JPH0220833Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an ultrasonic wire bonding apparatus, and more particularly to a wire guide mechanism disposed in front of a tool through which a wire is inserted and which guides the wire.

[Conventional technology]

BACKGROUND ART Conventionally, there has been known a device in which a wire guide member for guiding a wire is disposed in front of a tool, for example, as shown in Japanese Patent Publication No. 59-24540. This structure has the feature that even if the wire wiring direction between the first bond point and the second bond point is oblique to the direction in which the wire is inserted through the tool, bonding can be performed without rotating the sample.

[Problem that the invention attempts to solve]

However, since such a structure includes a wire guide drive mechanism that drives the wire guide member up and down, the structure is complicated and the device becomes expensive.

An object of the present invention is to provide an ultrasonic wire bonding device that solves the above problems.

[Means for solving problems]

The first configuration of the present invention to achieve the above purpose is as follows.
This will be explained using figures. In the present invention, a wire guide member 30 disposed in front of the tool 6 is fixed to the bonding head 2 via a wire guide attachment arm 31.

[Effect]

Since the wire guide member 30 is at a predetermined height position, when the tool 6 rises and moves in the XY direction as shown in FIGS. 3b to 3c, the wire 7 extending from the lower end of the tool 6 Member 30
guide slit 30a. Therefore, while the tool 6 is moving above the second bonding point 41, the wire 7 extending from the lower end of the tool 6 is guided by the guide slit 30a of the wire guide member 30, as shown in FIGS. As shown in FIG. 4, the first bond point 40 (first bond 7a) and second bond point 41 (second bond 7b) are aligned in the wire insertion direction (Y direction) in which the tool 6 is inserted. The wire 7 is guided onto the second bond point 41 without coming off the bond groove 6b of the tool 6 even if the wire 7 is in a diagonal direction with respect to the second bond point 41. Next, as shown in FIG. 3e, the tool 6 is lowered to the second bond point 4.
Immediately before the tool 6 comes into contact with the wire guide member 30, the wire 7 extending from the tool 6 separates from the wire guide member 30. However, immediately after that, the wire 7 is pressed against the second bond point 41 by the tool 6, so the wire 7
is never separated from the bond groove 6b of the tool 6.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
In FIG. 1, 1 is an XY table that moves in the XY direction, 2 is a bonding head mounted on the XY table 1, and 3 is a horn support arm that supports a horn 4 and is swingable up and down. It is fixed to a support shaft 5 rotatably supported by the bonding head 2. 6 is a tool fixed to the tip of the horn 4, and a wire 7 is attached to the tip of the tool 6 along the vibration direction of the horn 4 as shown in FIG.
The inclined guide hole 6a and the bond groove 6 through which the
b is provided. Also, tool 6 is attached to horn 4.
A guide hole 4a is provided in the insertion direction of the wire 7 inserted therein.

Reference numeral 10 denotes a clamper for cutting the wire 7 from the bond base after the second bond, and is disposed behind the tool 6. Reference numeral 11 denotes a clamper holder for holding the clamper 10, and is slidably provided on a receiving arm 12 fixed to the side surface of the horn support arm 3. A wire spool 13 is provided on an extension line in the insertion direction of the wire 7 and supplies the wire 7 to the lower surface of the tool 6 through the guide hole 4a of the horn 4, the clamper 10, and the guide hole of the tool 6. A camshaft 14 is rotatably supported by the bonding head 2 and rotated by a camshaft drive motor (not shown).A tool vertical drive cam 15 that moves the tool 6 up and down, and a clamper that moves the clamper 10 horizontally are attached to this camshaft 14. A drive cam 16 and various timing signal cams (not shown) are fixed. The tool vertical drive cam 15 has a cam follower 1 provided at one end of the horn support arm 3.
It is urged by a spring 18 so as to come into pressure contact with 7. 19 is a clamper drive arm fixed to a support shaft 20 rotatably supported by the horn support arm 3; a cam follower 21 attached to one end of this clamper drive arm 19 is connected to the clamper drive cam 1;
6 is urged by a spring 22. Further, at the other end of the clamper drive arm 19, a pin 23 is implanted at the upper end of the clamper holder 11.
are in contact with each other with a spring 24. The above is a conventionally known structure.

Next, the wire guide mechanism according to the present invention will be explained. A wire guide member 30 is provided parallel to the tool 6 in front of the tool, and is fixed to a wire guide mounting arm 31 fixed to the bonding head 2. The wire guide member 30 is provided with a guide slit 30a which is open at the bottom, as shown in FIG. 2, so as to guide the wire 7.

