JP2005277142A - Bonding apparatus - Google Patents

Bonding apparatus Download PDF

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JP2005277142A
JP2005277142A JP2004088960A JP2004088960A JP2005277142A JP 2005277142 A JP2005277142 A JP 2005277142A JP 2004088960 A JP2004088960 A JP 2004088960A JP 2004088960 A JP2004088960 A JP 2004088960A JP 2005277142 A JP2005277142 A JP 2005277142A
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bonding
ball
pad
torch electrode
wire
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JP4327633B2 (en
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Manabu Watanabe
真名武 渡邊
Naoaki Nakamura
直章 中村
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Fujitsu Ltd
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
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    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus, in which a thin film in a bonding object is not ruptured, even when an arc discharge is induced between a bonding wire and a torch electrode, in the bonder wherein the tip of the bonding wire is fused by applying a high voltage between the bonding wire and the torch electrode, and inducing the arc discharge between these, a discharge means to form a ball there is included, and the ball formed by the discharge means is combined with a pad of the object of bonding. <P>SOLUTION: A shield member is provided to shield the bonding object 12 from electromagnetic waves generated by the arc discharge at forming the ball. The shield member is composed of, for example, a conductive plate material 10 which separates the bonding wire (gold wire 3) and the torch electrode 6 from the bonding object 12. When a gold ball 3a moves toward the pad of the bonding object 12, the plate material is constituted so that its passing is not be interrupted. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、ボンディングワイヤとトーチ電極との間に高電圧を印加し、両者間でアーク放電を行わせることにより、ボンディングワイヤの先端を溶融させて、そこにボールを形成する放電手段を備え、該放電手段により形成したボールをボンディング対象物のパッドに結合するボンディング装置に関する。   The present invention comprises a discharging means for applying a high voltage between the bonding wire and the torch electrode and causing arc discharge between the two to melt the tip of the bonding wire and form a ball there. The present invention relates to a bonding apparatus for bonding a ball formed by the discharging means to a pad of a bonding object.

この種のボンディング装置、例えば、ボンディング対象物であるベアチップのパッド上にバンプを形成する際に用いられるボンディング装置においては、ボンディングワイヤである金ワイヤとトーチ電極との間に高電圧を印加し、両者間でアーク放電を行わせることにより、金ワイヤの先端を溶融させて、金ボールを形成している。そして、金ボールをベアチップのパッドに押し付け、超音波振動を与えてパッドに熱圧着し、この金ボールでバンプを形成している（例えば、特許文献１参照）。   In a bonding apparatus of this type, for example, a bonding apparatus used when forming bumps on a pad of a bare chip that is a bonding target, a high voltage is applied between a gold wire that is a bonding wire and a torch electrode, By causing arc discharge between them, the tip of the gold wire is melted to form a gold ball. Then, the gold ball is pressed against the pad of the bare chip, ultrasonic vibration is applied to the pad and thermocompression is applied to the pad, and the bump is formed with the gold ball (see, for example, Patent Document 1).

又、他のボンディング装置としては、（ａ）ベアチップのパッド上にリードワイヤの先端を配置し、リードワイヤとは別の金線の先端にアーク放電により形成した金ボールで、リードワイヤの先端を覆うことで、パッド上にリードワイヤを結合するボンディング装置や、（ｂ）チップのパッド上にリードワイヤの先端を配置し、このリードワイヤの先端をアーク放電によりボール状に溶融させて、得られた金ボールを直接パッドに溶着するボンディング装置も存在する（例えば、特許文献２参照）。
特開平１１−６７７７５号公報（図７） 特開２００１−１１６７１３公報（図４，図６） As another bonding apparatus, (a) the tip of the lead wire is placed on the pad of the bare chip, and the tip of the lead wire is formed by a gold ball formed by arc discharge on the tip of a gold wire different from the lead wire. By covering, a bonding apparatus for bonding the lead wire on the pad, or (b) the tip of the lead wire is placed on the chip pad, and the tip of the lead wire is melted into a ball shape by arc discharge. There is also a bonding apparatus that directly welds a gold ball to a pad (see, for example, Patent Document 2).
JP-A-11-67775 (FIG. 7) JP 2001-116713 A (FIGS. 4 and 6)

特許文献１や特許文献２に記載されているように、従来のボンディング装置は、ボンディングワイヤとトーチ電極との間に高電圧を印加し、両者間でアーク放電を行わせることにより、ボンディングワイヤの先端を溶融させて、そこにボールを形成する放電手段を備えている。   As described in Patent Document 1 and Patent Document 2, the conventional bonding apparatus applies a high voltage between the bonding wire and the torch electrode, and causes arc discharge between the two, so that the bonding wire Discharge means for melting the tip and forming a ball there is provided.

このため、ボール形成時における、ボンディングワイヤとトーチ電極との間のアーク放電により、電磁波が発生する。この電磁波がボンディング対象物であるベアチップ等を通過しようとすると、ボンディング対象物内に誘導電圧が生じる。   For this reason, electromagnetic waves are generated by arc discharge between the bonding wire and the torch electrode during ball formation. When this electromagnetic wave tries to pass through a bare chip or the like that is a bonding target, an induced voltage is generated in the bonding target.

近年、ＬＳＩ，ＭＲヘッド（磁気抵抗効果型磁気ヘッド）等のボンディング対象物では、その高性能化に伴い、ボンディング対象物内の薄膜の厚みが微小になり、薄膜の耐電圧も低下している。そこで、ボンディングワイヤとトーチ電極との間でアーク放電を行った時のボンディング対象物内の誘導電圧が、薄膜の耐電圧よりも高くなり、薄膜が破壊されてしまうという問題がある。   In recent years, bonding objects such as LSIs and MR heads (magnetoresistance effect type magnetic heads) have become thin and the withstand voltage of the thin film has been reduced with increasing performance. . Therefore, there is a problem that the induced voltage in the object to be bonded when arc discharge is performed between the bonding wire and the torch electrode becomes higher than the withstand voltage of the thin film and the thin film is destroyed.

