JPS58105138U - Automatic bonding equipment for semiconductor devices - Google Patents

Automatic bonding equipment for semiconductor devices

Info

Publication number
JPS58105138U
JPS58105138U JP1982002973U JP297382U JPS58105138U JP S58105138 U JPS58105138 U JP S58105138U JP 1982002973 U JP1982002973 U JP 1982002973U JP 297382 U JP297382 U JP 297382U JP S58105138 U JPS58105138 U JP S58105138U
Authority
JP
Japan
Prior art keywords
semiconductor devices
capillary
automatic bonding
bonding equipment
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982002973U
Other languages
Japanese (ja)
Other versions
JPS6344996Y2 (en
Inventor
秀樹 岡崎
Original Assignee
日本テキサス・インスツルメンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本テキサス・インスツルメンツ株式会社 filed Critical 日本テキサス・インスツルメンツ株式会社
Priority to JP1982002973U priority Critical patent/JPS58105138U/en
Publication of JPS58105138U publication Critical patent/JPS58105138U/en
Application granted granted Critical
Publication of JPS6344996Y2 publication Critical patent/JPS6344996Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案によるボンディング装置の主要部の拡大
図、第２図と第３図は本考案の実施例を、　示す構造図
、第４図Ａ−Ｃは本考案の動作説明図である。 ５・・・キャピラリ、８・・・トーチ、９・・・導体板
、１０・・・支持ガイド、１１・・・メカニズム。Figure 1 is an enlarged view of the main parts of the bonding device according to the present invention, Figures 2 and 3 are structural diagrams showing embodiments of the present invention, and Figures 4A-C are diagrams explaining the operation of the present invention. . 5... Capillary, 8... Torch, 9... Conductor plate, 10... Support guide, 11... Mechanism.

Claims (1)

【実用新案登録請求の範囲】 （ａ）　　半導体チップを保持する支持部材と；（ｂｌ
　　上記半導体チップにワイヤボンドするキャピラリと
； ｆｃ）　　上記キャピラリや近傍に慇けられたトーチと
； （ｄｌ　　上記トーチ゛と上記半導体チップの中間位置
で上記半導体チップ全面を覆うような第１位置と、上記
キャピラリがボンディング工程にあるとき上記キャピラ
リの作動を妨害しない第２位置との間を所定のタイミン
グで移動可能な電気的に接地された導体板と； （ｅ）　　上記導体板を所定のタイミングで上記第１位
置と上記第２位置との間を反復移動させる機械装置と を含む半導体装置用自動ボンディング装置。[Scope of claims for utility model registration] (a) A supporting member that holds a semiconductor chip; (bl
a capillary wire-bonded to the semiconductor chip; fc) a torch placed on or near the capillary; an electrically grounded conductor plate movable at a predetermined timing between a second position that does not interfere with the operation of the capillary when the capillary is in the bonding process; An automatic bonding apparatus for semiconductor devices, including a mechanical device that repeatedly moves between a first position and the second position.
JP1982002973U 1982-01-13 1982-01-13 Automatic bonding equipment for semiconductor devices Granted JPS58105138U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982002973U JPS58105138U (en) 1982-01-13 1982-01-13 Automatic bonding equipment for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982002973U JPS58105138U (en) 1982-01-13 1982-01-13 Automatic bonding equipment for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS58105138U true JPS58105138U (en) 1983-07-18
JPS6344996Y2 JPS6344996Y2 (en) 1988-11-22

Family

ID=30015924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982002973U Granted JPS58105138U (en) 1982-01-13 1982-01-13 Automatic bonding equipment for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS58105138U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277142A (en) * 2004-03-25 2005-10-06 Fujitsu Ltd Bonding apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005277142A (en) * 2004-03-25 2005-10-06 Fujitsu Ltd Bonding apparatus

Also Published As

Publication number Publication date
JPS6344996Y2 (en) 1988-11-22

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