Next, the operation of the present apparatus having such a configuration will be explained with reference to FIG. The XY table 1 is moved to position the tool 6 directly above the first bond point 40 as shown in FIG. 3a. Next, the camshaft 14
starts rotating, which causes the tool vertical drive cam 1
5 draws a descending curve on the operational chart, and the horn support arm 3 rotates counterclockwise around the support shaft 5. As a result, the tool 6 and clamper 10 descend as shown in FIG. 3b, and the tool 6 contacts the first bond point 40 with a preset working pressure. Next, a micro switch is activated by a command cam (not shown) fixed to the camshaft 14, and the horn 4 starts to oscillate, transmitting ultrasonic vibration to the tool 6, and connecting the wire 7 to the first bond point 40. First bond 7a.

When the first bond 7a is completed, the tool vertical drive cam 15 changes to an upward curve, and the XY table 1
The tool 6 moves in the X and Y directions and passes through the path shown in FIG. By the way, as described above, the wire guide member 30 is attached to the wire guide mounting arm 31.
It is fixed to the bonding head 2 through The wire 7 extending from the lower end of the wire guide member 6 is guided to the guide slit 30a of the wire guide member 30. In this way, the wire 7 extending from the lower end of the tool 6 is
While moving above the bond point 41, it is guided by the guide slit 30a of the wire guide member 30, so that the first bond point 40 is moved as shown in FIG.
Even if the (first bond 7a) and the second bond point 41 (second bond 7b) are diagonal to the wire insertion direction (Y direction) inserted into the tool 6, the wire 7 is inserted into the bond groove of the tool 6. 6b and is guided onto the second bond point 41. In this case, there is no problem as long as the wire wiring direction is within 45 degrees with respect to the wire insertion direction.

Next, the tool vertical drive cam 15 draws a downward curve, and the tool 6 and clamper 10 descend as shown in FIG. 3e, and the tool 6 comes into contact with the second bond point 41. Even in this state, the wire guide member 30 is at a predetermined height position. Therefore, tool 6
Immediately before pressing the wire 7 to the second bond point 41, the wire 7 extending from the tool 6 separates from the wire guide member 30, but immediately after that, the wire 7 is pressed by the tool 6 to the second bond point 41. The wire 7 is never separated from the bond groove 6b of the tool 6.

Next, a micro switch is actuated by a command cam (not shown) fixed to the camshaft 14, and the horn 4
starts to oscillate, and the ultrasonic vibration is transmitted to the tool 6, and the wire 7 is connected to the second bond point 41 by the second bond 7b.
do. After the second bond 7b is completed, the clamper 1 is controlled by a command cam (not shown) fixed to the cam shaft 14.
0 clamps the wire 7, then the clamper drive cam 16 draws an upward curve, the clamper drive arm 19 rotates clockwise, and the clamper holder 11
is raised via the pin 23, whereby the clamper 10 moves away from the tool 6 while clamping the wire 7, and cuts the wire 7 from the rear end of the lower surface of the tool 6.

Subsequently, the tool vertical drive cam 15 draws an upward curve, and the tool 6 and the clamper 10 rise. Subsequently, the clamper drive cam 16 draws a downward curve, the clamper drive arm 19 rotates counterclockwise, and the clamper 10 moves forward toward the tool 6 to attach the wire to the lower end of the tool 6, as shown in FIG. 3a. Roll out a 7. The above operation creates two bond points 40 and 41.
In the meantime, the operation of bonding the wire 7 is completed.

[Effect of idea]

As is clear from the above description, the ultrasonic wire bonding apparatus according to the present invention has a very simple structure in which the wire guide member is fixed to the bonding head, so that an inexpensive apparatus can be obtained. Further, when the tool comes into contact with the sample, since the wire guide member is located above, there is no adverse effect on the sample.

[Brief explanation of the drawing]

Fig. 1 is an overall configuration diagram showing one embodiment of the ultrasonic wire bonding device according to the present invention, Fig. 2 is a front view of a wire guide member, and Figs. 3 a to e are explanatory diagrams showing the steps of wire bonding work. , FIG. 4 is an explanatory plan view showing the state of wire bonding by the apparatus according to the present invention. 1: XY table, 2: bonding head,
4: horn, 6: tool, 7: wire, 30: wire guide member, 30a: guide slit.

Claims (1)

[Scope of utility model registration request] A bonding head mounted on an XY table, a horn provided on the bonding head with a tool attached to its tip so that the tool can move up and down, and a wire placed in front of the tool and inserted through the tool. and a wire guide member having a guide slit that is open at the bottom so as to guide the wire guide member, and connects the wire between a first bond point and a second bond point by the tool. An ultrasonic wire bonding apparatus characterized in that a member is fixed to the bonding head.