本発明は、上記問題を解決するためになされたもので、ボンディングワイヤとトーチ電極との間でアーク放電を行った時でも、ボンディング対象物内の薄膜が破壊されることがないボンディング装置を実現しようとするものである。   The present invention has been made to solve the above problems, and realizes a bonding apparatus in which a thin film in a bonding object is not broken even when arc discharge is performed between a bonding wire and a torch electrode. It is something to try.

上記課題を解決する請求項１に係る発明は、ボンディングワイヤとトーチ電極との間に高電圧を印加し、両者間でアーク放電を行わせることにより、前記ボンディングワイヤの先端を溶融させて、そこにボールを形成する放電手段を備え、該放電手段により形成したボールをボンディング対象物のパッドに結合するボンディング装置であって、前記ボール形成時のアーク放電に際して発生する電磁波から前記ボンディング対象物を遮蔽するためのシールド部材を有したボンディング装置である。   In the invention according to claim 1 for solving the above-mentioned problem, the tip of the bonding wire is melted by applying a high voltage between the bonding wire and the torch electrode and causing an arc discharge between them. A bonding device for connecting a ball formed by the discharging means to a pad of an object to be bonded, and shielding the object to be bonded from electromagnetic waves generated during arc discharge at the time of forming the ball. This is a bonding apparatus having a shield member.

この発明では、ボール形成時のアーク放電に際して発生する電磁波が、シールド部材により遮蔽される。
シールド部材としては、ボンディングワイヤ及びトーチ電極とボンディング対象物との間を仕切る導電性板材で成り、ボールがボンディング対象物のパッドに向けて移動する際には、その通行を阻害しないように退避可能に構成されたものを用いることができる。 In this invention, electromagnetic waves generated during arc discharge during ball formation are shielded by the shield member.
The shield member is made of a conductive plate that separates the bonding wire and torch electrode from the bonding target, and can be retracted so as not to obstruct the passage when the ball moves toward the pad of the bonding target. What was comprised in can be used.

他のシールド部材としては、ボンディングワイヤ及びトーチ電極とボンディング対象物との間を仕切る導電性板材で成り、ボールがボンディング対象物のパッドに向けて移動する経路上には、ボールの通行を阻害しないように貫通穴が穿設されているものを用いることができる。   The other shield member is made of a conductive plate that separates the bonding wire and torch electrode from the bonding target, and does not obstruct the passage of the ball on the path along which the ball moves toward the pad of the bonding target. In this way, a through hole can be used.

更に他のシールド部材としては、ボンディングワイヤ及びトーチ電極とボンディング対象物との間を仕切る導電性メッシュ材で成り、ボールがボンディング対象物のパッドに向けて移動する経路上には、メッシュ穴が位置し、ボールの通行を阻害しないように構成されているものを用いることができる。   Still another shielding member is a conductive mesh material that partitions the bonding wire and torch electrode from the bonding target, and a mesh hole is located on the path of the ball moving toward the bonding target pad. However, it is possible to use one configured so as not to obstruct the passage of the ball.

更に他のシールド部材としては、始端と終端が短絡された１ターン以上のコイルで成り、ボールは、該コイル内を通って、ボンディング対象物のパッドに向けて移動するように構成されているものを用いることができる。   Still another shield member is composed of a coil of one turn or more in which the start and end are short-circuited, and the ball is configured to move toward the bonding target pad through the coil. Can be used.

請求項１〜５に係る発明によれば、ボール形成時のアーク放電に際して発生する電磁波は、シールド部材により遮蔽されるため、ボンディング対象物に到達する電磁波を低減できる。このため、ボンディングワイヤとトーチ電極との間でアーク放電を行った時のボンディング対象物内の誘導電圧も低くなり、この誘導電圧が薄膜の耐電圧よりも高くなることはない。よって、ボンディングワイヤとトーチ電極との間でアーク放電を行った時でも、ボンディング対象物内の薄膜が破壊されることはない。   According to the first to fifth aspects of the present invention, the electromagnetic wave generated during arc discharge during ball formation is shielded by the shield member, so that the electromagnetic wave reaching the bonding object can be reduced. For this reason, the induced voltage in the bonding object when arc discharge is performed between the bonding wire and the torch electrode is also reduced, and this induced voltage does not become higher than the withstand voltage of the thin film. Therefore, even when arc discharge is performed between the bonding wire and the torch electrode, the thin film in the bonding object is not destroyed.

更に、請求項２に係る発明によれば、シールド部材が退避可能であるため、ボールがボンディング対象物のパッドに向けて移動する際に、通行を阻害されない。又、請求項３に係る発明によれば、シールド部材として貫通穴付き導電性板材を用いたので、導電性板材を退避させなくても、ボールはボンディング対象物のパッドに向けて移動できる。   Further, according to the invention of claim 2, since the shield member can be retracted, passage is not hindered when the ball moves toward the pad of the bonding object. According to the invention of claim 3, since the conductive plate with a through hole is used as the shield member, the ball can move toward the pad of the bonding object without retracting the conductive plate.

請求項４に係る発明によれば、シールド部材として導電性メッシュ材を用いたので、導電性板材を退避させなくても、ボールはボンディング対象物のパッドに向けて移動できる。請求項５に係る発明によれば、シールド部材として、始端と終端が短絡された１ターン以上のコイルを用いたので、導電性板材を退避させなくても、ボールはボンディング対象物のパッドに向けて移動できる。   According to the fourth aspect of the present invention, since the conductive mesh material is used as the shield member, the ball can move toward the pad of the bonding object without retracting the conductive plate material. According to the invention of claim 5, since the coil having one turn or more in which the start end and the end are short-circuited is used as the shield member, the ball faces the pad of the object to be bonded without retracting the conductive plate. Can move.

