JPS58164232U - wire bonding equipment - Google Patents

wire bonding equipment

Info

Publication number
JPS58164232U
JPS58164232U JP6065482U JP6065482U JPS58164232U JP S58164232 U JPS58164232 U JP S58164232U JP 6065482 U JP6065482 U JP 6065482U JP 6065482 U JP6065482 U JP 6065482U JP S58164232 U JPS58164232 U JP S58164232U
Authority
JP
Japan
Prior art keywords
wire
wire bonding
bonding
bonding equipment
elastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6065482U
Other languages
Japanese (ja)
Other versions
JPH019156Y2 (en
Inventor
山口　耕二
柳原　臣吾
白山　正海
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP6065482U priority Critical patent/JPS58164232U/en
Publication of JPS58164232U publication Critical patent/JPS58164232U/en
Application granted granted Critical
Publication of JPH019156Y2 publication Critical patent/JPH019156Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のワイヤボンディング方法の工程説明図、
第２図ａ〜ｄおよび第２図ａ′〜ｄ′はボールとキャピ
ラリテーバ部め関係位置およびそれにより形成されるホ
ンディング部の形状を示す説明図、第３図は従来のバッ
クテンションをかけたボンディング装置の概要説明図、
第４図は従来のクランパー説明図、第５図ａ　”−ｃは
クランパーの振動により引き起されるワイヤとクランパ
ーの関係位置を示す説明図、第６図ａ　”　ｃは本考案
によるボンディング装置のワイヤ挟持部の説明用断面図
、第７図は本考案によるボンディング装置の振動時のワ
イヤ挟持部とワイヤの関係位置を示す　′説明図。 １・・・・・・ボンディングワイヤ、２・・・・・・半
導体ペレット、３・・・・・・キャピラリ、４・・・・
・・水素焔、５，５’、９．９’、９“、９″・・・・
・・ボール、１０゜１０’、１０“、１０／″・・・・
・・接続部、１１・・・・・・リール、１２．１２’、
１７・・・・・・ガイド・、１３゜１３′・・・・・・
クランパー、１４・・・・・・板ばね、２０゜２１・・
・・・・クランパー挟持部（金属）、２２．２０’、２
１’、２０“、２１“・・・・・・クランパー挟持部（
弾性体）、２３．２４・・・・・・アーム、２５・・・
・・・調整ねじ、２６．２７・・・・・・アーム固定部
、２８・・・・・・固定アーム。 補正　昭５７．　８．１９ 図面の簡単な説明を次のように補正する。 明細書第９頁第７行の［第２図ａ　”−ｄおよび第２図
ａ′〜ｄ’　Ｊを［第２図ａ　〉ｈ　Ｊと補正する。Figure 1 is a process explanatory diagram of the conventional wire bonding method.
Figures 2 a to d and Figures 2 a' to d' are explanatory diagrams showing the relationship between the ball and the capillary lever part and the shape of the honding part formed thereby, and Figure 3 shows the conventional back tensioning. A schematic explanatory diagram of the bonding equipment,
Fig. 4 is an explanatory diagram of a conventional clamper, Fig. 5 a''-c is an explanatory diagram showing the relative position between the wire and the clamper caused by the vibration of the clamper, and Fig. 6 a'' c is an explanatory diagram of the bonding device according to the present invention. FIG. 7 is an explanatory sectional view of the wire clamping part, and FIG. 7 is an explanatory diagram showing the relative position of the wire clamping part and the wire when the bonding apparatus according to the present invention vibrates. 1... Bonding wire, 2... Semiconductor pellet, 3... Capillary, 4...
...Hydrogen flame, 5,5', 9.9', 9", 9"...
...Ball, 10°10', 10", 10/"...
... Connection part, 11 ... Reel, 12.12',
17... Guide, 13°13'...
Clamper, 14...Plate spring, 20°21...
... Clamper holding part (metal), 22.20', 2
1', 20", 21"... Clamper clamping part (
elastic body), 23.24...arm, 25...
...Adjustment screw, 26.27...Arm fixing part, 28...Fixed arm. Correction 1984. 8.19 The brief description of the drawings is amended as follows. [Fig. 2 a''-d and Fig. 2 a'-d' J in page 9, line 7 of the specification are corrected to [Fig. 2 a>h J.

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）　　半導体ペレットのポンディングパッドと外部
リードをワイヤで接続するワイヤボンディングのワイヤ
にテンションを与えるためのワイヤクランプ手段におい
て、ワイヤに接続する部分の少くとも一部が弾性体であ
ることを特徴とするワイヤボンディング装置。(1) A wire clamping means for applying tension to a wire for wire bonding that connects a bonding pad of a semiconductor pellet and an external lead with a wire, characterized in that at least a part of the part connected to the wire is an elastic body. wire bonding equipment. （２）弾性体がスポンジ又はフェルトであることを特徴
とする実用新案登録請求の範囲第（１）項記載のワイヤ
ボンディング装置。(2) The wire bonding device according to claim (1), wherein the elastic body is sponge or felt. （３）ワイヤのクランプ部分が対向する板状体であるこ
とを特徴とする実用新案登録請求の範囲第（１）項並ひ
に第２項記載のワイヤボンディング装置。(3) The wire bonding apparatus according to claims 1 and 2, wherein the clamping portions of the wire are opposed plate-like bodies.
JP6065482U 1982-04-26 1982-04-26 wire bonding equipment Granted JPS58164232U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6065482U JPS58164232U (en) 1982-04-26 1982-04-26 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6065482U JPS58164232U (en) 1982-04-26 1982-04-26 wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS58164232U true JPS58164232U (en) 1983-11-01
JPH019156Y2 JPH019156Y2 (en) 1989-03-13

Family

ID=30070889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6065482U Granted JPS58164232U (en) 1982-04-26 1982-04-26 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS58164232U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS58130541A (en) * 1982-01-29 1983-08-04 Toshiba Corp Wire bonding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326667A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Clamp chip of wire bonder
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS58130541A (en) * 1982-01-29 1983-08-04 Toshiba Corp Wire bonding device

Also Published As

Publication number Publication date
JPH019156Y2 (en) 1989-03-13

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