JPS567443A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPS567443A
JPS567443A JP8136679A JP8136679A JPS567443A JP S567443 A JPS567443 A JP S567443A JP 8136679 A JP8136679 A JP 8136679A JP 8136679 A JP8136679 A JP 8136679A JP S567443 A JPS567443 A JP S567443A
Authority
JP
Japan
Prior art keywords
wire
electromagnet
magnetic material
switching
attracted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8136679A
Other languages
Japanese (ja)
Inventor
Yuzo Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8136679A priority Critical patent/JPS567443A/en
Publication of JPS567443A publication Critical patent/JPS567443A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a wire with fixed tension at all times even when a device is operated at high speed by a method wherein a clamper is used which a space between an attracting surface of an electromagnet and a surface to be attracted of a magnetic material in case of nonattraction is made slightly wider than the thickness of the wire. CONSTITUTION:A space between an attracting surface of an electromagnet 12 and a surface to be attracted of a magnetic material 13 in case of nonattraction is made slightly wider than the thickness of a wire 4, and both surfaces approximately contact to the wire closely. When switching the electromagnet ON, the magnetic material 13 is instantaneously attracted, and the wire 4 is clamped. When switching the electromagnet OFF, the tension of the wire is removed, and the wire is extracted to the bonding side from a capillary. Thus, the wire is provided with the desired tension at all times by switching the electromagnet ON-OFF. When the magnetic material 13 is hung by a string, etc. and moved in air, its responsiveness is far better than a movable plunger. Thus, wire bonding at high speed can be executed.
JP8136679A 1979-06-29 1979-06-29 Wire bonder Pending JPS567443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8136679A JPS567443A (en) 1979-06-29 1979-06-29 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8136679A JPS567443A (en) 1979-06-29 1979-06-29 Wire bonder

Publications (1)

Publication Number Publication Date
JPS567443A true JPS567443A (en) 1981-01-26

Family

ID=13744314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8136679A Pending JPS567443A (en) 1979-06-29 1979-06-29 Wire bonder

Country Status (1)

Country Link
JP (1) JPS567443A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833109U (en) * 1981-08-23 1983-03-04 株式会社ダイヘン Cladding tube manufacturing equipment
JPS58164232U (en) * 1982-04-26 1983-11-01 日本電気株式会社 wire bonding equipment
JPS5943535A (en) * 1982-09-02 1984-03-10 Matsushita Electric Ind Co Ltd Bonding device for semiconductor wire
JPS61104547U (en) * 1984-12-13 1986-07-03
JPS61242768A (en) * 1985-04-19 1986-10-29 Kawasaki Steel Corp Heating method with electrification for rolling stock
US5234155A (en) * 1991-04-19 1993-08-10 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus
JPH081572U (en) * 1995-11-22 1996-11-05 任天堂株式会社 Jack for connection
DE19538397A1 (en) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Wiring clamp apparatus for connecting semiconductor chip to carrier wiring

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5833109U (en) * 1981-08-23 1983-03-04 株式会社ダイヘン Cladding tube manufacturing equipment
JPH0216869Y2 (en) * 1981-08-23 1990-05-10
JPS58164232U (en) * 1982-04-26 1983-11-01 日本電気株式会社 wire bonding equipment
JPH019156Y2 (en) * 1982-04-26 1989-03-13
JPS5943535A (en) * 1982-09-02 1984-03-10 Matsushita Electric Ind Co Ltd Bonding device for semiconductor wire
JPS61104547U (en) * 1984-12-13 1986-07-03
JPH0222993Y2 (en) * 1984-12-13 1990-06-21
JPS61242768A (en) * 1985-04-19 1986-10-29 Kawasaki Steel Corp Heating method with electrification for rolling stock
JPH0370587B2 (en) * 1985-04-19 1991-11-08 Kawasaki Steel Co
US5234155A (en) * 1991-04-19 1993-08-10 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus
DE19538397A1 (en) * 1995-08-15 1997-02-20 Hesse & Knipps Gmbh Wiring clamp apparatus for connecting semiconductor chip to carrier wiring
JPH081572U (en) * 1995-11-22 1996-11-05 任天堂株式会社 Jack for connection

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