以下、図面を用いて本発明を実施するための最良の形態を説明する。
（第１の実施の形態例）
図１を用いて本発明の第１の実施の形態例を説明する。図１において、キャピラリ１は、絶縁物を筒状に形成したもので成り、キャピラリ駆動部２によって、図１の上下方向に駆動される。ボンディングワイヤとしての金線３は、金線駆動部４からキャピラリ１に繰り出され、その先端は、キャピラリ１内を通過し、キャピラリ１の下方に突出している。本形態例において、金線３はアースされている。金線駆動部４は、例えば、金線３が巻かれたドラムをモータで回転駆動し、金線３をキャピラリ１に送り出したり引き戻したりできるように構成されている。 Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.
(First embodiment)
A first embodiment of the present invention will be described with reference to FIG. In FIG. 1, a capillary 1 is formed by forming an insulator in a cylindrical shape, and is driven in a vertical direction in FIG. 1 by a capillary drive unit 2. A gold wire 3 as a bonding wire is drawn out from the gold wire driving unit 4 to the capillary 1, and the tip of the gold wire 3 passes through the capillary 1 and protrudes below the capillary 1. In this embodiment, the gold wire 3 is grounded. For example, the gold wire driving unit 4 is configured so that a drum around which the gold wire 3 is wound can be rotationally driven by a motor so that the gold wire 3 can be sent to and retracted from the capillary 1.

トーチ電極６は、トーチ電極駆動部７により図１の左右方向に駆動されるものである。放電手段９は、金線３とトーチ電極６との間に高電圧を印加し、両者間でアーク放電を行わせるものである。このアーク放電は、金線３の先端とトーチ電極６の先端との間でなされ、これにより、金線３の先端が溶融され、そこに金ボール３ａが形成される。尚、トーチ電極６は、この放電時には図１に示す位置（左方向に前進した位置）にある。   The torch electrode 6 is driven in the left-right direction in FIG. The discharge means 9 applies a high voltage between the gold wire 3 and the torch electrode 6 and causes arc discharge between them. This arc discharge is performed between the tip of the gold wire 3 and the tip of the torch electrode 6, whereby the tip of the gold wire 3 is melted and a gold ball 3a is formed there. The torch electrode 6 is in the position shown in FIG. 1 (position advanced to the left) during this discharge.

シールド部材としての導電性板材１０は、金線３及びトーチ電極６とボンディング対象物１２との間を仕切るように配置され、金ボール３ａ形成時のアーク放電に際して発生する電磁波から、ボンディング対象物１２を遮蔽するものである。開閉駆動部１３は、矩形状の導電性板材１０を図１の左右方向に駆動するものである。   The conductive plate 10 as a shield member is disposed so as to partition the gold wire 3 and the torch electrode 6 and the bonding target object 12, and from the electromagnetic wave generated during arc discharge when the gold ball 3 a is formed, the bonding target object 12. Is to shield. The opening / closing drive unit 13 drives the rectangular conductive plate 10 in the left-right direction in FIG.

導電性板材１０は、アーク放電時には図１に示す位置（左方向に前進した実線位置）にある。尚、導電性板材１０が図１の右方向に後退した退避位置（二点鎖線位置）では、金ボール３ａやキャピラリ１は、その通行を導電性板材１０に阻害されることはなく、ボンディング対象物１２のパッドに向けて移動できる。   The conductive plate 10 is in the position shown in FIG. 1 (solid line position advanced in the left direction) during arc discharge. Incidentally, at the retracted position (two-dot chain line position) where the conductive plate 10 is retracted in the right direction in FIG. 1, the gold ball 3a and the capillary 1 are not obstructed by the conductive plate 10 and are bonded. It can move toward the pad of the object 12.

制御部１４は、キャピラリ駆動部２，金線駆動部４，トーチ電極駆動部７，放電手段９及び開閉駆動部１３を一定のシーケンスでもって制御し、放電手段９により形成した金ボール３ａをボンディング対象物１２のパッドに結合するするものである。   The control unit 14 controls the capillary drive unit 2, the gold wire drive unit 4, the torch electrode drive unit 7, the discharge unit 9 and the opening / closing drive unit 13 in a predetermined sequence, and bonds the gold ball 3 a formed by the discharge unit 9. It is connected to the pad of the object 12.

以下、図２を用いて、本形態例でのボンディングの工程を説明する。
先ず、制御部１４は、キャピラリ駆動部２を制御し、キャピラリ１を所定の位置に停止させ、金線駆動部４を制御して、キャピラリ１の下端から金線３を突出させる（図２（ａ）参照）。 Hereinafter, the bonding process in this embodiment will be described with reference to FIG.
First, the control unit 14 controls the capillary drive unit 2 to stop the capillary 1 at a predetermined position, and controls the gold wire drive unit 4 to project the gold wire 3 from the lower end of the capillary 1 (FIG. 2 ( a)).

次に、トーチ電極駆動部７により、トーチ電極６を図１に示す位置（左方向に前進した位置）まで移動させる。導電性板材１０についても、開閉駆動部１３により、図１に示す遮蔽位置（左方向に前進した実線位置）まで移動させる。   Next, the torch electrode driving unit 7 moves the torch electrode 6 to the position shown in FIG. 1 (position advanced in the left direction). The conductive plate 10 is also moved to the shielding position (solid line position advanced in the left direction) shown in FIG.

