10, a clamping arm 24 holding a clamper 23, a driving arm 50 fixed to a driving block 17 and a motor 41 driving the driving arm 50 through a block 45, a contacting roller 33 is mounted to one end of a load arm 31 while being opposed to the upper surface of the bonding arm 11, and a movable plate 34 is set up to the other end. The electromagnetic magnet 35 is attached to a mounting block 30 while being opposed to the movable plate 34. Accordingly, the pressing force of the capillary 10 is load obtained by adding load by a spring 22 and load by the sucking force of the electromagnetic magnet 35 corresponding to voltage.
JP56074028A 1981-05-15 1981-05-15 Load variable mechanism in wire bonder Granted JPS57188840A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56074028A JPS57188840A (en) 1981-05-15 1981-05-15 Load variable mechanism in wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074028A JPS57188840A (en) 1981-05-15 1981-05-15 Load variable mechanism in wire bonder

Publications (2)

Publication Number Publication Date
JPS57188840A true JPS57188840A (en) 1982-11-19
JPS6229897B2 JPS6229897B2 (en) 1987-06-29

Family

ID=13535265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074028A Granted JPS57188840A (en) 1981-05-15 1981-05-15 Load variable mechanism in wire bonder

Country Status (1)

Country Link
JP (1) JPS57188840A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130433A (en) * 1983-01-17 1984-07-27 Toshiba Corp Wire bonding device
JPS60117743A (en) * 1983-11-30 1985-06-25 Toshiba Corp Method of judgement for junction state in wire bonding
JPS60132333A (en) * 1983-12-20 1985-07-15 Matsushita Electric Ind Co Ltd Wire bonding device
JPH01175239A (en) * 1987-11-19 1989-07-11 Shinkawa Ltd Bonding apparatus
DE4016720B4 (en) * 1989-08-11 2005-11-24 Orthodyne Electronics Corp., Costa Mesa Method and apparatus for ultrasonic bonding

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124864A (en) * 1976-04-13 1977-10-20 Tokyo Sokuhan Kk Wireebonder
JPS54101667A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Wire bonding unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124864A (en) * 1976-04-13 1977-10-20 Tokyo Sokuhan Kk Wireebonder
JPS54101667A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Wire bonding unit

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130433A (en) * 1983-01-17 1984-07-27 Toshiba Corp Wire bonding device
JPH0468776B2 (en) * 1983-01-17 1992-11-04 Tokyo Shibaura Electric Co
JPS60117743A (en) * 1983-11-30 1985-06-25 Toshiba Corp Method of judgement for junction state in wire bonding
JPS60132333A (en) * 1983-12-20 1985-07-15 Matsushita Electric Ind Co Ltd Wire bonding device
JPH01175239A (en) * 1987-11-19 1989-07-11 Shinkawa Ltd Bonding apparatus
DE4016720B4 (en) * 1989-08-11 2005-11-24 Orthodyne Electronics Corp., Costa Mesa Method and apparatus for ultrasonic bonding

Also Published As

Publication number Publication date
JPS6229897B2 (en) 1987-06-29

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