この状態で、放電手段９を駆動し、金線３とトーチ電極６との間に高電圧を印加し、両者間でアーク放電を行わせる（図２（ｂ）参照）。このアーク放電は、金線３の先端とトーチ電極６の先端との間でなされるため、金線３の先端が溶融する。このアーク放電終了後は、トーチ電極駆動部７により、トーチ電極６を図１における右方向に後退させると共に、開閉駆動部１３により、導電性板材１０を図１における右方向に退避した二点鎖線で示す退避位置まで後退させる。   In this state, the discharge means 9 is driven, a high voltage is applied between the gold wire 3 and the torch electrode 6, and arc discharge is performed between them (see FIG. 2B). Since this arc discharge is performed between the tip of the gold wire 3 and the tip of the torch electrode 6, the tip of the gold wire 3 is melted. After the end of the arc discharge, the torch electrode drive unit 7 retracts the torch electrode 6 in the right direction in FIG. 1, and the open / close drive unit 13 retracts the conductive plate 10 in the right direction in FIG. Retreat to the retracted position indicated by.

上記工程により、金線３の先端には、表面張力により、金ボール３ａが形成された状態になる（図２（ｃ）参照）。又、金ボール３ａやキャピラリ１がボンディング対象物１２のパッドに向けて移動する際に、その通行を阻害するものが存在しない状態が確保される。   Through the above process, a gold ball 3a is formed at the tip of the gold wire 3 due to surface tension (see FIG. 2C). Further, when the gold ball 3a and the capillary 1 move toward the pad of the bonding target 12, a state in which there is no obstacle to the passage is ensured.

金ボール３ａ形成後、金線駆動部４による金線３の拘束を解き、キャピラリ駆動部２によりキャピラリ１を下降させ、金ボール３ａをボンディング対象物１２のパッドに押し付け、超音波振動を与えて金ボール３ａをパッドに熱圧着する（図２（ｄ）参照）。   After the formation of the gold ball 3a, the restriction of the gold wire 3 by the gold wire driving unit 4 is released, the capillary 1 is lowered by the capillary driving unit 2, the gold ball 3a is pressed against the pad of the bonding object 12, and ultrasonic vibration is applied. The gold ball 3a is thermocompression bonded to the pad (see FIG. 2D).

その後、キャピラリ駆動部２によりキャピラリ１を下降前の位置まで戻し（図２（ｅ）参照）、更に、金線駆動部４により、金線３を引き上げ、金ボール３ａの上部で金線３を切断する（図２（ｆ）参照）。このようにしてボンディング対象物１２上に残された金ボール３ａは、バンプを構成する。   Thereafter, the capillary drive unit 2 returns the capillary 1 to the position before the descent (see FIG. 2 (e)), and further, the gold wire drive unit 4 pulls up the gold wire 3, and the gold wire 3 is placed above the gold ball 3a. Cut (see FIG. 2 (f)). The gold balls 3a left on the bonding object 12 in this way constitute bumps.

本形態例では、金ボール３ａ形成時のアーク放電に際して発生する電磁波が、シールド部材である導電性板材１０により遮蔽される。このため、ボンディング対象物１２に到達する電磁波を低減できる。その結果、金線３とトーチ電極６との間でアーク放電を行った時のボンディング対象物１２内の誘導電圧も低くなり、この誘導電圧がボンディング対象物１２内の薄膜の耐電圧よりも高くなることはない。よって、金線３とトーチ電極６との間でアーク放電を行った時でも、ボンディング対象物１２内の薄膜が破壊されることはない。更に、導電性板材１０が退避可能であるため、金ボール３ａやキャピラリ１がボンディング対象物１２のパッドに向けて移動する際に、その通行を阻害されない。
（第２の実施の形態例）
図３を用いて本発明の第２の実施の形態例を説明する。図３において、図１及び図２と同一部分には同一符号を付し、その説明は省略する。本形態例と第１の実施の形態例との相異点は、導電性板材１０及びその退避構造である。本形態例では、導電性板材１０として、直線スライドするものではなく、回転するものを用いている。 In this embodiment, electromagnetic waves generated during arc discharge when forming the gold ball 3a are shielded by the conductive plate 10 that is a shield member. For this reason, the electromagnetic waves that reach the bonding object 12 can be reduced. As a result, the induced voltage in the bonding object 12 when arc discharge is performed between the gold wire 3 and the torch electrode 6 is also reduced, and this induced voltage is higher than the withstand voltage of the thin film in the bonding object 12. Never become. Therefore, even when arc discharge is performed between the gold wire 3 and the torch electrode 6, the thin film in the bonding object 12 is not destroyed. Furthermore, since the conductive plate 10 can be retracted, the passage of the gold ball 3a and the capillary 1 when moving toward the pad of the bonding target 12 is not hindered.
(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted. The difference between this embodiment and the first embodiment is the conductive plate 10 and its retracted structure. In this embodiment, the conductive plate member 10 is not the one that linearly slides but the one that rotates.

即ち、図３（Ａ）に示すように、一部が扇状に切り欠かれた円板でなる導電性板材１０を回転中心軸２０を中心に回転可能に支持している。そして、アーク放電に際しては、図示しないトーチ電極駆動部７により、トーチ電極６を図３（Ａ）に示す位置まで移動させる。一方、導電性板材１０については、図示しない開閉駆動部１３により、図３（Ａ）に示すように、中実部１０ｃが金線３やキャピラリ１に対向する遮蔽位置まで回転させる。   That is, as shown in FIG. 3 (A), a conductive plate 10 made of a disk partially cut out in a fan shape is supported so as to be rotatable about a rotation center axis 20. During arc discharge, the torch electrode driving unit 7 (not shown) moves the torch electrode 6 to the position shown in FIG. On the other hand, as shown in FIG. 3A, the conductive plate member 10 is rotated to the shielding position where the solid portion 10c is opposed to the gold wire 3 and the capillary 1 by the opening / closing drive unit 13 (not shown).

この状態で、図示しない放電手段９を駆動し、金線３とトーチ電極６との間に高電圧を印加し、両者間でアーク放電を行わせる。このアーク放電は、金線３の先端とトーチ電極６の先端との間でなされるため、金線３の先端が溶融し、先端に金ボール３ａが形成される。   In this state, the discharge means 9 (not shown) is driven, a high voltage is applied between the gold wire 3 and the torch electrode 6, and arc discharge is performed between them. Since this arc discharge is performed between the tip of the gold wire 3 and the tip of the torch electrode 6, the tip of the gold wire 3 is melted and a gold ball 3a is formed at the tip.

このアーク放電後は、図示しないトーチ電極駆動部７により、トーチ電極６を右方向に後退させ、図示しない開閉駆動部１３により、導電性板材１０を１８０°回転させる。これにより、金ボール３ａやキャピラリ１は、導電性板材１０の切り欠き部１０ａに対向することになり、ボンディング対象物１２のパッドに向けて移動する際に、その通行を阻害されなくなる。   After this arc discharge, the torch electrode 6 is retracted to the right by the torch electrode driving unit 7 (not shown), and the conductive plate 10 is rotated 180 ° by the opening / closing driving unit 13 (not shown). As a result, the gold ball 3 a and the capillary 1 are opposed to the notch 10 a of the conductive plate 10, and the movement of the gold ball 3 a and the capillary 1 is not hindered when moving toward the pad of the bonding target 12.

その後は、図３（Ｂ）に示すように、第１の形態例の場合と同様に、図示しないキャピラリ駆動部２によりキャピラリ１を下降させ、金ボール３ａをボンディング対象物１２のパッドに押し付け、超音波振動を与えて金ボール３ａをパッドに熱圧着する。本形態例でも、第１の実施の形態例と同様な作用効果が得られる。
（第３の実施の形態例）
図４を用いて本発明の第３の実施の形態例を説明する。図４において、図１〜図３と同一部分には同一符号を付し、その説明は省略する。本形態例における第１及び第２の実施の形態例との相異点は、導電性板材１０が常に静止しており、その退避構造（開閉駆動部１３）を有しない点である。 Thereafter, as shown in FIG. 3 (B), as in the case of the first embodiment, the capillary 1 is lowered by the capillary drive unit 2 (not shown), and the gold ball 3a is pressed against the pad of the bonding object 12, The gold ball 3a is thermocompression bonded to the pad by applying ultrasonic vibration. Also in this embodiment, the same effects as those in the first embodiment can be obtained.
(Third embodiment)
A third embodiment of the present invention will be described with reference to FIG. 4, the same parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and the description thereof is omitted. The difference between this embodiment and the first and second embodiments is that the conductive plate 10 is always stationary and does not have its retracting structure (opening / closing drive unit 13).

即ち、図４（Ａ）に示すように、本形態例における矩形状の導電性板材１０の中央には、矩形の貫通穴１０ｂが穿設されている。この貫通穴１０ｂは、金ボール３ａやキャピラリ１に対向する位置に設けられている。言い換えれば、金ボール３ａがボンディング対象物１２のパッドに向けて移動する経路上に、金ボール３ａやキャピラリ１の通行を阻害しないように貫通穴１０ｂが穿設されている。   That is, as shown in FIG. 4A, a rectangular through hole 10b is formed in the center of the rectangular conductive plate member 10 in this embodiment. The through hole 10 b is provided at a position facing the gold ball 3 a and the capillary 1. In other words, the through hole 10 b is formed on the path along which the gold ball 3 a moves toward the pad of the bonding object 12 so as not to obstruct the passage of the gold ball 3 a and the capillary 1.

本形態例では、アーク放電に際しては、図示しないトーチ電極駆動部７により、トーチ電極６を図４（Ａ）に示す位置まで移動させる。この状態で、図示しない放電手段９を駆動し、金線３とトーチ電極６との間に高電圧を印加し、両者間でアーク放電を行わせ、金線３の先端に金ボール３ａを形成させる。   In the present embodiment, during arc discharge, the torch electrode drive unit 7 (not shown) moves the torch electrode 6 to the position shown in FIG. In this state, the discharge means 9 (not shown) is driven, a high voltage is applied between the gold wire 3 and the torch electrode 6 to cause arc discharge between them, and a gold ball 3 a is formed at the tip of the gold wire 3. Let

このアーク放電後は、図示しないトーチ電極駆動部７により、トーチ電極６を右方向に後退させ、図４（Ｂ）に示すように、図示しないキャピラリ駆動部２によりキャピラリ１を下降させ、金ボール３ａをボンディング対象物１２のパッドに押し付け、超音波振動を与えて金ボール３ａをパッドに熱圧着する。   After this arc discharge, the torch electrode 6 is retreated in the right direction by the torch electrode driving unit 7 (not shown), and the capillary 1 is lowered by the capillary driving unit 2 (not shown) as shown in FIG. 3a is pressed against the pad of the bonding object 12, and ultrasonic vibration is applied to thermally bond the gold ball 3a to the pad.

本形態例では、金ボール３ａ形成時のアーク放電に際して発生する電磁波の内、導電性板材１０の中実部１０ｆに到達したものは、そこで遮蔽される。一方、貫通穴１０ｂの存在により、導電性板材１０は１ターンのリング（短絡コイル）を構成していることになるので、貫通穴１０ｂに到達し通過しようとした電磁波も、貫通穴１０ｂの通過を阻まれる。   In the present embodiment, among the electromagnetic waves generated during the arc discharge when forming the gold ball 3a, the electromagnetic wave that reaches the solid portion 10f of the conductive plate 10 is shielded there. On the other hand, since the conductive plate 10 forms a one-turn ring (short-circuit coil) due to the presence of the through hole 10b, the electromagnetic wave that reaches the through hole 10b and tries to pass through it also passes through the through hole 10b. Is blocked.

このため、ボール３ａ形成時のアーク放電に際して発生する電磁波は、導電性板材１０により遮蔽され、ボンディング対象物１２に到達する電磁波は大幅に低減される。その結果、金線３とトーチ電極６との間でアーク放電を行った時のボンディング対象物１２内の誘導電圧も低くなり、この誘導電圧がボンディング対象物１２内の薄膜の耐電圧よりも高くなることはない。よって、金線３とトーチ電極６との間でアーク放電を行った時でも、ボンディング対象物１２内の薄膜が破壊されることがない。更に、本形態例では、導電性板材１０を退避させる機構（開閉駆動部１３）が不要であり、構成を簡単にできる。
（第４の実施の形態例）
図５を用いて本発明の第４の実施の形態例を説明する。図５において、図１〜図４と同一部分には同一符号を付し、その説明は省略する。本形態例では、図５（Ａ）に示すように、導電性の金属材料で成る矩形状のメッシュ部材２５をシールド部材として用いている。メッシュ部材２５の中央のメッシュ穴２５ａは、金ボール３ａやキャピラリ１の通行を阻害しないように、金ボール３ａがボンディング対象物１２のパッドに向けて移動する経路上に位置している。 For this reason, the electromagnetic waves generated during the arc discharge when forming the ball 3a are shielded by the conductive plate 10, and the electromagnetic waves reaching the bonding object 12 are greatly reduced. As a result, the induced voltage in the bonding object 12 when arc discharge is performed between the gold wire 3 and the torch electrode 6 is also reduced, and this induced voltage is higher than the withstand voltage of the thin film in the bonding object 12. Never become. Therefore, even when arc discharge is performed between the gold wire 3 and the torch electrode 6, the thin film in the bonding object 12 is not destroyed. Furthermore, in this embodiment, a mechanism (opening / closing drive unit 13) for retracting the conductive plate 10 is unnecessary, and the configuration can be simplified.
(Fourth embodiment)
A fourth embodiment of the present invention will be described with reference to FIG. 5, the same parts as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, as shown in FIG. 5A, a rectangular mesh member 25 made of a conductive metal material is used as a shield member. The mesh hole 25a at the center of the mesh member 25 is located on a path along which the gold ball 3a moves toward the pad of the bonding target 12 so as not to obstruct the passage of the gold ball 3a and the capillary 1.

本形態例でも、第３の形態例と同様に、アーク放電に際しては、図示しないトーチ電極駆動部７により、トーチ電極６を図５（Ａ）に示す位置まで移動させる。この状態で、図示しない放電手段９を駆動し、金線３とトーチ電極６との間に高電圧を印加し、両者間でアーク放電を行わせ、金線３の先端に金ボール３ａを形成させる。   Also in this embodiment, as in the third embodiment, during arc discharge, the torch electrode 6 is moved to the position shown in FIG. In this state, the discharge means 9 (not shown) is driven, a high voltage is applied between the gold wire 3 and the torch electrode 6 to cause arc discharge between them, and a gold ball 3 a is formed at the tip of the gold wire 3. Let

このアーク放電後は、図示しないトーチ電極駆動部７により、トーチ電極６を右方向に後退させ、図５（Ｂ）に示すように、図示しないキャピラリ駆動部２によりキャピラリ１を下降させ、金ボール３ａをボンディング対象物１２のパッドに押し付け、超音波振動を与えて金ボール３ａをパッドに熱圧着する。   After the arc discharge, the torch electrode drive unit 7 (not shown) retracts the torch electrode 6 in the right direction, and the capillary drive unit 2 (not shown) lowers the capillary 1 as shown in FIG. 3a is pressed against the pad of the bonding object 12, and ultrasonic vibration is applied to thermally bond the gold ball 3a to the pad.

本形態例では、各メッシュ穴２５ａの周囲に、１ターンのリング（短絡コイル）が構成されているため、その各メッシュ穴２５ａに到達し通過しようとした電磁波は、その通過を阻まれる。このため、ボール３ａ形成時のアーク放電に際して発生する電磁波は、メッシュ部材２５により遮蔽され、ボンディング対象物１２に到達する電磁波を低減できる。   In the present embodiment, since a one-turn ring (short-circuit coil) is formed around each mesh hole 25a, the electromagnetic wave that reaches the mesh hole 25a and attempts to pass through is blocked. For this reason, the electromagnetic wave generated at the time of arc discharge at the time of ball 3a formation is shielded by the mesh member 25, and the electromagnetic wave which reaches | attains the bonding target object 12 can be reduced.

その結果、金線３とトーチ電極６との間でアーク放電を行った時のボンディング対象物１２内の誘導電圧も低くなり、この誘導電圧がボンディング対象物１２内の薄膜の耐電圧よりも高くなることはない。よって、金線３とトーチ電極６との間でアーク放電を行った時でも、ボンディング対象物１２内の薄膜が破壊されることがない。更に、本形態例でも、第３の形態例の場合と同様、メッシュ部材２５を退避させる機構（開閉駆動部１３）が不要であり、構成を簡単にできる。尚、メッシュ形状は図５に示した矩形に限るものではない。
（第５の実施の形態例）
図６を用いて本発明の第５の実施の形態例を説明する。図６において、図１〜図５と同一部分には同一符号を付し、その説明は省略する。本形態例では、図６（Ａ）に示すように、始端と終端が短絡された１ターン以上のコイル２７をシールド部材として用いている。そして、金ボール３ａ及びキャピラリ１は、該コイル２７内を通って、ボンディング対象物１２のパッドに向けて移動するように構成されている。 As a result, the induced voltage in the bonding object 12 when arc discharge is performed between the gold wire 3 and the torch electrode 6 is also reduced, and this induced voltage is higher than the withstand voltage of the thin film in the bonding object 12. Never become. Therefore, even when arc discharge is performed between the gold wire 3 and the torch electrode 6, the thin film in the bonding object 12 is not destroyed. Further, in this embodiment, as in the case of the third embodiment, the mechanism (opening / closing drive unit 13) for retracting the mesh member 25 is unnecessary, and the configuration can be simplified. The mesh shape is not limited to the rectangle shown in FIG.
(Fifth embodiment)
A fifth embodiment of the present invention will be described with reference to FIG. 6, the same parts as those in FIGS. 1 to 5 are denoted by the same reference numerals, and the description thereof is omitted. In the present embodiment, as shown in FIG. 6A, a coil 27 having one or more turns in which a start end and a termination are short-circuited is used as a shield member. The gold ball 3 a and the capillary 1 are configured to move toward the pad of the bonding target 12 through the coil 27.

本形態例でも、第３及び第４の形態例と同様に、アーク放電に際しては、図示しないトーチ電極駆動部７により、トーチ電極６を図６（Ａ）に示す位置まで移動させる。この状態で、図示しない放電手段９を駆動し、金線３とトーチ電極６との間に高電圧を印加し、両者間でアーク放電を行わせ、金線３の先端に金ボール３ａを形成させる。   Also in this embodiment, as in the third and fourth embodiments, the torch electrode 6 is moved to the position shown in FIG. 6A by the torch electrode driving unit 7 (not shown) during arc discharge. In this state, the discharge means 9 (not shown) is driven, a high voltage is applied between the gold wire 3 and the torch electrode 6 to cause arc discharge between them, and a gold ball 3 a is formed at the tip of the gold wire 3. Let

このアーク放電後は、図示しないトーチ電極駆動部７により、トーチ電極６を右方向に後退させ、図６（Ｂ）に示すように、図示しないキャピラリ駆動部２によりキャピラリ１を下降させ、金ボール３ａをボンディング対象物１２のパッドに押し付け、超音波振動を与えて金ボール３ａをパッドに熱圧着する。   After this arc discharge, the torch electrode 6 is retreated in the right direction by the torch electrode driving unit 7 (not shown), and the capillary 1 is lowered by the capillary driving unit 2 (not shown) as shown in FIG. 3a is pressed against the pad of the bonding object 12, and ultrasonic vibration is applied to thermally bond the gold ball 3a to the pad.

本形態例では、ボンディング対象物１２の上側に、始端と終端が短絡されたコイル２７が配置されているため、コイル２７内を通過しボンディング対象物１２に向かおうとする電磁波は、このコイル２７によりコイル２７内の通過を阻まれる。このため、ボール３ａ形成時のアーク放電に際して発生する電磁波は、コイル２７により遮蔽され、ボンディング対象物１２に到達する電磁波は低減される。   In the present embodiment, the coil 27 whose start and end are short-circuited is disposed on the upper side of the bonding object 12, so that electromagnetic waves that pass through the coil 27 and go toward the bonding object 12 are transmitted to the coil 27. Is prevented from passing through the coil 27. For this reason, the electromagnetic wave generated at the time of arc discharge when the ball 3a is formed is shielded by the coil 27, and the electromagnetic wave reaching the bonding object 12 is reduced.

その結果、金線３とトーチ電極６との間でアーク放電を行った時のボンディング対象物１２内の誘導電圧も低くなり、この誘導電圧がボンディング対象物１２内の薄膜の耐電圧よりも高くなることはない。よって、金線３とトーチ電極６との間でアーク放電を行った時でも、ボンディング対象物１２内の薄膜が破壊されることがない。更に、本形態例でも、第３及び第４の形態例の場合と同様、コイル２７を退避させる機構（開閉駆動部１３）が不要であり、構成を簡単にできる。
（その他の形態例）
本発明は上記形態例に限られるものではない。例えば、上記形態例のボンディング装置は、ボンディング対象物のパッド上にバンプを形成する際に用いられるボンディング装置であるが、これ以外のボンディング装置、例えば、ボンディング対象物のパッド上にリードワイヤの先端を配置し、リードワイヤとは別の金線の先端にアーク放電により形成した金ボールで、リードワイヤの先端を覆うことで、パッド上にリードワイヤを結合するボンディング装置や、ボンディング対象物のパッド上にリードワイヤの先端を配置し、このリードワイヤの先端をアーク放電によりボール状に溶融させて、パッドに溶着するボンディング装置にも本発明を適用できる。 As a result, the induced voltage in the bonding object 12 when arc discharge is performed between the gold wire 3 and the torch electrode 6 is also reduced, and this induced voltage is higher than the withstand voltage of the thin film in the bonding object 12. Never become. Therefore, even when arc discharge is performed between the gold wire 3 and the torch electrode 6, the thin film in the bonding object 12 is not destroyed. Further, in this embodiment, as in the third and fourth embodiments, a mechanism (opening / closing drive unit 13) for retracting the coil 27 is unnecessary, and the configuration can be simplified.
(Other examples)
The present invention is not limited to the above embodiment. For example, the bonding apparatus of the above embodiment is a bonding apparatus used when forming bumps on the pads of the bonding object, but other bonding apparatuses, for example, the tip of the lead wire on the pad of the bonding object A bonding device for bonding the lead wire onto the pad by covering the tip of the lead wire with a gold ball formed by arc discharge on the tip of a gold wire different from the lead wire, or a pad of the bonding object The present invention can also be applied to a bonding apparatus in which the tip of a lead wire is disposed on the tip, the tip of the lead wire is melted into a ball shape by arc discharge and welded to a pad.

又、上記形態例のボンディング装置では、ボンディングワイヤとして金線を用いて金ボールを形成し、ボンディングを行ったが、金以外の金属（例えば、Ａｕ−ＰｄやＡｕ−Ｃｕ等）でなるボンディングワイヤを用いることもできる。   In the bonding apparatus of the above embodiment, a gold ball is formed using a gold wire as a bonding wire and bonding is performed. However, a bonding wire made of a metal other than gold (for example, Au—Pd, Au—Cu, etc.). Can also be used.

本発明の第１の実施の形態例を示す概略構成図である。It is a schematic block diagram which shows the 1st Example of this invention. 図１に示す形態例でのボンディング工程を示す図である。It is a figure which shows the bonding process in the example shown in FIG. 本発明の第２の実施の形態例の主要部を示す図である。It is a figure which shows the principal part of the 2nd Example of this invention. 本発明の第３の実施の形態例の主要部を示す図である。It is a figure which shows the principal part of the 3rd Embodiment of this invention. 本発明の第４の実施の形態例の主要部を示す図である。It is a figure which shows the principal part of the 4th Example of this invention. 本発明の第５の実施の形態例の主要部を示す図である。It is a figure which shows the principal part of the 5th Example of this invention.

符号の説明Explanation of symbols

１ ： キャピラリ
２ ： キャピラリ駆動部
３ ： 金線
３ａ ： 金ボール
４ ： 金線駆動部
６ ： トーチ電極
７ ： トーチ電極駆動部
９ ： 放電手段
１０ ： 導電性板材
１０ａ ： 切り欠き部部
１０ｂ ： 貫通穴
１２ ： ボンディング対象物
１３ ： 開閉駆動部
１４ ： 制御部
２０ ： 回転中心軸
２５ ： メッシュ部材
２５ａ ： メッシュ穴
２７ ： コイル DESCRIPTION OF SYMBOLS 1: Capillary 2: Capillary drive part 3: Gold wire 3a: Gold ball 4: Gold wire drive part 6: Torch electrode 7: Torch electrode drive part 9: Discharge means 10: Conductive board 10a: Notch part 10b: Through Hole 12: Bonding object 13: Opening / closing drive unit 14: Control unit 20: Rotation center shaft 25: Mesh member 25a: Mesh hole 27: Coil

Claims (5)

ボンディングワイヤとトーチ電極との間に高電圧を印加し、両者間でアーク放電を行わせることにより、前記ボンディングワイヤの先端を溶融させて、そこにボールを形成する放電手段を備え、該放電手段により形成したボールをボンディング対象物のパッドに結合するボンディング装置であって、
前記ボール形成時のアーク放電に際して発生する電磁波から前記ボンディング対象物を遮蔽するためのシールド部材を有したボンディング装置。 Discharge means for applying a high voltage between the bonding wire and the torch electrode and causing arc discharge between the two to melt the tip of the bonding wire and form a ball therein, the discharge means A bonding apparatus for bonding the ball formed by the step to a pad of an object to be bonded,
A bonding apparatus having a shield member for shielding the object to be bonded from electromagnetic waves generated during arc discharge during ball formation. 前記シールド部材は、前記ボンディングワイヤ及びトーチ電極と前記ボンディング対象物との間を仕切る導電性板材で成り、前記ボールが前記ボンディング対象物のパッドに向けて移動する際には、その通行を阻害しないように退避可能に構成されていることを特徴とする請求項１記載のボンディング装置。   The shield member is made of a conductive plate that partitions the bonding wire and torch electrode from the bonding target, and does not hinder the passage of the ball when moving toward the bonding target pad. The bonding apparatus according to claim 1, wherein the bonding apparatus is configured to be retractable. 前記シールド部材は、前記ボンディングワイヤ及びトーチ電極と前記ボンディング対象物との間を仕切る導電性板材で成り、前記ボールが前記ボンディング対象物のパッドに向けて移動する経路上には、前記ボールの通行を阻害しないように貫通穴が穿設されていることを特徴とする請求項１記載のボンディング装置。   The shield member is made of a conductive plate that partitions the bonding wire and torch electrode from the bonding target, and the ball passes on a path along which the ball moves toward the pad of the bonding target. The bonding apparatus according to claim 1, wherein a through hole is formed so as not to hinder. 前記シールド部材は、前記ボンディングワイヤ及びトーチ電極と前記ボンディング対象物との間を仕切る導電性メッシュ材で成り、前記ボールが前記ボンディング対象物のパッドに向けて移動する経路上には、メッシュ穴が位置し、前記ボールの通行を阻害しないように構成されていることを特徴とする請求項１記載のボンディング装置。   The shield member is made of a conductive mesh material that partitions the bonding wire and torch electrode from the bonding object, and a mesh hole is formed on a path along which the ball moves toward the pad of the bonding object. The bonding apparatus according to claim 1, wherein the bonding apparatus is positioned so as not to obstruct the passage of the ball. 前記シールド部材は、始端と終端が短絡された１ターン以上のコイルで成り、前記ボールは、該コイル内を通って、前記ボンディング対象物のパッドに向けて移動するように構成されていることを特徴とする請求項１記載のボンディング装置。   The shield member is composed of a coil of one turn or more whose start and end are short-circuited, and the ball is configured to move toward the bonding target pad through the coil. The bonding apparatus according to claim 1.
JP2004088960A 2004-03-25 2004-03-25 Bonding equipment Expired - Fee Related JP4327633B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58105138U (en) * 1982-01-13 1983-07-18 日本テキサス・インスツルメンツ株式会社 Automatic bonding equipment for semiconductor devices
JPS60211951A (en) * 1984-04-06 1985-10-24 Toshiba Corp Wire-bonding device
JPS61296731A (en) * 1985-06-26 1986-12-27 Toshiba Corp Wire bonding apparatus
JPS63318132A (en) * 1987-06-19 1988-12-27 Hitachi Ltd Semiconductor device and bonding method and device for manufacturing same
JP2001185574A (en) * 1999-12-24 2001-07-06 Tdk Corp Spark torch body for wire bonder, and wire bonder

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58105138U (en) * 1982-01-13 1983-07-18 日本テキサス・インスツルメンツ株式会社 Automatic bonding equipment for semiconductor devices
JPS60211951A (en) * 1984-04-06 1985-10-24 Toshiba Corp Wire-bonding device
JPS61296731A (en) * 1985-06-26 1986-12-27 Toshiba Corp Wire bonding apparatus
JPS63318132A (en) * 1987-06-19 1988-12-27 Hitachi Ltd Semiconductor device and bonding method and device for manufacturing same
JP2001185574A (en) * 1999-12-24 2001-07-06 Tdk Corp Spark torch body for wire bonder, and wire bonder

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